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WO2009050829A1 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
WO2009050829A1
WO2009050829A1 PCT/JP2007/071423 JP2007071423W WO2009050829A1 WO 2009050829 A1 WO2009050829 A1 WO 2009050829A1 JP 2007071423 W JP2007071423 W JP 2007071423W WO 2009050829 A1 WO2009050829 A1 WO 2009050829A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
via conductor
wiring board
electrodes
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/071423
Other languages
English (en)
French (fr)
Inventor
Kazuhiro Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to EP07831157A priority Critical patent/EP2091311B1/en
Priority to JP2008550579A priority patent/JP4773531B2/ja
Priority to CN2007800300409A priority patent/CN101502191B/zh
Priority to KR1020087028270A priority patent/KR101085322B1/ko
Publication of WO2009050829A1 publication Critical patent/WO2009050829A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10712—Via grid array, e.g. via grid array capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H10W72/07251—
    • H10W72/20—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

　コンデンサ（３５０）は、誘電体層（３３０）と、誘電体層（３００）を挟んで対向する第１電極（３１０）と第２電極（３２０）と、から形成される。コンデンサ積層体（４５０）は、コンデンサ（３５０）を接着剤（３４０）を介して積層される。配線基板（９００）は、コンデンサ積層体（４５０）を内蔵する第１の樹脂絶縁層（２００ａ）と、第１電極（３１０）同士を電気的に接続する第１のヴィア導体（４１１）と、第２電極（３２０）同士を電気的に接続する第２のヴィア導体（４１２）と、第１のヴィア導体（４１１）と電気的に接続している第１の外部端子（４２７Ｐ）と、第２のヴィア導体（４１２）と電気的に接続している第２の外部端子（４２７Ｇ）と、を有する。第１電極（３１０）と第２電極（３２０）とは、電極の面方向に互いにずれて配置される。
PCT/JP2007/071423 2007-10-18 2007-11-02 配線基板及びその製造方法 Ceased WO2009050829A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP07831157A EP2091311B1 (en) 2007-10-18 2007-11-02 Wiring board and its manufacturing method
JP2008550579A JP4773531B2 (ja) 2007-10-18 2007-11-02 配線基板及びその製造方法
CN2007800300409A CN101502191B (zh) 2007-10-18 2007-11-02 布线基板及其制造方法
KR1020087028270A KR101085322B1 (ko) 2007-10-18 2007-11-02 배선 기판 및 그의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US98096907P 2007-10-18 2007-10-18
US60/980,969 2007-10-18

Publications (1)

Publication Number Publication Date
WO2009050829A1 true WO2009050829A1 (ja) 2009-04-23

Family

ID=40567120

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/071423 Ceased WO2009050829A1 (ja) 2007-10-18 2007-11-02 配線基板及びその製造方法

Country Status (7)

Country Link
US (1) US8148645B2 (ja)
EP (2) EP2217045A1 (ja)
JP (1) JP4773531B2 (ja)
KR (1) KR101085322B1 (ja)
CN (1) CN101502191B (ja)
TW (1) TWI365688B (ja)
WO (1) WO2009050829A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011009408A (ja) * 2009-06-25 2011-01-13 Ricoh Co Ltd 電子部品モジュール及び製造方法
CN113013152A (zh) * 2019-12-18 2021-06-22 台达电子企业管理（上海）有限公司 基板及其所适用的制造方法及功率模块
US12308738B2 (en) 2019-12-18 2025-05-20 Delta Electronics (Shanghai) Co., Ltd. Power module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090296310A1 (en) * 2008-06-03 2009-12-03 Azuma Chikara Chip capacitor precursors, packaged semiconductors, and assembly method for converting the precursors to capacitors
WO2010041589A1 (ja) * 2008-10-08 2010-04-15 株式会社村田製作所 複合モジュール
CN102356703B (zh) * 2009-03-19 2015-05-13 株式会社村田制作所 电路基板以及母层叠体
JP5397482B2 (ja) * 2009-12-24 2014-01-22 株式会社村田製作所 回路モジュール
JP6115791B2 (ja) * 2011-08-15 2017-04-19 エスエムエー ソーラー テクノロジー アーゲー 回路基板のホルダにコンデンサを含む電子デバイス、及び電子デバイスを製造する方法
CN103096646B (zh) * 2011-10-31 2016-01-20 健鼎（无锡）电子有限公司 内埋元件的多层基板的制造方法
US20140070404A1 (en) * 2012-09-12 2014-03-13 Shing-Ren Sheu Semiconductor package structure and interposer therefor
US9035194B2 (en) * 2012-10-30 2015-05-19 Intel Corporation Circuit board with integrated passive devices
KR101420526B1 (ko) * 2012-11-29 2014-07-17 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
US20140167900A1 (en) 2012-12-14 2014-06-19 Gregorio R. Murtagian Surface-mount inductor structures for forming one or more inductors with substrate traces
KR20190058695A (ko) * 2014-02-21 2019-05-29 미쓰이금속광업주식회사 내장 캐패시터층 형성용 동장 적층판, 다층 프린트 배선판 및 다층 프린트 배선판의 제조 방법
US20190045620A1 (en) * 2014-07-09 2019-02-07 Schreiner Group Gmbh & Co. Kg Sensor device with a flexible electrical conductor structure
US20160055976A1 (en) * 2014-08-25 2016-02-25 Qualcomm Incorporated Package substrates including embedded capacitors
US9659850B2 (en) * 2014-12-08 2017-05-23 Qualcomm Incorporated Package substrate comprising capacitor, redistribution layer and discrete coaxial connection
CN104900406B (zh) * 2015-06-01 2017-10-10 中国科学院上海硅酸盐研究所 可键合多层陶瓷电容器及其制备方法
JP6741419B2 (ja) * 2015-12-11 2020-08-19 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージおよびその製造方法
US10373904B2 (en) * 2017-08-28 2019-08-06 Micron Technology, Inc. Semiconductor devices including capacitors, related electronic systems, and related methods
CN117560860A (zh) * 2022-08-04 2024-02-13 辉达公司 堆叠多个印刷电路板的方法和配置

