[go: up one dir, main page]

WO2009001497A1 - Appareil de traitement au laser - Google Patents

Appareil de traitement au laser Download PDF

Info

Publication number
WO2009001497A1
WO2009001497A1 PCT/JP2008/000838 JP2008000838W WO2009001497A1 WO 2009001497 A1 WO2009001497 A1 WO 2009001497A1 JP 2008000838 W JP2008000838 W JP 2008000838W WO 2009001497 A1 WO2009001497 A1 WO 2009001497A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing apparatus
laser processing
laser
workpiece
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000838
Other languages
English (en)
Japanese (ja)
Inventor
Katsuhiko Hiratsuka
Manabu Nishihara
Yoshiya Shiraishi
Toshiichi Murakoshi
Noriyuki Tanaka
Takahiro Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2009520285A priority Critical patent/JP4947146B2/ja
Priority to CN2008800222457A priority patent/CN101687281B/zh
Publication of WO2009001497A1 publication Critical patent/WO2009001497A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne un appareil de traitement au laser. Une table XY destinée à maintenir une pièce à usiner présente une pluralité de parties de positionnement destinées à maintenir la pièce à usiner. La pluralité de parties de positionnement sont conçues pour monter et descendre. Lors du traitement d'un trou de passage par un laser, seule la partie de positionnement immédiatement en dessous du laser monte.
PCT/JP2008/000838 2007-06-28 2008-04-01 Appareil de traitement au laser Ceased WO2009001497A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009520285A JP4947146B2 (ja) 2007-06-28 2008-04-01 レーザ加工装置
CN2008800222457A CN101687281B (zh) 2007-06-28 2008-04-01 激光加工装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007169938 2007-06-28
JP2007-169938 2007-06-28

Publications (1)

Publication Number Publication Date
WO2009001497A1 true WO2009001497A1 (fr) 2008-12-31

Family

ID=40185325

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000838 Ceased WO2009001497A1 (fr) 2007-06-28 2008-04-01 Appareil de traitement au laser

Country Status (4)

Country Link
JP (1) JP4947146B2 (fr)
CN (1) CN101687281B (fr)
TW (1) TWI388390B (fr)
WO (1) WO2009001497A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102596484A (zh) * 2010-09-24 2012-07-18 松下电器产业株式会社 激光加工装置
JP2013071153A (ja) * 2011-09-28 2013-04-22 Hitachi Via Mechanics Ltd レーザ加工装置及び方法
WO2013136695A1 (fr) * 2012-03-16 2013-09-19 パナソニック株式会社 Dispositif de traitement au laser et procédé de traitement au laser
WO2020165140A1 (fr) * 2019-02-11 2020-08-20 Theodor Gräbener GmbH & Co. KG Dispositif et procédé pour la fabrication de tôles soudées au laser, en particulier pour la synchronisation de telles tôles ainsi qu'utilisation du dispositif et du procédé
JP2021159948A (ja) * 2020-03-31 2021-10-11 本田技研工業株式会社 レーザ加工装置及びレーザ加工方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012035721A1 (fr) * 2010-09-16 2012-03-22 パナソニック株式会社 Dispositif de traitement au laser et procédé de traitement au laser
DE102011003426A1 (de) * 2011-02-01 2012-08-02 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitungsanlage mit Absaugung
CN102528300B (zh) * 2011-12-28 2015-08-19 北京工业大学 吸盘式装夹装置
CN103433619B (zh) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 激光熔覆打印机及线路板的制作方法
JP6333786B2 (ja) * 2015-09-17 2018-05-30 ファナック株式会社 レーザ光路の清浄化機能を有するレーザ加工システム
JP6948888B2 (ja) * 2017-08-31 2021-10-13 株式会社神戸製鋼所 接合体の製造方法及び接合体の製造装置
CN112643226A (zh) * 2020-12-30 2021-04-13 赣州金顺科技有限公司 一种印制电路板激光成型的定位方法及其装置
CN112996248A (zh) * 2021-02-03 2021-06-18 深圳市同创鑫电子有限公司 一种线路板盲孔加工方法及相关装置
CN113001782A (zh) * 2021-02-24 2021-06-22 鄢丽媛 一种石墨稀薄膜切割设备
CN115041834B (zh) * 2022-06-20 2025-05-13 深圳市触点蓝天科技有限公司 基于机床坐标系的印制电路金属基板激光切割方法
CN117943761B (zh) * 2024-03-27 2024-06-21 山东义和鼎晟机械制造有限公司 一种直臂式高空作业车底盘焊接工装

