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JP2012192470A - Plate-like body polishing apparatus - Google Patents

Plate-like body polishing apparatus Download PDF

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Publication number
JP2012192470A
JP2012192470A JP2011056733A JP2011056733A JP2012192470A JP 2012192470 A JP2012192470 A JP 2012192470A JP 2011056733 A JP2011056733 A JP 2011056733A JP 2011056733 A JP2011056733 A JP 2011056733A JP 2012192470 A JP2012192470 A JP 2012192470A
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JP
Japan
Prior art keywords
plate
polishing
glass plate
pressurized fluid
canvas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011056733A
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Japanese (ja)
Inventor
Yuichi Onabeda
裕一 女部田
Junichi Saito
準一 齋藤
Hideo Nakamura
英生 中村
Hiroshi Kimura
宏 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP2011056733A priority Critical patent/JP2012192470A/en
Priority to TW101108943A priority patent/TW201302381A/en
Priority to KR1020120026433A priority patent/KR20120105382A/en
Priority to CN2012100684844A priority patent/CN102672599A/en
Publication of JP2012192470A publication Critical patent/JP2012192470A/en
Withdrawn legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • B24B7/245Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0069Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/10Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

【課題】本発明は、板状体の生産性を高めることができる板状体の研磨装置を提供する。
【解決手段】本発明は、ステージ16において、キャンバス14のバックプレート38に貼り付けられた吸着シート39にガラス板Gを貼着させる。次に、このキャンバス14をステージ18に搬送し、キャリア52に水平に保持させる。次いで、キャンバス14と研磨パッド58、60とを相対的に近接させて、ガラス板Gを研磨パッド58、60に圧縮空気の圧力によって押し付けるとともに、キャンバス14及び研磨パッド58、60をガラス板Gの研磨面に沿って相対的に移動させてガラス板Gの研磨面を研磨する。本発明では、膜体を使用せずキャンバス14を使用してガラス板Gを研磨する。よって、ガラス板Gの生産工程から膜体の交換工程を省くことができる。
【選択図】図4
The present invention provides an apparatus for polishing a plate-like body, which can increase the productivity of the plate-like body.
In the present invention, a glass plate G is attached to an adsorption sheet 39 attached to a back plate 38 of a canvas 14 at a stage 16. Next, the canvas 14 is conveyed to the stage 18 and held horizontally by the carrier 52. Next, the canvas 14 and the polishing pads 58 and 60 are brought relatively close to each other, the glass plate G is pressed against the polishing pads 58 and 60 by the pressure of compressed air, and the canvas 14 and the polishing pads 58 and 60 are pressed against the glass plate G. The polishing surface of the glass plate G is polished by relatively moving along the polishing surface. In the present invention, the glass plate G is polished using the canvas 14 without using the film body. Therefore, the film body replacement step can be omitted from the glass plate G production step.
[Selection] Figure 4

Description

本発明は、板状体の研磨装置に関する。   The present invention relates to a plate-like body polishing apparatus.

液晶ディスプレイ用に適用されるガラス板は、その表面の微小な凹凸やうねりが画像に歪みを与える原因となるため、その微小な凹凸やうねりが研磨装置にて除去される。このような研磨装置として、研磨定盤に設けられた研磨パッドに、キャリアに保持されたガラス板を押し当てるとともに、研磨定盤及びキャリアを相対的に回転させてガラス板を研磨する研磨装置が一般的に知られている。   A glass plate used for a liquid crystal display causes minute irregularities and undulations on the surface to cause distortion of the image, and therefore the minute irregularities and undulations are removed by a polishing apparatus. As such a polishing apparatus, there is a polishing apparatus that presses a glass plate held by a carrier against a polishing pad provided on a polishing surface plate and polishes the glass plate by relatively rotating the polishing surface plate and the carrier. Generally known.

特許文献1に開示された研磨装置は、ガラス板を吸着して保持する吸着シートが膜体に取り付けられ、この膜体がキャリアに張設されている。また、前記膜体と前記キャリアとの間には、加圧流体が供給され、前記吸着シートに保持されたガラス板が前記加圧流体の圧力によって研磨パッドに押し付けられる。これにより、特許文献1の研磨装置によれば、前記加圧流体によってガラス板の各部分にかかる圧力が均一な圧力となるので、ガラス板を平坦に研磨しながらガラス板の表面の微小凹凸を除去できるという利点がある。   In the polishing apparatus disclosed in Patent Document 1, an adsorption sheet that adsorbs and holds a glass plate is attached to a film body, and the film body is stretched around a carrier. Further, a pressurized fluid is supplied between the film body and the carrier, and the glass plate held by the adsorption sheet is pressed against the polishing pad by the pressure of the pressurized fluid. Thus, according to the polishing apparatus of Patent Document 1, since the pressure applied to each part of the glass plate by the pressurized fluid becomes a uniform pressure, the fine unevenness on the surface of the glass plate is polished while polishing the glass plate flatly. There is an advantage that it can be removed.

前記吸着シートは発泡ポリウレタン製であり、ポリカーボネイト等の中間シートを介して前記膜体に接着され、この中間シートの引っ張り方向の剛性が、前記吸着シートの引っ張り方向の剛性よりも高く設定されている。これにより、特許文献1の研磨装置では、吸着シートが中間シートから剥がれなくなるので、吸着シートが剥がれて捲り上がることを防止できるという利点がある。また、膜体は、樹脂層と繊維層とからなる二層構造に構成されている。   The adsorbing sheet is made of polyurethane foam, and is adhered to the film body via an intermediate sheet such as polycarbonate, and the rigidity in the pulling direction of the intermediate sheet is set higher than the rigidity in the pulling direction of the adsorbing sheet. . As a result, the polishing apparatus of Patent Document 1 has an advantage that the adsorbing sheet can be prevented from peeling off and rising because the adsorbing sheet is not peeled off from the intermediate sheet. Moreover, the film body is comprised by the two-layer structure which consists of a resin layer and a fiber layer.

WO2007/020859号公報WO2007 / 020858 Publication

ところで、特許文献1の膜体は、加圧流体を直接受けてガラス板に研磨圧力を伝達する機能と、ガラス板の研磨中に相対的に回転しているガラス板と研磨パッドとの間に生じる研磨抵抗を受ける機能とを有している。すなわち、膜体は、加圧流体によって膨張される方向の力、及び研磨抵抗によって繰り返し引っ張り方向に伸縮される力を受ける。このため、膜体の寿命は短く、膜体の交換を頻繁に行う必要があるため、ガラス板の生産性を高めることができないという問題があった。   By the way, the film body of Patent Document 1 receives a pressurized fluid directly and transmits a polishing pressure to the glass plate, and between the glass plate rotating relatively during polishing of the glass plate and the polishing pad. And a function of receiving the generated polishing resistance. That is, the film body receives a force in a direction in which it is expanded by the pressurized fluid and a force that is repeatedly expanded and contracted in the pulling direction by the polishing resistance. For this reason, since the lifetime of the film body is short and it is necessary to frequently replace the film body, there is a problem that the productivity of the glass plate cannot be increased.

本発明は、このような事情に鑑みてなされたもので、ガラス板の生産性を高めることができる板状体の研磨装置を提供することを目的とする。   This invention is made | formed in view of such a situation, and it aims at providing the grinding | polishing apparatus of the plate-shaped object which can improve the productivity of a glass plate.

本発明は、前記目的を達成するために、板状体を貼着する板状体貼着部と、前記板状体貼着部を保持する板状体保持部と、前記板状体貼着部に対向して配置され、前記板状体貼着部によって貼着される前記板状体の研磨面を研磨する研磨具と、を有する板状体の研磨装置において、前記板状体貼着部は前記研磨具の対向面に平面部分を有し、該平面部分に板状体の貼着部を備え、前記平面部分は、前記板状体保持部によって保持される板状部材から構成され、前記板状部材と前記板状体保持部との間の空間に加圧流体を供給する加圧流体供給手段を有することを特徴とする板状体の研磨装置を提供する。   In order to achieve the above object, the present invention provides a plate-like body adhering portion for adhering a plate-like body, a plate-like body holding portion for holding the plate-like body adhering portion, and the plate-like body adhering. And a polishing tool for polishing a polishing surface of the plate-like body that is disposed opposite to the plate and is stuck by the plate-like body sticking portion. The portion has a flat portion on the opposing surface of the polishing tool, and the flat portion includes a plate-like sticking portion, and the flat portion is constituted by a plate-like member held by the plate-like holding portion. There is provided a plate-like body polishing apparatus comprising pressurized fluid supply means for supplying a pressurized fluid to a space between the plate-like member and the plate-like body holding part.

