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WO2009024565A1 - Module pour électronique intégrée de commande de construction simplifiée - Google Patents

Module pour électronique intégrée de commande de construction simplifiée Download PDF

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Publication number
WO2009024565A1
WO2009024565A1 PCT/EP2008/060825 EP2008060825W WO2009024565A1 WO 2009024565 A1 WO2009024565 A1 WO 2009024565A1 EP 2008060825 W EP2008060825 W EP 2008060825W WO 2009024565 A1 WO2009024565 A1 WO 2009024565A1
Authority
WO
WIPO (PCT)
Prior art keywords
connection
printed circuit
base element
circuit boards
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/060825
Other languages
German (de)
English (en)
Inventor
Karl Smirra
Josef Loibl
Thomas Preuschl
Hermann-Josef Robin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of WO2009024565A1 publication Critical patent/WO2009024565A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Definitions

  • the invention relates to a module for an integrated control electronics according to the preamble of patent claim 1 and to a method for producing such a module, in particular for gear or motor controls in the automotive industry.
  • control units In automotive engineering, components such as transmission, engine or brake systems are increasingly being primarily electronically controlled. There is a trend towards integrated mechatronic controls, ie the integration of control electronics and the associated electronic components such as sensors or valves in the transmission, the engine or the brake system. Control units thus generally have a plurality of electronic components, which are in connection with other components outside of the control unit. In such "on-the-spot" electronics, these controls are no longer housed in a separate protected electronics room and therefore have to withstand corresponding environmental influences and mechanical, thermal and chemical stresses.
  • housings are usually used for this purpose in special housings.
  • the housings fulfill an important shielding function.
  • an electrical connection from the inside of the housing to the outside of the housing is necessary.
  • the distribution of electrical signals and currents are realized in current series applications by leadframes or by the use of flexible printed circuit boards (FPCB).
  • FPCB flexible printed circuit boards
  • the usual structure for such integrated mechatronic applications consists of a ceramic substrate which contains the various electronic components of the central control unit. This ceramic substrate is connected by means of bonding with rigid or flexible printed circuit boards in order to enable the connection of the peripheral components to the central unit.
  • transmission control modules are housed in the transmission oil sump and are therefore completely surrounded by oil and the conductive contamination contained therein. This can be for example
  • a cover usually as a metallic, non-metallic or metallized housing cover, is applied to the housing bottom plate and hermetically sealed.
  • This composite of ceramic substrate, printed circuit boards and their connection to the electronic connection of the periphery as well as hermetically sealed housing is a significant cost driver.
  • the LTCCs low temperature co-fired ceramic
  • Their electronic connection via flexible printed circuit boards or punched grid to the outside of the sealed housing components is also complex and therefore costly.
  • PCB printed Circuit Boards
  • pressfit interconnector which has at least one pressfit pin or a press connector on two sides. having a fit pin area.
  • the disadvantage is that such a plug must be individually designed and made.
  • the installation and connection step of the plug to the printed circuit boards is an additional process that must meet the corresponding quality requirements and is expensive.
  • the object of the invention is therefore to provide a module for an integrated control electronics with a housing, a central control unit accommodated therein comprising various electronic components and an electronic connection between the housing interior and the housing exterior, which provides a simple and flexible connection to outside allows the components lying in the housing, wherein the electronic connection and the central control unit with a favorable utilization of utilization has a simplified and therefore more cost-effective structure and at the same time is protected against short circuiting and / or conductive contamination.
  • a module for an integrated control electronics with at least one housing cover and a base element as an electrical connection between the housing interior and outside of the housing components is proposed in which the base member carrier for the e- lektronischen components of the central control electronics and at the same time thermal connection to the bottom plate is and is formed from at least two electrically and mechanically directly interconnected two- or multi-layer PCB printed circuit boards, which are constructed the same or different.
  • a printed circuit board assembly of at least two electrically and mechanically directly interconnected two-layered or multi-layered PCB printed circuit boards is used as a base element for signal and potential distribution, which further comprises the electronic components of the carries central control unit and also ensures the derivation of the heat generated by the power units.
  • inexpensive, two-layer or multi-layered standard PCB printed circuit boards may preferably be used for the formation of the base element.
