[go: up one dir, main page]

WO2009041247A1 - 信号伝送基板 - Google Patents

信号伝送基板 Download PDF

Info

Publication number
WO2009041247A1
WO2009041247A1 PCT/JP2008/066083 JP2008066083W WO2009041247A1 WO 2009041247 A1 WO2009041247 A1 WO 2009041247A1 JP 2008066083 W JP2008066083 W JP 2008066083W WO 2009041247 A1 WO2009041247 A1 WO 2009041247A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
parts
signal wiring
signal transmission
transmission board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/066083
Other languages
English (en)
French (fr)
Inventor
Takashi Nakano
Yoji Nishio
Yurika Aoki
Koji Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Micron Memory Japan Ltd
Original Assignee
NEC Corp
Elpida Memory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Elpida Memory Inc filed Critical NEC Corp
Publication of WO2009041247A1 publication Critical patent/WO2009041247A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Dc Digital Transmission (AREA)

Abstract

　第１の信号配線は、第１の層に配された部分と第２の層に配された部分とを含んでいる。第１の層に配された部分と第２の層に配された部分とが所定位置で接続されている。第２の信号配線は、第１の信号配線の第１の層に配された部分と合計の長さが等しい第１の層に配された部分と、第１の信号配線の第２の層に配された部分と合計の長さが等しい第２の層に配された部分とを含んでいる。第１の層に配された部分と第２の層に配された部分との接続位置が第１の信号配線と異なる。
PCT/JP2008/066083 2007-09-27 2008-09-05 信号伝送基板 Ceased WO2009041247A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007251156A JP4934856B2 (ja) 2007-09-27 2007-09-27 信号伝送基板
JP2007-251156 2007-09-27

Publications (1)

Publication Number Publication Date
WO2009041247A1 true WO2009041247A1 (ja) 2009-04-02

Family

ID=40511136

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066083 Ceased WO2009041247A1 (ja) 2007-09-27 2008-09-05 信号伝送基板

Country Status (2)

Country Link
JP (1) JP4934856B2 (ja)
WO (1) WO2009041247A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012199904A (ja) * 2011-03-08 2012-10-18 Japan Oclaro Inc 差動伝送回路、光送受信モジュール、及び情報処理装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5473688B2 (ja) * 2010-03-12 2014-04-16 三菱電機株式会社 伝送線路
JP2022184342A (ja) 2021-06-01 2022-12-13 富士通株式会社 設計プログラム、設計方法、プリント配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181669A (ja) * 1994-12-27 1996-07-12 Matsushita Electric Ind Co Ltd クロック妨害抑制装置
JP2005268649A (ja) * 2004-03-19 2005-09-29 Sony Corp 基板、光ピックアップ及び光ディスクドライブ
JP2007142307A (ja) * 2005-11-22 2007-06-07 Hitachi Ltd 高速差動信号用多層基板、通信装置およびデータ記憶装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07245575A (ja) * 1994-03-04 1995-09-19 Oki Electric Ind Co Ltd 複数信号平行伝送路
JPH11251779A (ja) * 1998-03-02 1999-09-17 Toshiba Corp 半導体装置
JP2001267701A (ja) * 2000-03-21 2001-09-28 Ricoh Co Ltd プリント基板
JP2001339442A (ja) * 2000-05-25 2001-12-07 Mitsubishi Electric Corp 信号伝送方式
JP2005072961A (ja) * 2003-08-25 2005-03-17 Kawasaki Microelectronics Kk 信号伝送回路
JP2007195055A (ja) * 2006-01-20 2007-08-02 Sharp Corp 信号伝送装置
JP2008227376A (ja) * 2007-03-15 2008-09-25 Toshiba Corp 伝送基板及びコンピュータ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181669A (ja) * 1994-12-27 1996-07-12 Matsushita Electric Ind Co Ltd クロック妨害抑制装置
JP2005268649A (ja) * 2004-03-19 2005-09-29 Sony Corp 基板、光ピックアップ及び光ディスクドライブ
JP2007142307A (ja) * 2005-11-22 2007-06-07 Hitachi Ltd 高速差動信号用多層基板、通信装置およびデータ記憶装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012199904A (ja) * 2011-03-08 2012-10-18 Japan Oclaro Inc 差動伝送回路、光送受信モジュール、及び情報処理装置

Also Published As

Publication number Publication date
JP2009081378A (ja) 2009-04-16
JP4934856B2 (ja) 2012-05-23

Similar Documents

Publication Publication Date Title
TWI341020B (en) Fingerprint sensing chip having a flexible circuit board serving as a signal transmission structure and method of manufacturing the same
WO2008030641A3 (en) Integrated circuit with graduated on-die termination
WO2007120804A3 (en) Multiplexing a parallel bus interface and a flash memory interface
EP2274962A4 (en) Wiring board and method for manufacturing the same
WO2008044164A3 (en) Pitch lag estimation
EP2450911A4 (en) CONDUCTIVE LAYER AND CONVERTER AND FLEXIBLE PCB WITH THIS
TWI341158B (en) Noise-suppressing wiring-member and printed wiring board
EP2187720A4 (en) FLEXIBLE PCB AND MANUFACTURING METHOD THEREFOR
EP2068605A4 (en) CIRCUIT BOARD
EP2103641A4 (en) POLYAMIDE-IMIDE RESIN, CLEAR COLORLESS FLEXIBLE METALLIC LAMINATE MADE THEREOF, AND CIRCUIT-CIRCUIT BOARD
EP2259667A4 (en) FLEXIBLE-ROLLED PCB AND METHOD FOR THE PRODUCTION THEREOF
EP2046107A4 (en) PRINTED CIRCUIT BOARD DEVICE, ELECTRONIC DEVICE WITH PRINTED CIRCUIT BOARD DEVICE, AND MASS CONNECTION METHOD
WO2009115686A3 (fr) Composant de connexion muni d'inserts creux et son procede de realisation
GB2482093B (en) Signal transmission line and circuit board
WO2008105478A1 (ja) 配線基板、電気信号伝送システムおよび電子機器
EP1761935A4 (en) DIFFERENTIAL SIGNAL TRANSMISSION CABLE
WO2011163333A3 (en) Sandwich structure for directional coupler
EP2007176A4 (en) CIRCUIT BOARD AND CONNECTING SUBSTRATE
TWI348248B (en) A signal transmission circuit and method thereof
EP1951016A4 (en) FLEXORIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
EP2352134A4 (en) Transmission input circuit
EP2059100A4 (en) FLEXIBLE PRINTED CIRCUIT BOARD
WO2009041247A1 (ja) 信号伝送基板
EP1837669A4 (en) SIGNAL TRANSMISSION SYSTEM, SIGNAL OUTPUT CIRCUIT BOARD, SIGNAL RECEIVING CIRCUIT BOARD, SIGNAL OUTPUT METHOD AND SIGNAL RECEPTION PROCEDURE
EP2056655A4 (en) CIRCUIT BOARD

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08833772

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08833772

Country of ref document: EP

Kind code of ref document: A1