本発明によれば、まず、板状体貼着部の平面部分に備えられた貼着部に板状体を貼着させ、次に、この板状体貼着部を板状体保持部に保持させる。そして、板状体保持部と研磨具とを相対的に近接させて、板状体を研磨具に押し付けるとともに、板状体保持部及び研磨具を板状体の研磨面に沿って相対的に移動させて板状体の研磨面を研磨する。   According to the present invention, first, the plate-like body is attached to the attachment portion provided in the flat portion of the plate-like body attachment portion, and then this plate-like body attachment portion is used as the plate-like body holding portion. Hold. Then, the plate-like body holding part and the polishing tool are relatively brought close to each other to press the plate-like body against the polishing tool, and the plate-like body holding part and the polishing tool are relatively moved along the polishing surface of the plate-like body. The polishing surface of the plate-like body is polished by moving.

本発明では、膜体を使用せず板状体を研磨するので、板状体の生産性を高めることができる。板状体貼着部の平面部分は、研磨抵抗によって繰り返し引っ張り方向に伸縮される力を受けるため、剛性の高い金属製であることが好ましい。また、剛性は、ヤング率などの弾性率が大きい金属を使用する、又は板厚を厚くすることで高めることができる。   In the present invention, since the plate-like body is polished without using the film body, the productivity of the plate-like body can be increased. Since the planar portion of the plate-like body attaching portion receives a force repeatedly expanded and contracted in the pulling direction by the polishing resistance, it is preferably made of a highly rigid metal. Further, the rigidity can be increased by using a metal having a large elastic modulus such as Young's modulus or by increasing the plate thickness.

また、本発明によれば、板状部材と板状体保持部との間の空間に、加圧流体供給手段から加圧流体が供給されると、前記貼着部に貼着された板状体が前記加圧流体の圧力によって研磨具に押し付けられる。これにより、本発明によれば、前記加圧流体によって板状体の各部分にかかる圧力が均一な圧力となるので、板状体を平坦に研磨しながら板状体の表面の微小凹凸を除去できる。   Further, according to the present invention, when pressurized fluid is supplied from the pressurized fluid supply means to the space between the plate-like member and the plate-like body holding portion, the plate-like shape stuck to the sticking portion. The body is pressed against the polishing tool by the pressure of the pressurized fluid. As a result, according to the present invention, the pressure applied to each part of the plate-like body by the pressurized fluid becomes a uniform pressure, so that the fine irregularities on the surface of the plate-like body are removed while polishing the plate-like body flatly. it can.

本発明の前記平面部分は、前記板状体保持部によって保持される板状部材から構成され、前記板状部材と前記板状体保持部との間の空間に、前記板状体保持部に取り付けられた膜体が配置され、前記膜体と前記板状体保持部との間の空間に加圧流体を供給する加圧流体供給手段を有することが好ましい。   The flat surface portion of the present invention is configured by a plate-like member held by the plate-like body holding portion, and in the space between the plate-like member and the plate-like body holding portion, the plate-like body holding portion is provided. It is preferable that the attached film body is disposed and has a pressurized fluid supply means for supplying a pressurized fluid to a space between the film body and the plate-like body holding portion.

本発明によれば、膜体と板状体保持部との間の空間に、加圧流体供給手段から加圧流体が供給されると、膜体が膨張することにより、前記貼着部に貼着された板状体が前記加圧流体の圧力によって研磨具に押し付けられる。これにより、本発明によれば、前記加圧流体によって板状体の各部分にかかる圧力が均一な圧力となるので、板状体を平坦に研磨しながら板状体の表面の微小凹凸を除去できる。   According to the present invention, when the pressurized fluid is supplied from the pressurized fluid supply means to the space between the membrane body and the plate-like body holding portion, the membrane body expands, and the adhesive body is affixed to the pasting portion. The attached plate-like body is pressed against the polishing tool by the pressure of the pressurized fluid. As a result, according to the present invention, the pressure applied to each part of the plate-like body by the pressurized fluid becomes a uniform pressure, so that the fine irregularities on the surface of the plate-like body are removed while polishing the plate-like body flatly. it can.

また、本発明の板状体の研磨装置は、従来の研磨装置の如く膜体を有するが、本発明の膜体は、板状体を研磨具に加圧する機能のみ備えたものである。すなわち、研磨中に生じる研磨抵抗は、板状体貼着部の平面部分(板状部材)が受ける。つまり本発明は、板状体を研磨具に加圧する部材(膜体)と、研磨抵抗を受ける部材(平面部分:板状部材)とを別部品としたので、膜体の長寿命化を図ることができる。   The plate-like body polishing apparatus of the present invention has a film body as in the conventional polishing apparatus, but the film body of the present invention has only a function of pressing the plate-like body against the polishing tool. That is, the polishing resistance generated during polishing is received by the flat portion (plate member) of the plate-like body attaching portion. That is, according to the present invention, the member (film body) that presses the plate-like body against the polishing tool and the member that receives the polishing resistance (plane portion: plate-like member) are separate parts, so that the life of the film body is extended. be able to.

本発明は、前記板状体保持部及び前記板状部材が接する箇所に封止部を有することが好ましい。   In the present invention, it is preferable that a sealing portion is provided at a place where the plate-like body holding portion and the plate-like member are in contact with each other.

本発明によれば、加圧流体供給手段から供給された加圧流体の洩れを封止部によって防止できるので、加圧流体の圧力を効率よく板状体に伝達することができる。   According to the present invention, since leakage of the pressurized fluid supplied from the pressurized fluid supply means can be prevented by the sealing portion, the pressure of the pressurized fluid can be efficiently transmitted to the plate-like body.

本発明の前記平面部分は、開口面を有する箱状体の平面部分から構成され、前記箱状体が前記開口面を介して前記板状体保持部で保持されていることが好ましい。   The planar portion of the present invention is preferably composed of a planar portion of a box-shaped body having an opening surface, and the box-shaped body is preferably held by the plate-shaped body holding portion via the opening surface.

本発明によれば、まず、板状体貼着部を構成する箱状体の平面部分に備えられた貼着部に板状体を貼着させ、次に、この箱状体を板状体保持部に開口面を介して保持させる。そして、板状体保持部と研磨具とを相対的に近接させて、板状体を研磨具に押し付けるとともに、板状体保持部及び研磨具を板状体の研磨面に沿って相対的に移動させて板状体の研磨面を研磨する。本発明においても、膜体を使用せず板状体を研磨するので、板状体の生産性を高めることができる。   According to the present invention, first, the plate-like body is stuck to the sticking portion provided in the flat portion of the box-like body constituting the plate-like body sticking portion, and then this box-like body is put into the plate-like body. The holding portion is held through the opening surface. Then, the plate-like body holding part and the polishing tool are relatively brought close to each other to press the plate-like body against the polishing tool, and the plate-like body holding part and the polishing tool are relatively moved along the polishing surface of the plate-like body. The polishing surface of the plate-like body is polished by moving. Also in the present invention, since the plate-like body is polished without using the film body, the productivity of the plate-like body can be increased.

本発明は、前記箱状体と前記板状体保持部との間の空間に加圧流体を供給する加圧流体供給手段を有することが好ましい。   The present invention preferably includes a pressurized fluid supply means for supplying a pressurized fluid to a space between the box-shaped body and the plate-shaped body holding portion.

本発明によれば、箱状体と板状体保持部との間の空間に、加圧流体供給手段から加圧流体が供給されると、箱状体が研磨具に向けて移動されることにより、前記貼着部に貼着された板状体が前記加圧流体の圧力によって研磨具に押し付けられる。これにより、本発明によれば、前記加圧流体によって板状体の各部分にかかる圧力が均一な圧力となるので、板状体を平坦に研磨しながら板状体の表面の微小凹凸を除去できる。   According to the present invention, when the pressurized fluid is supplied from the pressurized fluid supply means to the space between the box-shaped body and the plate-shaped body holding portion, the box-shaped body is moved toward the polishing tool. Thus, the plate-like body stuck to the sticking part is pressed against the polishing tool by the pressure of the pressurized fluid. As a result, according to the present invention, the pressure applied to each part of the plate-like body by the pressurized fluid becomes a uniform pressure, so that the fine irregularities on the surface of the plate-like body are removed while polishing the plate-like body flatly. it can.

