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TWI318599B - - Google Patents

Info

Publication number
TWI318599B
TWI318599B TW097135922A TW97135922A TWI318599B TW I318599 B TWI318599 B TW I318599B TW 097135922 A TW097135922 A TW 097135922A TW 97135922 A TW97135922 A TW 97135922A TW I318599 B TWI318599 B TW I318599B
Authority
TW
Taiwan
Application number
TW097135922A
Other languages
Chinese (zh)
Other versions
TW200920589A (en
Inventor
Masahiro Tsuchiya
Hirotake Matsumoto
Yasushi Goto
Nobuhiro Mori
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40467928&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI318599(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200920589A publication Critical patent/TW200920589A/en
Application granted granted Critical
Publication of TWI318599B publication Critical patent/TWI318599B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/24—Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
TW097135922A 2007-09-21 2008-09-19 Mold release film TW200920589A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007245140 2007-09-21

Publications (2)

Publication Number Publication Date
TW200920589A TW200920589A (en) 2009-05-16
TWI318599B true TWI318599B (en) 2009-12-21

Family

ID=40467928

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097135922A TW200920589A (en) 2007-09-21 2008-09-19 Mold release film

Country Status (5)

Country Link
JP (1) JP4332204B2 (en)
KR (2) KR20100090728A (en)
CN (1) CN101678605B (en)
TW (1) TW200920589A (en)
WO (1) WO2009038118A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5245497B2 (en) * 2008-03-31 2013-07-24 住友ベークライト株式会社 Release film
JP5438367B2 (en) * 2009-04-27 2014-03-12 積水化学工業株式会社 Multi-layer release film
CN102791480B (en) * 2010-03-12 2015-06-17 积水化学工业株式会社 Mold release film and method for manufacturing mold release film
JP5565230B2 (en) * 2010-09-16 2014-08-06 日本ゼオン株式会社 Optical film roll and method for producing optical film roll
JP5907786B2 (en) * 2012-04-09 2016-04-26 倉敷紡績株式会社 Transfer film
JP5832480B2 (en) * 2012-10-19 2015-12-16 三井化学東セロ株式会社 Release film
JP5992091B2 (en) * 2013-03-14 2016-09-14 三井化学東セロ株式会社 Release film
JP5874768B2 (en) * 2013-04-30 2016-03-02 住友ベークライト株式会社 Release film and method of using release film
JP5874774B2 (en) * 2013-06-06 2016-03-02 住友ベークライト株式会社 Release film and method of using release film
JP6205874B2 (en) * 2013-06-07 2017-10-04 東レ株式会社 Release film
WO2015008759A1 (en) * 2013-07-16 2015-01-22 倉敷紡績株式会社 Mold-release film
JP6223913B2 (en) * 2013-08-05 2017-11-01 積水化学工業株式会社 Release film
JP6574468B2 (en) * 2013-08-05 2019-09-11 積水化学工業株式会社 Release film
JP5804141B1 (en) * 2014-06-18 2015-11-04 住友ベークライト株式会社 Release film
JP5862740B1 (en) * 2014-09-30 2016-02-16 住友ベークライト株式会社 Release film and method of using release film
JP6531555B2 (en) * 2014-10-31 2019-06-19 東レ株式会社 Polyester film for optical film production
JP6494761B2 (en) * 2015-07-24 2019-04-03 富士フイルム株式会社 Release film and adhesive laminate
JP2017047594A (en) * 2015-09-01 2017-03-09 大日本印刷株式会社 Decorative sheet, decorative molded product, and method for producing decorative molded product
JP6391554B2 (en) * 2015-12-14 2018-09-19 住友ベークライト株式会社 Release film
JP6970025B2 (en) * 2018-01-10 2021-11-24 タツタ電線株式会社 Electromagnetic wave shield film
JP7400263B2 (en) * 2018-08-23 2023-12-19 東レ株式会社 Film and film manufacturing method
WO2021010412A1 (en) * 2019-07-17 2021-01-21 株式会社クラレ Water-soluble film and package
TWI788659B (en) * 2020-04-24 2023-01-01 南亞塑膠工業股份有限公司 Method of manufacturing porous anti-adhesion film
KR102297307B1 (en) * 2020-08-18 2021-09-02 황진상 Preparation method of embossing release film for semiconductor package mold, and embossing release film thereof
CN117858800A (en) * 2021-08-31 2024-04-09 东洋纺株式会社 Release film for resin sheet molding
JP2023059203A (en) * 2021-10-14 2023-04-26 東レ株式会社 Release film for compression mold
KR102799321B1 (en) * 2023-01-27 2025-04-23 (주)상아프론테크 Fluorine-based release film, Semiconductor package manufacturing method using the same and Semiconductor package
JP7619507B1 (en) 2024-03-26 2025-01-22 住友ベークライト株式会社 Manufacturing method of release film and molded product
JP7619505B1 (en) 2024-03-26 2025-01-22 住友ベークライト株式会社 Manufacturing method of release film and molded product
JP7619506B1 (en) 2024-03-26 2025-01-22 住友ベークライト株式会社 Manufacturing method of release film and molded product

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1298451C (en) * 1985-08-02 1992-04-07 Hiromi Shigemoto Surface-roughened film and sheet, and process for production and use thereof
JP2701924B2 (en) * 1989-03-13 1998-01-21 三井石油化学工業株式会社 Release film made of poly-4-methyl-1-pentene having both surfaces roughened and method for producing the same
JPH0361011A (en) * 1989-07-28 1991-03-15 Mitsui Petrochem Ind Ltd Release film and its manufacturing method
JP3014421B2 (en) * 1990-08-22 2000-02-28 三井化学株式会社 Matte film for roughening the exterior board of multilayer printed circuit boards
WO2001015896A1 (en) * 1999-08-31 2001-03-08 Mitsubishi Plastics, Inc. Releasing laminated film
JP4580541B2 (en) * 2000-11-17 2010-11-17 大日本印刷株式会社 Release paper and synthetic leather produced using it
CN100577389C (en) * 2003-09-30 2010-01-06 积水化学工业株式会社 multilayer sheet
US7407712B2 (en) * 2003-12-26 2008-08-05 Sekisui Chemical Co., Ltd. Release film
JP2006130796A (en) * 2004-11-05 2006-05-25 Daicel Chem Ind Ltd Laminated body including polymethylpentene resin layer and method for producing the same
CN101175637B (en) * 2005-05-13 2012-07-25 三井化学株式会社 Laminate containing 4-methyl-1-pentene polymer and release film composed of it
JP2007083459A (en) * 2005-09-20 2007-04-05 Tohcello Co Ltd Surface-roughened film and its application
JP4894344B2 (en) 2006-04-25 2012-03-14 パナソニック電工株式会社 Single-sided board manufacturing method and multilayer printed wiring board

Also Published As

Publication number Publication date
WO2009038118A1 (en) 2009-03-26
JP4332204B2 (en) 2009-09-16
KR20100090728A (en) 2010-08-16
KR20090120519A (en) 2009-11-24
CN101678605A (en) 2010-03-24
TW200920589A (en) 2009-05-16
CN101678605B (en) 2013-04-10
KR101018621B1 (en) 2011-03-03
JP2009090647A (en) 2009-04-30

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