200848554 九、發明說明： 【發明所屬之技術領域】 本發明係關於平面物品，尤其諸如晶圓之基板、太陽能 電池、混合電路、CD或其類似物之濕式化學、電化學及 電解處理以及清洗。 【先前技術】 表面清洗後處理方法之典型實例涉及合適基板之活化、 摻雜、電化學/電解或化學金屬化或蝕刻、剝離及其類似 操作。通常，該等物品之表面僅經單側處理。進而，可能 發生全表面以及結構化處理。為避免物品因化學反應損 壞，不經處理之背面常必須經安全保護以免被處理流體潤 濕。對此，已知所謂的杯狀或噴泉狀處理設備。待處理物 口口本身一面罪近該等設備之處理室。在整個處理期間，物 。口（例如）藉助於基板固持器、夾持器或夾持固定物與處理 室連接。因此，處理流體可靠著處理表面流動以致可實施 物品之化學改質。靠近物品位於夾持設備處之密封元件避 免潤濕不可經處理之背面。該等密封元件亦可由適當夾持 器、真空吸盤或其他在接觸期間覆蓋物品背面全部區域之 傳送設備形成，由此保護其免於不當潤濕。通常，該等設 備可（例如）為機械、伯努利（BernouiH)或真空型的。 用於處理前述物品之裝置之典型實例揭示於文獻w〇 99/1 6963中且涉及晶圓電解金屬化。在處理室内，整合一 陽極及（若必需）一散布孔。待處理之物品表面形成電解池 之陰極。電解質自底部流入處理室中且接著經由溢流經其 130646.doc 200848554 邊緣離開處理室。物品係藉助於由樣品固持器、轉子、定 子功率傳輸及量測設備組成之載體固持及接觸。在整個 處理期間’由此夾持之物品藉助於傳送設備在溢流處理流 -表面水平及垂直疋位且固定。藉助於載體之精確垂直驅 動機械（諸如步進馬達），調節物品之浸沒深度使得僅待處 理之底面被潤濕且與處理流體保持接觸。對於目前的電解 =屬化，位於物品底面之導電樣品固持器亦經金屬化。此 等經不當金屬化之固持器必須不時地去金屬化。為此，在 另一處理步射將冑體在無物品之情況下以使樣品固持器 至屬化up勿次沒於處理流體中之方式定位於處理室上。 樣品固持器與陰極辅助電極相對發生陽極轉換。接著藉助 :電机源使樣⑽固持器電解去金屬化。輔助電極吸收金 屬，例如銅。其必須在數次蝕刻過程之後更換。根據目前 技術水平之此裝置展示以下缺點·· 物品必須夾持於載體以便處理且在整個處理期間必須由 其固持。因此，物品相對於處理流體之高度水平必須個別 確定及藉由精確調節垂直驅動機械來施加。由於通常極薄 之物ΠΠ (例如，厚度為〇·3 mm)實際上在處理室上方盤旋， 因此必須向處理室結構以及向傳送設備及載體提供極牢固 的機械構造。將來由矽製成之太陽能電池之厚度將降低至 、、、、 mm此外，處理期間之溫度變化可能影響載體相對 於處理流體之高度水平。 US 5,429,733中揭示之裝備遇到在電解質表面上正確調 準物up之問題。物品係藉助於氣墊固持於處理室之上，其 130646.doc 200848554 中=個固持器與處理室機械連接。同時，密封不可經濕式 化學處理之物品之上面以防接觸處理流體。然而，必須將 物品=於固持器中且由其固定之事實是不利的，因為此舉 耗費日守間。在處理完成之後，必須將物品自固持器卸載。 ί易損物品之情況下’例如對於石夕太陽能電池，總是存在 薄板破損之危險。若處理流體過強靠著受夾持物品流動， 該物品因此尤其遭受破損危險，則在處理本身期間情況同 樣如此。《而’電解質流人處理室之既定最小流速是必需 勺乂克服所述回流及接觸物品表面以便實施其化學改質。 在此^ $ 了，且t其寥於待經濕式化學處理之具有漸増直 "^的更4基板’此等薄物品之破損危險亦顯著增加。 對於使用US 5,437,777及DE 197 36 34() C2中所述之平面 物品，式化學及/或電解處理設備，存在相同的破損危 險。精助於固持器，使物品與處理流體接觸。密封件保護 物品不經處理之上面以及用於將電流饋人處理流體之接觸 構件。除所述物品破損危險之外，另—缺點為其必須被置 放於固持器中且必須在處理之後再取出。 此等操作問題對於us 5,443,707中揭示之裝置亦存在。 該裝置之固持器在整個暴露期間必須保持在物品處：各系 統必需數個此等技術複雜的設備以在處理期間定位物卜、 間隔物決以目對於槽上緣之高度水平，物品係由固^或 傳送設備壓在該槽上緣上。在所情況下，均向物品上施加 力，此可能導致其破損。 US 5，_，827揭示一種用於部分金屬化晶圓之電解池。 130646.doc -10- 200848554 自底部流入之電解質藉助於溢流邊緣離開電池。為影響該 流’尤其在晶圓底面之邊沿區域中，藉助於螺釘形式之支 撐元件調節距離Η。對於由晶圓及電解池之直徑確定且必 須一次調節之距離S同樣如此。電接觸發生在晶圓之乾燥 • 上面’藉此物品在電解處理期間與此接觸構件保持接觸。 由於電解質不能達到電接點，因此此等接點不經金屬化。 然而，物品兩面必須彼此電連接。在此情況下，接觸之去 金屬化並非必需的。200848554 IX. Description of the Invention: Technical Field of the Invention The present invention relates to wet chemical, electrochemical and electrolytic treatment and cleaning of flat articles, particularly substrates such as wafers, solar cells, hybrid circuits, CDs or the like. . [Prior Art] Typical examples of post-cleaning treatment methods involve activation, doping, electrochemical/electrolysis or chemical metallization or etching, stripping, and the like of a suitable substrate. Typically, the surfaces of such items are treated only on one side. Further, full surface