本発明は、前記箱状体と前記板状体保持部との間の空間に、前記板状体保持部に取り付けられた膜体が配置され、前記膜体と前記板状体保持部との間の空間に加圧流体を供給する加圧流体供給手段を有することが好ましい。   In the present invention, a film body attached to the plate-like body holding part is arranged in a space between the box-like body and the plate-like body holding part, and the film body and the plate-like body holding part It is preferable to have a pressurized fluid supply means for supplying pressurized fluid to the space between them.

本発明によれば、膜体と板状体保持部との間の空間に、加圧流体供給手段から加圧流体が供給されると、膜体が膨張することにより、前記貼着部に貼着された板状体が前記加圧流体の圧力によって研磨具に押し付けられる。これにより、本発明によれば、前記加圧流体によって板状体の各部分にかかる圧力が均一な圧力となるので、板状体を平坦に研磨しながら板状体の表面の微小凹凸を除去できる。   According to the present invention, when the pressurized fluid is supplied from the pressurized fluid supply means to the space between the membrane body and the plate-like body holding portion, the membrane body expands, and the adhesive body is affixed to the pasting portion. The attached plate-like body is pressed against the polishing tool by the pressure of the pressurized fluid. As a result, according to the present invention, the pressure applied to each part of the plate-like body by the pressurized fluid becomes a uniform pressure, so that the fine irregularities on the surface of the plate-like body are removed while polishing the plate-like body flatly. it can.

また、本発明は、従来の研磨装置の如く膜体を有するが、この膜体は、板状体を研磨具に加圧するだけの機能を備えたものである。すなわち、研磨中に生じる研磨抵抗は、箱状体の平面部分が受ける。つまり本発明は、板状体を研磨具に加圧する部材(膜体)と、研磨抵抗を受ける部材(平面部分)とを別部品としたので、膜体の長寿命化を図ることができる。   Further, the present invention has a film body as in a conventional polishing apparatus, and this film body has a function of simply pressurizing a plate-like body against a polishing tool. In other words, the polishing resistance generated during polishing is received by the flat portion of the box-shaped body. That is, according to the present invention, since the member (film body) that presses the plate-like body against the polishing tool and the member that receives the polishing resistance (plane portion) are separate parts, the life of the film body can be extended.

本発明は、前記板状体保持部及び前記箱状体が接する箇所に封止部を有することが好ましい。   In the present invention, it is preferable that the plate-like body holding portion and the box-like body have a sealing portion at a place where they contact each other.

本発明によれば、加圧流体供給手段から供給された加圧流体の洩れを封止部によって防止できるので、加圧流体の圧力を効率よく板状体に伝達することができる。   According to the present invention, since leakage of the pressurized fluid supplied from the pressurized fluid supply means can be prevented by the sealing portion, the pressure of the pressurized fluid can be efficiently transmitted to the plate-like body.

本発明の前記平面部分は水平に配置され、該平面部分の上方に前記研磨具が配置されていることが好ましい。   It is preferable that the planar portion of the present invention is disposed horizontally, and the polishing tool is disposed above the planar portion.

本発明によれば、平面部分の上方に研磨具が配置された形態の研磨装置、すなわち、板状体保持部の上方に研磨具が開示された研磨装置でもよい。この研磨装置であって、箱状体が開口面を介して板状体保持部に保持される研磨装置の場合、箱状体の開口面(雌)に板状体保持部(雄)が嵌合される入れ子式の嵌合部を備えた構造となる。この場合、板状体の研磨に使用された研磨液は、そのまま落下するので、前記入れ子式の嵌合部から板状体保持部の内側に研磨液が浸入することを防止できる。   According to the present invention, the polishing apparatus may be a polishing apparatus in which the polishing tool is disposed above the plane portion, that is, the polishing apparatus in which the polishing tool is disclosed above the plate-shaped body holding portion. In this polishing apparatus, in the case where the box-shaped body is held by the plate-shaped body holding portion via the opening surface, the plate-shaped body holding portion (male) is fitted to the opening surface (female) of the box-shaped body. It becomes a structure provided with the fitting type of the nest type to be united. In this case, since the polishing liquid used for polishing the plate-like body falls as it is, it is possible to prevent the polishing liquid from entering the inside of the plate-like body holding portion from the nested fitting portion.

本発明の前記平面部分は水平に配置され、該平面部分の下方に前記研磨具が配置されていることが好ましい。   The planar portion of the present invention is preferably disposed horizontally, and the polishing tool is disposed below the planar portion.

本発明によれば、平面部分の下方に研磨具が配置された形態の研磨装置、すなわち、板状体保持部の下方に研磨具が開示された研磨装置でもよい。   According to the present invention, the polishing apparatus may be a polishing apparatus in which the polishing tool is disposed below the plane portion, that is, the polishing apparatus in which the polishing tool is disclosed below the plate-like body holding portion.

本発明の板状体の研磨装置によれば、板状体の生産性を高めることができる。   According to the plate-like body polishing apparatus of the present invention, the productivity of the plate-like body can be increased.

実施の形態の研磨装置の全体構造を示す平面図The top view which shows the whole structure of the grinding | polishing apparatus of embodiment キャリアとキャンバスの組立斜視図Assembly perspective view of carrier and canvas 研磨ステージの実施の形態を示す側面図Side view showing an embodiment of a polishing stage キャリアに対するキャンバスの取付構造を示した要部拡大断面図Expanded cross-sectional view of the main part showing the canvas mounting structure to the carrier 研磨定盤の構成を示した一部破断部を含む斜視図A perspective view including a partially broken portion showing the configuration of the polishing surface plate 膜体を使用した研磨部の他の構成を示した要部拡大断面図The principal part expanded sectional view which showed the other structure of the grinding | polishing part using a film body 箱状体を使用した研磨部の他の構成を示した模式図Schematic showing another configuration of the polishing section using a box-shaped body

以下、添付図面に従って本発明に係る研磨装置の好ましい実施の形態を詳説する。   Hereinafter, preferred embodiments of a polishing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

図1は、実施の形態の研磨装置10の全体構造を示す平面図である。図2は、キャリア52とキャンバス14の組立斜視図である。図3は、研磨ステージの実施の形態を示す側面図である。   FIG. 1 is a plan view showing an overall structure of a polishing apparatus 10 according to an embodiment. FIG. 2 is an assembled perspective view of the carrier 52 and the canvas 14. FIG. 3 is a side view showing an embodiment of a polishing stage.

図1に示す実施の形態の研磨装置10は、例えば一辺が1000mmを超え、厚みが0.2mm〜0.7mmの大型のガラス板Gの研磨面を液晶ディスプレイ用ガラス板に必要な平坦度に研磨する研磨装置である。研磨対象のガラス板Gの大きさは、一辺の長さが1000mm超が好ましく、2000mm以上(2200mm×2500mm以上)がより好ましく、2800mm以上(2800mm×3000mm以上)がさらに好ましい。   The polishing apparatus 10 of the embodiment shown in FIG. 1 has a flatness necessary for a glass plate for a liquid crystal display, for example, with a polishing surface of a large glass plate G having a side exceeding 1000 mm and a thickness of 0.2 mm to 0.7 mm. A polishing apparatus for polishing. As for the size of the glass plate G to be polished, the length of one side is preferably more than 1000 mm, more preferably 2000 mm or more (2200 mm × 2500 mm or more), and further preferably 2800 mm or more (2800 mm × 3000 mm or more).

