200924894 九、發明說明：200924894 IX. Invention Description:
技術領域 本發明係有關於一種雷射加工裝置，該雷射加工裝置 5 係在照射雷射光進行力〇工的雷射加工裝置中，由一台加工 裝置提供盲孔加工（非貫穿孔加工）及通孔加工（貫穿孔加工) 兩種加工方式者。 I：先前技術】 ❹BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus 5 which is provided with a blind hole processing (non-through hole processing) by a processing apparatus in a laser processing apparatus that is irradiated with laser light. And through hole processing (through hole processing) two processing methods. I: Prior Art] ❹
背景技術 10 以往’為了對裝栽於電腦或可攜式終端裝置等的印刷 基板等被加工物進行鑽孔，而使用以雷射進行鑽孔的雷射 加工裝置。該雷射孔加工係將雷射的熱能集中照射於被加 工物之一部分來進行熱加工或燒蝕加工，故被除去之被加 工物會成為粉塵，而產生加工粉塵。另一方面，近年來， 15在作為代表性被加工物的印刷基板中，已進行多積層化、 微細化’且被要求維持清潔度適合基板製作步驟的環境及 減少對被加工物本身之粉塵附著。一般雖在被加工物的孔 力口工纽有洗淨步輝來對應，但從減輕洗淨步驟負擔、確 #工廠清潔度等方面來看，亦被要求儘可能降低加工粉塵 20 飛散及對被加工物之附著。 Λ種雷射加:L裝置為了要實現高速且微細的孔加工， 而搭載電流掃描器’高速地加工5Gmm左右的 四角形範圍。 般的被加工物中，加工範圍均大於’故藉由將被加 I物固疋保持在具有真空吸附功能的載置部或具有夾持機 5 200924894 構的載置部’並將該載置部震載於χγ工作台使之移動來 實現大於電流掃描器之掃描範圍的加工範圍。 此種由雷射對被加工物進行之孔加工中，大致分類可 分成通孔加工及盲孔加工2種，該通孔加工係對被加工物鐵 5出貫穿孔者’而該盲孔加工係留下作為被加工物之一的印 刷基板表面層的電路形成用銅箔並鑽出非貫穿孔者。習知 被加工物載置部在加工盲孔時，係以具有真空吸附功能的 平滑板狀來固定被加工物。加工盲孔時，一般是藉由將被 加工物直接吸附在裝載於ΧΥ工作台上，且具有真空吸附功 1〇能的平滑載置部來進行被加工物的保持。由於加工孔未貫 穿，故粉塵僅產生於被加工物上部。此時係藉由在被加工 物上部配備集塵機構來防止粉塵飛散。 但是，使用此種板狀載置部時，一旦加工通孔，則貫 穿之雷射將會於載置部表面反射而傷到被加工物之下層 15面，並且會傷到載置部表面。結果，將無法精度良好地維 持被要求平滑高精度之載置部。為避免此種情形，以往採 取的是藉由在被加工物下部放置保護材，並在加工後連同 被加工物一起移除，來避免雷射到達載置部的方法。又， 亦有將載置部加工成配合被加工物之加工圖案的形狀，使 20用於下部僅避開孔加工所需之最小部份的個別被加工物專 用形狀載置部的方法。此外，亦藉由根據從周圍保持被加 工物且針對被加工物之重力所致之彎曲從保持部施加拉力 等構造，使用不設置被加工物下部的載置部，而在下部裝 載集塵機構的構造等(例如，參照專利文獻1)各種方法來實 200924894 施加工。 如前述，習知雷射加工裝置中，用以實現盲孔加工及 通孔加工的機構有所不同，故雖在由同一裝置進行兩種加 工上花了各種功夫，卻仍各自包含有問題點。例如，在被 5加工物之加工面的相反側放置保護構件的方法中，用在對 全數被加工物加工時的保護構件必須作為消耗品，從成本 面、環境面來看已成為問題。又，配合被加工物的加工避 開加工裝置之被加工物載置部時，必須根據加工形狀改變 基板載置部，故品種對應的自由度低，從花在變更上的成 10本面、更換時間損耗所致之生產效率降低的面來看已成為 問題。 又’習知構造中’對應通孔加工而不具有被加工物下 部之載置部的構造’其被加工物會彎曲，但為了要高精度 地加工通孔（貫穿孔）則必須平面且高精度地保持被加工 15物。為了要實現此事，係藉由夾頭保持被加工物的周圍。 此時，為抑制中央部分的彎曲，在夾頭部設置拉力機構， 藉由對被加工物施加拉伸應力來確保精度。但是，該構造 中，由於對被加工物施加應力，故為了確保被加工物之伸 長精度，必須嚴密地管理拉力的量。並且，必須針對被加 20工物的材質、厚度、尺寸等種種條件個別管理拉力，故要 確保高精度的保持狀態是困難的。又，為了進行盲孔加工， 必須設計成在被加工物設置用以夾持的多餘空間。關於載 置部，為了要同時使用夾頭的保持方法及不使用夾頭的保 持方法，連同下部的集塵機構，還得伴隨載置部的大幅變 7 200924894 更’故在事實上是不可能的。[Background Art] In order to drill a workpiece such as a printed circuit board loaded on a computer or a portable terminal device, a laser processing device that drills with a laser is used. In the laser hole processing, the thermal energy of the laser is concentrated on a part of the workpiece to be subjected to hot working or ablation processing, so that the removed workpiece is dusted to generate processed dust. On the other hand, in recent years, in the printed circuit board which is a representative workpiece, it has been subjected to multi-layering and miniaturization, and it is required to maintain an environment in which the cleanliness is suitable for the substrate forming step and to reduce the dust on the workpiece itself. Attached. Generally, in the case of the hole punching of the workpiece, there is a cleaning step, but from the viewpoint of reducing the burden of the washing step, and confirming the cleanliness of the factory, it is also required to reduce the scattering of the processed dust 20 as much as possible. Attachment of the workpiece. In addition to the high-speed and fine hole machining, the L device is equipped with a current scanner to process a quadrangular range of about 5 Gmm at high speed. In the general workpiece, the processing range is larger than 'thereby holding the object to be fixed on the mounting portion having the vacuum adsorption function or the mounting portion having the holder 5 200924894 structure and