[go: up one dir, main page]

WO2009031536A1 - 絶縁シート及び積層構造体 - Google Patents

絶縁シート及び積層構造体 Download PDF

Info

Publication number
WO2009031536A1
WO2009031536A1 PCT/JP2008/065763 JP2008065763W WO2009031536A1 WO 2009031536 A1 WO2009031536 A1 WO 2009031536A1 JP 2008065763 W JP2008065763 W JP 2008065763W WO 2009031536 A1 WO2009031536 A1 WO 2009031536A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating sheet
thermal conductivity
acid anhydride
less
monomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065763
Other languages
English (en)
French (fr)
Inventor
Hiroshi Maenaka
Yasunari Kusaka
Takuji Aoyama
Isao Higuchi
Daisuke Nakajima
Takashi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007230482A external-priority patent/JP4922108B2/ja
Priority claimed from JP2007329140A external-priority patent/JP2009149770A/ja
Priority claimed from JP2008076347A external-priority patent/JP4922220B2/ja
Priority claimed from JP2008078797A external-priority patent/JP5150326B2/ja
Priority claimed from JP2008078796A external-priority patent/JP2009231249A/ja
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to US12/676,435 priority Critical patent/US20100297453A1/en
Priority to CN2008801058680A priority patent/CN101796106B/zh
Publication of WO2009031536A1 publication Critical patent/WO2009031536A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W40/251—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/427—Polyethers
    • H10W40/255—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Insulating Bodies (AREA)
  • Laminated Bodies (AREA)

Abstract

　熱伝導率が１０Ｗ／ｍ・Ｋ以上の熱伝導体を導電層に接着するのに用いられ、未硬化状態でのハンドリング性に優れており、かつ硬化物の接着性、耐熱性、絶縁破壊特性及び熱伝導性を高めることができる絶縁シートを提供する。 　熱伝導率が１０Ｗ／ｍ・Ｋ以上の熱伝導体を導電層に接着するのに用いられる絶縁シートであって、芳香族骨格を有し、かつ重量平均分子量が１万以上であるポリマー（Ａ）と、芳香族骨格を有し、かつ重量平均分子量が６００以下であるエポキシモノマー（Ｂ１）及びオキセタンモノマー（Ｂ２）の内の少なくとも一方のモノマー（Ｂ）と、フェノール樹脂、又は芳香族骨格もしくは脂環式骨格を有する酸無水物、該酸無水物の水添加物もしくは該酸無水物の変性物である硬化剤（Ｃ）と、フィラー（Ｄ）とを含有し、未硬化状態でのガラス転移温度Ｔｇが２５°C以下である絶縁シート。
PCT/JP2008/065763 2007-09-05 2008-09-02 絶縁シート及び積層構造体 Ceased WO2009031536A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/676,435 US20100297453A1 (en) 2007-09-05 2008-09-02 Insulating sheet and multilayer structure
CN2008801058680A CN101796106B (zh) 2007-09-05 2008-09-02 绝缘片及层压结构体

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2007-230482 2007-09-05
JP2007230482A JP4922108B2 (ja) 2007-09-05 2007-09-05 絶縁シート及び積層構造体
JP2007323527 2007-12-14
JP2007-323527 2007-12-14
JP2007-329140 2007-12-20
JP2007329140A JP2009149770A (ja) 2007-12-20 2007-12-20 絶縁シート及び積層構造体
JP2008076347A JP4922220B2 (ja) 2007-12-14 2008-03-24 絶縁シート及び積層構造体
JP2008-076347 2008-03-24
JP2008-078796 2008-03-25
JP2008078797A JP5150326B2 (ja) 2008-03-25 2008-03-25 絶縁シート及び積層構造体
JP2008078796A JP2009231249A (ja) 2008-03-25 2008-03-25 絶縁シート及び積層構造体
JP2008-078797 2008-03-25

Publications (1)

Publication Number Publication Date
WO2009031536A1 true WO2009031536A1 (ja) 2009-03-12

Family

ID=40428852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065763 Ceased WO2009031536A1 (ja) 2007-09-05 2008-09-02 絶縁シート及び積層構造体

Country Status (1)