研磨装置10は、研磨前のガラス板Gを搬入するガラス板搬入用コンベア12、ガラス板Gをキャンバス(板状体貼着部)14に貼着するガラス板貼着ステージ16、第1の研磨ステージ18、第2の研磨ステージ20、研磨完了したガラス板Gをキャンバス14から取り外すガラス板取り外しステージ22、ガラス板搬出用コンベア24、キャンバス洗浄ステージ26、キャンバス乾燥ステージ28、及びキャンバス返送コンベア30を主として備えている。   The polishing apparatus 10 includes a glass plate carrying conveyor 12 for carrying a glass plate G before polishing, a glass plate sticking stage 16 for sticking the glass plate G to a canvas (plate-like body sticking portion) 14, and a first polishing. A stage 18, a second polishing stage 20, a glass plate removal stage 22 for removing the polished glass plate G from the canvas 14, a glass plate carry-out conveyor 24, a canvas cleaning stage 26, a canvas drying stage 28, and a canvas return conveyor 30. Mainly prepared.

以下、説明を簡略するために、ガラス板貼着ステージ16、第1の研磨ステージ18、第2の研磨ステージ20、ガラス板取り外しステージ22、キャンバス洗浄ステージ26、及びキャンバス乾燥ステージ28については、単にステージ16、18、20、22、26、28と記載する。   Hereinafter, in order to simplify the description, the glass plate attaching stage 16, the first polishing stage 18, the second polishing stage 20, the glass plate removing stage 22, the canvas cleaning stage 26, and the canvas drying stage 28 are simply described. It is described as stages 16, 18, 20, 22, 26, 28.

研磨装置10には、ステージ16からステージ18にキャンバス14を搬送する搬送装置150、ステージ18からステージ20にキャンバス14を搬送する搬送装置152、及びステージ20からステージ22にキャンバス14を搬送する搬送装置154が設けられている。これらの搬送装置150、152、154は、同一構成であって研磨装置10を統括制御する制御部200によってその動作が制御されており、図1上で左右方向に同期して往復移動される。   The polishing apparatus 10 includes a transport device 150 that transports the canvas 14 from the stage 16 to the stage 18, a transport device 152 that transports the canvas 14 from the stage 18 to the stage 20, and a transport device that transports the canvas 14 from the stage 20 to the stage 22. 154 is provided. These transfer devices 150, 152, and 154 have the same configuration, and their operations are controlled by a control unit 200 that controls the polishing apparatus 10 in an integrated manner, and are reciprocated synchronously in the left-right direction in FIG.

ガラス板搬入用コンベア12によって搬入されてきた研磨前のガラス板Gは、ロボット32のアーム33に設けられた吸着パッド34に吸着保持される。そして、アーム33の回転動作によってガラス板搬入用コンベア12からコンベア36に移載され、コンベア36によってステージ16に搬送される。   The unpolished glass plate G carried in by the glass plate carrying-in conveyor 12 is sucked and held by a suction pad 34 provided on the arm 33 of the robot 32. Then, it is transferred from the glass plate carry-in conveyor 12 to the conveyor 36 by the rotation operation of the arm 33, and is conveyed to the stage 16 by the conveyor 36.

ステージ16において、研磨前のガラス板Gがキャンバス14に貼着される。この貼着方法について説明すると、キャンバス14はステージ16において、不図示の昇降装置に保持されており、キャンバス14の下方にガラス板Gが位置したところで、キャンバス14が昇降装置により下降移動され、図2に示すキャンバス14のバックプレート(平面部分:板状部材)38に取り付けられた発泡ポリウレタン製の吸着シート(貼着部)39がガラス板Gの非研磨面に押し付けられる。この押圧力によってガラス板Gの非研磨面がバックプレート38に吸着シート39を介して着脱自在に貼着される。その後、キャンバス14が図1の搬送装置150に保持されて、図3のステージ18に搬送され、ここで研磨ヘッド50のキャリア(板状体保持部)52に保持される。   In the stage 16, the glass plate G before polishing is attached to the canvas 14. The sticking method will be described. The canvas 14 is held by a lifting device (not shown) on the stage 16, and when the glass plate G is positioned below the canvas 14, the canvas 14 is moved downward by the lifting device. A foamed polyurethane adsorbing sheet (sticking portion) 39 attached to the back plate (planar portion: plate-like member) 38 of the canvas 14 shown in FIG. 2 is pressed against the non-polished surface of the glass plate G. With this pressing force, the non-polished surface of the glass plate G is detachably attached to the back plate 38 via the suction sheet 39. Thereafter, the canvas 14 is held by the transfer device 150 of FIG. 1 and transferred to the stage 18 of FIG. 3 where it is held by the carrier (plate-shaped body holding portion) 52 of the polishing head 50.

図2に示すように、キャンバス14は、矩形状のバックプレート38を、同じく矩形状の上枠40と下枠42との間で張設した後、上枠40と下枠42とを不図示のボルトによって締結することによって構成される。バックプレート38、上枠40、及び下枠42は、研磨時における研磨圧力及びガラス板Gの研磨抵抗に十分に耐え得る材質、例えばアルミニウム等の金属で構成されている。また、バックプレート38の厚さは、2〜4mm程度が好適である。バックプレート38の厚さが2mm以上であれば、前記研磨圧力及び前記研磨抵抗に十分に耐えることができる。バックプレート38の厚さが4mm以内であれば、後述する圧縮空気(加圧流体)による研磨圧力をガラス板Gに伝達し易くなる。   As shown in FIG. 2, the canvas 14 has a rectangular back plate 38 stretched between a rectangular upper frame 40 and a lower frame 42, and then the upper frame 40 and the lower frame 42 are not shown. It is constituted by fastening with bolts. The back plate 38, the upper frame 40, and the lower frame 42 are made of a material that can sufficiently withstand the polishing pressure during polishing and the polishing resistance of the glass plate G, for example, a metal such as aluminum. The thickness of the back plate 38 is preferably about 2 to 4 mm. If the thickness of the back plate 38 is 2 mm or more, it can sufficiently withstand the polishing pressure and the polishing resistance. If the thickness of the back plate 38 is within 4 mm, it becomes easy to transmit the polishing pressure by compressed air (pressurized fluid) described later to the glass plate G.

次に、図3に示した研磨ヘッド50について説明する。なお、ステージ18の研磨ヘッド50及びステージ20の研磨ヘッド50は同一構造なので、同一の符号を付して説明する。   Next, the polishing head 50 shown in FIG. 3 will be described. Since the polishing head 50 of the stage 18 and the polishing head 50 of the stage 20 have the same structure, the same reference numerals are used for explanation.

研磨ヘッド50は、本体ケーシング51を備えており、本体ケーシング51には不図示の公転駆動機構部が内蔵されている。この公転駆動機構部は、プラネタリーギア機構部とモータとによって構成され、このモータで駆動されるプラネタリーギア機構部の出力軸が、鉛直方向に垂下されたスピンドル56に連結されている。また、このスピンドル56にキャリア52が連結されている。したがって、前記プラネタリーギア機構部が駆動されると、キャリア52及びキャンバス14は所定の公転中心を中心に公転される。   The polishing head 50 includes a main body casing 51, and a revolving drive mechanism (not shown) is built in the main body casing 51. The revolution drive mechanism is composed of a planetary gear mechanism and a motor, and the output shaft of the planetary gear mechanism driven by the motor is connected to a spindle 56 that is suspended in the vertical direction. A carrier 52 is connected to the spindle 56. Therefore, when the planetary gear mechanism is driven, the carrier 52 and the canvas 14 are revolved around a predetermined revolution center.

更に、本体ケーシング51は、スライダ158を介して昇降機構156に連結されている。この昇降機構156によって本体ケーシング51がスライダ158に対して昇降されることにより、キャリア52がステージ18の円形の研磨パッド(研磨具)58、及びステージ20の円形の研磨パッド(研磨具)60に対し進退移動されるとともに、図4の如くバックプレート38の吸着シート39に貼着されたガラス板Gの研磨面が、図3の研磨パッド58、60に所定の研磨圧力で押圧される。   Further, the main casing 51 is connected to the lifting mechanism 156 via the slider 158. The main body casing 51 is moved up and down with respect to the slider 158 by the lifting mechanism 156, whereby the carrier 52 is moved to the circular polishing pad (polishing tool) 58 of the stage 18 and the circular polishing pad (polishing tool) 60 of the stage 20. While moving forward and backward, the polishing surface of the glass plate G adhered to the suction sheet 39 of the back plate 38 as shown in FIG. 4 is pressed against the polishing pads 58 and 60 of FIG. 3 with a predetermined polishing pressure.