and structured processing may occur. To avoid damage to the material due to chemical reactions, the untreated back must always be protected from moisture by the treatment fluid. For this purpose, so-called cup-shaped or fountain-like processing equipment is known. The object to be treated is guilty of the handling of the equipment. During the entire process, things. The port is connected to the processing chamber, for example, by means of a substrate holder, a holder or a clamp fixture. Therefore, the treatment fluid reliably treats the surface flow so that chemical modification of the article can be carried out. The sealing element near the item at the holding device avoids wetting the untreated back side. The sealing elements may also be formed by a suitable holder, vacuum chuck or other transfer device that covers the entire area of the back of the article during contact, thereby protecting it from improper wetting. Typically, such devices can be, for example, mechanical, Bernoui H or vacuum type. A typical example of a device for processing the aforementioned articles is disclosed in the document WO 99/1 6963 and relates to wafer electrowinning. In the processing chamber, an anode and, if necessary, a distribution orifice are integrated. The surface of the article to be treated forms the cathode of the electrolytic cell. The electrolyte flows from the bottom into the processing chamber and then exits the processing chamber via the edge of the overflow through it. The articles are held and contacted by means of a carrier consisting of a sample holder, a rotor, a stator power transfer and a measuring device. During this entire process, the articles thus held are clamped and fixed horizontally and vertically at the surface of the overflow process by means of a conveying device. The immersion depth of the article is adjusted by means of a precision vertical drive mechanism of the carrier, such as a stepper motor, such that only the bottom surface to be treated is wetted and in contact with the process fluid. For current electrolysis, the conductive sample holder located on the underside of the article is also metallized. Such improperly metallized holders must be metallized from time to time. To this end, in another processing step, the carcass is positioned on the processing chamber in the absence of the article in such a manner that the sample holder is not in the treatment fluid. An anode transition occurs between the sample holder and the cathode auxiliary electrode. The sample (10) holder is then electrolyzed to metallization by means of a motor source. The auxiliary electrode absorbs a metal such as