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WO2008133271A1 - 硬化性樹脂組成物、ｌｅｄパッケージ及びその製造方法、並びに、光半導体 - Google Patents

硬化性樹脂組成物、ｌｅｄパッケージ及びその製造方法、並びに、光半導体 Download PDF

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Publication number
WO2008133271A1
WO2008133271A1 PCT/JP2008/057840 JP2008057840W WO2008133271A1 WO 2008133271 A1 WO2008133271 A1 WO 2008133271A1 JP 2008057840 W JP2008057840 W JP 2008057840W WO 2008133271 A1 WO2008133271 A1 WO 2008133271A1
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WO
WIPO (PCT)
Prior art keywords
led package
resin composition
curable resin
production
optical semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057840
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English (en)
French (fr)
Inventor
Takeo Tomiyama
Shouko Tanaka
Akihiro Yoshida
Shingo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN2008800132963A priority Critical patent/CN101668786B/zh
Priority to KR1020097022212A priority patent/KR101175836B1/ko
Priority to EP08751978A priority patent/EP2141185A4/en
Priority to US12/597,294 priority patent/US20100200890A1/en
Priority to JP2009511885A priority patent/JP5327047B2/ja
Publication of WO2008133271A1 publication Critical patent/WO2008133271A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
    • C08G18/4269—Lactones
    • C08G18/4277—Caprolactone and/or substituted caprolactone
    • C—CHEMISTRY; METALLURGY
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4202—Two or more polyesters of different physical or chemical nature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
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    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
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    • C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
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    • C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
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    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
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Abstract

　本発明の硬化性樹脂組成物は、３官能以上のポリカプロラクトンポリオールを含有するポリオール成分と、イソシアネート基が第二級炭素原子に結合した化学構造を１以上有する２官能又は３官能の脂環式イソシアネート含有するポリイソシアネート成分とを含むものである。
PCT/JP2008/057840 2007-04-24 2008-04-23 硬化性樹脂組成物、ｌｅｄパッケージ及びその製造方法、並びに、光半導体 Ceased WO2008133271A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008800132963A CN101668786B (zh) 2007-04-24 2008-04-23 固化性树脂组合物、led封装件及其制造方法、以及光半导体
KR1020097022212A KR101175836B1 (ko) 2007-04-24 2008-04-23 경화성 수지 조성물, ｌｅｄ 패키지 및 그 제조방법, 및, 광반도체
EP08751978A EP2141185A4 (en) 2007-04-24 2008-04-23 HARDENABLE RESIN COMPOSITION, LED HOUSING AND METHOD FOR MANUFACTURING THE LED HOUSING AND OPTICAL SEMICONDUCTOR
US12/597,294 US20100200890A1 (en) 2007-04-24 2008-04-23 Curable resin composition, led package, and method for production of the led package, and optical semiconductor
JP2009511885A JP5327047B2 (ja) 2007-04-24 2008-04-23 硬化性樹脂組成物、ｌｅｄパッケージ及びその製造方法、並びに、光半導体

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007114149 2007-04-24
JP2007114148 2007-04-24
JP2007-114148 2007-04-24
JP2007-114149 2007-04-24
JP2007-282031 2007-10-30
JP2007282031 2007-10-30

Publications (1)

Publication Number Publication Date
WO2008133271A1 true WO2008133271A1 (ja) 2008-11-06

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PCT/JP2008/057840 Ceased WO2008133271A1 (ja) 2007-04-24 2008-04-23 硬化性樹脂組成物、ｌｅｄパッケージ及びその製造方法、並びに、光半導体

Country Status (7)

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US (1) US20100200890A1 (ja)
EP (1) EP2141185A4 (ja)
JP (1) JP5327047B2 (ja)
KR (1) KR101175836B1 (ja)
CN (1) CN101668786B (ja)
TW (1) TW200911858A (ja)
WO (1) WO2008133271A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010100793A (ja) * 2008-09-29 2010-05-06 Hitachi Chem Co Ltd 硬化性樹脂組成物、ｌｅｄパッケージ、及びその製造方法
JP2010116534A (ja) * 2008-10-16 2010-05-27 Hitachi Chem Co Ltd ウレタン樹脂組成物及び光半導体装置
CN102219991A (zh) * 2010-04-15 2011-10-19 林宏泰 能发光的pu树脂材的制造方法
KR101413052B1 (ko) * 2009-10-05 2014-06-30 히타치가세이가부시끼가이샤 우레탄 수지 조성물, 경화체 및 경화체를 사용한 광 반도체 장치
US9306133B2 (en) 2011-09-02 2016-04-05 Shin-Etsu Chemical Co., Ltd. Optical semiconductor device
JP2019023305A (ja) * 2014-05-02 2019-02-14 旭化成株式会社 ポリイソシアネート硬化物、及びポリイソシアネート硬化物の製造方法
JP2020528103A (ja) * 2017-07-25 2020-09-17 ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツングＢＡＳＦ Ｃｏａｔｉｎｇｓ ＧｍｂＨ 繊維強化プラスチック材料をコーティングするための二成分コーティング材料組成物

Families Citing this family (11)

* Cited by examiner, † Cited by third party
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US9711689B2 (en) * 2012-11-05 2017-07-18 Sony Semiconductor Solutions Corporation Optical unit and electronic apparatus
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JP5327047B2 (ja) 2013-10-30
KR101175836B1 (ko) 2012-08-24
CN101668786B (zh) 2012-12-05
EP2141185A4 (en) 2012-01-04
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