なお、研磨装置10からスライダ158を取り外し、本体ケーシング51が昇降機構156に直接連結されてもよい。   The slider 158 may be removed from the polishing apparatus 10 and the main body casing 51 may be directly connected to the lifting mechanism 156.

研磨パッド58は、図5の如く研磨定盤62の上面に貼り付けられる。この研磨定盤62は、研磨テーブル64に軸受65を介して回転自在に支持されており、その回転中心は研磨パッド58の中心軸と同軸上に設定されている。また、研磨定盤62の側面にはギヤ部66が設けられ、このギヤ部66に、モータ68によって回転されるギヤ67が噛合されている。更に、ギヤ部66は、研磨パッド58の中心軸を中心とする円弧状に構成されている。したがって、モータ68を駆動することにより、研磨パッド58がその中心軸を中心に回動(自転)される。   The polishing pad 58 is affixed to the upper surface of the polishing surface plate 62 as shown in FIG. The polishing surface plate 62 is rotatably supported by a polishing table 64 via a bearing 65, and the center of rotation is set coaxially with the central axis of the polishing pad 58. A gear portion 66 is provided on the side surface of the polishing surface plate 62, and a gear 67 rotated by a motor 68 is engaged with the gear portion 66. Further, the gear portion 66 is formed in an arc shape centering on the central axis of the polishing pad 58. Accordingly, by driving the motor 68, the polishing pad 58 is rotated (spinned) around its central axis.

また、研磨テーブル64は、平行に配置された一対のガイドレール69、69にスライド移動自在に支持されている。研磨テーブル64をガイドレール69、69に沿って往復動作させる駆動部(不図示)を備えることにより、研磨パッド58が必要時において水平方向に揺動される。研磨パッド58の揺動方向は、図1の搬送装置150による搬送方向に対して直交する方向でもよく、この搬送方向に平行な方向でもよい。すなわち、研磨パッド58を水平方向に揺動させる方向であればよい。   The polishing table 64 is slidably supported by a pair of guide rails 69 and 69 arranged in parallel. By providing a drive unit (not shown) for reciprocating the polishing table 64 along the guide rails 69, 69, the polishing pad 58 is swung horizontally when necessary. The swinging direction of the polishing pad 58 may be a direction orthogonal to the transport direction by the transport device 150 of FIG. 1 or may be a direction parallel to the transport direction. That is, any direction that swings the polishing pad 58 in the horizontal direction may be used.

なお、図5の研磨定盤62には、研磨パッド58の裏側にスラリを供給するための多数のホース(不図示)が連結されている。これらのホースを絡めさせないために、研磨パッド58は所定の基準位置から所定の角度範囲で旋回するようにその回転が規制されている。前記ホースから研磨パッド58の裏側に供給されたスラリは、研磨パッド58の内部を貫通するスラリ供給孔を通過して研磨パッド58の表面に供給される。   Note that a number of hoses (not shown) for supplying slurry to the back side of the polishing pad 58 are connected to the polishing surface plate 62 of FIG. In order to prevent the hoses from being entangled, the rotation of the polishing pad 58 is regulated so as to turn within a predetermined angle range from a predetermined reference position. The slurry supplied from the hose to the back side of the polishing pad 58 is supplied to the surface of the polishing pad 58 through a slurry supply hole penetrating the inside of the polishing pad 58.

また、研磨パッド58の旋回角度の範囲、旋回速度等の旋回動作、単位時間当たりの公転回転数等の公転動作は、図1の制御部200によって独立して制御されている。   Further, the range of the turning angle of the polishing pad 58, the turning operation such as the turning speed, and the revolution operation such as the revolution speed per unit time are independently controlled by the control unit 200 of FIG.

研磨パッド60の各部構成については、上述した研磨パッド58の構成と同一なので、ここではその説明を省略する。   Since the configuration of each part of the polishing pad 60 is the same as the configuration of the polishing pad 58 described above, description thereof is omitted here.

一方、図3の如くステージ18のスライダ158には、直動ガイド70、70が取り付けられている。直動ガイド70、70はガイドレール72、72に嵌合されている。このガイドレール72、72は、図1の破線の如くステージ18のスピンドル56やキャリア52をメンテナンスするメンテナンスステージ74に向けて配設されている。   On the other hand, linear motion guides 70 are attached to the slider 158 of the stage 18 as shown in FIG. The linear motion guides 70, 70 are fitted to the guide rails 72, 72. The guide rails 72 and 72 are disposed toward a maintenance stage 74 for maintaining the spindle 56 of the stage 18 and the carrier 52 as indicated by broken lines in FIG.

また、図3の如くステージ20のスライダ158にも同様に、直動ガイド70、70が取り付けられ、直動ガイド70、70はガイドレール160、160に嵌合されている。このガイドレール160、160は、図1の破線の如くステージ20のスピンドル56やキャリア52をメンテナンスするメンテナンスステージ76に向けて配設されている。   Further, as shown in FIG. 3, linear motion guides 70, 70 are similarly attached to the slider 158 of the stage 20, and the linear motion guides 70, 70 are fitted to the guide rails 160, 160. The guide rails 160 and 160 are arranged toward a maintenance stage 76 for maintaining the spindle 56 and the carrier 52 of the stage 20 as indicated by broken lines in FIG.

なお、研磨装置10からスライダ158を取り外し、直動ガイド70、70が昇降装置156に直接取り付けられてもよい。   Note that the slider 158 may be removed from the polishing apparatus 10, and the linear motion guides 70 and 70 may be directly attached to the lifting device 156.

次に、図2、図4に示すキャリア52について説明する。図4は、キャリア52に対するキャンバス14の取付構造を示した要部拡大断面図である。   Next, the carrier 52 shown in FIGS. 2 and 4 will be described. FIG. 4 is an enlarged cross-sectional view of a main part showing a structure for attaching the canvas 14 to the carrier 52.

キャリア52の4辺部には、キャリア52にキャンバス14を保持させるための複数の保持部80、80…が設けられている。保持部80は、図4の如くキャリア52の4辺部の端部52Aを押圧する円盤82と、キャンバス14の上枠40の4辺部の端部40Aを押圧する円盤84と、円盤82と円盤84とを連結するピン86とから構成される。円盤82及び円盤84を前記の如く押圧させる押圧手段は、キャリア52に内設されており、例えばシリンダのピストンをピン86に連結し、ピストンを収縮させることにより、円盤82及び円盤84を引き寄せて円盤82を端部52Aに押圧させるとともに、円盤84を端部40Aに押圧させる。なお、前記押圧手段は、前記シリンダに限定されるものではなく、また、保持部80の形態も本例に限定されるものではない。すなわち、キャリア52にキャンバス14を着脱自在に保持できる構成であれば、如何なるものでもよい。   A plurality of holding portions 80, 80... For holding the canvas 14 on the carrier 52 are provided on the four sides of the carrier 52. As shown in FIG. 4, the holding unit 80 includes a disc 82 that presses the end portions 52 </ b> A of the four sides of the carrier 52, a disc 84 that presses the end portions 40 </ b> A of the four sides of the upper frame 40 of the canvas 14, The pin 86 is connected to the disk 84. The pressing means for pressing the disk 82 and the disk 84 as described above is provided in the carrier 52. For example, the piston of the cylinder is connected to the pin 86, and the piston 82 is contracted to draw the disk 82 and the disk 84 together. The disc 82 is pressed against the end 52A, and the disc 84 is pressed against the end 40A. The pressing means is not limited to the cylinder, and the shape of the holding portion 80 is not limited to this example. That is, any configuration may be used as long as the canvas 14 can be detachably held on the carrier 52.