copper. It must be replaced after several etching processes. This device according to the state of the art exhibits the following disadvantages: • The article must be clamped to the carrier for handling and must be held by it throughout the process. Therefore, the height level of the article relative to the treatment fluid must be determined individually and applied by precisely adjusting the vertical drive mechanism. Since generally extremely thin objects (e.g., having a thickness of 〇3 mm) actually spiral above the processing chamber, it is necessary to provide a very robust mechanical construction to the processing chamber structure as well as to the transfer equipment and carrier. In the future, the thickness of solar cells made from tantalum will be reduced to , , , mm. In addition, temperature changes during processing may affect the level of the carrier relative to the level of processing fluid. The apparatus disclosed in US 5,429,733 encounters the problem of properly aligning the substance on the surface of the electrolyte. The article is held on the processing chamber by means of an air cushion, and its holder is mechanically coupled to the processing chamber. At the same time, the top of the article that is not wet chemically treated is sealed to prevent contact with the treatment fluid. However, the fact that the item must be in the holder and fixed by it is disadvantageous because it takes a lot of time. After the process is complete, the item must be unloaded from the holder. In the case of ί vulnerable items, for example, for Shi Xi solar cells, there is always a risk of damage to the thin plates. If the process fluid is too strong to flow against the article being held, the article is therefore particularly at risk of breakage, as is the case during the process itself. The established minimum flow rate of the electrolyte flow chamber is necessary to overcome the backflow and contact with the surface of the article in order to effect its chemical modification. Here, the risk of breakage of such thin articles is also significantly increased, and the thickness of the thinner articles which are subjected to wet chemical treatment. For the planar articles, chemical and/or electrolytic treatment equipment described in US 5,437,777 and DE 197 36 34() C2, the same risk of breakage exists. Finely assist the holder to bring the item into contact with the treatment fluid. The seal protects the item from the untreated surface and the contact member for feeding the current to the fluid. In addition to the risk of breakage of the article, another disadvantage is that it must be placed in the holder and must be