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WO2008131790A1 - Procede et appareil de metallisation electrolytique d'un article a traiter - Google Patents

Procede et appareil de metallisation electrolytique d'un article a traiter Download PDF

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Publication number
WO2008131790A1
WO2008131790A1 PCT/EP2007/003747 EP2007003747W WO2008131790A1 WO 2008131790 A1 WO2008131790 A1 WO 2008131790A1 EP 2007003747 W EP2007003747 W EP 2007003747W WO 2008131790 A1 WO2008131790 A1 WO 2008131790A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrolyte
contact
metallization
during
air boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/003747
Other languages
English (en)
Inventor
Norbert BÜRGER
Lütke Notarp DIETMAR
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rena Sondermaschinen GmbH
Original Assignee
Rena Sondermaschinen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena Sondermaschinen GmbH filed Critical Rena Sondermaschinen GmbH
Priority to PCT/EP2007/003747 priority Critical patent/WO2008131790A1/fr
Priority to TW097114932A priority patent/TW200848554A/zh
Publication of WO2008131790A1 publication Critical patent/WO2008131790A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

  • the invention relates to the electrolytic metallization of treatment good in electroplating devices that have at least one contact for the electrical contacting of the treatment good, in particular in continuous pass equipment, immersion bath equipment, so called cup-platers or fountain-platers and the like.
  • the surface of the good that is to be electrolytically treated as well as an anode are located within the electrolyte of a treatment chamber.
  • the treatment good's surface that is to be electroplated is cathodically switched by means of at least one electrical contact and a bath current source.
  • the at least one contact is electrolytically metallized.
  • This contact metallization has to be removed by an additional process step. Usually, this is achieved by using the same electrolyte for the de- metallization of the at least one contact against a cathodic auxiliary electrode.
  • the unavoidable oxide formation at the surface of such metals is the reason for the insufficient adhesion of such an isolation layer to the contacts.
  • the metallization of the metallic blank contact regions must thus repeatedly be removed during ongoing production.
  • the contacts in the treatment chamber are switched anodically against a cathodic auxiliary electrode.
  • this electrolytic de- metallization it is observed that in the vicinity of the contact's electrolyte/air boundary only an incomplete removal of the metallized layer takes place.
  • more and more metal builds up on the contact in this border region more or less annularly. Additionally, crystals of the electrolyte used can be deposited in this region. Automatic de-metallization and cleaning of the contacts therefore is insufficient for an uninterrupted production. Every now and then, manual interventions for the removal of the interfering annular deposits are necessary.
  • FIG. 1 of the accompanying drawings depicts a typical prior art electroplating device in form of a fountain-plater for the treatment of planar goods such as wafers or solar cells. Details in the region of an electrical contact are shown enlarged.
  • the electrolyte 17 that streams into the treatment chamber 3 is fed in by a pump 4. Circularly, the electrolyte streams over an overflow edge 5 into a reservoir 6.
  • the streaming electrolyte reaches both the bottom side 7 of the treatment good 1 that is to be electroplated and the contacts 2 that are arranged at contact mounts 14 that may also serve as supports for the treatment good. These contact mounts serve for the electrical connection to the contacts 2, and thus to the treatment good 1.
  • the flow of the electrolyte 17 is represented by flow direction arrows 8.
  • a soluble or insoluble anode 9 is arranged within the treatment chamber 3.
  • the treatment good 1 is being switched cathodic against the anode 9 by a bath current source 15.
  • the wetted bottom side 7 of the treatment good 1 and the wetted region of the metallic blank contacts 2 are being electroplated by the electrolyte up to the electrolyte/air boundary 10.
  • crystals can deposit at this boundary as well.
  • the contacts 2 must be electrolytically de- metallized and cleaned. For this purpose, they are poled anodic against a cathodically switched counter electrode.
  • a multiple extension of the de-metallization time probably could electrolytically dissolve the metal ring 19 to a large extent. However, this is associated with a loss of the system's production capacity and thus should be avoided.
  • Another possibility of electrolytically dissolving or etching the metal ring 19 could be the increase of the circulated electrolyte flow volume during de-metallization. However, this would necessitate a more complex arrangement and cause the disadvantage of an increased drag-in of air into the electrolyte due to a pushed and therefore more disturbed flow.
  • the air affects the additives of the electrolyte, resulting in a disadvantageous rise of its consumption.
  • the de-metallization time preferably is very short compared to the plating time, the temporary flow increase has only a minor influence on the electrolyte system.
  • the object of the present invention is to provide a method and an apparatus which overcome the above drawbacks of the prior art and ensure a complete de-metallization and cleaning of electrically non-isolated contacts of treatment chambers, even when these are fixed and invariably arranged with respect to said treatment chambers.
  • the at last one electrical contact for the power supply to the bottom side of the good is electrolytically de-metallized after one or several metallization procedures within the same electrolyte.
  • the apparatus according to the present invention additionally comprises means that serve to move the electrolyte/air boundary at the contact and/or the surface of the electrolyte for metallization and de-metallization in relation to the natural electrolyte/air boundary. Thereby, the flow rate of the electrolyte can be nearly or exactly the same for both cases.