一方、キャリア52の下面の周縁の内側には、周縁に沿ったマウント88が形成されており、そのマウント88の下面にシール部材(封止部)90が取り付けられている。キャリア52にキャンバス14が保持部80に保持されて、ガラス板Gが研磨パッド58、60に押圧された際に、バックプレート38の上面がシール部材90に圧接される。これにより、キャリア52とキャンバス14との間に気密性のよい空気室(空間)54が形成される。気密性のよい空気室54が形成されると、ガラス板Gの各部分にかかる圧力が均一な圧力となるので、ガラス板Gを平坦に研磨しながらガラス板Gの表面の微小凹凸を除去できる。   On the other hand, a mount 88 is formed along the periphery of the lower surface of the carrier 52, and a seal member (sealing part) 90 is attached to the lower surface of the mount 88. When the canvas 14 is held by the holding portion 80 and the glass plate G is pressed against the polishing pads 58 and 60 by the carrier 52, the upper surface of the back plate 38 is pressed against the seal member 90. Thereby, an air chamber (space) 54 with good airtightness is formed between the carrier 52 and the canvas 14. When the air chamber 54 having good airtightness is formed, the pressure applied to each part of the glass plate G becomes a uniform pressure, so that the fine irregularities on the surface of the glass plate G can be removed while the glass plate G is polished flat. .

キャリア52には、空気室54に圧縮空気(加圧流体)を噴出する噴射口98、98…が開口されている。これらの噴射口98、98…は、キャリア52の上面に備えられた空気室100を介して、図3上の破線で示す空気供給路102に連通される。空気供給路102は、研磨ヘッド50に取り付けられた不図示のロータリジョイントを介して研磨ヘッド50の外部に延設され、バルブ104を介して空気ポンプ(加圧流体供給手段)106に接続されている。したがって、バルブ104を開放すると、空気ポンプ106からの圧縮空気が空気供給路102、図4の空気室100、及び噴射口98を介して空気室54に供給される。これにより、圧縮空気の圧力がバックプレート38を介してガラス板Gに伝達され、この圧力によってガラス板Gの研磨面が図3の研磨パッド58、60に押し付けられて研磨される。また、空気室54に供給された圧縮空気は、シール部材90によって空気室54が密閉されているので、空気室54からの洩れが抑えられている。これによって、圧縮空気の圧力が効率よくガラス板Gに伝達される。   In the carrier 52, jet ports 98, 98... For jetting compressed air (pressurized fluid) into the air chamber 54 are opened. These injection ports 98, 98... Communicate with an air supply path 102 indicated by a broken line in FIG. 3 through an air chamber 100 provided on the upper surface of the carrier 52. The air supply path 102 extends outside the polishing head 50 via a rotary joint (not shown) attached to the polishing head 50, and is connected to an air pump (pressurized fluid supply means) 106 via a valve 104. Yes. Therefore, when the valve 104 is opened, the compressed air from the air pump 106 is supplied to the air chamber 54 via the air supply path 102, the air chamber 100 of FIG. Thus, the pressure of the compressed air is transmitted to the glass plate G through the back plate 38, and the polishing surface of the glass plate G is pressed against the polishing pads 58 and 60 of FIG. Further, since the compressed air supplied to the air chamber 54 is sealed by the seal member 90, leakage from the air chamber 54 is suppressed. Thereby, the pressure of compressed air is efficiently transmitted to the glass plate G.

図1に示したステージ20でガラス板Gの研磨が終了すると、ここでキャンバス14がキャリア52から取り外されて搬送装置154によりステージ22に搬送される。そして、ステージ22では、キャンバス14から、研磨終了したガラス板Gを取り外す。取り外されたガラス板Gは、コンベア138によって搬送され、そして、ロボット140のアーム142に取り付けられた吸着ヘッド144に吸着され、ロボット140の動作によってガラス板搬出用コンベア24に移載され、研磨装置10の外部に搬出される。   When the polishing of the glass plate G is completed at the stage 20 shown in FIG. 1, the canvas 14 is removed from the carrier 52 and conveyed to the stage 22 by the conveying device 154. At the stage 22, the glass plate G that has been polished is removed from the canvas 14. The removed glass plate G is conveyed by the conveyor 138, and is adsorbed by the adsorption head 144 attached to the arm 142 of the robot 140, and is transferred to the glass plate carry-out conveyor 24 by the operation of the robot 140. 10 to the outside.

また、ガラス板Gが取り外されたキャンバス14はコンベア146によってステージ26に搬送され、ここで水洗浄される。洗浄終了したキャンバス14は、コンベア148によってステージ28に搬送され、ここで加熱されて乾燥される。そして、乾燥終了したキャンバス14は、キャンバス返送コンベア30によってステージ16に搬送され、ガラス板Gの貼着に再使用される。以上が研磨装置10の全体構成である。   In addition, the canvas 14 from which the glass plate G has been removed is conveyed to the stage 26 by the conveyor 146 where it is washed with water. The washed canvas 14 is conveyed to the stage 28 by the conveyor 148, where it is heated and dried. Then, the dried canvas 14 is transported to the stage 16 by the canvas return conveyor 30 and reused for attaching the glass plate G. The above is the overall configuration of the polishing apparatus 10.

なお、研磨ステージは、用途により一つであっても、二つ以上であってもよい。効率やコストを考慮すると、粗研磨ステージと仕上研磨ステージの二つのステージを備えることが好ましいが、場合によって高品質目的のために仕上研磨ステージを追加してもよい。   The polishing stage may be one or two or more depending on the application. In consideration of efficiency and cost, it is preferable to provide two stages of a rough polishing stage and a finish polishing stage, but a finish polishing stage may be added for high quality purposes in some cases.

次に、前記の如く構成された研磨装置10の作用について説明する。   Next, the operation of the polishing apparatus 10 configured as described above will be described.

まず、ステージ16において、キャンバス14のバックプレート38に貼り付けられた吸着シート39にガラス板Gを貼着させる。次に、このキャンバス14をステージ18に搬送し、キャリア52に水平に保持させる。次いで、キャンバス14と研磨パッド58、60とを相対的に近接させて、ガラス板Gを研磨パッド58、60に圧縮空気の圧力によって押し付けるとともに、キャンバス14及び研磨パッド58、60をガラス板Gの研磨面に沿って相対的に移動させてガラス板Gの研磨面を研磨する。   First, on the stage 16, the glass plate G is attached to the suction sheet 39 attached to the back plate 38 of the canvas 14. Next, the canvas 14 is conveyed to the stage 18 and held horizontally by the carrier 52. Next, the canvas 14 and the polishing pads 58 and 60 are brought relatively close to each other, the glass plate G is pressed against the polishing pads 58 and 60 by the pressure of compressed air, and the canvas 14 and the polishing pads 58 and 60 are pressed against the glass plate G. The polishing surface of the glass plate G is polished by relatively moving along the polishing surface.

図4は、ステージ18、20に設置された研磨部の構成を示した一部断面図である。前記研磨部は、キャリア52の空気室54に供給された圧縮空気の圧力を、キャンバス14のバックプレート38及び吸着シート39を介してガラス板Gに伝達し、ガラス板Gの研磨面を研磨パッド58、60によって研磨する。   FIG. 4 is a partial cross-sectional view showing the configuration of the polishing section installed on the stages 18 and 20. The polishing unit transmits the pressure of the compressed air supplied to the air chamber 54 of the carrier 52 to the glass plate G through the back plate 38 and the suction sheet 39 of the canvas 14, and the polishing surface of the glass plate G is used as a polishing pad. Polish by 58, 60.

実施の形態の研磨装置10では、膜体を使用せずキャンバス14を使用してガラス板Gを研磨するので、ガラス板Gの生産工程から膜体の交換工程を省くことができる。これにより、ガラス板Gの生産性が向上する。   In the polishing apparatus 10 according to the embodiment, since the glass plate G is polished using the canvas 14 without using the film body, the film body replacement step can be omitted from the production process of the glass plate G. Thereby, the productivity of the glass plate G is improved.

なお、実施の形態では、圧縮空気の圧力によってガラス板Gを研磨する例を示したが、これに限定されるものではなく、研磨パッド58、60に対するキャリア52の進出力によってガラス板Gに研磨圧力を与える研磨装置にも適用することができる。   In the embodiment, the example in which the glass plate G is polished by the pressure of the compressed air has been described. However, the present invention is not limited to this, and the glass plate G is polished by the advance of the carrier 52 with respect to the polishing pads 58 and 60. The present invention can also be applied to a polishing apparatus that applies pressure.

図6は、研磨圧力をガラス板Gに伝達する部材として膜体92を使用した他の研磨部の形態が示されている。   FIG. 6 shows a form of another polishing unit using a film body 92 as a member for transmitting the polishing pressure to the glass plate G.