removed after handling. These operational problems also exist for the device disclosed in us 5,443,707. The holder of the device must remain at the article throughout the exposure: each system must have several such technically complicated devices to position the object and spacers during processing to determine the height level of the upper edge of the groove. The fixing device or the conveying device is pressed on the upper edge of the groove. In all cases, a force is applied to the item, which may cause it to break. US 5,_,827 discloses an electrolytic cell for partially metallized wafers. 130646.doc -10- 200848554 The electrolyte flowing in from the bottom leaves the battery by means of the overflow edge. In order to influence this flow, especially in the rim region of the bottom surface of the wafer, the distance Η is adjusted by means of a supporting element in the form of a screw. The same is true for the distance S determined by the diameter of the wafer and the electrolytic cell and which must be adjusted once. Electrical contact occurs on the wafer's dry • above' whereby the article remains in contact with the contact member during the electrolytic process. Since the electrolyte does not reach the electrical contacts, these contacts are not metallized. However, both sides of the article must be electrically connected to each other. In this case, the metallization of the contact is not necessary.
C 亦固定晶圓以防其在電池上橫向移動之支撐元件為該發 明之必需部件。然而，該等橫向作用限制物或末端擋塊實 際上引起處理流體因毛細管力而在物品邊緣或沿物品邊緣 +滞。因此’流體在此等限制物附近不當地接觸物品上 面，通常導致不合格品損失。因此，該等限制物不能在未 受保護之上面甚至不允許部分潤濕之情況下使用。 其他用於晶圓之電鍍設備（例如）揭示於de 600 25 773 U 12(圖1)及1^6,001，23 5(圖1)中。用於與浴電流源連接之電 接點垂直升至電解質之上。直至電解質/空氣邊界，在物 金屬化期間接點亦經金屬化，至少直至可能的部分絕緣 覆蓋層。由於實際上此絕緣覆蓋層遭受磨損，亦因為電絕 緣材料不能或僅不充分地黏著於通常由電化學惰性金屬 (諸如鈦或鈮）組成之基底材料，因此常將其省略。此等金 屬表面不可避免之氧化物形成係該絕緣覆蓋層不充分黏著 於接點之原因。金屬毯覆接觸區域之金屬化因此必須在生 產進仃期間重複地移除。為此，使處理室中之接點與陰極 130646.doc 200848554 輔助電極相對發生陽極轉換。在此電解去金屬化期間，觀 察到在電解質/空氣邊界附近僅發生金屬化層之不完全移 除。因此且即使進行數次中間去金屬化步驟，仍有越來越 多的金屬或多或少呈環狀地堆積於此邊沿區域中之接點 上。另外，所用電解質之晶體可沈積於此區域中。因此， 對於不間斷生產，自動去金屬化及清洗接點是不夠的。時 常必需人工介入來移除干擾性環狀沈積物。 不充分去金屬化之相同問題出現於使用亦可充當物品支 撐物之水平定位或傾斜之接點的電鍍設備中。一部分此等 接點被流出處理室之電解質潤濕。因此，相對於處理室永 久性機械固定之接點被金屬化直至電解質/空氣邊界。在 電解去金屬化期間，在此邊界處出現上述不完全去金屬化 及清洗。 本發明之目標係提供克服先前技術之上述缺點且確保單 側濕式化學、電化學& /或電解處理或清洗平面物品之完 全平坦或結構化底面之裝置及方法，該物品係以使得幾乎 無可能使物品移位之水平力作用於其上之方式置放於處理 室上之至少一個支撐物上。 換言之，本發明使得從業者能夠專一地僅處理平面物品 面而…、而固持及/或橫向限制該物品且無需保護物品 另一面以防其被潤濕。 【發明内容】 因此，提供根據請求項1之裝置及根據請求項20之方 法。較佳實施㈣各別獨立請求項之標的物。 130646.doc •12- 200848554 根據本發明，避免作用於物品之機械應力或其他力以顯 著降低易損物品之破損危險。 在電化學或電解應用之情況下，本發明使得能夠完全去 金屬化及清洗相對於處理室固定且永久性配置之非電絕緣 接點。 