mounting the same The partial shock is carried on the χγ table to move it to achieve a processing range larger than the scanning range of the current scanner. In the hole processing of the workpiece by the laser, the classification can be divided into two types of through hole processing and blind hole processing, and the through hole processing system is for the through hole of the workpiece iron 5 and the blind hole is processed. A copper foil for circuit formation of the surface layer of the printed substrate which is one of the workpieces is left and a non-through hole is drilled. Conventionally, when the blind spot is processed, the workpiece mounting portion fixes the workpiece in a smooth plate shape having a vacuum suction function. When a blind hole is machined, the workpiece is generally held by directly adsorbing the workpiece on a slab that is mounted on a boring table and has a vacuum suction function. Since the machined hole is not penetrated, the dust is only generated in the upper part of the workpiece. At this time, dust scattering is prevented by providing a dust collecting mechanism on the upper portion of the workpiece. However, when such a plate-shaped mounting portion is used, once the through hole is machined, the penetrating laser beam will be reflected on the surface of the mounting portion to damage the surface of the underlying layer 15 of the workpiece, and the surface of the mounting portion will be damaged. As a result, it is impossible to accurately maintain the mounting portion that is required to be smooth and highly accurate. In order to avoid this, in the past, a method of preventing the laser from reaching the mounting portion by placing a protective material under the workpiece and removing it together with the workpiece after processing is employed. Further, there is a method in which the mounting portion is processed to match the shape of the processing pattern of the workpiece, and 20 is used for the individual workpiece-specific shape mounting portion which is only required to avoid the minimum portion required for the hole processing. In addition, a structure in which a pulling force is applied from the holding portion by bending due to the gravity of the workpiece and the bending of the workpiece is used, and the mounting portion that does not provide the lower portion of the workpiece is used, and the dust collecting mechanism is mounted on the lower portion. Various methods such as the structure (for example, refer to Patent Document 1) are applied to the processing of 200924894. As described above, in the conventional laser processing apparatus, the mechanism for realizing the blind hole processing and the through hole processing is different, so although various efforts are made in performing the two processing by the same device, they still contain problems. . For example, in the method of placing the protective member on the opposite side to the machined surface of the workpiece, it is necessary to use the protective member for processing the entire workpiece as a consumable, which is a problem from the viewpoint of cost and environment. In addition, when the workpiece is placed in the workpiece mounting portion of the processing device, the substrate mounting portion must be changed according to the processing shape. Therefore, the degree of freedom corresponding to the type of the workpiece is low, and the surface is changed to 10 The reduction in production efficiency due to replacement of time loss has become a problem. Further, in the conventional structure, the structure corresponding