[go: up one dir, main page]

WO2009072632A1 - 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法 - Google Patents

硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法 Download PDF

Info

Publication number
WO2009072632A1
WO2009072632A1 PCT/JP2008/072204 JP2008072204W WO2009072632A1 WO 2009072632 A1 WO2009072632 A1 WO 2009072632A1 JP 2008072204 W JP2008072204 W JP 2008072204W WO 2009072632 A1 WO2009072632 A1 WO 2009072632A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy group
composition
producing
sealing material
curable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/072204
Other languages
English (en)
French (fr)
Inventor
Tarou Kanamori
Kimihiko Yoshii
Keisuke Yajima
Kouji Kashishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP2009544758A priority Critical patent/JPWO2009072632A1/ja
Publication of WO2009072632A1 publication Critical patent/WO2009072632A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H10W74/121—
    • H10W74/47—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　本発明は、耐紫外線性、透明性に優れ、高い硬度を有する硬化物を得ることができる硬化性組成物、光学素子コーティング用組成物、およびＬＥＤ封止用材料、ならびにこのような組成物の製造方法を提供することを目的としている。本発明の硬化性組成物は、エポキシ基を含有する有機基を末端に有し、該エポキシ基含有有機基が結合したケイ素に１個または２個の水酸基が結合しており、エポキシ当量が１５０ｇ／ｅｑ．以上、２０００ｇ／ｅｑ．未満であるエポキシ基末端ポリジメチルシロキサンと硬化剤とを含有することを特徴とする。
PCT/JP2008/072204 2007-12-07 2008-12-05 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法 Ceased WO2009072632A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009544758A JPWO2009072632A1 (ja) 2007-12-07 2008-12-05 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007316880 2007-12-07
JP2007-316880 2007-12-07

Publications (1)

Publication Number Publication Date
WO2009072632A1 true WO2009072632A1 (ja) 2009-06-11

Family

ID=40717810

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072204 Ceased WO2009072632A1 (ja) 2007-12-07 2008-12-05 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法

Country Status (3)

Country Link
JP (1) JPWO2009072632A1 (ja)
TW (1) TW200925173A (ja)
WO (1) WO2009072632A1 (ja)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235376A (ja) * 2008-03-06 2009-10-15 Nitto Denko Corp 変性ポリアルミノシロキサン
WO2010026714A1 (ja) * 2008-09-03 2010-03-11 日本化薬株式会社 シロキサン化合物、硬化性樹脂組成物、その硬化物及び光半導体素子
JP2011021078A (ja) * 2009-07-14 2011-02-03 Jsr Corp オルガノポリシロキサンならびにこれを含む硬化性組成物およびその製造方法
WO2011108516A1 (ja) * 2010-03-02 2011-09-09 日本化薬株式会社 オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物
CN102850992A (zh) * 2012-09-16 2013-01-02 江苏江永新材料科技有限公司 一种单组份脱醇型灌封胶
JP2013057000A (ja) * 2011-09-08 2013-03-28 Mitsubishi Chemicals Corp 熱硬化性樹脂組成物、半導体デバイス用部材、及びそれを用いた半導体発光デバイス
EP2587560A1 (en) * 2011-10-26 2013-05-01 Forschungsverbund Berlin e.V. Light emitting diode
JP2014173019A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 金属塗装用コーティング剤組成物
JP2014173020A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 金属塗装用コーティング剤組成物
JP2014177616A (ja) * 2013-02-15 2014-09-25 Arakawa Chem Ind Co Ltd コーティング組成物
JP2014237861A (ja) * 2014-09-26 2014-12-18 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物
WO2014208619A1 (ja) * 2013-06-26 2014-12-31 日本化薬株式会社 エポキシ基含有ポリオルガノシロキサンおよびそれを含有する硬化性樹脂組成物
TWI609927B (zh) * 2012-01-06 2018-01-01 羅門哈斯電子材料韓國公司 含有機聚矽氧烷之可固化樹脂組成物
CN110023371A (zh) * 2016-11-29 2019-07-16 西门子股份公司 灌注料、绝缘材料及其用途
JP2023546328A (ja) * 2020-10-20 2023-11-02 ワッカー ケミー アクチエンゲゼルシャフト アルコキシ基含有アミノシロキサンを合成する方法
JP2025115869A (ja) * 2024-01-26 2025-08-07 株式会社ダイセル 硬化性組成物、アンダーコート層、積層体及び表示装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287077A (ja) * 1992-04-14 1993-11-02 Toshiba Silicone Co Ltd エポキシ変性シリコーン樹脂組成物
JP2001040094A (ja) * 1999-07-30 2001-02-13 Shin Etsu Chem Co Ltd エポキシ基含有シリコーン樹脂
WO2005100445A1 (ja) * 2004-04-16 2005-10-27 Jsr Corporation 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
WO2007046399A1 (ja) * 2005-10-18 2007-04-26 Asahi Kasei Kabushiki Kaisha 熱硬化性樹脂組成物及び光半導体封止材
JP2007106798A (ja) * 2005-10-11 2007-04-26 Jsr Corp 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
JP2007169406A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材
JP2007169427A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材
JP2007191697A (ja) * 2005-12-19 2007-08-02 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び光半導体装置
JP2007332314A (ja) * 2006-06-16 2007-12-27 Jsr Corp 熱硬化性樹脂組成物および光半導体用接着剤
WO2008090971A1 (ja) * 2007-01-25 2008-07-31 Jsr Corporation エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287077A (ja) * 1992-04-14 1993-11-02 Toshiba Silicone Co Ltd エポキシ変性シリコーン樹脂組成物
JP2001040094A (ja) * 1999-07-30 2001-02-13 Shin Etsu Chem Co Ltd エポキシ基含有シリコーン樹脂
WO2005100445A1 (ja) * 2004-04-16 2005-10-27 Jsr Corporation 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
JP2007106798A (ja) * 2005-10-11 2007-04-26 Jsr Corp 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
WO2007046399A1 (ja) * 2005-10-18 2007-04-26 Asahi Kasei Kabushiki Kaisha 熱硬化性樹脂組成物及び光半導体封止材
JP2007191697A (ja) * 2005-12-19 2007-08-02 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び光半導体装置
JP2007169406A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材
JP2007169427A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材
JP2007332314A (ja) * 2006-06-16 2007-12-27 Jsr Corp 熱硬化性樹脂組成物および光半導体用接着剤
WO2008090971A1 (ja) * 2007-01-25 2008-07-31 Jsr Corporation エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235376A (ja) * 2008-03-06 2009-10-15 Nitto Denko Corp 変性ポリアルミノシロキサン
WO2010026714A1 (ja) * 2008-09-03 2010-03-11 日本化薬株式会社 シロキサン化合物、硬化性樹脂組成物、その硬化物及び光半導体素子
JP2011021078A (ja) * 2009-07-14 2011-02-03 Jsr Corp オルガノポリシロキサンならびにこれを含む硬化性組成物およびその製造方法
JP5730852B2 (ja) * 2010-03-02 2015-06-10 日本化薬株式会社 オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物
WO2011108516A1 (ja) * 2010-03-02 2011-09-09 日本化薬株式会社 オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物
JP2013057000A (ja) * 2011-09-08 2013-03-28 Mitsubishi Chemicals Corp 熱硬化性樹脂組成物、半導体デバイス用部材、及びそれを用いた半導体発光デバイス
EP2587560A1 (en) * 2011-10-26 2013-05-01 Forschungsverbund Berlin e.V. Light emitting diode
TWI609927B (zh) * 2012-01-06 2018-01-01 羅門哈斯電子材料韓國公司 含有機聚矽氧烷之可固化樹脂組成物
CN102850992A (zh) * 2012-09-16 2013-01-02 江苏江永新材料科技有限公司 一种单组份脱醇型灌封胶
JP2014177616A (ja) * 2013-02-15 2014-09-25 Arakawa Chem Ind Co Ltd コーティング組成物
JP2014173020A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 金属塗装用コーティング剤組成物
JP2014173019A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 金属塗装用コーティング剤組成物
WO2014208619A1 (ja) * 2013-06-26 2014-12-31 日本化薬株式会社 エポキシ基含有ポリオルガノシロキサンおよびそれを含有する硬化性樹脂組成物
JP2014237861A (ja) * 2014-09-26 2014-12-18 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物
CN110023371A (zh) * 2016-11-29 2019-07-16 西门子股份公司 灌注料、绝缘材料及其用途
JP2023546328A (ja) * 2020-10-20 2023-11-02 ワッカー ケミー アクチエンゲゼルシャフト アルコキシ基含有アミノシロキサンを合成する方法
JP2025115869A (ja) * 2024-01-26 2025-08-07 株式会社ダイセル 硬化性組成物、アンダーコート層、積層体及び表示装置