在產生本發明之實驗過程中，最初設法藉由將橫向限制 物與置放於支撐物上之物品邊緣之間的接觸區域縮小至線C. The support member that also holds the wafer in place to move laterally over the battery is an essential component of the invention. However, the laterally acting restriction or end stop actually causes the treatment fluid to lag at the edge of the article or along the edge of the article due to capillary forces. Therefore, fluids that are inadvertently contacted with objects near such restraints often result in the loss of nonconforming products. Therefore, such restrictions cannot be used on unprotected or even partially wetted parts. Other plating equipment for wafers (for example) are disclosed in de 600 25 773 U 12 (Fig. 1) and 1^6, 001, 23 5 (Fig. 1). The electrical contacts for connection to the bath current source rise vertically above the electrolyte. Up to the electrolyte/air boundary, the contacts are also metallized during metallization, at least up to a possible partial insulating coating. Since the insulating cover layer is actually subjected to wear, and since the electrically insulating material is not or only insufficiently adhered to the base material usually composed of an electrochemically inert metal such as titanium or tantalum, it is often omitted. The formation of oxides which are unavoidable on these metal surfaces is responsible for the insufficient adhesion of the insulating coating to the contacts. The metallization of the metal blanket contact area must therefore be removed repeatedly during the production process. To this end, the junction in the process chamber is anode-converted relative to the cathode 130646.doc 200848554 auxiliary electrode. During this electrolytic demetallization, it was observed that only incomplete removal of the metallization layer occurred near the electrolyte/air boundary. Therefore, and even if the intermediate demetallization step is carried out several times, more and more metals are more or less annularly deposited on the joints in the edge region. Additionally, crystals of the electrolyte used can be deposited in this region. Therefore, for uninterrupted production, automatic metallization and cleaning of joints is not enough. Manual intervention is often necessary to remove interfering annular deposits. The same problem of insufficient metallization arises in the use of electroplating equipment that can also act as a horizontal or inclined joint for the support of the article. A portion of these contacts are wetted by the electrolyte flowing out of the processing chamber. Thus, the joints that are permanently mechanically fixed relative to the processing chamber are metallized to the electrolyte/air boundary. The above incomplete demetallization and cleaning occurs at this boundary during electrolytic demetallization. It