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WO2009060787A1 - Dicing die-bonding film - Google Patents

Dicing die-bonding film Download PDF

Info

Publication number
WO2009060787A1
WO2009060787A1 PCT/JP2008/069798 JP2008069798W WO2009060787A1 WO 2009060787 A1 WO2009060787 A1 WO 2009060787A1 JP 2008069798 W JP2008069798 W JP 2008069798W WO 2009060787 A1 WO2009060787 A1 WO 2009060787A1
Authority
WO
WIPO (PCT)
Prior art keywords
bonding film
die
dicing
adhesive layer
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069798
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuhiko Kamiya
Takeshi Matsumura
Shuuhei Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007314899A external-priority patent/JP4717051B2/en
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to US12/741,875 priority Critical patent/US20100233409A1/en
Priority to DE112008003005T priority patent/DE112008003005T5/en
Priority to CN2008801150899A priority patent/CN101855710B/en
Priority to KR1020137027287A priority patent/KR101420993B1/en
Priority to KR1020107025179A priority patent/KR101420903B1/en
Publication of WO2009060787A1 publication Critical patent/WO2009060787A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H10P72/7402—
    • H10P72/7404—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H10P72/7416—
    • H10W72/01331—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/354—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—
    • H10W99/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Disclosed is a dicing die-bonding film which has an excellent balance between a holding force during the dicing of a work and detachability upon the detachment of a chip-type work produced by the dicing together with the die-bonding film even when the work is thin. The dicing die-bonding film comprises a base material, a dicing film arranged on the base material and having an adhesive layer, and a die-bonding film arranged on the adhesive layer, wherein the adhesive layer comprises a polymer comprising an acrylic acid ester as the main monomer, a hydroxyl-containing monomer at a content of 10 to 30 mol% relative to the amount of the acrylic acid ester, and an isocyanate compound having a radical-reactive carbon-carbon double bond at a content of 70 to 90 mol% relative to the amount of the hydroxyl-containing monomer, and wherein the die-bonding film comprises an epoxy resin.
PCT/JP2008/069798 2007-11-08 2008-10-30 Dicing die-bonding film Ceased WO2009060787A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/741,875 US20100233409A1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film
DE112008003005T DE112008003005T5 (en) 2007-11-08 2008-10-30 Adhesive foil for cutting chips
CN2008801150899A CN101855710B (en) 2007-11-08 2008-10-30 Dicing die-bonding film
KR1020137027287A KR101420993B1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film
KR1020107025179A KR101420903B1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007291056 2007-11-08
JP2007-291056 2007-11-08
JP2007314899A JP4717051B2 (en) 2007-11-08 2007-12-05 Dicing die bond film
JP2007-314899 2007-12-05

Publications (1)

Publication Number Publication Date
WO2009060787A1 true WO2009060787A1 (en) 2009-05-14

Family

ID=40625680

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069798 Ceased WO2009060787A1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film

Country Status (1)

