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WO2009066670A1 - White led device and method for manufacturing the same - Google Patents

White led device and method for manufacturing the same Download PDF

Info

Publication number
WO2009066670A1
WO2009066670A1 PCT/JP2008/070957 JP2008070957W WO2009066670A1 WO 2009066670 A1 WO2009066670 A1 WO 2009066670A1 JP 2008070957 W JP2008070957 W JP 2008070957W WO 2009066670 A1 WO2009066670 A1 WO 2009066670A1
Authority
WO
WIPO (PCT)
Prior art keywords
led device
white led
manufacturing
same
recessed portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070957
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Morisaki
Noriyuki Sugiyama
Kazuo Uchida
Shinji Nozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanoteco Corp
Original Assignee
Nanoteco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008291003A external-priority patent/JP4961413B2/en
Application filed by Nanoteco Corp filed Critical Nanoteco Corp
Publication of WO2009066670A1 publication Critical patent/WO2009066670A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Led Device Packages (AREA)

Abstract

Disclosed is a white LED device comprising a container having a recessed portion, a blue LED chip mounted on the bottom of the recessed portion, an insulating liquid or sol layer filled into the recessed portion to surround the blue LED chip, and a transparent resin layer arranged on top of the container for sealing the insulating liquid or sol layer in such a manner that the transparent resin layer is continuously in contact with the surface of the insulating liquid or sol layer. In this white LED device, a phosphor is dispersed in the transparent resin layer.
PCT/JP2008/070957 2007-11-20 2008-11-18 White led device and method for manufacturing the same Ceased WO2009066670A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007300744 2007-11-20
JP2007-300744 2007-11-20
JP2008291003A JP4961413B2 (en) 2007-11-20 2008-11-13 White LED device and manufacturing method thereof
JP2008-291003 2008-11-13

Publications (1)

Publication Number Publication Date
WO2009066670A1 true WO2009066670A1 (en) 2009-05-28

Family

ID=40667492

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070957 Ceased WO2009066670A1 (en) 2007-11-20 2008-11-18 White led device and method for manufacturing the same

Country Status (1)

Country Link
WO (1) WO2009066670A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102299237A (en) * 2010-06-22 2011-12-28 日东电工株式会社 Semiconductor light emitting device
JP2012146952A (en) * 2011-01-07 2012-08-02 Fitilite (S) Pte Ltd Taiwan Branch Light-emitting device and formation method thereof
WO2013056927A1 (en) * 2011-10-20 2013-04-25 Osram Gmbh Attachment part for a support of a semiconductor light device
WO2014154722A1 (en) * 2013-03-26 2014-10-02 Koninklijke Philips N.V. Hermetically sealed illumination device with luminescent material and manufacturing method therefor
EP3018720A1 (en) * 2014-11-10 2016-05-11 LG Innotek Co., Ltd. Light emitting device package and light system including the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001036149A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source device
JP2003347601A (en) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Light emitting diode lighting equipment
JP2004235261A (en) * 2003-01-28 2004-08-19 Matsushita Electric Works Ltd Optical device and method of manufacturing the same
JP2004343059A (en) * 2003-04-24 2004-12-02 Nichia Chem Ind Ltd Semiconductor device and manufacturing method thereof
WO2006034671A2 (en) * 2004-09-30 2006-04-06 Osram Opto Semiconductors Gmbh Optoelectronic component with a wireless contacting
JP2006286999A (en) * 2005-04-01 2006-10-19 Okaya Electric Ind Co Ltd Light emitting diode and manufacturing method thereof
JP2006295230A (en) * 2004-01-28 2006-10-26 Kyocera Corp Light emitting device and lighting device
JP2007067204A (en) * 2005-08-31 2007-03-15 Toshiba Lighting & Technology Corp Light emitting diode device
JP2007281260A (en) * 2006-04-07 2007-10-25 Sumitomo Metal Electronics Devices Inc Reflector, light emitting element storage package using the reflector, and lens used for the reflector

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001036149A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source device
JP2003347601A (en) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Light emitting diode lighting equipment
JP2004235261A (en) * 2003-01-28 2004-08-19 Matsushita Electric Works Ltd Optical device and method of manufacturing the same
JP2004343059A (en) * 2003-04-24 2004-12-02 Nichia Chem Ind Ltd Semiconductor device and manufacturing method thereof
JP2006295230A (en) * 2004-01-28 2006-10-26 Kyocera Corp Light emitting device and lighting device
WO2006034671A2 (en) * 2004-09-30 2006-04-06 Osram Opto Semiconductors Gmbh Optoelectronic component with a wireless contacting
JP2006286999A (en) * 2005-04-01 2006-10-19 Okaya Electric Ind Co Ltd Light emitting diode and manufacturing method thereof
JP2007067204A (en) * 2005-08-31 2007-03-15 Toshiba Lighting & Technology Corp Light emitting diode device
JP2007281260A (en) * 2006-04-07 2007-10-25 Sumitomo Metal Electronics Devices Inc Reflector, light emitting element storage package using the reflector, and lens used for the reflector

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102299237A (en) * 2010-06-22 2011-12-28 日东电工株式会社 Semiconductor light emitting device
US9608178B2 (en) 2010-06-22 2017-03-28 Nitto Denko Corporation Semiconductor light emitting device
JP2012146952A (en) * 2011-01-07 2012-08-02 Fitilite (S) Pte Ltd Taiwan Branch Light-emitting device and formation method thereof
WO2013056927A1 (en) * 2011-10-20 2013-04-25 Osram Gmbh Attachment part for a support of a semiconductor light device
WO2014154722A1 (en) * 2013-03-26 2014-10-02 Koninklijke Philips N.V. Hermetically sealed illumination device with luminescent material and manufacturing method therefor
CN105051443A (en) * 2013-03-26 2015-11-11 皇家飞利浦有限公司 Built-in lighting device and corresponding production method
US10050185B2 (en) 2013-03-26 2018-08-14 Lumileds Llc Hermetically sealed illumination device with luminescent material and manufacturing method therefor
EP3018720A1 (en) * 2014-11-10 2016-05-11 LG Innotek Co., Ltd. Light emitting device package and light system including the same
US10347803B2 (en) 2014-11-10 2019-07-09 Lg Innotek Co., Ltd. Light emitting device package and light system including the same

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