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WO2009066351A1 - Polishing head and polishing apparatus - Google Patents

Polishing head and polishing apparatus Download PDF

Info

Publication number
WO2009066351A1
WO2009066351A1 PCT/JP2007/001271 JP2007001271W WO2009066351A1 WO 2009066351 A1 WO2009066351 A1 WO 2009066351A1 JP 2007001271 W JP2007001271 W JP 2007001271W WO 2009066351 A1 WO2009066351 A1 WO 2009066351A1
Authority
WO
WIPO (PCT)
Prior art keywords
middle plate
polishing
polishing head
work
rubber film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/001271
Other languages
French (fr)
Japanese (ja)
Inventor
Hisashi Masumura
Koji Kitagawa
Kouji Morita
Hiromi Kishida
Satoru Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Original Assignee
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp, Shin Etsu Handotai Co Ltd filed Critical Fujikoshi Machinery Corp
Priority to PCT/JP2007/001271 priority Critical patent/WO2009066351A1/en
Priority to DE112007003710T priority patent/DE112007003710T5/en
Priority to CN200780101162.2A priority patent/CN101827685A/en
Priority to KR1020107010751A priority patent/KR20100094466A/en
Priority to US12/682,458 priority patent/US20100210192A1/en
Publication of WO2009066351A1 publication Critical patent/WO2009066351A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A polishing head (11) is composed of at least a substantially disc-like middle plate (12), and a rubber film (13) which covers at least a lower surface section and a side surface section of the middle plate. The polishing head has a space section (14) surrounded by the middle plate and the rubber film, and is configured to have pressure in the space section changed by a pressure adjusting mechanism (15). The polishing head holds the rear surface of a work (W) at a lower surface section of the rubber film, and polishes the surface of the work by sliding the surface of the work on a polishing cloth (22) adhered on a surface plate. In the polishing head, the middle plate and the rubber film are not in contact with each other at least entirely on a lower surface section of the middle plate, and a gap (14a) is provided. Thus, the rubber chuck system polishing head applies uniform polishing load to the entire work without being affected by rigidity and planarity of the middle plate.
PCT/JP2007/001271 2007-11-20 2007-11-20 Polishing head and polishing apparatus Ceased WO2009066351A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2007/001271 WO2009066351A1 (en) 2007-11-20 2007-11-20 Polishing head and polishing apparatus
DE112007003710T DE112007003710T5 (en) 2007-11-20 2007-11-20 Polishing head and polishing device
CN200780101162.2A CN101827685A (en) 2007-11-20 2007-11-20 Polishing head and polishing apparatus
KR1020107010751A KR20100094466A (en) 2007-11-20 2007-11-20 Polishing head and polishing apparatus
US12/682,458 US20100210192A1 (en) 2007-11-20 2007-11-20 Polishing head and polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/001271 WO2009066351A1 (en) 2007-11-20 2007-11-20 Polishing head and polishing apparatus

Publications (1)

Publication Number Publication Date
WO2009066351A1 true WO2009066351A1 (en) 2009-05-28

Family

ID=40667190

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/001271 Ceased WO2009066351A1 (en) 2007-11-20 2007-11-20 Polishing head and polishing apparatus

Country Status (5)

Country Link
US (1) US20100210192A1 (en)
KR (1) KR20100094466A (en)
CN (1) CN101827685A (en)
DE (1) DE112007003710T5 (en)
WO (1) WO2009066351A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012192470A (en) * 2011-03-15 2012-10-11 Asahi Glass Co Ltd Plate-like body polishing apparatus
DE112012002493T8 (en) * 2011-06-29 2014-06-12 Shin-Etsu Handotai Co., Ltd. Polishing head and polishing device
US9566687B2 (en) 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
CN110815071A (en) * 2019-12-09 2020-02-21 深圳市汇友环境科技有限公司 Anti-drop conversion sheet and manufacturing method thereof
US12420376B2 (en) 2021-12-23 2025-09-23 Globalwafers Co., Ltd. Polishing head assembly having recess and cap