to the through hole processing without the mounting portion of the lower portion of the workpiece is curved, but the workpiece must be curved in order to machine the through hole (through hole) with high precision. The workpiece 15 is accurately held. In order to achieve this, the periphery of the workpiece is held by the collet. At this time, in order to suppress the bending of the central portion, a tension mechanism is provided on the chuck portion, and the tensile stress is applied to the workpiece to ensure accuracy. However, in this configuration, since stress is applied to the workpiece, it is necessary to strictly manage the amount of tension in order to ensure the accuracy of the workpiece. In addition, it is necessary to individually manage the pulling force for various conditions such as the material, thickness, and size of the workpiece to be added, so it is difficult to ensure a high-precision holding state. Moreover, in order to perform blind hole processing, it is necessary to design an excess space for holding the workpiece. Regarding the mounting portion, in order to simultaneously use the chuck holding method and the method of holding the chuck, the dust collecting mechanism along with the lower portion has to be greatly changed along with the mounting portion. .
【專利文獻〗】特開平10-296473號公報 【發明内容J 發明揭示 5 本發明之雷射加工裝置具有將被加工物雷射加工的加 工頭、及保持且往XY方向驅動被加工物的χγ工作台。 工作台具有多數保持被加工物的載置部，且經常以至少以固 以上的載置部保持被加工物。XY工作台内，設有限制多數 載置部排法的工作台基座、及使多數栽置部各自 H)的升降驅動部，並相對於由加工頭進行之雷射照射方向控 制前述升降驅動部，使多數載置部中位於由加工頭進行之 雷射照射之位置的㈣部相對於其他載置部位於下部。 該構造中，由於使貫穿之雷射之位置處的載置部位於 下部，在貫穿加工時可藉由其他載置部穩穩地保持被加工 Μ物，且不會因貫穿之雷射而傷到載置部。而且，不必使用 對被加工物設置賴構件、針„純加卫 ==r…即可_孔_孔二 及通孔(貫穿孔)加工兩種加工方式來生產 產效率高的雷射加工裝置。 文了徒供生 2〇圖式簡單說明 造圖第1圖係本發明之實施型態之雷射加工裝置的概略構 圖係顯示構成本發明之實施型 的被加工物載置部詳細的立體圖。 200924894 第3圖係構$太I日月> _ 再成本發月之實施型態之雷射加工裝置的被 加工物載置部的部分截面圖。 【實施冷式】 實施發明之最佳態樣 5 Ο 10 15 20 以下根據圖式詳細說明本發明之雷射加工裝 置的實施 型態。另外，本發明不受限於該實施型態。 (實施型態） 第1圖係本發明之實施型態之雷射加工裝置的概略構 4圖本實施型態之雷射加工裝置如第1圖所示，具有藉由[Patent Document] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Workbench. The table has a plurality of mounting portions for holding the workpiece, and the workpiece is often held by the mounting portion having at least a solid portion. The XY table is provided with a table base that restricts the arrangement of the plurality of mounting portions, and a lifting and lowering driving unit for each of the plurality of planting portions H), and controls the lifting drive with respect to the laser irradiation direction by the processing head. The portion (4) of the plurality of mounting portions located at the position where the laser beam is irradiated by the processing head is located at a lower portion with respect to the other mounting portions. In this configuration, since the placing portion at the position where the laser beam is inserted is located at the lower portion, the workpiece can be stably held by the other mounting portion during the through process, and the workpiece is not damaged by the penetration laser. Go to the placement department. Moreover, it is not necessary to use a processing device that provides a high-efficiency laser processing device by providing a processing member, a needle, a pure cleaning device, a hole, a hole, a hole, and a through hole. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a detailed configuration of a workpiece mounting portion constituting an embodiment of the present invention, showing a detailed configuration of a laser processing apparatus according to an embodiment of the present invention. 