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Publication number Priority date Publication date Assignee Title
JPS59127829A (ja) * 1983-01-12 1984-07-23 松下電器産業株式会社 チツプ状フイルムコンデンサ−
JP2001297944A (ja) * 2000-04-14 2001-10-26 Matsushita Electric Ind Co Ltd 薄膜積層体とコンデンサ及びこれらの製造方法と製造装置
WO2002101769A1 (en) * 2001-06-08 2002-12-19 Matsushita Electric Industrial Co., Ltd. Multilayer film capacitor and production method thereof
JP2004228190A (ja) * 2003-01-21 2004-08-12 Toppan Printing Co Ltd 積層体付き金属箔およびそれを用いた受動素子内蔵基板の製造方法
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WO2002101769A1 (en) * 2001-06-08 2002-12-19 Matsushita Electric Industrial Co., Ltd. Multilayer film capacitor and production method thereof
JP2004228190A (ja) * 2003-01-21 2004-08-12 Toppan Printing Co Ltd 積層体付き金属箔およびそれを用いた受動素子内蔵基板の製造方法
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JP2007096232A (ja) * 2005-09-30 2007-04-12 Fujitsu Ltd インターポーザ及び電子装置の製造方法
JP2007150123A (ja) * 2005-11-30 2007-06-14 Ngk Spark Plug Co Ltd 配線基板内蔵用キャパシタ、キャパシタ内蔵配線基板及びその製造方法

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See also references of EP2091311A4 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011009408A (ja) * 2009-06-25 2011-01-13 Ricoh Co Ltd 電子部品モジュール及び製造方法
CN113013152A (zh) * 2019-12-18 2021-06-22 台达电子企业管理（上海）有限公司 基板及其所适用的制造方法及功率模块
US11901114B2 (en) 2019-12-18 2024-02-13 Delta Electronics (Shanghai) Co., Ltd. Substrate, manufacturing method, and power module with same
CN113013152B (zh) * 2019-12-18 2024-06-07 台达电子企业管理（上海）有限公司 基板及其所适用的制造方法及功率模块
US12308738B2 (en) 2019-12-18 2025-05-20 Delta Electronics (Shanghai) Co., Ltd. Power module

Also Published As

Publication number Publication date
US8148645B2 (en) 2012-04-03
CN101502191B (zh) 2012-02-08
EP2091311B1 (en) 2013-03-06
JPWO2009050829A1 (ja) 2011-02-24
JP4773531B2 (ja) 2011-09-14
EP2217045A1 (en) 2010-08-11
US20090266594A1 (en) 2009-10-29
KR20090086023A (ko) 2009-08-10
TWI365688B (en) 2012-06-01
CN101502191A (zh) 2009-08-05
TW200920196A (en) 2009-05-01
EP2091311A4 (en) 2010-01-20
EP2091311A1 (en) 2009-08-19
KR101085322B1 (ko) 2011-11-23

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