  • very fine line structures can be realized with PCB printed circuit boards compared to the stamped grid technology.
  • the multilayer design of the printed circuit boards can be used to de-link the signal and current paths.
  • connection is realized without a separate plug, so that the number of items and interfaces can be minimized.
  • the mechanical attachment and electrical connection of the at least two PCBs to the base member can be simplified and therefore made more cost effective. In this way, moreover, the number of interfaces can be significantly reduced and at the same time the length of the signal and current paths can be significantly shortened and kept to a minimum.
  • Connection of the PCBs according to the invention also has the advantage that the electrical connection is no longer accessible and therefore without an additional cover or seal against contamination, in particular against metallic chips or Parti- no and thus caused short circuits protected.
  • the at least two PCBs can be the same or different.
  • they can be constructed of different layers, in particular layers with different copper thicknesses, conductor track widths or layer numbers.
  • a complex circuit board structure of the base element a good utilization of utility and a variable adaptation to different requirements and applications possible.
  • At least one PCB of the base element may be at least partially deformable. This makes it possible, for example by bending the PCB, to produce three-dimensional structures.
  • the deformability can be achieved, for example, by printed circuit board areas which have a very thin core and very thin copper surfaces.
  • the core may have a thickness of 0.15 mm and the copper surfaces may have a thickness of 35 ⁇ m.
  • the direct connection of the PCBs can be realized by oppositely configured edges. According to the invention, this is understood to mean that the edges in one PCB can be milled from above and the other from below in such a way that the respective surfaces formed are substantially matched to one another. The edges are galvanically contacted with each other on their mutually facing surfaces.
  • the circuit boards can be connected to each other, for example by soldering or welding.
  • the direct connection of the circuit boards can be configured as a tongue and groove connection. According to the invention, this is understood to mean that essentially the entire width of the front side of a printed circuit board is configured as a groove and that of a second printed circuit board as a spring. This embodiment is particularly stable substantially vertically to the layer structure of the printed circuit boards.
  • the electrical and mechanical connection can be made possible in a parallel process, that is to say at the same time.
  • the galvanic contacting and the mechanical stabilization and attachment by gluing or lamination can be realized by soldering.
  • the parallel connection process may be configured such that respective solder pads are mounted on the printed circuit boards to be connected and these are placed on each other and further on at least one circuit board side, for example, an adhesive film, in particular acrylic adhesive film is provided. Subsequently, via the introduction of pressure and temperature, for example with a heat-sealing press, a solder joint can be produced and at the same time the adhesive can be crosslinked and cured.
  • Support according to the invention for the electronic components of the central control unit means that the customary ceramic substrates with the electronic components of the control electronics integrated therein can be applied to the base element.
  • the electronic components of the control electronics can also be integrated directly in the base element.
  • the use of expensive ceramic circuit carriers such as LTCCs (Low Temperature co-fired Ceramics) or HTCs (High Temperature Ceramics) and their connection can be avoided by means of rigid or flexible circuit boards to the peripheral components.
  • the electronic components of the central control electronics can be integrated in one or more printed circuit boards of the base element.
  • printed resistors or capacitors which can also be designed as lines or surfaces, as well as chips or complex chips (ICs) can be used. In this way, an increased long-term stability and an excellent connection to the signal and potential distribution are ensured.
  • the carrier effect, the signal and potential distribution and the thermal connection to the heat-dissipating bottom plate or closure can advantageously be taken over by a single component, namely the base element.
  • the bottom plate according to the invention may also be, for example, a hydraulic plate. In this way, significant costs of the ceramic LTCCs and their complex connection to the heat dissipation and the peripheral components such as sensors, valves or other actuators can be avoided compared with this form and use customary hitherto.
  • the module according to the invention may in a preferred development be laminated to a base plate.
  • the bottom plate is preferably made of a metallic material, more preferably it is made of aluminum.
  • the multilayer printed circuit board is laminated to the metallic bottom plate. This ensures a reliable and cost-effective fixation.
  • a seal of the electronics compartment down, for example, the transmission oil is achieved in this way.
  • the housing cover can be made of any material that allows a secure covering of the surface of the electronics compartment with the components of the central control unit and at the same time the necessary EMC Provides shielding values.
  • a metallized plastic molded body can be used.