200924894 Fig. 3 is a partial cross-sectional view of the workpiece mounting portion of the laser processing apparatus of the embodiment of the method of performing the cost of the monthly cost. [Implementation of the cold type] Aspect 5 Ο 10 15 20 Hereinafter, an embodiment of the laser processing apparatus of the present invention will be described in detail based on the drawings. Further, the present invention is not limited to the embodiment. (Embodiment) FIG. 1 is a view of the present invention. A schematic view of a laser processing apparatus of an embodiment of the present invention has a laser processing apparatus of the present embodiment as shown in FIG.
加控制410、雷射振盈器i卜電流掃描器、反射鏡(X 兄a Y鏡Ub)等所構成之光學系統I9及Μ透鏡I3。此 外’該雷射加工裝置具有χγ工作台17、加工祕、被加工 載置P15❿且，作為加卫對象的被加卫物κ被載置於 被加工物載置部15上並進行加工。 如前述所構成之本實施型態之雷射加工裝置中’從雷 射振盈器所射出之雷射光Ua會通過光學系統叫被引進 加工頭14。第㈣，XYZ轴各自位於直角方向Z轴方向 為垂直於XY轴形成之平面的方向，而χ為平行於紙面的方 向，且Υ為垂直於紙面的方向。 雷射光11a在通過光學系統19後會被整形成所要求之 形狀’並且被賦予所需之能量分布。雷射光〗丨 描器12控制辦面上的射出方向位置，並經過 聚光於被加工物上的加工點。 边蜆 一旦可由電流掃描器12控制射出方向位置的掃描加工 9 200924894 區域内的加工結束，則會作出移動XY工作台丨7使吸附固定 於載置部15的被加工物16之未加工區域朝可由電流掃描器 12掃描之加工區域範圍進入的動作，並再度開始加工。反 覆該等加工、移動，來加工大於電流掃描器12之加工區域 5 的被加工物16。 第2圖係顯示本發明之被加工物載置部15詳細的立體 圖。保持被加工物16的載置部15，其X方向被分割成8個對 應電流知描器12之掃描區域的寬度。將周圍四角框之固定 部分視為1個，則加起來共被分割成9個設有吸附孔的方塊。 10 第3圖係構成本發明之實施型態之雷射加工裴置的被 加工物載置部的部分截面圖，且係從γ軸方向所見之放大第 2圖中以圓圍成之部分的截面圖。被加工物16被放置在所分 割之載置部15a〜15e的上部。所分割之載置部15a〜15e具有 可個別往上下方向動作的構造，且按照來自加工控制部 15的控制訊號，藉由氣缸等升降驅動部27(參照第2圖）上下動 作。載置部15a〜15e的内部有中空部2〇，且載置部15。、 15d、15ei中空部20連通吸引裝置（未圖示）。在此中空部 2〇的内部呈負壓’使得吸引力25在上部之吸附孔28中發揮 作用來吸引固定被加工物16。 2〇 盲孔(非貫穿孔)加工時，載置部15會呈所有的吸附部均 上昇的狀態。接著，使用整面載置部吸附固定被加工物Μ 並進打加工。此時，藉由設置於被加工物16之上部的集塵 裝置18，吸引處理產生於被加工物16之上部的粉塵，來防 止粉塵飛散及對被加工物16之粉塵附著。 200924894 通孔（貫穿孔)加工時，電流掃描器12及乂丫工作台17的 動作雖與盲孔加工時相同，但會根據處理因加工孔貫穿而 產生於被加工物16之下部的粉塵及保護位於被加工物16之 下部的載置部的目的，而進行以下所示之動作。 5彳目當於電流掃描1112之掃描區域，亦即雷射可達範圍 之下。P處的載置部15b，受到輸人有被加工物資訊的加工控 制部10(參照第1圖）控制動作，且如第3圖所見般，僅在相當 於加工之下部處時下降。又，由氣體供應巢置綱供應之 氣體會從相鄰於載置部15b的載置部15e之下部喷出至載置 10部15b上方，且在下降中的載置部15b上空形成由氣體構成 之流道，使產生之_從載置部15b上空往栽置部以下方 的排出路徑移動。被排出之氣體會由氣體排出裝置％所吸 引並排出。第3圖中以3條箭頭表示前述氣體的動作。根據 該構造，對於除去產生於雷射加工時的粉塵，可藉由加上 μ氣體排出裝置24及氣體供應裝置23形成排出粉塵所需的氣 體流道，故可有效地進行粉塵之排出。要作出此種氣體流 道’必須連通位於下部的載置部15b之上部空間、及位於上 部的載置部15e或載置部15a之下部空間。因此，最前端之 載置部15a位於下部時，只要形成從載置部l5b之某一方向 供應氣體，且從載置部15b之其他方向排出氣體及粉塵的氣 體流道即可。又，亦可在周圍四角框之固定部分新設置最 前端專用的氣體排出孔或氣體供應孔。氣體使用的是乾燥 空氣或氮氣等。 〃 此時，邊取得用以排出粉塵的氣體供應量與排出量之 200924894 平衡邊進行排出與供應，使載置部内部（載置部15c等之下 部空間與載置部15b之上部空間）與載置部外部之差消失。 藉由該調整，可防止氣體壓力加諸至被加工物而產生變 形，使得保持精度惡化。此外，藉由從相鄰於位於下部之 5載置部的載置部輔助性地且局部性地使氣體流出，可抑制 王體的集塵氣體流量，故可將對加工基板產生的影響降到 最小並且實現有效的集塵功能。 10 15 20 —戰置部15上的電流掃描器12之掃描加工領域的力 工結束，則第2圖所示之XY工作台17會往γ方向（第3圖上& 深度方向）移動，並依序繼續進行加工。一旦 上面的被㈣分的㈣輯，_下=:= 域的裁置部15e會解除被加卫物16的吸附固定，且對之前一 直真工吸附的朗孔28進行真空破壞、喷氣，在不會對朝 區祕6產生影響的情況下下降。又，作為已結束加工之 日載置部说會上昇且吸引固定被加工物16。於此同 加工Jr作台17會進行移動，使電流掃描區域來到作為朝 的载置部^載置部以上空。又，從相鄰於作為新加工領域 形= '::載置部⑸下面進行喷氣，在載置部-面 依序進行粉塵的有效排出。此種移動及加工會 圍四角框^說^真空吸附的詳細情形及新的氣體供應。周 載置部二二定部分設錢體吸㈣卜載置部⑸與其他 體吸弓Inn、叫樣位於上部時，中空部2G的空氣會與氣 通’且氣體會由氣體吸收σ21所吸取並排An optical system I9 and a Μ lens I3 composed of a control 410, a laser oscillating device, a current scanner, a mirror (X-brother, a Y-Ub), and the like are added. In addition, the laser processing apparatus has a χγ table 17, a process, and a workpiece P15, and the object to be cured κ is placed on the workpiece mounting unit 15 and processed. In the laser processing apparatus of the present embodiment configured as described above, the laser light Ua emitted from the laser oscillator is introduced into the processing head 14 through an optical system. In the fourth (fourth), the XYZ axes are each located in the direction of the right-angle direction, and the direction of the Z-axis is a direction perpendicular to the plane formed by the XY-axis, and χ is a direction parallel to the plane of the paper, and Υ is a direction perpendicular to the plane of the paper. The laser light 11a is shaped to form the desired shape after passing through the optical system 19 and is imparted with the desired energy distribution. The laser light scanner 12 controls the position of the exit direction on the surface and passes through a processing point that is concentrated on the workpiece. Once the edge processing is controlled by the current scanner 12, the scanning processing in the area of the exiting direction is completed. In the area where the processing in the area of 200924894 is completed, the moving XY table 7 is moved to fix the unprocessed area of the workpiece 16 fixed to the placing portion 15 toward The action of the processing area that is scanned by the current scanner 12 is entered and the processing is resumed. The processing 16 is processed to move larger than the workpiece 16 of the processing region 5 of the current scanner 12. Fig. 2 is a detailed perspective view showing the workpiece mounting portion 15 of the present invention. The mounting portion 15 of the workpiece 16 is held, and the X direction thereof is divided into the widths of the scanning regions of the eight corresponding current scanners 12. When the fixed portion of the surrounding square frame is regarded as one, it is added into a total of nine squares having adsorption holes. 10 is a partial cross-sectional view of a workpiece mounting portion constituting a laser processing apparatus according to an embodiment of the present invention, and is a portion enclosed by a circle in the enlarged view of the γ-axis direction. Sectional view. The workpiece 16 is placed on the upper portion of the divided placing portions 15a to 15e. The divided placing portions 15a to 15e have a structure that can be individually moved in the vertical direction, and are moved up and down by a lifting/lowering driving unit 27 (see Fig. 2) such as an air cylinder in accordance with a control signal from the machining control unit 15. Inside the mounting portions 15a to 15e, there are a hollow portion 2A and a mounting portion 15. The 15d and 15ei hollow portions 20 are connected to a suction device (not shown). The inside of the hollow portion 2 is under a negative pressure so that the suction force 25 acts in the upper adsorption hole 28 to attract and fix the workpiece 16. 2〇 When the blind hole (non-through hole) is processed, the mounting portion 15 is in a state in which all of the adsorption portions are raised. Next, the workpiece is sucked and fixed by the entire surface mounting portion and processed. At this time, the dust collecting device 18 provided on the upper portion of the workpiece 16 sucks and processes the dust generated in the upper portion of the workpiece 16 to prevent the dust from scattering and the dust adhering to the workpiece 16. 200924894 When the through hole (through hole) is processed, the operation of the current scanner 12 and the boring table 17 is the same as that during the blind hole processing. However, the dust generated in the lower portion of the workpiece 16 due to the processing of the through hole is processed. The purpose of protecting the object placed on the lower portion of the workpiece 16 is as follows. The 5th eye is in the scanning area of the current scan 1112, that is, below the reach of the laser. The placing portion 15b at the P is controlled by the machining control unit 10 (see Fig. 1) in which the workpiece information is input, and as seen in Fig. 3, it is lowered only