前記研磨部は、キャリア52の空気室54に供給された圧縮空気の圧力によって膜体92を膨張させ、膨張した膜体92の押圧力を、キャンバス14のバックプレート38及び吸着シート39を介してガラス板Gに伝達し、ガラス板Gの研磨面を研磨パッド58、60によって研磨する。この研磨部においても、圧縮空気の圧力によってガラス板Gの各部分にかかる圧力が均一な圧力となるので、ガラス板Gを平坦に研磨しながらガラス板Gの表面の微小凹凸を除去できる。   The polishing unit expands the film body 92 by the pressure of the compressed air supplied to the air chamber 54 of the carrier 52, and applies the pressing force of the expanded film body 92 via the back plate 38 and the suction sheet 39 of the canvas 14. This is transmitted to the glass plate G, and the polishing surface of the glass plate G is polished by the polishing pads 58 and 60. Also in this polishing part, the pressure applied to each part of the glass plate G by the pressure of the compressed air becomes a uniform pressure, so that the fine irregularities on the surface of the glass plate G can be removed while polishing the glass plate G flatly.

本例では膜体92を有するが、本例の膜体92はキャリア52に取り付けられたものであり、ガラス板Gを研磨パッド58、60に加圧する機能のみ備えたものである。すなわち、ガラス板Gの研磨中に生じる研磨抵抗は、キャンバス14のバックプレート38が受ける。つまり本例は、ガラス板Gを研磨パッド58、60に加圧する部材(膜体92)と、研磨抵抗を受ける部材(バックプレート38)とを別部品としたので、特許文献1の膜体よりも、その寿命を延ばすことができる。   In this example, the film body 92 is provided, but the film body 92 of this example is attached to the carrier 52 and has only a function of pressing the glass plate G against the polishing pads 58 and 60. In other words, the polishing resistance generated during the polishing of the glass plate G is received by the back plate 38 of the canvas 14. That is, in this example, the member (film body 92) that presses the glass plate G against the polishing pads 58 and 60 and the member that receives the polishing resistance (back plate 38) are separate parts. Can extend its life.

図6に示した形態においても、キャリア52のマウント88に図4に示したシール部材90を設けてもよい。これにより、空気室54の気密性が向上する。   Also in the form shown in FIG. 6, the seal member 90 shown in FIG. 4 may be provided on the mount 88 of the carrier 52. Thereby, the airtightness of the air chamber 54 is improved.

なお、図1〜図6に示した形態では、水平に配置されたバックプレート38の下方に研磨パッド58、60が配置された研磨装置10を例示したが、バックプレート38の上方に研磨パッド58、60が配置された研磨装置にも適用できる。   1 to 6 exemplify the polishing apparatus 10 in which the polishing pads 58 and 60 are disposed below the horizontally disposed back plate 38, the polishing pad 58 is disposed above the back plate 38. , 60 can be applied to the polishing apparatus.

図7は、箱体(箱状体)94を使用した研磨部の他の構成を示した模式図である。   FIG. 7 is a schematic diagram showing another configuration of a polishing unit using a box (box-like body) 94.

同図に示す研磨部は、水平に配置されたバックプレート38の上方に研磨パッド58、60が配置されている。   In the polishing unit shown in the figure, polishing pads 58 and 60 are arranged above a horizontally arranged back plate 38.

バックプレート38は、下面に開口面を有する箱体94の上面(平面部分)に取り付けられている。このバックプレート38の上面に吸着シート39が接着され、吸着シート39の上面にガラス板Gの非研磨面が貼着されている。   The back plate 38 is attached to the upper surface (planar portion) of the box 94 having an opening surface on the lower surface. The suction sheet 39 is adhered to the upper surface of the back plate 38, and the non-polished surface of the glass plate G is adhered to the upper surface of the suction sheet 39.

箱体94の開口面から箱体94の内部空間部に、キャリア52が入れ子式に嵌合される。そして、キャリア52の上面縁部にはシール部材90が取り付けられており、このシール部材90は、箱体94の上壁の内側面に接触される。これにより、キャリア52と箱体94との間に空気室54が形成される。この空気室54に圧縮空気を供給すると、箱体94が研磨パッド58、60に向けて上昇し、吸着シート39に貼着されたガラス板Gが圧縮空気の圧力によって研磨パッド58、60に押し付けられる。これにより、この研磨部においても、圧縮空気によってガラス板Gの各部分にかかる圧力が均一な圧力となるので、ガラス板Gを平坦に研磨しながらガラス板Gの表面の微小凹凸を除去できる。   The carrier 52 is telescoped from the opening surface of the box 94 into the internal space of the box 94. A seal member 90 is attached to the upper surface edge of the carrier 52, and the seal member 90 is in contact with the inner side surface of the upper wall of the box 94. Thereby, an air chamber 54 is formed between the carrier 52 and the box 94. When compressed air is supplied to the air chamber 54, the box 94 rises toward the polishing pads 58 and 60, and the glass plate G adhered to the adsorption sheet 39 is pressed against the polishing pads 58 and 60 by the pressure of the compressed air. It is done. Thereby, also in this grinding | polishing part, since the pressure concerning each part of the glass plate G by compressed air becomes a uniform pressure, the fine unevenness | corrugation on the surface of the glass plate G can be removed, grind | polishing the glass plate G flatly.

なお、キャリア52に二点鎖線で示す膜体92を取り付けて、膜体92とキャリア52との間の空気室54に圧縮空気を供給してもよい。また、圧縮空気を使用せず、キャリア52の上昇力によって研磨圧力を得るようにしてもよい。   Note that a film body 92 indicated by a two-dot chain line may be attached to the carrier 52, and compressed air may be supplied to the air chamber 54 between the film body 92 and the carrier 52. Further, the polishing pressure may be obtained by the ascending force of the carrier 52 without using compressed air.

また、図7の研磨部は、箱体94の開口面(雌)にキャリア52の上部(雄)が嵌合される入れ子式の嵌合部を備えた構造である。この場合、ガラス板Gの研磨に使用されたスラリ(研磨液)は、そのまま落下するので、前記入れ子式の嵌合部からキャリア52の内側の空気室54にスラリが浸入することを防止できる。   7 has a structure including a nested fitting portion in which the upper portion (male) of the carrier 52 is fitted to the opening surface (female) of the box 94. In this case, since the slurry (polishing liquid) used for polishing the glass plate G falls as it is, it is possible to prevent the slurry from entering the air chamber 54 inside the carrier 52 from the nested fitting portion.

なお、本例の研磨部は、水平に配置されたバックプレート38の上方に研磨パッド58、60を配置したが、バックプレート38の下方に研磨パッド58、60が配置された研磨装置にも本例を適用することができる。   In the polishing unit of this example, the polishing pads 58 and 60 are disposed above the horizontally arranged back plate 38. However, the present embodiment is also applied to a polishing apparatus in which the polishing pads 58 and 60 are disposed below the back plate 38. An example can be applied.

ステージ18、20の仕様の一例を下記に示す。   An example of the specifications of the stages 18 and 20 is shown below.

研磨圧力 :2kPa〜25kPa
研磨スラリ :酸化セリウムを水に分散させた研磨スラリを研磨定盤のスラリ供給孔から供給
研磨パッド58 :発泡ポリウレタン製で表面にスラリを流す溝有り(溝ピッチ4.5mm、溝幅1.5mm、溝深さ1〜5mm)
研磨パッド60 :軟質ウレタン製スエード状で表面にスラリを流す溝有り(溝ピッチ4.5mm、溝幅1.5mm、溝深さ1〜5mm)
ガラス板Gの厚み :0.2mm〜0.7mm
ガラス板Gの形状 :一辺が1000mmを超えた矩形状ガラス板
ガラス板Gの非研磨面:キャンバス14のバックプレート38に貼り付けられたポリウレタン製の吸着パッドにて密着保持
キャンバス14のバックプレート38は、長期間の使用においても劣化、損傷とも無く、よって、キャンバス14の交換作業を激減できることを実験にて確認できた。これにより、ガラス板の生産性が向上することも把握できた。
Polishing pressure: 2 kPa to 25 kPa
Polishing slurry: Polishing slurry in which cerium oxide is dispersed in water is supplied from the slurry supply hole of the polishing platen. Polishing pad 58: Made of polyurethane foam, with grooves that allow slurry to flow on the surface (groove pitch 4.5mm, groove width 1.5mm) , Groove depth 1-5mm)
Polishing pad 60: Suede made of soft urethane, with grooves for flowing slurry on the surface (groove pitch 4.5mm, groove width 1.5mm, groove depth 1-5mm)
Thickness of glass plate G: 0.2 mm to 0.7 mm
Shape of glass plate G: Rectangular glass plate with a side exceeding 1000 mm Non-polished surface of glass plate G: Adherently held by polyurethane adsorption pad attached to back plate 38 of canvas 14 Back plate 38 of canvas 14 In the experiment, it was confirmed that there was no deterioration or damage even after long-term use, and that the replacement work of the canvas 14 could be drastically reduced. Thereby, it has also been grasped that the productivity of the glass plate is improved.

