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WO2009020050A1 - ワーク搬送方法及びワーク受渡し機構を有する装置 - Google Patents

ワーク搬送方法及びワーク受渡し機構を有する装置 Download PDF

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Publication number
WO2009020050A1
WO2009020050A1 PCT/JP2008/063796 JP2008063796W WO2009020050A1 WO 2009020050 A1 WO2009020050 A1 WO 2009020050A1 JP 2008063796 W JP2008063796 W JP 2008063796W WO 2009020050 A1 WO2009020050 A1 WO 2009020050A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesion layer
wafer
tool
securing
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063796
Other languages
English (en)
French (fr)
Inventor
Takeshi Segawa
Kiyofumi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Lintec Corp
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd, Lintec Corp filed Critical Shin Etsu Polymer Co Ltd
Priority to KR1020107002644A priority Critical patent/KR101486104B1/ko
Priority to US12/452,649 priority patent/US8529314B2/en
Priority to CN2008801009148A priority patent/CN101772835B/zh
Publication of WO2009020050A1 publication Critical patent/WO2009020050A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H10P72/0428—
    • H10P72/0442—
    • H10P72/3302—
    • H10P72/7602—
    • H10P72/78—

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　ウエハの両面を順次処理する場合、ウエハを確実に保持して所定の処理や搬送をできるようにする。 ウエハの一面に第１の固定治具（３ａ）を密着固定し、その他面に対し所定の処理を行った後、ウエハの他面に第２の固定治具（３ｂ）を密着固定し、第１の固定治具（３ａ）を脱離して第２の固定治具（３ｂ）にウエハを受け渡す。両固定治具は、治具本体（３１）と、その片面に設けた密着層（３２）とからなる。治具本体は、密着層を支持する複数の支持突起（３３）及び側壁（３４）を有し、側壁の端面に密着層が接着されて密着層と治具本体との間に側壁で囲われた区画空間（３５）が画成され、区画空間に連通する通気孔（３６）が形成され、区画空間内の空気の吸引により密着層が変形される。脱離の際、第１の固定治具の密着層を変形させ、両固定治具を相互に離間する方向に相対移動させる。
PCT/JP2008/063796 2007-08-09 2008-07-31 ワーク搬送方法及びワーク受渡し機構を有する装置 Ceased WO2009020050A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107002644A KR101486104B1 (ko) 2007-08-09 2008-07-31 작업물 반송 방법 및 작업물 전달 기구를 갖는 장치
US12/452,649 US8529314B2 (en) 2007-08-09 2008-07-31 Method of transporting work and apparatus with work handover mechanism
CN2008801009148A CN101772835B (zh) 2007-08-09 2008-07-31 工件输送方法以及具有工件交接机构的装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007208263A JP5663126B2 (ja) 2007-08-09 2007-08-09 ワーク搬送方法及びワーク受渡し機構を有する装置
JP2007-208263 2007-08-09

Publications (1)

Publication Number Publication Date
WO2009020050A1 true WO2009020050A1 (ja) 2009-02-12

Family

ID=40341284

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063796 Ceased WO2009020050A1 (ja) 2007-08-09 2008-07-31 ワーク搬送方法及びワーク受渡し機構を有する装置

Country Status (6)

Country Link
US (1) US8529314B2 (ja)
JP (1) JP5663126B2 (ja)
KR (1) KR101486104B1 (ja)
CN (1) CN101772835B (ja)
TW (1) TWI446478B (ja)
WO (1) WO2009020050A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014122968A1 (ja) * 2013-02-05 2014-08-14 新東工業株式会社 ブラシユニットおよびこのブラシユニットを備えたブラシ研磨装置、ブラシ研磨システム、およびブラシ研磨方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8489222B2 (en) * 2010-05-20 2013-07-16 Korea Nuclear Fuel Co., Ltd. Machine and method for grinding spacer grid of nuclear fuel assembly
JP2012243335A (ja) * 2011-05-17 2012-12-10 Sony Corp ディスク搬送装置及びディスクストレージシステム
JP5547147B2 (ja) * 2011-09-13 2014-07-09 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
EP2915189B1 (en) * 2012-11-02 2020-01-08 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
US9987747B2 (en) * 2016-05-24 2018-06-05 Semes Co., Ltd. Stocker for receiving cassettes and method of teaching a stocker robot disposed therein
WO2018043611A1 (ja) * 2016-09-05 2018-03-08 シャープ株式会社 搬送具及びその搬送具を用いた有機ｅｌ表示装置の製造方法
JP6866171B2 (ja) 2017-01-30 2021-04-28 コマツ産機株式会社 ワーク搬送装置
KR102581316B1 (ko) * 2017-07-12 2023-09-22 도쿄엘렉트론가부시키가이샤 반송 장치, 기판 처리 시스템, 반송 방법 및 기판 처리 방법
US12068190B2 (en) 2019-03-27 2024-08-20 Yaskawa Europe Technology Ltd. Semiconductor flipper
CN112103227A (zh) * 2019-06-18 2020-12-18 上海微电子装备（集团）股份有限公司 一种交接装置、半导体设备、半导体生产线以及交接方法
KR102679253B1 (ko) * 2021-12-30 2024-06-26 세메스 주식회사 본딩 장치 및 본딩 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005109489A1 (ja) * 2004-05-07 2005-11-17 Shin-Etsu Engineering Co., Ltd. ワーク除電方法及びその装置
JP2006318984A (ja) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法
JP2007096085A (ja) * 2005-09-29 2007-04-12 Shin Etsu Polymer Co Ltd 固定キャリア及びその使用方法
JP2007157847A (ja) * 2005-12-01 2007-06-21 Shin Etsu Polymer Co Ltd 吸着装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413145B1 (en) * 2000-04-05 2002-07-02 Applied Materials, Inc. System for polishing and cleaning substrates
JP4641781B2 (ja) * 2003-11-04 2011-03-02 三星電子株式会社 不均一強度を有する研磨面を使用した化学的機械的研磨装置および方法
JP2006027795A (ja) * 2004-07-14 2006-02-02 Toshiba Corp 吸着装置、ならびに板状部材の搬送方法、液晶表示装置の製造方法
JP4587828B2 (ja) 2005-02-03 2010-11-24 信越ポリマー株式会社 精密基板用の固定治具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005109489A1 (ja) * 2004-05-07 2005-11-17 Shin-Etsu Engineering Co., Ltd. ワーク除電方法及びその装置
JP2006318984A (ja) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法
JP2007096085A (ja) * 2005-09-29 2007-04-12 Shin Etsu Polymer Co Ltd 固定キャリア及びその使用方法
JP2007157847A (ja) * 2005-12-01 2007-06-21 Shin Etsu Polymer Co Ltd 吸着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014122968A1 (ja) * 2013-02-05 2014-08-14 新東工業株式会社 ブラシユニットおよびこのブラシユニットを備えたブラシ研磨装置、ブラシ研磨システム、およびブラシ研磨方法
US9597766B2 (en) 2013-02-05 2017-03-21 Sintokogio, Ltd. Brush unit, a device for brush-polishing that uses the brush unit, a system for brush-polishing, and a method for brush-polishing

Also Published As

Publication number Publication date
JP5663126B2 (ja) 2015-02-04
CN101772835B (zh) 2011-12-07
US20100189533A1 (en) 2010-07-29
KR101486104B1 (ko) 2015-01-23
JP2009043995A (ja) 2009-02-26
KR20100052471A (ko) 2010-05-19
TW200929422A (en) 2009-07-01
CN101772835A (zh) 2010-07-07
US8529314B2 (en) 2013-09-10
TWI446478B (zh) 2014-07-21

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