  • case 1 and case 2 For the movement of the electrolyte/air boundary, two preferred embodiments exist that are subsequently referred to as case 1 and case 2 and comprise said means in the form of at least one gas distributor that, preferably, has at least one valve 16 that can be opened, choked, or closed for controlling the gas stream 12 emanating from at least one opening or nozzle 18.
  • the electrolyte and thus the electrolyte/air boundary in the vicinity of each contact is moved towards the treatment chamber by at least one gas stream, preferably an air stream, during metallization of the treatment good.
  • this can be achieved by a gas stream that is directed close to each contact against the surface level of the electrolyte inside the treatment chamber.
  • the flow direction of the gas is pointed towards the approximate center of the treatment chamber, i.e. towards the natural flow direction at the surface of the electrolyte.
  • the electrolyte/air boundary is moved towards the treatment chamber.
  • the de-metallization of the anodically switched contact (s) then occurs without the good by a gas stream being shut off or choked, e.g. due to the valve 16 being shut off or choked.
  • the natural electrolyte/air boundary at each contact is moved from the original boundary position that exists during metallization to the outward direction. Therefore, each contact is completely wetted also in the critical boundary area by the electrolyte, and a total de- metallization takes place in the electrolytic cell that is spatially extended in absence of a gas stream.
  • the electrolyte/air boundary at each contact is displaced or moved from the treatment chamber towards the outside (the contact mount 14) , such that the electrolyte/air boundary at each contact reaches an area of the contact that has not yet been wetted during metallization.
  • the gas stream is directed distant to the contacts against the level of the electrolyte in the treatment chamber in such a way, that the level rises at each contact and wets a region represented by the original natural electrolyte/air boundary at each contact.
  • a total electrolytic de-metallization takes place, since the contact's area that has to be de-metallized is entirely positioned within the electrolyte.
  • the electrolyte/air boundary during de-metallization of the at least one contact is sufficiently moved by any of the following steps which can be performed alone or in combination, such that the boundary that is formed during previous metallization is entirely positioned within the electrolyte at least in the vicinity of the at least one contact: a) directing a gas stream in-line with the flow direction of the electrolyte at the contact or against the surface of the electrolyte; b) lowering the at least one contact for de-metallization into the electrolyte, e.g.
  • the electrolytic de-metallization of the contacts can be carried out with a significantly higher current density than it is applicable for the metallization of the treatment good.
  • the metallization time becomes short, e.g. 20 seconds in comparison to a metallization time of 10 to 30 minutes or longer .
  • the complete de-metallization and cleaning of each contact during each de-metallization allows for an uninterrupted automatic treatment of good in an electroplating device.
  • its surface can be covered with an electrically conductive diamond layer and/or partially covered with an electrically insulating layer.
  • Figure 2a shows in a detail a stretched contact during metallization of the treatment good according to case 1.
  • Figure 2b shows the situation during the de-metallization of the stretched contact.
  • Figure 3a shows in a detail an angled contact during metallization of the treatment good according to case 1.
  • Figure 3b shows the situation during the de-metallization of the angled contact.
  • Figure 4a shows in a detail an angled contact during metallization of the treatment good according to case 2.
  • Figure 4b shows the situation during the de-metallization of the angled contact.
  • the invention solves the problem by a complete removal of the entire contact metallization 11 during each de-metallization process, thus a metal ring 19 even cannot develop. This is achieved by moving the electrolyte/air boundary 10 to different regions of the contacts 2 during metallization and de-metallization. These two regions are depicted by the detail views of a device or a treatment apparatus in figures 2 and 3 for the case 1, and in figure 4 for the case 2.
  • Figure 2a illustrates the situation during metallization of the good 1.
  • the contact 2 having e.g. a circular or rectangular shape, contacts and supports the good. In case of a circular shape, the good rests on at least three contacts 2 over the treatment chamber 3.
  • the treatment chamber can comprise only one support that is substantially ring-shaped and located close to the inner tank wall (not shown) .
  • the electrolyte 17 that is delivered by a pump (not shown) streams along the bottom side 7 of the good 1, and from there over the overflow edge 5 in an only partially visible reservoir 6.
  • a natural electrolyte/air boundary 10 develops more or less diffusely in the border region of the good 1 and therefore close to the overflow edge 5.
  • This boundary and thus also the region of the contact that is metallized during each metallization step up to the electrolyte/air boundary 10 is, during electroplating, displaced in direction of the center of the treatment chamber 3 by means of at least one gas stream 12 that preferably is an air stream.
  • the air stream 12 emanates from at least one individual opening or nozzle 18, that is arranged at gas distributors 13, preferably at gas distribution pipes.
  • the gas distributors 13 are fed e.g. with compressed air by at least one compactor or compressor (not shown) .
  • the air stream 12 can be controlled and therefore switched on, choked, and turned off by means of a valve 16, a flap or the like.
  • the emanating gas or air, respectively can be controlled collectively in groups. This purpose is served by the flaps or valves 16 that are located between the compressor and the nozzles 18.
  • Amount and velocity of each emanating air stream are adjusted in a manner such that the electrolytic de-metallization that follows metallization without gas stream 12 results in a complete de-metallization and cleaning of the contacts within the shortest possible time.