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574749A (en) * 1991-09-13 1993-03-26 Toshiro Doi Method and apparatus for planarization polishing of wafer with device
JP2001260004A (en) * 2000-03-14 2001-09-25 Mitsubishi Materials Corp Wafer polishing head
JP2002524281A (en) * 1998-09-08 2002-08-06 アプライド マテリアルズ インコーポレイテッド Carrier head for chemical mechanical polishing of substrates
JP2003019661A (en) * 2001-07-09 2003-01-21 Okamoto Machine Tool Works Ltd Board carrier in polishing apparatus
JP2004154933A (en) * 2002-11-07 2004-06-03 Ebara Technologies Inc Vertically adjustable chemical mechanical polishing head with pivot mechanism and method for its use
JP2004327547A (en) * 2003-04-22 2004-11-18 Shin Etsu Handotai Co Ltd Wafer polishing apparatus, its polishing head, and wafer polishing method
JP2006159392A (en) * 2004-12-10 2006-06-22 Ebara Corp Substrate holding device and polishing device

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569310A (en) 1991-04-23 1993-03-23 Mitsubishi Materials Corp Wafer mirror polishing device
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
JPH11285966A (en) * 1998-04-02 1999-10-19 Speedfam-Ipec Co Ltd Carrier and CMP equipment
FR2778129B1 (en) * 1998-05-04 2000-07-21 St Microelectronics Sa MEMBRANE SUPPORT DISC OF A POLISHING MACHINE AND METHOD OF OPERATING SUCH A MACHINE
US6210255B1 (en) * 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6227955B1 (en) * 1999-04-20 2001-05-08 Micron Technology, Inc. Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6855043B1 (en) * 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6213855B1 (en) * 1999-07-26 2001-04-10 Speedfam-Ipec Corporation Self-powered carrier for polishing or planarizing wafers
DE60024559T2 (en) * 1999-10-15 2006-08-24 Ebara Corp. Method and device for polishing a workpiece
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
JP2001345297A (en) * 2000-05-30 2001-12-14 Hitachi Ltd Method of manufacturing semiconductor integrated circuit device and polishing apparatus
US20040005842A1 (en) * 2000-07-25 2004-01-08 Chen Hung Chih Carrier head with flexible membrane
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
JP2002187060A (en) * 2000-10-11 2002-07-02 Ebara Corp Substrate holding device, polishing device, and polishing method
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
JP4583207B2 (en) 2004-03-31 2010-11-17 不二越機械工業株式会社 Polishing equipment
KR100621629B1 (en) * 2004-06-04 2006-09-19 삼성전자주식회사 Polishing heads and polishing methods used in chemical mechanical polishing devices
JP2007307623A (en) * 2006-05-16 2007-11-29 Elpida Memory Inc Polishing device
WO2007143566A2 (en) * 2006-06-02 2007-12-13 Applied Materials, Inc. Fast substrate loading on polishing head without membrane inflation step
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574749A (en) * 1991-09-13 1993-03-26 Toshiro Doi Method and apparatus for planarization polishing of wafer with device
JP2002524281A (en) * 1998-09-08 2002-08-06 アプライド マテリアルズ インコーポレイテッド Carrier head for chemical mechanical polishing of substrates
JP2001260004A (en) * 2000-03-14 2001-09-25 Mitsubishi Materials Corp Wafer polishing head
JP2003019661A (en) * 2001-07-09 2003-01-21 Okamoto Machine Tool Works Ltd Board carrier in polishing apparatus
JP2004154933A (en) * 2002-11-07 2004-06-03 Ebara Technologies Inc Vertically adjustable chemical mechanical polishing head with pivot mechanism and method for its use
JP2004327547A (en) * 2003-04-22 2004-11-18 Shin Etsu Handotai Co Ltd Wafer polishing apparatus, its polishing head, and wafer polishing method
JP2006159392A (en) * 2004-12-10 2006-06-22 Ebara Corp Substrate holding device and polishing device

Also Published As

Publication number Publication date
DE112007003710T5 (en) 2010-12-02
CN101827685A (en) 2010-09-08
KR20100094466A (en) 2010-08-26
US20100210192A1 (en) 2010-08-19

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