is an object of the present invention to provide apparatus and methods that overcome the above-discussed shortcomings of the prior art and that ensure a single-sided wet chemical, electrochemical &/or electrolytic treatment or cleaning of a fully flat or structured underside of a planar article, such that the article is It is not possible to place the horizontal force on which the article is displaced on at least one of the supports on the processing chamber. In other words, the present invention enables a practitioner to exclusively process a flat article only... while holding and/or laterally confining the article without protecting the other side of the article from being wetted. SUMMARY OF THE INVENTION Accordingly, a device according to claim 1 and a method according to claim 20 are provided. Preferably, (4) the subject matter of each individual request item. 130646.doc • 12- 200848554 In accordance with the present invention, mechanical stress or other forces acting on the article are avoided to significantly reduce the risk of breakage of the consumable article. In the case of electrochemical or electrolytic applications, the present invention enables complete demetallization and cleaning of non-electrically isolated contacts that are fixed and permanently disposed relative to the process chamber. In the course of the experiment in which the present invention was made, it was originally sought to reduce the contact area between the lateral restraint and the edge of the article placed on the support to the line.
接觸來避免橫向限制物或末端擋塊之上述毛細管作用。由 於產生約0.1 mm至0·3 mm之邊緣高度的物品之通常極低的 厚度，不能避免物品上面的部分潤濕。由於已經少量之流 體可能導致上面處之不當化學反應，因此此方法不得不放 棄0 然而’實驗意外地顯示由沿物品表面流動之流體所產生 之橫向剪切力實際是可控制的。若處理流體流至少在物品 附近自垂直線向處理室之所有側面徑向對稱地引導，且若 將物品與處理室疊合定位，則可避免缺少橫向限制物或末 端擋塊之情況下物品遠離支撐物之水平移位。藉由增強精 確性，尤其對於實驗結構之以上對稱性，可充分減少物品 離開其中心位置之水平飄移。若間隙高度因至少—個支撐 物相對於溢流邊緣之精確定位而在處理室之整個圓周上大 體上完全相同’且若溢流邊緣及間隙沿整個圓周完全水平 持定位於不包含任何橫向末端播塊且位 撐物上。當調準域物對物品之支 處理流體表面相等時’達成此種情形。為此，若可 130646.doc •13- 200848554 在充分範圍内調節支撐物之高度水平，則被證實是有益 的。由於在此實驗中使用一個以上支撐物，因此若支撐物 相對於處理室之垂直中心線至少將近對稱地排列，則亦被 證實是有益的。儘管在此實驗中使用多個對稱配置之支撐 物’但本發明亦可藉由使用僅具有一個支撐物之裝置來進 行’忒支撐物可為一個橫向或中心支撐物，或連續或間斷 的圓周環形支撐物。在下文中，該至少一個支撐物之技術 f 特徵在具有三個獨立及對稱分布之支撐物之裝置中例示。 §將物品置放於處理室上溢流處理流體表面之上及因此 支樓物之上時，物品與處理流體之間黏著力的水平分力幾 乎彼此抵消。若支撐物係對稱配置且若接觸物品底面之處 理流體流係徑向對稱地引導，則尤其發生此種情況。一次 置放於無任何橫向末端擋塊之支撐物上之物品保持在適當 位置處而無需任何框架、夾持器、固持器或具有達成此結 果所必需之橫向限制物之支撐物。因此，由於不存在橫向 L) 末端擋塊，因此不會發生物品上面潤濕。另一優點為上面 不需要任何類型之保護，例如藉由將其用保護層覆蓋或藉 助於機械覆蓋層或諸如常用真空吸盤之夾持器。另外，無 有害機械力或應力作用於物品。 流入處理室中之處理流體之量藉助於泵及/或閥來調節 使得置放於流出處理室之處理流體表面上且藉助於至少一 個支撐物精確定位的物品之上面不被潤濕。流體之表面張 力足以甚至防止物品之薄邊緣被潤濕。 處理流體永久性饋入處理室中且在已接觸物品底面之後 130646.doc -14- 200848554 經處理室之溢流邊緣溢流至儲集器中。藉此，在物品邊沿 物品與處理流體之間黏著力的垂直分力使物品輕輕黏著於 至V個支撐物。