  • the electrolyte/air boundary 10 during metallization is sufficiently moved back towards the center of the treatment chamber 3, such that, during subsequent de-metallization with the gas stream being choked of shut off, the electrolyte/air boundary formed during metallization is entirely positioned within the electrolyte.
  • the electrolyte/air boundary 10 is shifted in direction of the contact. This natural boundary is then located in the region of the contact 2 that was not metallized or contaminated during metallization, because it stayed dry due to the air stream 12. Therefore, a complete de-metallization of each contact is achieved in each de-metallization process.
  • the gas stream is directed against the surface of the electrolyte during metallization, so that the level of the electrolyte inside the treatment chamber 3 is lowered at least in the vicinity of the contacts, also resulting in a displacement of the electrolyte/air boundary 10.
  • Figure 2b illustrates the situation at the beginning of the de-metallization of the contact metallization 11 with the air stream 12 being shut off.
  • the electrolyte/air boundary 10 that develops naturally has been shifted outwards.
  • the contact metallization 11 is completely positioned within the electrolyte enabling its complete electrolytic dissolution. Eventually formed crystals are also dissolved by the electrolyte stream. Even after many metallization and de- metallization processes, a metal ring 19 cannot develop at the at least one contact .
  • Figures 3a and 3b relate to case 1 and show details of a similar electroplating device with both process situations (metallization in figure 3a; de-metallization in figure 3b) .
  • the contact mount 14 is arranged above the highest level of the electrolyte 17.
  • the electrolyte cannot spread itself up to the contact mount 14 when the air is shut off.
  • Figure 4a relates to case 2 and shows an angled contact 2 during electrolytic metallization.
  • the electrolyte streams over the overflow edge 5 of the treatment chamber 3 into the reservoir 6. This gives rise to the development of the natural electrolyte/air boundary 10 at the depicted region of the angled contact 2.
  • this boundary has to be entirely positioned within the electrolyte during de-metallization. This preferably takes place by means of at least one gas stream 12 directed in-line with the streaming electrolyte, as e.g. exemplified in figure 4b.
  • a gas stream 12 emanates from at least one nozzle 18 and causes the electrolyte or the electrolyte stream, at least in the vicinity of the contacts 2, to be displaced in a manner such that the newly developing electrolyte/air boundary 10, in relation to the original natural electrolyte/air boundary, is moved against gravity, i.e. outwards. This region of the contacts was not reached by the electrolyte during metallization and therefore not metallized.
  • the at least one gas stream is directed against the surface of the electrolyte such that the level of the electrolyte within the treatment chamber 3 rises at least in the vicinity of each contact, thereby elevating the electrolyte/air boundary 10.
  • the gas stream is also directed almost horizontal in direction of the contact mount 14, as depicted in figure 4b. Due to the different electrolyte/air boundaries 10 upon metallization and de- metallization, a complete de-metallization and cleaning of the contacts 2 is obtained in each de-metallization process.
  • De-metallization usually takes place against a counter electrode that is used as an auxiliary electrode.
  • the counter electrode (not shown) can also be the soluble or insoluble anode that is located within the treatment chamber 3.
  • the anode is cathodically switched against the contacts 2 that are to be de-metallized.
  • the metal that has been dissolved from the contacts 2 and deposited onto the anode can usefully be recycled.
  • it is re- dissolved from there and used for metallization of the good 1.
  • the invention is suitable for all typical electrolytic devices and for all planar goods such as wafers, solar cells, circuit boards, and hybrids. Furthermore, all metals that are suitable for electrolytic depositing and dissolving can be used, e.g. such as copper, nickel, tin, and silver. List of reference marks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne la mise en contact électrique d'un article à traiter (1) devant être électroplaqué au moyen, par exemple, d'un équipement de passage continu, d'un équipement de bain d'immersion, tel que des plaqueurs-coupes ou des plaqueurs-fontaines, ou analogue. Les contacts électriques destinés à acheminer le courant du bain sur la surface devant être électroplaquée sont métallisés avec l'article à traiter. La dé-métallisation nécessaire des contacts se produit dans la même chambre de traitement, avec l'électrolyte (10) qui la remplit. En pratique, la dé-métallisation ne se produit pas complètement. Au niveau du contact (2), dans la zone frontière électrolyte/air (10), un anneau métallique (19) se développe et doit être retiré manuellement. Selon l'invention, la frontière naturelle électrolyte/air au niveau des contacts (2) est déplacée de façon appropriée, par exemple par un flux d'air régulé (12) contre le sens d'écoulement ou la surface de l'électrolyte. Le flux d'air est mis en marche et dirigé de sorte que la zone frontière électrolyte/air (10) qui se développe pendant la métallisation soit entièrement immergée pendant la dé-métallisation. Ainsi, les contacts sont entièrement dé-métallisés et l'anneau métallique (19) ne peut pas se développer.
PCT/EP2007/003747 2007-04-27 2007-04-27 Procede et appareil de metallisation electrolytique d'un article a traiter Ceased WO2008131790A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2007/003747 WO2008131790A1 (fr) 2007-04-27 2007-04-27 Procede et appareil de metallisation electrolytique d'un article a traiter
TW097114932A TW200848554A (en) 2007-04-27 2008-04-23 Apparatus and process for single-side wet chemical and electrolytic treatment of goods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2007/003747 WO2008131790A1 (fr) 2007-04-27 2007-04-27 Procede et appareil de metallisation electrolytique d'un article a traiter