Also Published As

Publication number Publication date
JPWO2009072632A1 (ja) 2011-04-28
TW200925173A (en) 2009-06-16

Similar Documents

Publication Publication Date Title
WO2009072632A1 (ja) 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法
TW200710166A (en) Polymer compositions and adhesives, coatings, and sealants made therefrom
TW200734403A (en) Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
NO20081346L (no) Fuktherdbar silylert polymerinneholdende frie polyoler for belegging, klebing og forseglingsapplikasjoner
WO2009042535A3 (en) Silicone organic elastomer gels from organopolysiloxane resins
TW200833788A (en) Heat stable aryl polysiloxane compositions
MY169938A (en) Curable composition, cured product thereof, optical member and optical device
PH12014501678A1 (en) Resin composition and semiconductor mounting substrate obtained by molding same
TW200738828A (en) Curable silicone rubber compositions and cured products thereof
WO2011003054A3 (en) Film forming, silicone containing compositions
WO2008045417A3 (en) Extenders for organosiloxane compositions
GB2453813B (en) Room temperature fast-curing organopolysiloxane compositions, their preparation and use
TW200736342A (en) Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
MX2012003993A (es) Composiciones de organosiloxano.
WO2011051236A3 (en) Paintable elastomer
WO2008071363A3 (en) Hybrid cationic curable coatings
EP1990367A3 (en) Curable organosilicon composition and cured product thereof
EP2924061A3 (en) Silicone adhesive composition, a method for the preparation thereof and an adhesive film
WO2010135730A3 (en) One-component epoxy coating compositions
MY147460A (en) Optical devices and silicone compositions and process fabricating the optical devices
WO2014038727A3 (en) Curable silicone composition and optical semiconductor device
UA97169C2 (ru) Эпоксидная композиция для покрытия с высоким содержанем сухого остатка, силикатмодифицированная эпоксидная смола, способ ее получения, применения, способ покрытия субстрата и покрытый субстрат
MY171190A (en) Curable composition, cured product, and method for using curable composition
MY160129A (en) Near-infrared shielding coating agent curable at ordinary temperatures,near-infrared shielding film using same, and manufacturing method therefor
MY148272A (en) Curable silicone composition

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08856163

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009544758

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08856163

Country of ref document: EP

Kind code of ref document: A1