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WO2009054487A1 - Précurseur de polyimide et composition de résine photosensible contenant le précurseur de polyimide - Google Patents

Précurseur de polyimide et composition de résine photosensible contenant le précurseur de polyimide Download PDF

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Publication number
WO2009054487A1
WO2009054487A1 PCT/JP2008/069315 JP2008069315W WO2009054487A1 WO 2009054487 A1 WO2009054487 A1 WO 2009054487A1 JP 2008069315 W JP2008069315 W JP 2008069315W WO 2009054487 A1 WO2009054487 A1 WO 2009054487A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide precursor
resin composition
carbon atoms
composition containing
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069315
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Hayakawa
Takeki Shimizu
Kanako Ogasawara
Hideaki Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp, Asahi Chemical Industry Co Ltd filed Critical Asahi Kasei Corp
Priority to KR1020097007187A priority Critical patent/KR101110938B1/ko
Priority to CN200880000934.8A priority patent/CN101568572B/zh
Priority to JP2009501647A priority patent/JP5129230B2/ja
Publication of WO2009054487A1 publication Critical patent/WO2009054487A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

L'invention porte sur un précurseur de polyimide caractérisé par le fait qu'il a une structure de polyimide représentée par la formule générale (1) ci-après et une structure de polyamide-acide représentée par la formule générale (2) ci-après [formule chimique 1] [formule chimique 2] (Dans les formules, R1 et R6 représentent chacun un groupe organique tétravalent ayant 1-50 atomes de carbone; R2 représente un groupe organique divalent ayant 1-30 atomes de carbone; R5 représente un groupe organique divalent ayant 1-80 atomes de carbone; R3 représente un groupe organique monovalent ayant 1-30 atomes de carbone; et n représente un entier non inférieur à 1 mais non supérieur à 30.)
PCT/JP2008/069315 2007-10-26 2008-10-24 Précurseur de polyimide et composition de résine photosensible contenant le précurseur de polyimide Ceased WO2009054487A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097007187A KR101110938B1 (ko) 2007-10-26 2008-10-24 폴리이미드 전구체 및 폴리이미드 전구체를 포함하는 감광성 수지 조성물
CN200880000934.8A CN101568572B (zh) 2007-10-26 2008-10-24 聚酰亚胺前体和包含聚酰亚胺前体的感光性树脂组合物
JP2009501647A JP5129230B2 (ja) 2007-10-26 2008-10-24 感光性樹脂組成物

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007279503 2007-10-26
JP2007-279503 2007-10-26
JP2008072020 2008-03-19
JP2008-072020 2008-03-19
JP2008113176 2008-04-23
JP2008-113176 2008-04-23
JP2008-223599 2008-09-01
JP2008223599 2008-09-01

Publications (1)

Publication Number Publication Date
WO2009054487A1 true WO2009054487A1 (fr) 2009-04-30

Family

ID=40579589

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069315 Ceased WO2009054487A1 (fr) 2007-10-26 2008-10-24 Précurseur de polyimide et composition de résine photosensible contenant le précurseur de polyimide

Country Status (4)

Country Link
JP (1) JP5129230B2 (fr)
KR (1) KR101110938B1 (fr)
CN (1) CN101568572B (fr)
WO (1) WO2009054487A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009053646A (ja) * 2007-07-31 2009-03-12 Asahi Kasei Corp 感光性樹脂組成物及びそれを用いた感光性フィルム
JP2010018802A (ja) * 2008-07-09 2010-01-28 Lg Chem Ltd ポリイミド−ポリアミド酸共重合体、その製造方法、それを含む感光性組成物およびこれにより提供される保護膜
JP2011195736A (ja) * 2010-03-19 2011-10-06 Asahi Kasei E-Materials Corp ポリイミド前駆体及び感光性樹脂組成物
WO2011122198A1 (fr) * 2010-03-31 2011-10-06 Jsr株式会社 Précurseur de polyimide, composition de résine contenant ledit précurseur, et procédé de formation d'un film à l'aide de la composition de résine
JP2011228493A (ja) * 2010-04-20 2011-11-10 Asahi Kasei E-Materials Corp フレキシブル配線板の製造方法
JP2011242531A (ja) * 2010-05-17 2011-12-01 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた感光性フィルム
CN102449070A (zh) * 2009-06-09 2012-05-09 旭化成电子材料株式会社 树脂组合物、固化物和使用该固化物的电路基板
WO2012098734A1 (fr) * 2011-01-18 2012-07-26 旭化成イーマテリアルズ株式会社 Composition de résine, objet traité, film de résine, et tableau de connexions
WO2012118020A1 (fr) * 2011-02-28 2012-09-07 Jsr株式会社 Composition de résine et procédé de formation de film l'utilisant
CN104016870A (zh) * 2014-06-25 2014-09-03 中山大学 一种含间三联苯结构二胺化合物及其合成方法和应用