Country Link
WO (1) WO2009031536A1 (ja)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010218975A (ja) * 2009-03-18 2010-09-30 Sekisui Chem Co Ltd 絶縁シート、積層板及び多層積層板
EP2264102A1 (en) * 2009-06-17 2010-12-22 Hitachi Industrial Equipment Systems Co., Ltd. Cast insulation resin for electric apparatus and high voltage electric apparatus using the same
CN102803335A (zh) * 2009-06-22 2012-11-28 陶氏环球技术有限责任公司 环氧树脂的硬化剂组合物
CN102947390A (zh) * 2010-06-22 2013-02-27 住友电木株式会社 用于形成构成金属基底基板的树脂层的树脂组合物、金属基底基板以及金属基底基板的制造方法
JP2013159098A (ja) * 2012-02-08 2013-08-19 Sekisui Chem Co Ltd 積層構造体
EP2316897A4 (en) * 2008-08-18 2013-08-21 Sekisui Chemical Co Ltd INSULATION FOIL AND COATED STRUCTURE
WO2016088832A1 (ja) * 2014-12-04 2016-06-09 積水化学工業株式会社 硬化性組成物、硬化性組成物の製造方法及び半導体装置
JP2017036415A (ja) * 2015-08-12 2017-02-16 三菱化学株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
EP3176198A1 (en) * 2015-12-03 2017-06-07 Industrial Technology Research Institute Epoxy resin compositions and thermal interface materials comprising the same
WO2019160143A1 (ja) * 2018-02-19 2019-08-22 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
WO2021193690A1 (ja) * 2020-03-26 2021-09-30 日本アエロジル株式会社 絶縁性フィラー及びその製造方法、該絶縁性フィラーを含む絶縁材及びその製造方法
EP3826437A4 (en) * 2018-07-18 2022-04-20 Mitsubishi Materials Corporation METAL BASE SUBSTRATE
CN117255474A (zh) * 2023-09-26 2023-12-19 广东格斯泰科技有限公司 一种耐高温树脂基覆铜箔层压板及其制备方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04323889A (ja) * 1991-04-23 1992-11-13 Matsushita Electric Works Ltd 金属ベース配線基板
JPH0883963A (ja) * 1994-09-12 1996-03-26 Hitachi Chem Co Ltd 金属ベース基板
WO1996031574A1 (en) * 1995-04-04 1996-10-10 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
JPH08332696A (ja) * 1995-06-06 1996-12-17 Hitachi Chem Co Ltd 絶縁接着材料付き金属体及びその製造方法
JPH09186462A (ja) * 1996-01-04 1997-07-15 Hitachi Chem Co Ltd 多層フレキシブルプリント配線板の製造方法
JPH10242606A (ja) * 1997-02-27 1998-09-11 Hitachi Chem Co Ltd 金属ベース基板
JP2004172597A (ja) * 2002-10-30 2004-06-17 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2004250470A (ja) * 2003-02-18 2004-09-09 Hitachi Chem Co Ltd 絶縁樹脂組成物及びその使用
JP2006261555A (ja) * 2005-03-18 2006-09-28 Mitsubishi Electric Corp 冷却構造体、ヒートシンクおよび発熱体の冷却方法
JP2007145996A (ja) * 2005-11-28 2007-06-14 Fujitsu Ltd アンダーフィル組成物及びそれを用いた半導体装置
JP2007246861A (ja) * 2006-03-20 2007-09-27 Nippon Steel Chem Co Ltd 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
WO2007129662A1 (ja) * 2006-05-08 2007-11-15 Sekisui Chemical Co., Ltd. 絶縁材料、電子部品装置の製造方法及び電子部品装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04323889A (ja) * 1991-04-23 1992-11-13 Matsushita Electric Works Ltd 金属ベース配線基板
JPH0883963A (ja) * 1994-09-12 1996-03-26 Hitachi Chem Co Ltd 金属ベース基板
WO1996031574A1 (en) * 1995-04-04 1996-10-10 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
JPH08332696A (ja) * 1995-06-06 1996-12-17 Hitachi Chem Co Ltd 絶縁接着材料付き金属体及びその製造方法
JPH09186462A (ja) * 1996-01-04 1997-07-15 Hitachi Chem Co Ltd 多層フレキシブルプリント配線板の製造方法
JPH10242606A (ja) * 1997-02-27 1998-09-11 Hitachi Chem Co Ltd 金属ベース基板
JP2004172597A (ja) * 2002-10-30 2004-06-17 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2004250470A (ja) * 2003-02-18 2004-09-09 Hitachi Chem Co Ltd 絶縁樹脂組成物及びその使用
JP2006261555A (ja) * 2005-03-18 2006-09-28 Mitsubishi Electric Corp 冷却構造体、ヒートシンクおよび発熱体の冷却方法
JP2007145996A (ja) * 2005-11-28 2007-06-14 Fujitsu Ltd アンダーフィル組成物及びそれを用いた半導体装置
JP2007246861A (ja) * 2006-03-20 2007-09-27 Nippon Steel Chem Co Ltd 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
WO2007129662A1 (ja) * 2006-05-08 2007-11-15 Sekisui Chemical Co., Ltd. 絶縁材料、電子部品装置の製造方法及び電子部品装置