G…ガラス板、10…研磨装置、12…ガラス板搬入用コンベア、14…キャンバス、16…ガラス板貼着ステージ、18…第1の研磨ステージ、20…第2の研磨ステージ、22…ガラス板取り外しステージ、24…ガラス板搬出用コンベア、26…キャンバス洗浄ステージ、28…キャンバス乾燥ステージ、30…キャンバス返送コンベア、32…ロボット、33…アーム、34…吸着パッド、36…コンベア、38…バックプレート、39…吸着シート、40…上枠、42…下枠、50…研磨ヘッド、51…本体ケーシング、52…キャリア、54…空気室、56…スピンドル、58…研磨パッド、60…研磨パッド、62…研磨定盤、70…直動ガイド、72…ガイドレール、74…メンテナンスステージ、76…メンテナンスステージ、80…保持部、82、84…円盤、86…ピン、88…マウント、90…シール部材、92…膜体、94…箱体、98…噴射口、100…空気室、102…空気供給路、104…バルブ、106…空気ポンプ、138…コンベア、140…ロボット、142…アーム、144…吸着ヘッド、146、148…コンベア、150、152、154…搬送装置、160…ガイドレール、200…制御部   G ... Glass plate, 10 ... Polishing device, 12 ... Conveyor for carrying glass plate, 14 ... Canvas, 16 ... Glass plate sticking stage, 18 ... First polishing stage, 20 ... Second polishing stage, 22 ... Glass plate Removal stage, 24 ... Conveyor for carrying out glass plate, 26 ... Canvas washing stage, 28 ... Canvas drying stage, 30 ... Canvas return conveyor, 32 ... Robot, 33 ... Arm, 34 ... Suction pad, 36 ... Conveyor, 38 ... Back plate 39 ... Adsorption sheet, 40 ... Upper frame, 42 ... Lower frame, 50 ... Polishing head, 51 ... Main body casing, 52 ... Carrier, 54 ... Air chamber, 56 ... Spindle, 58 ... Polishing pad, 60 ... Polishing pad, 62 ... Polishing surface plate, 70 ... Linear motion guide, 72 ... Guide rail, 74 ... Maintenance stage, 76 ... Maintenance step G, 80 ... holding part, 82, 84 ... disk, 86 ... pin, 88 ... mount, 90 ... sealing member, 92 ... film body, 94 ... box, 98 ... injection port, 100 ... air chamber, 102 ... air supply Road 104: Valve 106 Air pump 138 Conveyor 140 Robot 142 Arm 144 Adsorption head 146 148 Conveyor 150 152 154 Conveyor 160 160 Guide rail 200 Control unit

Claims (9)

板状体を貼着する板状体貼着部と、
前記板状体貼着部を保持する板状体保持部と、
前記板状体貼着部に対向して配置され、前記板状体貼着部によって貼着される前記板状体の研磨面を研磨する研磨具と、
を有する板状体の研磨装置において、
前記板状体貼着部は前記研磨具の対向面に平面部分を有し、該平面部分に板状体の貼着部を備え、
前記平面部分は、前記板状体保持部によって保持される板状部材から構成され、
前記板状部材と前記板状体保持部との間の空間に加圧流体を供給する加圧流体供給手段を有することを特徴とする板状体の研磨装置。
A plate-like body attaching part for attaching the plate-like body;
A plate-like body holding part for holding the plate-like body attaching part;
A polishing tool that is disposed to face the plate-like body attaching part and polishes the polishing surface of the plate-like body that is attached by the plate-like body attaching part,
In a plate-shaped polishing apparatus having
The plate-like body adhering portion has a flat portion on the facing surface of the polishing tool, and the flat portion includes an adhering portion of the plate-like body,
The plane portion is composed of a plate-like member held by the plate-like body holding portion,
An apparatus for polishing a plate-like body, comprising pressurized fluid supply means for supplying a pressurized fluid to a space between the plate-like member and the plate-like body holding portion.
前記平面部分は、前記板状体保持部によって保持される板状部材から構成され、
前記板状部材と前記板状体保持部との間の空間に、前記板状体保持部に取り付けられた膜体が配置され、
前記膜体と前記板状体保持部との間の空間に加圧流体を供給する加圧流体供給手段を有する請求項1に記載の板状体の研磨装置。
The plane portion is composed of a plate-like member held by the plate-like body holding portion,
In the space between the plate-like member and the plate-like body holding part, a film body attached to the plate-like body holding part is arranged,
The plate-shaped body polishing apparatus according to claim 1, further comprising a pressurized fluid supply unit configured to supply a pressurized fluid to a space between the film body and the plate-shaped body holding portion.
前記板状体保持部及び前記板状部材が接する箇所に封止部を有する請求項1又は2に記載の板状体の研磨装置。   The polishing apparatus for a plate-like body according to claim 1, wherein the plate-like body holding portion and the plate-like member are in contact with each other and have a sealing portion. 前記平面部分は、開口面を有する箱状体の平面部分から構成され、
前記箱状体が前記開口面を介して前記板状体保持部で保持されている請求項1に記載の板状体の研磨装置。
The plane portion is composed of a plane portion of a box-shaped body having an opening surface,
The plate-shaped polishing apparatus according to claim 1, wherein the box-shaped body is held by the plate-shaped body holding portion through the opening surface.
前記箱状体と前記板状体保持部との間の空間に加圧流体を供給する加圧流体供給手段を有する請求項4に記載の板状体の研磨装置。   The plate-shaped body polishing apparatus according to claim 4, further comprising a pressurized fluid supply unit configured to supply a pressurized fluid to a space between the box-shaped body and the plate-shaped body holding portion. 前記箱状体と前記板状体保持部との間の空間に、前記板状体保持部に取り付けられた膜体が配置され、
前記膜体と前記板状体保持部との間の空間に加圧流体を供給する加圧流体供給手段を有する請求項4に記載の板状体の研磨装置。
In the space between the box-shaped body and the plate-shaped body holding portion, a film body attached to the plate-shaped body holding portion is disposed,
The plate-shaped body polishing apparatus according to claim 4, further comprising a pressurized fluid supply unit configured to supply a pressurized fluid to a space between the film body and the plate-shaped body holding portion.
前記板状体保持部及び前記箱状体が接する箇所に封止部を有する請求項5又は6に記載の板状体の研磨装置。   The polishing apparatus for a plate-shaped body according to claim 5 or 6, wherein the plate-shaped body holding section and the box-shaped body are in contact with each other. 前記平面部分は水平に配置され、該平面部分の上方に前記研磨具が配置されている請求項1〜6のいずれか一項に記載の板状体の研磨装置。   The said planar part is arrange | positioned horizontally, The said grinding | polishing tool is arrange | positioned above this planar part, The polishing apparatus of the plate-shaped body as described in any one of Claims 1-6. 前記平面部分は水平に配置され、該平面部分の下方に前記研磨具が配置されている請求項1〜6のいずれか一項に記載の板状体の研磨装置。   The said plane part is arrange | positioned horizontally, The said polishing tool is arrange | positioned under this plane part, The polishing apparatus of the plate-shaped object as described in any one of Claims 1-6.
JP2011056733A 2011-03-15 2011-03-15 Plate-like body polishing apparatus Withdrawn JP2012192470A (en)

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TW101108943A TW201302381A (en) 2011-03-15 2012-03-15 Polishing device for plate-like object
KR1020120026433A KR20120105382A (en) 2011-03-15 2012-03-15 Polishing device for plate-shaped body
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