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WO2009019990A1 - Copper alloy sheet - Google Patents

Copper alloy sheet Download PDF

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Publication number
WO2009019990A1
WO2009019990A1 PCT/JP2008/063320 JP2008063320W WO2009019990A1 WO 2009019990 A1 WO2009019990 A1 WO 2009019990A1 JP 2008063320 W JP2008063320 W JP 2008063320W WO 2009019990 A1 WO2009019990 A1 WO 2009019990A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper alloy
orientation
alloy sheet
excel
stress relaxation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063320
Other languages
French (fr)
Japanese (ja)
Inventor
Yasuhiro Aruga
Daisuke Hashimoto
Koya Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007205630A external-priority patent/JP4324627B2/en
Priority claimed from JP2007232641A external-priority patent/JP4210703B1/en
Priority claimed from JP2007252037A external-priority patent/JP4210706B1/en
Priority claimed from JP2007252036A external-priority patent/JP4210705B1/en
Priority to EP13005148.5A priority Critical patent/EP2695957B1/en
Priority to EP08791572.4A priority patent/EP2184371B1/en
Priority to US12/672,092 priority patent/US20110223056A1/en
Priority to KR1020107002597A priority patent/KR101227315B1/en
Priority to CN200880024723A priority patent/CN101743333A/en
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to EP13005147.7A priority patent/EP2695956B1/en
Priority to EP13005149.3A priority patent/EP2695958B1/en
Publication of WO2009019990A1 publication Critical patent/WO2009019990A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/10Sockets for co-operation with pins or blades
    • H01R13/11Resilient sockets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Cu-Ni-Sn-P copper alloy sheets of specified compositions. (1) In one form of copper alloy sheet, the electric conductivity is 32% IACS or greater. Along the direction parallel to rolling direction, the stress relaxation coefficient is 15% or below. The 0.2% proof strength is 500 MPa or greater, and the elongation is 10% or greater. (2) In another form, not only the X-ray diffracted intensity ratio I(200)/I(220) on the surface of the copper alloy sheet is regulated to a given level or below but also the crystal grain diameter is reduced to thereby decrease the anisotropy of stress relaxation resistance property. (3) In a further form, the structure of the copper alloy sheet is caused to be an aggregate structure such that the orientation distribution density in B-orientation and the sum of orientation distribution densities in B-orientation, S-orientation and Cu-orientation fall within specified ranges to thereby attain an enhancement of bending workability. (4) In still a further form, the dislocation density determined as the quotient of the half-value breadth of X-ray diffracted intensity peak from the {200} face of the copper alloy sheet surface divided by the height of the peak is a given level or greater to thereby attain an enhancement of press punchability. These Cu-Ni-Sn-P copper alloy sheets excel in the performance demanded for terminal/connector. Further, they excel in strength-ductility balance (1), or are satisfactory in the stress relaxation resistance property along the direction perpendicular to rolling direction (2), or excel in bending workability (3), or excel in press punchability (4).
PCT/JP2008/063320 2007-08-07 2008-07-24 Copper alloy sheet Ceased WO2009019990A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP13005149.3A EP2695958B1 (en) 2007-08-07 2008-07-24 Copper alloy sheet
EP13005147.7A EP2695956B1 (en) 2007-08-07 2008-07-24 Copper alloy sheet
EP13005148.5A EP2695957B1 (en) 2007-08-07 2008-07-24 Copper alloy sheet
CN200880024723A CN101743333A (en) 2007-08-07 2008-07-24 copper alloy sheet
EP08791572.4A EP2184371B1 (en) 2007-08-07 2008-07-24 Copper alloy sheet
US12/672,092 US20110223056A1 (en) 2007-08-07 2008-07-24 Copper alloy sheet
KR1020107002597A KR101227315B1 (en) 2007-08-07 2008-07-24 Copper alloy plate

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007-205630 2007-08-07
JP2007205630A JP4324627B2 (en) 2007-08-07 2007-08-07 Copper alloy sheet with excellent strength-ductility balance
JP2007232641A JP4210703B1 (en) 2007-09-07 2007-09-07 Copper alloy sheet with excellent stress relaxation resistance and bending workability
JP2007-232641 2007-09-07
JP2007-252036 2007-09-27
JP2007252036A JP4210705B1 (en) 2007-09-27 2007-09-27 Copper alloy sheet with excellent stress relaxation resistance and press punchability
JP2007252037A JP4210706B1 (en) 2007-09-27 2007-09-27 Copper alloy sheet with excellent stress relaxation resistance
JP2007-252037 2007-09-27

Publications (1)

Publication Number Publication Date
WO2009019990A1 true WO2009019990A1 (en) 2009-02-12

Family

ID=40341225

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063320 Ceased WO2009019990A1 (en) 2007-08-07 2008-07-24 Copper alloy sheet

Country Status (5)

Country Link
US (1) US20110223056A1 (en)
EP (4) EP2695956B1 (en)
KR (1) KR101227315B1 (en)
CN (1) CN101743333A (en)
WO (1) WO2009019990A1 (en)

Cited By (3)

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US7776163B2 (en) 2008-12-23 2010-08-17 Xiamen Lota International Co., Ltd. Lead-free free-cutting aluminum brass alloy and its manufacturing method
JP2012084487A (en) * 2010-10-14 2012-04-26 Yazaki Corp Female terminal, and method of manufacturing the same
WO2016171054A1 (en) * 2015-04-24 2016-10-27 古河電気工業株式会社 Copper alloy sheet material, and method for producing same