  • the housing cover is also made of a metallic material such as steel. This results in an increased long-term stability and improved shielding over the entire life of the electronic control device.
  • an improved diffusion density is achieved.
  • the multilayer printed circuit boards of the base element may have different vias for thermal connection to the bottom plate and for electronic connection to the outside of the housing components.
  • the term via vertical interconnection access is understood according to the invention to mean a via contacting which is arranged between the interconnect levels of a multilayer printed circuit board. With the help of vias, it is also possible to change the printed circuit levels in two- or multi-layer printed circuit boards. This is particularly advantageous in terms of good unbundling of complex circuits.
  • the electronic connection of the components lying outside the housing can be carried out by means of press-fit technology and / or laser welding.
  • press-fit pins in the press-fit technology a variable, simple and secure electronic connection to the peripheral components can be produced.
  • this compound can also be produced by means of laser welding.
  • the nature of the connection is not critical and can be selected according to the respective requirements of the components and the existing process devices from known in the art methods.
  • the compounds can be releasably prepared, for example, as a plug or non-detachable by, for example, soldering or welding.
  • the base element is particularly preferred directly with the signal transmitters and receivers (especially sensors, valves, etc.) connected outside the housing.
  • the electronic components of the central control electronics can preferably be fastened and / or contacted by means of soldering methods or gluing on the base element.
  • the soldering method may be, for example, a reflow soldering method.
  • At least two two-layer or multi-layer printed circuit boards can be directly and electrically connected to a base element and the base element can be equipped with the electronic components of the central control electronics, applied to a base plate and connected to the outside of the Housing lying components connected and subsequently attached to the housing cover.
  • the equipping of the base element with the electronic components can take place either before or after application to the base plate.
  • one or more printed circuit boards of the base element can be equipped with electronic components.
  • the electronic components can be at least partially integrated in the base element.
  • the mechanical and electrical connection of the printed circuit boards to the base element can be produced in successive process steps or in a parallel executed step.
  • the execution in a parallel, that is, at the same time, executed step is particularly inexpensive and therefore preferred according to the invention.
  • the electrical connection can be made by soldering or welding and the mechanical connection of the printed circuit boards by lamination or gluing.
  • Ia and Ib a schematic sectional view of two PCB printed circuit boards in the production of a base member over the same opposite edges for a module according to the invention.
  • 2a and 2b is a schematic sectional view of two PCB printed circuit boards in the production of a base member via a tongue and groove joint for a module according to the invention.
  • Fig. 3 is a schematic representation of the production direct connection of two PCBs in a parallel process step. 3a and 3c are shown as sectional views and Fig. 3b as a plan view.
  • 1 a shows a schematic sectional view of two PCB printed circuit boards 1 a, 1 b for the production of a base element 2 via oppositely configured edges 3 a, 3 b for a module according to the invention.
  • the first PCB Ia can be milled from above and the second PCB Ib from below such that in each case a protruding edge 3a and 3b is formed, which carries on its surface in each case an exposed copper layer region 4a, 4b.
  • These exposed copper layer areas 4a, 4b are then available, for example, for a soldering or welding connection process.
  • the edges 3a and 3b can be designed so that they are matched in their dimensions exactly to each other and the two PCB Ia, Ib can be connected directly to each other electrically and mechanically.
  • the connection process designed in this way allows the electrical contacting of the conductor terplatten Ia, Ib be completely covered, so that a protection against metallic contamination, such as chips or particles, a short circuit caused thereby is ensured.
  • An additional cover or protective device is therefore not necessary according to the invention.
  • the PCBs Ia and Ib are constructed differently.
  • the PCB Ia has only two inner copper layers 5a, while the PCB Ib has four inner copper layers 5b. Due to the possible different technological design of the PCBs Ia and Ib, it is advantageously possible to easily provide very complex printed circuit board structures.
  • both printed circuit boards Ia, Ib carry electronic components 6a, 6b.
  • the electrical connection of the electronic components 6a, 6b on the circuit boards Ia and / or Ib can be done for example by bonding 7.
  • the mechanical fastening of the components 6a, 6b can be achieved by standard soldering methods, for example reflow soldering methods, or by gluing.
  • the electronic connection of peripheral components can be done, for example, with a Pressfit connection by Pressfit pins or by laser welding.
  • the electrical components of the control electronics can alternatively be integrated in one or both printed circuit boards.