when it is equivalent to the lower portion of the machining. Further, the gas supplied from the gas supply nest is discharged from the lower portion of the placing portion 15e adjacent to the placing portion 15b to the upper portion of the mounting portion 15b, and the gas is formed over the falling portion 15b. The flow path to be formed is moved from the upper portion of the placing portion 15b to the discharge path below the planting portion. The discharged gas is sucked and discharged by the gas discharge device %. In Fig. 3, the operation of the gas is indicated by three arrows. According to this configuration, by removing the gas generated during the laser processing, the gas passage required for discharging the dust can be formed by adding the μ gas discharge device 24 and the gas supply device 23, so that the dust can be efficiently discharged. To make such a gas flow path, it is necessary to communicate the upper space of the lower placing portion 15b and the upper portion of the placing portion 15e or the lower portion of the placing portion 15a. Therefore, when the front end mounting portion 15a is located at the lower portion, it is sufficient to form a gas flow path for supplying gas from one direction of the mounting portion 15b and discharging gas and dust from the other direction of the mounting portion 15b. Further, a gas discharge hole or a gas supply hole dedicated to the front end may be newly provided at a fixed portion of the surrounding square frame. The gas is dry air or nitrogen. 〃 At this time, the supply and supply of the gas supply amount and the discharge amount for discharging the dust are balanced and discharged, and the inside of the placement portion (the lower space such as the placement portion 15c and the upper space of the placement portion 15b) is The difference outside the placement unit disappears. By this adjustment, it is possible to prevent the gas pressure from being applied to the workpiece to be deformed, so that the holding accuracy is deteriorated. Further, by assisting the gas from flowing out from the mounting portion adjacent to the fifth mounting portion located at the lower portion, the flow rate of the dust collecting gas of the king body can be suppressed, so that the influence on the processed substrate can be reduced. Minimize and achieve effective dust collection. 10 15 20 - When the force of the scanning process in the field of the current scanner 12 on the warhead portion 15 is completed, the XY table 17 shown in Fig. 2 moves in the γ direction (Fig. 3 & depth direction). And continue processing in sequence. Once the upper part of (4) is divided into four parts, the cutting part 15e of the _low=:= field will release the adsorption fixing of the reinforced object 16, and vacuum-destroy and jet the Langkong 28 which has been adsorbed before. It will not fall under the influence of the secret of the DPRK. Further, as the date on which the processing has been completed, the mounting portion is raised and the workpiece 16 is attracted and fixed. In this case, the Jr table 17 is moved to move the current scanning area to the mounting portion of the mounting portion. Further, the air is ejected from the lower side of the new processing area shape = ':: placing portion (5), and the dust is efficiently discharged on the placing portion side. This movement and processing will enclose the details of the vacuum adsorption and the new gas supply. In the second part of the week, the part of the set of money is set to absorb the body (4), the placing part (5) and the other body suction bow Inn, when the sample is located at the upper part, the air of the hollow part 2G will be connected with the gas and the gas will be absorbed by the gas absorption σ21. side by side
