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WO2009072544A1 - 電極構造及びその製造方法、回路基板、半導体モジュール - Google Patents

電極構造及びその製造方法、回路基板、半導体モジュール Download PDF

Info

Publication number
WO2009072544A1
WO2009072544A1 PCT/JP2008/072019 JP2008072019W WO2009072544A1 WO 2009072544 A1 WO2009072544 A1 WO 2009072544A1 JP 2008072019 W JP2008072019 W JP 2008072019W WO 2009072544 A1 WO2009072544 A1 WO 2009072544A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
layer
electrode structure
semiconductor module
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/072019
Other languages
English (en)
French (fr)
Inventor
Setsuo Andoh
Fumitake Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to US12/746,056 priority Critical patent/US8710679B2/en
Priority to JP2009544701A priority patent/JP5585080B2/ja
Publication of WO2009072544A1 publication Critical patent/WO2009072544A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H10W70/682—
    • H10W70/685—
    • H10W72/075—
    • H10W72/07531—
    • H10W72/07533—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/923—
    • H10W72/952—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　電気的接合部における充分な接合強度をもち、高い信頼性をもった半導体モジュールを得る。この半導体モジュール１０においては、回路基板２０上に半導体チップ１１が搭載される。回路基板２０においては、絶縁性のセラミックス基板２１上に、金属回路板２２が形成され、半導体チップ１１が搭載される。半導体チップ１１と金属回路板２２とはアルミニウム（Ａｌ）製のボンディングワイヤ２３で接続される。金属回路板２２とボンディングワイヤ２３との接続部分には、これらの間の接合を良好にするための被覆層２４が設けられている。被覆層２４は、図１における拡大図に示されるように、下側からニッケル（Ｎｉ）層２４１、リン（Ｐ）分布パラジウム（Ｐｄ）層２４２、金（Ａｕ）層２４３で構成される。Ｐ分布Ｐｄ層２４２にはリン（Ｐ）が添加されており、特にこのＰ濃度は、Ｎｉ層２４１側よりも、Ａｕ層２４３側で高くなっている。
PCT/JP2008/072019 2007-12-04 2008-12-04 電極構造及びその製造方法、回路基板、半導体モジュール Ceased WO2009072544A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/746,056 US8710679B2 (en) 2007-12-04 2008-12-04 Electrode structure and its manufacturing method, and semiconductor module
JP2009544701A JP5585080B2 (ja) 2007-12-04 2008-12-04 電極構造及びその製造方法、回路基板、半導体モジュール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007313535 2007-12-04
JP2007-313535 2007-12-04

Publications (1)

Publication Number Publication Date
WO2009072544A1 true WO2009072544A1 (ja) 2009-06-11

Family

ID=40717721

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072019 Ceased WO2009072544A1 (ja) 2007-12-04 2008-12-04 電極構造及びその製造方法、回路基板、半導体モジュール

Country Status (3)

Country Link
US (1) US8710679B2 (ja)
JP (1) JP5585080B2 (ja)
WO (1) WO2009072544A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2410078A1 (en) * 2010-07-20 2012-01-25 TDK Corporation Coating and electronic component
WO2012003315A3 (en) * 2010-07-02 2012-04-12 Texas Instruments Incorporated Corrosion-resistant copper-to-aluminum bonds
JP2013127115A (ja) * 2011-11-17 2013-06-27 Tdk Corp 被覆体及び電子部品

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2535929A1 (en) * 2011-06-14 2012-12-19 Atotech Deutschland GmbH Wire bondable surface for microelectronic devices
US9548276B2 (en) * 2012-04-18 2017-01-17 Win Semiconductors Corp. Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
EP2873752B1 (en) * 2012-07-13 2020-05-20 Toyo Kohan Co., Ltd. Electroless gold plating method and gold-plate-coated material
EP2740818B1 (en) * 2012-12-05 2016-03-30 ATOTECH Deutschland GmbH Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes
WO2014162987A1 (ja) * 2013-04-04 2014-10-09 ローム株式会社 複合チップ部品、回路アセンブリおよび電子機器
CN103258747B (zh) * 2013-05-16 2016-10-12 中国电子科技集团公司第四十一研究所 一种在金导体薄膜电路上进行铝丝键合的方法
US9343422B2 (en) * 2014-03-31 2016-05-17 Freescale Semiconductor, Inc. Structure for aluminum pad metal under ball bond
US10840008B2 (en) * 2015-01-15 2020-11-17 Murata Manufacturing Co., Ltd. Electronic component and electronic component-mounted structure
CN106558564B (zh) * 2015-09-29 2019-08-27 稳懋半导体股份有限公司 半导体元件背面铜金属的改良结构
US20170100744A1 (en) * 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component
EP3862463A4 (en) * 2018-10-02 2022-06-01 Japan Science and Technology Agency HETEROEPITACTIC STRUCTURE AND METHOD FOR PRODUCTION THEREOF, METAL LAYERING PRODUCT HAVING HETEROEPITATIC STRUCTURE AND METHOD FOR PRODUCTION THEREOF, NANOGAP ELECTRODE AND METHOD FOR PRODUCTION OF NANOGAP ELECTRODE
WO2021049235A1 (ja) 2019-09-13 2021-03-18 昭和電工株式会社 積層体およびその製造方法
JP7349317B2 (ja) * 2019-10-18 2023-09-22 Koa株式会社 チップ部品およびチップ部品の製造方法
JP7472770B2 (ja) * 2020-12-15 2024-04-23 トヨタ自動車株式会社 金属めっき皮膜の成膜装置及び成膜方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072282A (ja) * 2003-08-25 2005-03-17 Kyocera Corp 配線基板
JP2006196648A (ja) * 2005-01-13 2006-07-27 Hitachi Metals Ltd 外部接合電極付き電子部品およびその製造方法
JP2006339609A (ja) * 2005-06-06 2006-12-14 Kyocer Slc Technologies Corp 配線基板およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072282A (ja) * 2003-08-25 2005-03-17 Kyocera Corp 配線基板
JP2006196648A (ja) * 2005-01-13 2006-07-27 Hitachi Metals Ltd 外部接合電極付き電子部品およびその製造方法
JP2006339609A (ja) * 2005-06-06 2006-12-14 Kyocer Slc Technologies Corp 配線基板およびその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012003315A3 (en) * 2010-07-02 2012-04-12 Texas Instruments Incorporated Corrosion-resistant copper-to-aluminum bonds
EP2410078A1 (en) * 2010-07-20 2012-01-25 TDK Corporation Coating and electronic component
US10392704B2 (en) 2010-07-20 2019-08-27 Tdk Corporation Coating electronic component
JP2013127115A (ja) * 2011-11-17 2013-06-27 Tdk Corp 被覆体及び電子部品

Also Published As

Publication number Publication date
US8710679B2 (en) 2014-04-29
US20100258954A1 (en) 2010-10-14
JP5585080B2 (ja) 2014-09-10
JPWO2009072544A1 (ja) 2011-04-28

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