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111291U (fr) * 1987-01-12 1988-07-16
JPH0671475A (ja) * 1992-08-27 1994-03-15 Shibuya Kogyo Co Ltd レーザ加工装置
JPH10296473A (ja) * 1997-02-06 1998-11-10 Matsushita Electric Ind Co Ltd レーザ加工装置およびレーザ加工方法
JPH11192571A (ja) * 1998-01-07 1999-07-21 Matsushita Electric Ind Co Ltd レーザー加工方法及びその装置
JP2000153427A (ja) * 1998-11-17 2000-06-06 Amada Co Ltd ワーク支持加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111291A (ja) * 1986-10-23 1988-05-16 Nobuyoshi Kuboyama 発熱装置
CN87212702U (zh) * 1987-10-03 1988-05-11 青岛发动机厂 微机控制工件孔激光处理机床
US6090330A (en) * 1997-02-06 2000-07-18 Matsushita Electric Industrial Co., Ltd. Laser processing method
JP3341154B2 (ja) * 1998-10-23 2002-11-05 ダイトーエムイー株式会社 三次元座標測定機
JP2005300248A (ja) * 2004-04-08 2005-10-27 Mitsutoyo Corp 載置テーブル、表面性状測定機および表面性状測定方法
CN2703602Y (zh) * 2004-05-12 2005-06-08 武汉楚天激光（集团）股份有限公司 多功能激光加工机

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111291U (fr) * 1987-01-12 1988-07-16
JPH0671475A (ja) * 1992-08-27 1994-03-15 Shibuya Kogyo Co Ltd レーザ加工装置
JPH10296473A (ja) * 1997-02-06 1998-11-10 Matsushita Electric Ind Co Ltd レーザ加工装置およびレーザ加工方法
JPH11192571A (ja) * 1998-01-07 1999-07-21 Matsushita Electric Ind Co Ltd レーザー加工方法及びその装置
JP2000153427A (ja) * 1998-11-17 2000-06-06 Amada Co Ltd ワーク支持加工装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102596484A (zh) * 2010-09-24 2012-07-18 松下电器产业株式会社 激光加工装置
CN102596484B (zh) * 2010-09-24 2014-12-10 松下电器产业株式会社 激光加工装置
JP2013071153A (ja) * 2011-09-28 2013-04-22 Hitachi Via Mechanics Ltd レーザ加工装置及び方法
WO2013136695A1 (fr) * 2012-03-16 2013-09-19 パナソニック株式会社 Dispositif de traitement au laser et procédé de traitement au laser
JP5370622B1 (ja) * 2012-03-16 2013-12-18 パナソニック株式会社 レーザ加工装置およびレーザ加工方法
CN103492118A (zh) * 2012-03-16 2014-01-01 松下电器产业株式会社 激光加工装置及激光加工方法
CN103492118B (zh) * 2012-03-16 2015-01-07 松下电器产业株式会社 激光加工装置及激光加工方法
WO2020165140A1 (fr) * 2019-02-11 2020-08-20 Theodor Gräbener GmbH & Co. KG Dispositif et procédé pour la fabrication de tôles soudées au laser, en particulier pour la synchronisation de telles tôles ainsi qu'utilisation du dispositif et du procédé
JP2021159948A (ja) * 2020-03-31 2021-10-11 本田技研工業株式会社 レーザ加工装置及びレーザ加工方法
JP7370293B2 (ja) 2020-03-31 2023-10-27 本田技研工業株式会社 レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
CN101687281A (zh) 2010-03-31
JP4947146B2 (ja) 2012-06-06
CN101687281B (zh) 2012-06-27
JPWO2009001497A1 (ja) 2010-08-26
TWI388390B (zh) 2013-03-11
TW200924894A (en) 2009-06-16

Similar Documents

Publication Publication Date Title
WO2009001497A1 (fr) Appareil de traitement au laser
WO2006078522A3 (fr) Conception de mise sous boitier pour diodes lumineuses
WO2006078530A3 (fr) Modeles de boitiers pour diodes electroluminescentes
AP2273A (en) Flotation process using an organometallic complex as activator.
CA124982S (en) Device for supporting a workpiece
WO2007108880A3 (fr) Plateau d'emballage de composants
PL2601121T3 (pl) Urządzenie do rozładunku płaskich wyrobów z płaszczyzny roboczej, płaskie wyroby mające części, na których wytwarzane są desenie i/lub napisy przez cięcie i/lub nacinanie
WO2008142629A3 (fr) Marqueur polyvalent
TWI346597B (en) Precision machining apparatus
MY160373A (en) Bonding structure and method
WO2012049216A3 (fr) Machine-outil, procédé d'usinage de pièces
EP2384840A4 (fr) Machine de coupe sur table
WO2010111048A3 (fr) Ensemble de perçage par étapes de trou d'interconnexion de carte de circuits imprimés
WO2010094565A3 (fr) Dispositif de traitement de pièces en forme de plaques
TWI348881B (en) Method for manufacturing wiring board with parts, method for manufacturing wiring board with solder humps, and wiring board
WO2011156268A3 (fr) Gabarit à goujons réglable
EP4145621A4 (fr) Carte de câblage et procédé de fabrication de carte de câblage
EP2186586A4 (fr) Procédé de rainurage et appareil de rainurage
WO2009066602A1 (fr) Procédé de découpage en dés
GB0722746D0 (en) Apparatus for supporting cutting tools
TWI318620B (en) Apparatus for cutting substrate
WO2013025141A8 (fr) Porte-outil
GB2442123B (en) Perforating gun loading bay,table and method
EP2263825B8 (fr) Procédé de fabrication de pièces usinées à partir d'une plaque de matériau
MX2013006876A (es) Kit para una porcion de secador de un secador y metodo para producir una porcion de secador de un secador.

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880022245.7

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08738450

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009520285

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08738450

Country of ref document: EP

Kind code of ref document: A1