12 200924894 5 ❹ 10 15 20 出。因此，中空部20呈負壓，會如其他載置部15a或15c般 地真空吸附被加工物16。但是，如第3圖所示’位於加工位 置之下部時，不會進行真空吸附。位於下部時，設在周圍 四角框部分的氣體供應口 22連通中空部2〇。氣體會由該氣 體供應口 22被供應至中空部2〇内，於是使中空部20呈正 壓，在載置部的吸附孔28噴出喷出氣體26(空氣等）。藉此， 可積極地防止加工粉塵附著及對吸附孔28之侵入，故可更 有效果地防止對於加工粉塵的不良影響。 如前述，僅提到關於真空吸附的話，可由載置部位於 上部時及下部時’來切換真空吸_進行與否且以氣體 吸引口 21及氣體供應口22來切換。藉由此構造，可為在吸 :保持被加工物時’僅吸引保持有被加工物的載置部的構 造’且位於下部的載置部在移動時不會吸附被加工物，故 可防止被加工物變形。 升降部分以外的_^ 物的周圍四角框部分存在 隨時吸附固定被力：之吸附部，且從加工開始到結束會 有藉由例如氣周圍的固定吸附部分，亦 被加工物的方&圖不）等吸^卜的方法，機械性地固定 的位置，採以1置部15升降時，為了不移動被加工物 固定升降之栽置:圍:=方式是有效的，特別是藉由 加工物。 的長方向之外周圍，可穩定地保持被 如前述，汰& +實施型態之雷^ 射可達位置處的 加工裝置，係使貫穿之雷 的栽置部15b相較於其他載置部位於下部。由 13 200924894 於載置部15b位於下部，故可脫離雷射光Ua的聚光範圍， - 不會因雷射光11a而受到損傷。又，被加工物16，其大部分 的面積被吸附於載置部15b以外的載置部15a、15c、15d、 15e等，故可穩穩地被保持，且彎曲亦非常少。亦即，可實 5現加工時可穩穩地保持被加工物，並且不會因貫穿之雷射 . 而傷到載置部(XY工作台）的構造。又，載置部15b與載置部 · 15c交換時，其他所有的載置部亦會繼續吸附，故可防止被 加工物變形。 又’由於將通孔加工時產生之塵埃保留在位於下部之 @ 10載置部與前述被加工物之間的空間，且可將該保留之塵埃 從載置部下部的空間排出至氣體排出裝置24，故可使被加 工物表面或加工頭側不會出現塵埃。 又，藉由從相鄰於位於下部之載置部的載置部側輔助 性地使氣體流出，可作成氣體流道，且可將對被加工物產 15生的影響降到最小並且實現有效的集塵功能。 根據前述，對於盲孔(非貫穿孔)加工及通孔（貫穿孔)加 兩種加工方式’不必針對全數被加工物或被加工物種類 ❹ 使用特別方法，即可對應。可實現例如，在印刷基板的鑽 孔加工中’可穩定地對應多品種生產，且生產效率高的雷 20 射加工裝置。 產業上利用之可能性 如前述，本發明之雷射加工裝置，對於印刷基板等的 盲孔（非貫穿孔)加工及通孔（貫穿孔）加工兩種加工方式是 有用的。 14 200924894 【圖式簡單說明3 第1圖係本發明之實施型態之雷射加工裝置的概略構 造圖。 第2圖係顯示構成本發明之實施型態之雷射加工裝置 5 的被加工物載置部詳細的立體圖。 第3圖係構成本發明之實施型態之雷射加工裝置的被 加工物載置部的部分截面圖。 【主要元件符號說明】12 200924894 5 ❹ 10 15 20 out. Therefore, the hollow portion 20 is under a negative pressure, and the workpiece 16 is vacuum-absorbed like the other mounting portions 15a or 15c. However, as shown in Fig. 3, when it is located below the machining position, vacuum adsorption is not performed. When located at the lower portion, the gas supply port 22 provided in the surrounding square frame portion communicates with the hollow portion 2''. The gas is supplied into the hollow portion 2 through the gas supply port 22, so that the hollow portion 20 is pressurized, and the discharge gas 26 (air or the like) is ejected from the adsorption hole 28 of the mounting portion. Thereby, the adhesion of the processing dust and the intrusion into the adsorption holes 28 can be actively prevented, so that the adverse effect on the processed dust can be more effectively prevented. As described above, only the vacuum suction can be switched, and the vacuum suction can be switched between the upper portion and the lower portion, and the gas suction port 21 and the gas supply port 22 can be switched. With this configuration, it is possible to prevent the structure of the mounting portion that holds only the workpiece from being sucked while holding the workpiece, and the placing portion located at the lower portion does not adsorb the workpiece when moving, so that it can be prevented. The workpiece is deformed. The surrounding corner frame portion of the _^ object other than the lifting portion has an adsorption portion that is adsorbed and fixed at any time, and there is a fixed adsorption portion around the gas from the start to the end of the processing, and the square of the workpiece is also processed. In the case of the method of suctioning, the position where the mechanically fixed position is lifted by the 1st portion 15 is used to fix the lifting and lowering of the workpiece without moving the workpiece: the circumference: = mode is effective, especially by processing Things. In the periphery of the long direction, it is possible to stably maintain the processing