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JP4615628B2 (en) * 2008-10-22 2011-01-19 古河電気工業株式会社 Copper alloy material, electrical and electronic component, and method for producing copper alloy material
JP4831258B2 (en) * 2010-03-18 2011-12-07 三菱マテリアル株式会社 Sputtering target and manufacturing method thereof
CN103703154B (en) * 2011-08-04 2015-11-25 株式会社神户制钢所 Copper alloy
JP5117604B1 (en) * 2011-08-29 2013-01-16 Jx日鉱日石金属株式会社 Cu-Ni-Si alloy and method for producing the same
JP5126436B1 (en) * 2012-02-17 2013-01-23 日立電線株式会社 Rolled copper foil
US9002499B2 (en) * 2012-03-20 2015-04-07 GM Global Technology Operations LLC Methods for determining a recovery state of a metal alloy
JP5470483B1 (en) * 2012-10-22 2014-04-16 Jx日鉱日石金属株式会社 Copper alloy sheet with excellent conductivity and stress relaxation properties
JP5417523B1 (en) * 2012-12-28 2014-02-19 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment
KR101274063B1 (en) * 2013-01-22 2013-06-12 한국기계연구원 A metal matrix composite with two-way shape precipitation and method for manufacturing thereof
JP5417539B1 (en) * 2013-01-28 2014-02-19 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment
JP5501495B1 (en) * 2013-03-18 2014-05-21 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment
JP5604549B2 (en) * 2013-03-18 2014-10-08 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment
CN103421983B (en) * 2013-08-23 2015-08-19 苏州长盛机电有限公司 A kind of preparation method of pack fong
CN103526070A (en) * 2013-09-29 2014-01-22 苏州市凯业金属制品有限公司 Silicon bronze alloy metal tube
JP6050738B2 (en) * 2013-11-25 2016-12-21 Jx金属株式会社 Copper alloy sheet with excellent conductivity, moldability and stress relaxation properties
CN104046813B (en) * 2014-06-05 2016-06-29 锐展(铜陵)科技有限公司 A kind of preparation method of automobile electric wire cable copper alloy with high strength and high conductivity line
US20170251522A1 (en) * 2014-11-06 2017-08-31 Hirschmann Car Communication Gmbh Contact pin made of copper wire
CN104928528A (en) * 2015-07-06 2015-09-23 苏州科茂电子材料科技有限公司 Conductive copper alloy material and preparing method thereof
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CN105400989A (en) * 2015-11-13 2016-03-16 太仓荣中机电科技有限公司 Electronic alloy material containing rare earth elements
KR101627696B1 (en) 2015-12-28 2016-06-07 주식회사 풍산 Copper alloy material for car and electrical and electronic components and process for producing same
CN107046763B (en) * 2016-02-05 2019-12-24 Jx金属株式会社 Copper foil for flexible printed circuit board, copper clad laminate using same
CN106987739B (en) * 2017-04-05 2018-10-26 浙江大学 Copper alloy and preparation method thereof for high ferro contact line
CN107723499A (en) * 2017-09-20 2018-02-23 宁波兴敖达金属新材料有限公司 The tellurium silver chromium-bronze material of lead-free free-cutting high-strength high-plasticity high conductivity
JP6648088B2 (en) * 2017-10-19 2020-02-14 Jx金属株式会社 Rolled copper foil for negative electrode current collector of secondary battery, secondary battery negative electrode and secondary battery using the same, and method of producing rolled copper foil for negative electrode current collector of secondary battery
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JPS6299430A (en) * 1985-10-26 1987-05-08 Dowa Mining Co Ltd Copper alloy for terminal or connector and its manufacture
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JPH11293367A (en) 1998-04-13 1999-10-26 Kobe Steel Ltd Copper alloy excellent in property of proof stress relaxation, and its production
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JPH11293367A (en) 1998-04-13 1999-10-26 Kobe Steel Ltd Copper alloy excellent in property of proof stress relaxation, and its production
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JP2005029857A (en) 2003-07-09 2005-02-03 Nikko Metal Manufacturing Co Ltd High tensile and high conductivity copper alloy having excellent ductility
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See also references of EP2184371A4 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7776163B2 (en) 2008-12-23 2010-08-17 Xiamen Lota International Co., Ltd. Lead-free free-cutting aluminum brass alloy and its manufacturing method
JP2012084487A (en) * 2010-10-14 2012-04-26 Yazaki Corp Female terminal, and method of manufacturing the same
US9356412B2 (en) 2010-10-14 2016-05-31 Yazaki Corporation Female terminal and method for fabricating female terminal
US9698554B2 (en) 2010-10-14 2017-07-04 Dowa Metaltech Co., Ltd. Female terminal fabricating method
WO2016171054A1 (en) * 2015-04-24 2016-10-27 古河電気工業株式会社 Copper alloy sheet material, and method for producing same
JPWO2016171054A1 (en) * 2015-04-24 2017-05-18 古河電気工業株式会社 Copper alloy sheet and manufacturing method thereof
TWI698537B (en) * 2015-04-24 2020-07-11 日商古河電氣工業股份有限公司 Copper alloy plate and its manufacturing method

Also Published As

Publication number Publication date
EP2695958B1 (en) 2018-12-26
EP2695957A2 (en) 2014-02-12
EP2184371A4 (en) 2013-05-01
EP2695956A2 (en) 2014-02-12
EP2695956A3 (en) 2014-06-18
EP2695956B1 (en) 2018-12-19
KR101227315B1 (en) 2013-01-28
CN101743333A (en) 2010-06-16
US20110223056A1 (en) 2011-09-15
EP2695957A3 (en) 2014-07-02
KR20100031138A (en) 2010-03-19
EP2184371B1 (en) 2016-11-30
EP2695957B1 (en) 2018-11-28
EP2695958A2 (en) 2014-02-12
EP2695958A3 (en) 2014-07-02
EP2184371A1 (en) 2010-05-12

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