Country Link
WO (1) WO2009060787A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2242089A4 (en) * 2008-01-18 2011-08-03 Nitto Denko Corp CUTTING FILM IN CHIPS / FIXING OF CHIPS
EP2239763A4 (en) * 2008-01-18 2011-08-03 Nitto Denko Corp Dicing / CHIP BOND FILM
CN103608902A (en) * 2011-06-27 2014-02-26 电气化学工业株式会社 Adhesive sheet
US20140203458A1 (en) * 2010-04-19 2014-07-24 Nitto Denko Corporation Dicing tape-integrated film for semiconductor back surface
CN113261153A (en) * 2019-01-04 2021-08-13 三星Sdi株式会社 Separator for lithium secondary battery and lithium secondary battery including the same
US12136743B2 (en) 2018-12-26 2024-11-05 Samsung Sdi Co., Ltd. Separator for lithium secondary battery, and lithium secondary battery comprising same
US12230837B2 (en) 2018-12-21 2025-02-18 Samsung Sdi Co., Ltd. Separator having coating layer with ternary acrylic copolymer and inorganic particles with different particle diameters, and lithium secondary battery comprising same
US12230834B2 (en) 2019-01-16 2025-02-18 Samsung Sdi Co., Ltd. Separator including porous substrate and coating layer of acrylic copolymer, organic filler, and inorganic particles, and lithium secondary battery including the same
US12237536B2 (en) 2018-12-28 2025-02-25 Samsung Sdi Co., Ltd. Separator for lithium secondary battery and lithium secondary battery comprising same
US12300849B2 (en) 2018-12-20 2025-05-13 Samsung Sdi Co., Ltd. Separator for lithium secondary battery and lithium secondary battery comprising same
US12322830B2 (en) 2018-12-26 2025-06-03 Samsung Sdi Co., Ltd. Separator for lithium secondary battery and lithium secondary battery comprising same
US12531310B2 (en) 2018-09-18 2026-01-20 Samsung Sdi Co., Ltd. Separator for lithium secondary battery, and lithium secondary battery including same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001226647A (en) * 2000-02-18 2001-08-21 Kumamoto Nippon Denki Kk Adhesive sheet for attaching wafer
JP2002226796A (en) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd Adhesive sheet for attaching wafer and semiconductor device
JP2003096412A (en) * 2001-09-26 2003-04-03 Nitto Denko Corp Pressure-sensitive adhesive sheet for dicing semiconductor parts and method for manufacturing semiconductor parts
JP2005005355A (en) * 2003-06-10 2005-01-06 Nitto Denko Corp Dicing die bond film
JP2005116920A (en) * 2003-10-10 2005-04-28 Nitto Denko Corp Adhesive sheet for semiconductor processing and semiconductor processing method
JP2005239884A (en) * 2004-02-26 2005-09-08 Nitto Denko Corp Adhesive sheet for semiconductor wafer processing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001226647A (en) * 2000-02-18 2001-08-21 Kumamoto Nippon Denki Kk Adhesive sheet for attaching wafer
JP2002226796A (en) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd Adhesive sheet for attaching wafer and semiconductor device
JP2003096412A (en) * 2001-09-26 2003-04-03 Nitto Denko Corp Pressure-sensitive adhesive sheet for dicing semiconductor parts and method for manufacturing semiconductor parts
JP2005005355A (en) * 2003-06-10 2005-01-06 Nitto Denko Corp Dicing die bond film
JP2005116920A (en) * 2003-10-10 2005-04-28 Nitto Denko Corp Adhesive sheet for semiconductor processing and semiconductor processing method
JP2005239884A (en) * 2004-02-26 2005-09-08 Nitto Denko Corp Adhesive sheet for semiconductor wafer processing

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2242089A4 (en) * 2008-01-18 2011-08-03 Nitto Denko Corp CUTTING FILM IN CHIPS / FIXING OF CHIPS
EP2239763A4 (en) * 2008-01-18 2011-08-03 Nitto Denko Corp Dicing / CHIP BOND FILM
US20140203458A1 (en) * 2010-04-19 2014-07-24 Nitto Denko Corporation Dicing tape-integrated film for semiconductor back surface
US9478454B2 (en) * 2010-04-19 2016-10-25 Nitto Denko Corporation Dicing tape-integrated film for semiconductor back surface
CN103608902A (en) * 2011-06-27 2014-02-26 电气化学工业株式会社 Adhesive sheet
CN103608902B (en) * 2011-06-27 2016-05-11 电化株式会社 Bonding sheet
US12531310B2 (en) 2018-09-18 2026-01-20 Samsung Sdi Co., Ltd. Separator for lithium secondary battery, and lithium secondary battery including same
US12300849B2 (en) 2018-12-20 2025-05-13 Samsung Sdi Co., Ltd. Separator for lithium secondary battery and lithium secondary battery comprising same
US12230837B2 (en) 2018-12-21 2025-02-18 Samsung Sdi Co., Ltd. Separator having coating layer with ternary acrylic copolymer and inorganic particles with different particle diameters, and lithium secondary battery comprising same
US12136743B2 (en) 2018-12-26 2024-11-05 Samsung Sdi Co., Ltd. Separator for lithium secondary battery, and lithium secondary battery comprising same
US12322830B2 (en) 2018-12-26 2025-06-03 Samsung Sdi Co., Ltd. Separator for lithium secondary battery and lithium secondary battery comprising same
US12237536B2 (en) 2018-12-28 2025-02-25 Samsung Sdi Co., Ltd. Separator for lithium secondary battery and lithium secondary battery comprising same
CN113261153B (en) * 2019-01-04 2023-10-20 三星Sdi株式会社 Separator for lithium secondary battery and lithium secondary battery including the separator
CN113261153A (en) * 2019-01-04 2021-08-13 三星Sdi株式会社 Separator for lithium secondary battery and lithium secondary battery including the same
US12230834B2 (en) 2019-01-16 2025-02-18 Samsung Sdi Co., Ltd. Separator including porous substrate and coating layer of acrylic copolymer, organic filler, and inorganic particles, and lithium secondary battery including the same

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