device at the position where the lightning strike can reach the position as described above, so that the planting portion 15b penetrating the thunder is compared with the other mounting The department is located at the bottom. Since the mounting portion 15b is located at the lower portion from 13 200924894, the condensing range of the laser light Ua can be removed, and the laser light 11a is not damaged. Further, most of the workpiece 16 is adsorbed to the mounting portions 15a, 15c, 15d, and 15e other than the mounting portion 15b, so that it can be stably held and the bending is extremely small. In other words, the workpiece can be stably held during the current machining, and the structure of the mounting portion (XY table) is not damaged by the penetration of the laser. Further, when the placing portion 15b is exchanged with the placing portion 15c, all the other placing portions continue to be sucked, so that the workpiece can be prevented from being deformed. Further, the dust generated during the processing of the through hole is left in the space between the lower portion of the @10 mounting portion and the workpiece, and the retained dust can be discharged from the space below the mounting portion to the gas discharge device. 24, so that no dust can appear on the surface of the workpiece or on the processing head side. Further, by assisting the gas flow from the side of the mounting portion adjacent to the mounting portion located at the lower portion, the gas flow path can be formed, and the influence on the workpiece can be minimized and effective. Dust collection function. According to the above, it is possible to apply two processing methods for the blind hole (non-through hole) processing and the through hole (through hole), and it is not necessary to use a special method for all the workpieces or the type of the workpiece. For example, in a drilling process of a printed substrate, a laser beam processing apparatus which can stably correspond to a plurality of types of production and has high production efficiency can be realized. Industrial Applicability As described above, the laser processing apparatus of the present invention is useful for both blind hole (non-through hole) processing and through hole (through hole) processing of a printed circuit board or the like. 14 200924894 [Simple description of the drawings 3] Fig. 1 is a schematic configuration diagram of a laser processing apparatus according to an embodiment of the present invention. Fig. 2 is a detailed perspective view showing a workpiece mounting portion constituting the laser processing apparatus 5 of the embodiment of the present invention. Fig. 3 is a partial cross-sectional view showing a workpiece mounting portion constituting a laser processing apparatus according to an embodiment of the present invention. [Main component symbol description]
10 加工控制部 16 働口工物 11 雷射振盪器 17 XY工作台 11a 雷射光 18 集塵裝置 12 電流掃描Is 19 光學系統 12a X鏡 20 中空部 12b Y鏡 21 氣體吸引口 13 透鏡 22 氣體供應口 14 加工頭 23 氣體供應裝置 15 載置部 24 氣體排出裝置 15a 載置部 25 吸引力 15b 載置部 26 喷出氣體 15c 載置部 27 升降驅動部 15d 載置部 28 吸附孔 15e 載置部 1510 Machining control unit 16 Mouthwash 11 Laser oscillator 17 XY table 11a Laser light 18 Dust collector 12 Current sweep Is 19 Optical system 12a X mirror 20 Hollow 12b Y mirror 21 Gas suction port 13 Lens 22 Gas supply Port 14 machining head 23 gas supply device 15 mounting portion 24 gas discharge device 15a mounting portion 25 suction force 15b mounting portion 26 discharge gas 15c mounting portion 27 lifting drive portion 15d mounting portion 28 adsorption hole 15e mounting portion 15