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2316897A4 (en) * 2008-08-18 2013-08-21 Sekisui Chemical Co Ltd INSULATION FOIL AND COATED STRUCTURE
JP2010218975A (ja) * 2009-03-18 2010-09-30 Sekisui Chem Co Ltd 絶縁シート、積層板及び多層積層板
EP2264102A1 (en) * 2009-06-17 2010-12-22 Hitachi Industrial Equipment Systems Co., Ltd. Cast insulation resin for electric apparatus and high voltage electric apparatus using the same
CN101928443A (zh) * 2009-06-17 2010-12-29 株式会社日立产机系统 电气设备用绝缘铸型树脂及使用其的高电压电气设备
CN102803335A (zh) * 2009-06-22 2012-11-28 陶氏环球技术有限责任公司 环氧树脂的硬化剂组合物
CN106832224A (zh) * 2009-06-22 2017-06-13 蓝立方知识产权有限责任公司 环氧树脂的硬化剂组合物
CN102947390B (zh) * 2010-06-22 2018-06-22 住友电木株式会社 用于形成构成金属基底基板的树脂层的树脂组合物、金属基底基板以及金属基底基板的制造方法
CN102947390A (zh) * 2010-06-22 2013-02-27 住友电木株式会社 用于形成构成金属基底基板的树脂层的树脂组合物、金属基底基板以及金属基底基板的制造方法
JP2013159098A (ja) * 2012-02-08 2013-08-19 Sekisui Chem Co Ltd 積層構造体
WO2016088832A1 (ja) * 2014-12-04 2016-06-09 積水化学工業株式会社 硬化性組成物、硬化性組成物の製造方法及び半導体装置
JPWO2016088832A1 (ja) * 2014-12-04 2017-04-27 積水化学工業株式会社 硬化性組成物、硬化性組成物の製造方法及び半導体装置
JP2017036415A (ja) * 2015-08-12 2017-02-16 三菱化学株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
EP3176198A1 (en) * 2015-12-03 2017-06-07 Industrial Technology Research Institute Epoxy resin compositions and thermal interface materials comprising the same
US10059866B2 (en) 2015-12-03 2018-08-28 Industrial Technology Research Institute Epoxy resin compositions and thermal interface materials comprising the same
WO2019160143A1 (ja) * 2018-02-19 2019-08-22 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
JPWO2019160143A1 (ja) * 2018-02-19 2020-12-03 昭和電工マテリアルズ株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
EP3826437A4 (en) * 2018-07-18 2022-04-20 Mitsubishi Materials Corporation METAL BASE SUBSTRATE
WO2021193690A1 (ja) * 2020-03-26 2021-09-30 日本アエロジル株式会社 絶縁性フィラー及びその製造方法、該絶縁性フィラーを含む絶縁材及びその製造方法
JP2021155243A (ja) * 2020-03-26 2021-10-07 日本アエロジル株式会社 絶縁性フィラー及びその製造方法、該絶縁性フィラーを含む絶縁材及びその製造方法。
US11718729B2 (en) 2020-03-26 2023-08-08 Nippon Aerosil Co., Ltd. Insulating filler and production method therefor, insulating material containing said insulating filler and production method therefor
CN117255474A (zh) * 2023-09-26 2023-12-19 广东格斯泰科技有限公司 一种耐高温树脂基覆铜箔层压板及其制备方法
CN117255474B (zh) * 2023-09-26 2024-03-26 广东格斯泰科技有限公司 一种耐高温树脂基覆铜箔层压板及其制备方法

Similar Documents

Publication Publication Date Title
WO2009031536A1 (ja) 絶縁シート及び積層構造体
JP7370310B2 (ja) 熱硬化性樹脂組成物及びこれを用いたプリプレグ、積層シート、並びに印刷回路基板
JP5463110B2 (ja) カバーレイフィルム
CN102115569B (zh) 介电材料组合物及电路基板
CN106103534B (zh) 芳香族胺树脂、马来酰亚胺树脂、固化性树脂组合物及其固化物
CN106489183A (zh) 绝缘电线及其制造方法
KR102337574B1 (ko) 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판
CN107075222A (zh) 树脂组合物、使用了该树脂组合物的绝缘膜和半导体装置
TWI618470B (zh) 印刷線路板
CN105599389B (zh) 柔性金属层压板
KR20210055234A (ko) 고내열 저유전 폴리이미드 필름 및 이의 제조방법
CN105017959B (zh) 电缆电线用绝缘漆
US9107307B2 (en) Resin composition for printed circuit board, insulating film, prepreg, and printed circuit board
KR102723828B1 (ko) 접착제 조성물, 열경화성 접착 시트 및 프린트 배선판
JP2012241147A (ja) 難燃性接着剤組成物、それを用いた接着シート及びカバーレイフィルム
CN103819870A (zh) 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板
US8415004B2 (en) Low thermal-impedance insulated metal substrate and method for manufacturing the same
EP1375553A4 (en) HARDENABLE RESIN, HARD RESISTANT RESIN, HARDENABLE FILM AND ISOLATOR
KR102187491B1 (ko) 필름용 수지 조성물, 절연 필름 및 반도체 장치
CN107001886A (zh) 粘合剂树脂组合物、粘合膜和柔性金属层合体
WO2015088245A1 (ko) 저유전 손실 특성을 가진 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
KR20140079064A (ko) 내열성 실리콘 이형필름
KR20210055267A (ko) 고내열 저유전 폴리이미드 필름 및 이의 제조방법
JP2009067029A (ja) 樹脂付銅箔並びに樹脂付銅箔を用いた銅張積層板及び両面銅張積層板
CN117941013A (zh) 绝缘导体及制造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880105868.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08829764

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20107003904

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 12676435

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 08829764

Country of ref document: EP

Kind code of ref document: A1