Publications (1)

Publication Number Publication Date
WO2008131790A1 true WO2008131790A1 (fr) 2008-11-06

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PCT/EP2007/003747 Ceased WO2008131790A1 (fr) 2007-04-27 2007-04-27 Procede et appareil de metallisation electrolytique d'un article a traiter

Country Status (2)

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TW (1) TW200848554A (fr)
WO (1) WO2008131790A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778800B (zh) * 2021-09-22 2022-09-21 日商荏原製作所股份有限公司 鍍覆裝置及沖洗處理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5833820A (en) * 1997-06-19 1998-11-10 Advanced Micro Devices, Inc. Electroplating apparatus
US6638840B1 (en) * 2001-08-20 2003-10-28 Megic Corporation Electrode for electroplating planar structures
US6645356B1 (en) * 1998-12-07 2003-11-11 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US20030217916A1 (en) * 2002-05-21 2003-11-27 Woodruff Daniel J. Electroplating reactor
US20050045474A1 (en) * 1998-07-10 2005-03-03 Nolan Zimmerman Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5833820A (en) * 1997-06-19 1998-11-10 Advanced Micro Devices, Inc. Electroplating apparatus
US20050045474A1 (en) * 1998-07-10 2005-03-03 Nolan Zimmerman Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof
US6645356B1 (en) * 1998-12-07 2003-11-11 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6638840B1 (en) * 2001-08-20 2003-10-28 Megic Corporation Electrode for electroplating planar structures
US20030217916A1 (en) * 2002-05-21 2003-11-27 Woodruff Daniel J. Electroplating reactor

Also Published As

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