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WO2009001554A1 - 回路装置 - Google Patents

回路装置 Download PDF

Info

Publication number
WO2009001554A1
WO2009001554A1 PCT/JP2008/001645 JP2008001645W WO2009001554A1 WO 2009001554 A1 WO2009001554 A1 WO 2009001554A1 JP 2008001645 W JP2008001645 W JP 2008001645W WO 2009001554 A1 WO2009001554 A1 WO 2009001554A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal substrate
resin layer
insulating resin
wiring
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001645
Other languages
English (en)
French (fr)
Inventor
Yoh Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to US12/667,031 priority Critical patent/US8363419B2/en
Publication of WO2009001554A1 publication Critical patent/WO2009001554A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H10W42/276—
    • H10W44/601—
    • H10W70/6875—
    • H10W72/00—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H10W72/381—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　金属基板２０の上に絶縁樹脂層３０が形成され、絶縁樹脂層３０の上に配線が形成されている。回路素子５０および受動素子６０からなる回路が配線４０の上に形成され、金属基板２０の上にオーバーコート８０および封止樹脂体９０が被覆されている。絶縁樹脂層３０には、金属基板２０の一部が露出するように開口３１が設けられている。金属基板２０の露出部分は、導線４２を介してキャパシタ６２の一方の端子と接続され、キャパシタ６２の他方の端子は接地電位に接続されている。
PCT/JP2008/001645 2007-06-27 2008-06-24 回路装置 Ceased WO2009001554A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/667,031 US8363419B2 (en) 2007-06-27 2008-06-24 Circuit device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-169772 2007-06-27
JP2007169772A JP5188110B2 (ja) 2007-06-27 2007-06-27 回路装置

Publications (1)

Publication Number Publication Date
WO2009001554A1 true WO2009001554A1 (ja) 2008-12-31

Family

ID=40185379

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001645 Ceased WO2009001554A1 (ja) 2007-06-27 2008-06-24 回路装置

Country Status (3)

Country Link
US (1) US8363419B2 (ja)
JP (1) JP5188110B2 (ja)
WO (1) WO2009001554A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104112731A (zh) * 2013-07-17 2014-10-22 广东美的制冷设备有限公司 智能功率模块及其制造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8158510B2 (en) * 2009-11-19 2012-04-17 Stats Chippac, Ltd. Semiconductor device and method of forming IPD on molded substrate
JP2013197223A (ja) * 2012-03-19 2013-09-30 Hitachi Automotive Systems Ltd 電子制御装置
DE102013219780A1 (de) * 2013-09-30 2015-04-02 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
KR102284123B1 (ko) * 2014-05-26 2021-07-30 삼성전기주식회사 회로기판, 전자부품 및 회로기판 제조방법
WO2016017260A1 (ja) 2014-07-30 2016-02-04 富士電機株式会社 半導体モジュール
US10084388B2 (en) * 2014-08-22 2018-09-25 Mitsubishi Electric Corporation Power conversion device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162691A (ja) * 1990-10-25 1992-06-08 Sanyo Electric Co Ltd 混成集積回路
JPH0637421A (ja) * 1992-07-17 1994-02-10 Sanyo Electric Co Ltd 混成集積回路
JP2005005445A (ja) * 2003-06-11 2005-01-06 Sanyo Electric Co Ltd 混成集積回路装置
JP2007157773A (ja) * 2005-11-30 2007-06-21 Sanyo Electric Co Ltd 回路装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
JPH11307689A (ja) * 1998-02-17 1999-11-05 Seiko Epson Corp 半導体装置、半導体装置用基板及びこれらの製造方法並びに電子機器
JP4436706B2 (ja) 2004-03-25 2010-03-24 三洋電機株式会社 混成集積回路装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162691A (ja) * 1990-10-25 1992-06-08 Sanyo Electric Co Ltd 混成集積回路
JPH0637421A (ja) * 1992-07-17 1994-02-10 Sanyo Electric Co Ltd 混成集積回路
JP2005005445A (ja) * 2003-06-11 2005-01-06 Sanyo Electric Co Ltd 混成集積回路装置
JP2007157773A (ja) * 2005-11-30 2007-06-21 Sanyo Electric Co Ltd 回路装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104112731A (zh) * 2013-07-17 2014-10-22 广东美的制冷设备有限公司 智能功率模块及其制造方法
CN104112731B (zh) * 2013-07-17 2017-03-22 广东美的制冷设备有限公司 智能功率模块及其制造方法

Also Published As

Publication number Publication date
US20100188059A1 (en) 2010-07-29
JP2009010143A (ja) 2009-01-15
JP5188110B2 (ja) 2013-04-24
US8363419B2 (en) 2013-01-29

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