  • the printed circuit boards may have different vias 8, for example for heat dissipation and / or electrical connection between the different layers.
  • FIG. 1b shows, like FIG. 1a, a schematic sectional representation of two PCB printed circuit boards 1a, 1b for the production of a base element 2 via diametrically opposed edges 3a, 3b for a module according to the invention.
  • the design and the structure essentially correspond to those of FIG. 1.
  • the exposed copper layer regions 4a, 4b can be connected in this embodiment shown by a welding process become.
  • the edges 3a, 3b may have a Z-axis-controlled milling or bore 9.
  • the protruding spring 10 can be formed on a first printed circuit board 1a by means of milling on one edge from above and below, while on a second printed circuit board 1b a recess 11 adapted thereto, ie the groove, is produced.
  • Groove 12 and spring 11 can be connected to each other by a Lochgalvanmaschine and telescoping without the need for additional fasteners, such as pressfit pins, must be used. The connection is therefore very stable. In addition, the preparation of the connection is simple and inexpensive.
  • FIG. 2b shows a schematic sectional view of two PCB printed circuit boards Ia, Ib in the manufacture of a base element 3 via a tongue and groove joint for a module according to the invention.
  • groove 11 and spring 10 are already joined to the base element 2.
  • a bore 12 can be guided by tongue and groove through which, for example, with a pin or a screw additional mechanical reinforcement can be achieved.
  • 3a to 3c show a schematic representation of the production of a direct connection of two PCBs 1a, 1b in a parallel process step.
  • a soldering process is used for electrical contacting and lamination or bonding for mechanical connection and stabilization.
  • the additional mechanical stabilization is advantageous since in application areas of gear technology often ambient temperatures up to 150 0 C or more can occur and at high temperatures solder joints lose their holding power.
  • 3a shows the two circuit boards Ia, Ib in a sectional view.
  • 3b shows a plan view of one of the circuit boards 1 on which an adhesive film 14 is arranged.
  • the adhesive film 14 has openings 13 in the area of the soldering pads 13.
  • 3 c shows the two printed circuit boards Ia, Ib in a sectional view.
  • the printed circuit boards Ia, Ib are positioned on each other so that the solder pads 13 come to rest on each other.
  • a solder joint can be made and at the same time the adhesive crosslinked and cured.
  • the introduction of pressure and temperature can be done for example with a heat seal press.
  • the electrical contacting of the printed circuit boards Ia, Ib can be completely covered, so that protection against metallic contamination, such as chips or particles, a short circuit caused thereby is ensured.
  • the printed circuit boards Ia, Ib may be the same or different, so that even complex basic elements 2 can be formed without problems.
  • the subdivision of the printed circuit boards Ia, Ib can be variably adapted to a wide variety of applications and requirements.
  • no additional plug and connection component is required for the purpose of direct connection of the printed circuit boards to the base element.
  • the length of the signal and current paths can be kept to a minimum by the direct connection of the printed circuit boards. This applies equally to the number of interfaces required.
  • the base elements 2 according to the invention are simple and inexpensive to manufacture and are characterized by a high stability.
  • a module for an integrated control electronics in which the function of the carrier for the electronic components on the one hand and at the same time the electronic connection to the peripheral components is taken over by a base element.
  • the signal and potential distribution can be ensured by the base element e- benso reliable and long-term stability as the thermal connection to the bottom plate or comparable heat dissipation.
  • the connection concept according to the invention makes it possible to construct complex printed circuit board structures as a base element, without having to design, provide and install an additional plug and connection component for this purpose.
  • the module thus provided is easy and variably assemble and can be manufactured inexpensively with standard processes. The assembly can therefore be easily and inexpensively integrated into the overall assembly process of an electronic device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un module pour une électronique intégrée de commande, comprenant au moins un couvercle de boîtier et un élément de base (2) servant d'élément de liaison électrique entre l'intérieur du boîtier et des composants situés à l'extérieur du boîtier. Selon l'invention, l'élément de base (2) fait office de support pour les composants électroniques de l'électronique de commande centrale et assure en même temps la liaison thermique avec la plaque de base, ledit élément de base étant constitué d'au moins deux cartes de circuits imprimés (1a, 1b) bicouches ou multicouches, directement reliées entre elles électriquement et mécaniquement, lesquelles cartes sont de construction identique ou différente. L'invention concerne également la fabrication d'un tel module et son utilisation.
PCT/EP2008/060825 2007-08-22 2008-08-19 Module pour électronique intégrée de commande de construction simplifiée Ceased WO2009024565A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007039618.1 2007-08-22
DE102007039618.1A DE102007039618B4 (de) 2007-08-22 2007-08-22 Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau

Publications (1)

Publication Number Publication Date
WO2009024565A1 true WO2009024565A1 (fr) 2009-02-26

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Application Number Title Priority Date Filing Date
PCT/EP2008/060825 Ceased WO2009024565A1 (fr) 2007-08-22 2008-08-19 Module pour électronique intégrée de commande de construction simplifiée

Country Status (2)

Country Link
DE (1) DE102007039618B4 (fr)
WO (1) WO2009024565A1 (fr)

Cited By (1)

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WO2016072338A1 (fr) * 2014-11-04 2016-05-12 株式会社村田製作所 Câble de ligne de transmission

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DE102010003927A1 (de) * 2010-04-13 2011-10-13 Zf Friedrichshafen Ag Steuermodul
EP2555600B1 (fr) * 2011-07-30 2018-05-23 Advanced Digital Broadcast S.A. Agencement de carte à circuit imprimé
DE202014100686U1 (de) * 2014-02-17 2015-06-01 Zumtobel Lighting Gmbh Leiterplatte mit speziellen Kupplungsbereichen

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DE19611584A1 (de) * 1995-08-07 1997-02-13 Mecanismos Aux Ind Betriebsbehältnisse für elektrische und elektronische Schaltungen
EP1381258A1 (fr) * 2001-03-29 2004-01-14 TDK Corporation Module haute frequence
US20030066682A1 (en) * 2001-10-10 2003-04-10 Biron Richard M. Printed circuit board electrical interconnects
US20040214466A1 (en) * 2003-04-25 2004-10-28 Wen-Yen Lin Joint connector of printed circuit board and manufacturing method thereof
US6981878B1 (en) * 2004-02-07 2006-01-03 Edward Herbert Connection system for fast power supplies
US20060289201A1 (en) * 2005-06-22 2006-12-28 Gi-Cherl Kim Backlight assembly, display device having the same, and method thereof
DE202006005045U1 (de) * 2006-03-24 2007-08-09 Würth Elektronik Rot am See GmbH & Co. KG Leiterplattenmodul

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016072338A1 (fr) * 2014-11-04 2016-05-12 株式会社村田製作所 Câble de ligne de transmission
US10153534B2 (en) 2014-11-04 2018-12-11 Murata Manufacturing Co., Ltd. Transmission line cable

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