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101304590B1 (ko) * 2010-03-11 2013-09-05 주식회사 엘지화학 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물
WO2012132396A1 (fr) * 2011-03-25 2012-10-04 株式会社アイ．エス．テイ Solution précurseur de polyimide, précurseur de polyimide, résine polyimide, suspension épaisse mixte, électrode, procédé de production de la suspension épaisse mixte, et procédé de formation d'une électrode
KR101898689B1 (ko) * 2011-06-21 2018-09-13 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 난연화된 지환식 폴리이미드 수지 조성물 및 그 박육 성형체
CN110941142B (zh) * 2014-03-17 2021-05-25 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法、以及半导体装置
CN104017214B (zh) * 2014-06-25 2016-09-14 中山大学 基于间三联苯结构二胺的浅色透明聚酰亚胺及其制备方法和应用
KR102511999B1 (ko) * 2014-12-31 2023-03-21 하나 마이크론(주) 전자 소자 및 이의 제조 방법
US9477148B1 (en) 2015-05-26 2016-10-25 Industrial Technology Research Institute Polymer, method for preparing the same, and a photosensitive resin composition thereof
KR102229738B1 (ko) * 2015-08-21 2021-03-18 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 폴리이미드의 제조 방법 및 반도체 장치
KR102134263B1 (ko) * 2016-06-24 2020-07-15 도레이 카부시키가이샤 폴리이미드 수지, 폴리이미드 수지 조성물, 그것을 사용한 터치 패널 및 그의 제조 방법, 컬러 필터 및 그의 제조 방법, 액정 소자 및 그의 제조 방법, 유기 el 소자 및 그의 제조 방법
WO2019086963A2 (fr) * 2017-09-18 2019-05-09 嘉兴山蒲照明电器有限公司 Composition de résine polyimide modifiée par un organosilicium et application associée
CN113474156B (zh) * 2019-02-26 2022-04-29 东丽株式会社 聚酰胺酸树脂组合物、聚酰亚胺树脂膜及其制造方法、层叠体、以及电子器件及其制造方法
CN111333839B (zh) * 2020-03-17 2022-07-26 浙江大学宁波理工学院 一种含呋喃环的聚酰亚胺树脂及其制备方法
CN115667368A (zh) * 2020-05-28 2023-01-31 旭化成株式会社 树脂组合物

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JPS61207438A (ja) * 1985-03-11 1986-09-13 Chisso Corp 可溶性ポリイミドシロキサン前駆体及びその製造方法
JPH0441527A (ja) * 1990-06-08 1992-02-12 Sumitomo Bakelite Co Ltd 可溶性ポリイミドシロキサン
JPH09185064A (ja) * 1995-12-28 1997-07-15 Japan Synthetic Rubber Co Ltd イミド基含有ポリアミック酸およびその製造方法並びに液晶配向剤
JPH11153868A (ja) * 1997-11-19 1999-06-08 Hitachi Chem Co Ltd ポジ型感光性ポリイミド前駆体樹脂組成物及びこれを用いたレリーフパターンの製造法
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JP2002277880A (ja) * 2001-03-14 2002-09-25 Jsr Corp 樹脂基板塗布用液晶配向剤および液晶表示素子
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JP2008189694A (ja) * 2007-01-31 2008-08-21 Ube Ind Ltd アミック酸構造の繰返単位の一部がイミド構造になっている共重合体、およびその製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009053646A (ja) * 2007-07-31 2009-03-12 Asahi Kasei Corp 感光性樹脂組成物及びそれを用いた感光性フィルム
JP2010018802A (ja) * 2008-07-09 2010-01-28 Lg Chem Ltd ポリイミド−ポリアミド酸共重合体、その製造方法、それを含む感光性組成物およびこれにより提供される保護膜
CN102449070A (zh) * 2009-06-09 2012-05-09 旭化成电子材料株式会社 树脂组合物、固化物和使用该固化物的电路基板
CN102449070B (zh) * 2009-06-09 2014-01-22 旭化成电子材料株式会社 树脂组合物、固化物和使用该固化物的电路基板
JP2011195736A (ja) * 2010-03-19 2011-10-06 Asahi Kasei E-Materials Corp ポリイミド前駆体及び感光性樹脂組成物
WO2011122198A1 (fr) * 2010-03-31 2011-10-06 Jsr株式会社 Précurseur de polyimide, composition de résine contenant ledit précurseur, et procédé de formation d'un film à l'aide de la composition de résine
JP2011228493A (ja) * 2010-04-20 2011-11-10 Asahi Kasei E-Materials Corp フレキシブル配線板の製造方法
JP2011242531A (ja) * 2010-05-17 2011-12-01 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた感光性フィルム
WO2012098734A1 (fr) * 2011-01-18 2012-07-26 旭化成イーマテリアルズ株式会社 Composition de résine, objet traité, film de résine, et tableau de connexions
JP5820825B2 (ja) * 2011-01-18 2015-11-24 旭化成イーマテリアルズ株式会社 樹脂組成物、硬化物、樹脂フィルム及び配線板
WO2012118020A1 (fr) * 2011-02-28 2012-09-07 Jsr株式会社 Composition de résine et procédé de formation de film l'utilisant
CN104016870A (zh) * 2014-06-25 2014-09-03 中山大学 一种含间三联苯结构二胺化合物及其合成方法和应用

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KR20090073141A (ko) 2009-07-02
CN101568572A (zh) 2009-10-28

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