為進行物品底面之電化學及/或電解處 理’至少-個支撺物係導電的且亦可有利地充當電接點以 便施加物品電解處理所必需之電流。或者，物品之電接觸 可使用$夕個可與物品底面及/或上面連接之獨立接點 來達成。然而，一或多個整合機械及電接點之實施例係較 佳的。極可靠的電接觸可藉由垂直作用之黏著力來達成。 由於垂直分力，雖然較小的摩擦力作用於支撐物之支撐區 域與置放於其上之物品底面之間。此進一步穩定物品在支 撐物上之水平及中心位置，使得即使無橫向末端播塊或限 制物’物品仍意外地保持在其先前置放之中心位置處。 用於向物品底面供給之電源之至少-個電接點在-或數 次金屬化程序之後在相同電解質中經電解去金屬化。為避 免金屬在各接點之電解質/空氣邊界處的環狀堆積，本發 明之裝置另外包含用以相對於自然電解 質/空氣邊界移動 接點及/或電解質表面處之電解質/空氣邊界以便進行金屬 化及去金屬化之構件。藉此’兩種情況下電解質之流速可 接近或完全相同。對於移動電解質/空氣邊界，存在兩個 較佳實施例’接下來將其稱為實令"及實例2且其包含至少 一個氣體分配器形式之該構件。 流）使各接點附近之電解質及因此電解以空氣邊界向處理 室移動。在垂直配置之接點的情況下，此可藉由靠近各接 在實例1中’在處理物品金屬化期間藉由氣流(較佳空氣 130646.doc 200848554 ’占對準處理室内電解質之表面水平面引導之氣流來達成。 在κ平配置或傾斜之接點的情況下，t體之流動方向大致 才曰向處理室之中心。在兩種情況下，電解質/空氣邊界均 向處理室移動。 1 接著在無物品之情況下藉由關閉或停止氣流來進行經陽 極轉換之接點的去金屬化。以此方式，各接點處之自然電 解貝/空氣邊界自金屬化期間存在之原邊界位置向外方向 移動因此，各接點在臨界邊界區域中亦被電解質完全潤 濕’且在無氣流存在下空間擴展之電解池中發生完全去金 屬化。 “ 在貫例2中，在去金屬化期間各接點處之電解質/空氣邊 界之位移或移動係以相反方向發生。在先前金屬化期間， 經溢流邊緣且沿各接點流出處理室之電解質不受影響或無 移位，儘官可能足以減少氣流。因此，在接點處形成自然 電解質/空氣邊界。再於無物品之情況下進行接近水平定 位或傾斜且經陽極轉換之接點之去金屬化。因此，較佳藉 助於氣流，使各接點處之電解質/空氣邊界自處理室向外 位移或移動，使得各接點處之電解質達到在金屬化期間未 被潤濕之區域。對於接近垂直配置之接點，遠離接點對準 處理室令電解質之水平面以使各接點處之水平面升高且潤 濕各接點處原自然電解質/空氣邊界所代表之區域的方式 引導氣流。由於必須去金屬化之接點區域完全定位於電解 質内，因此再次發生完全電解去金屬化。 可在顯著咼於用於處理物品金屬化之電流密度下進行接 130646.doc -16- 200848554 點之電解去金屬化。因此，與10至3〇分鐘或更長之典型金 屬化時間相比，去金屬化可在較短時間内，例如2〇秒鐘内 實施。 根據一較佳實施例，至少一個接點之去金屬化期間之電 解質/空氣邊界係藉由可單獨或組合進行之以下步驟中之 任一者充分移動，使得在先前金屬化期間形成之邊界至少 在至少一個接點附近完全定位於電解質内：a)在各接點處 與電解質流動方向成直線或對準電解質表面引導氣流；b) 例如藉由向各接點提供臨時機械傾斜能力來將用於去金屬 化之至少一個接點降低至處理流體中；匀向至少一個接點 上局部施用處理流體；d)例如藉由使用機械障蔽物或其類 似物升高溢流邊緣，藉此升高處理流體之水平面；及/或匀 藉由增加處理流體之流動來升高其水平面。 根據本發明，各去金屬化期間各接點之完全去金屬化及 β洗允許電鍍設備中不間斷地自動處理物品。為增強至少 一個通常由氧化金屬製成之接點之電學及機械特性，可將 其表面用導電金剛石層覆蓋及/或用電絕緣層部分覆蓋。 待t電解處理之物品之底面表面必須包含至少一個供其 使用至少一個接點電接觸之接觸區域，其中該接觸區域與 待處理表面電連接。若物品在底面接觸，則此接觸區域必 須符合至少一個接點之設計以便電流可適當施加於物品。 或者，在某些情況下，物品可經由乾燥上面接觸，只要底 面與4上面電連接即可。此可（例如）藉由提供至少一個位 於電解質外之電接點來達成，其中來自浴電流源之電錢電 130646.doc -17- 200848554 流經由物品之周圍邊緣及/或經由物品本身饋入物品。 對於較佳由p-摻雜及η-摻雜矽組成之太陽能電池而言， 可藉由照明η-摻雜底面來提供此電連接。根據其原來目 的，太陽能電池接著充當直流電源，其與在電鍍期間同等 極化之（浴）電流源串聯連接。經適當照明之太陽能電池能 夠载運1 Α及更多之必需電鍍電流。此實施例之優點在於 不存在乾燥接觸構件之金屬化。所需照明體（包括反射體） 可位於工作槽中之電解質内且亦可位於工作槽外。外部配 置需要處理室之至少部分透明之槽壁。所有已知光源，尤 其是_素燈及發光二極體，均適用作照明體。 根據本發明之一較佳實施例，該裝置因此包含至少一個 用於活化處理流體之光敏感性組份及/或用於實施化學、 電化學或電解處理之光源。其較佳位於處理室内，但亦可 位於外面。此至少一個光源可為任何類型，包括鹵素燈、 發光二極體、螢光燈、紫外或紅外光源、雷射器或其組 合。藉由使用具有光可活化組份之處理流體與光源之組 合，處理過程僅在光源開啟時發生或在其時受到辅助。若 品要，活化可藉由使用保護物品表面某些區域免受照明之 合適遮罩來選擇性引導。 根據另一較佳實施例，該裝置進一步包含至少一個用於 將物品傳遞至及傳遞出處理室之傳送構件，該構件用於將 物品定位及置放於處理室上之至少一個支撐物上及用於在 處理之後重新定位及拾起物品。此等適用於裝載及卸載之 後種構件較佳經設計成專一地接觸物品之底面。換言之， 130646.doc -18- 200848554 應避免構件接觸物品之邊緣及/或上面。合適構件包含— 或多個桿形元件，其彎曲及/或呈銳角以達到置放於 流體表面上之物品底面而不接觸其邊緣。 【實施方式】 在下文中，藉由參考示意性及不按比例之圖示丨至9來 詳細地描述本發明。 在圖1中，平面物品〗置放於處理室3上之接點或支撐物2 上。用於圓形物品1之至少三個支撐物2或用於有角物品1 之至少四個支撐物2定位於處理室3之邊沿處且相對於其垂 直中心線9對稱配置。因此，物品1與此處桿形支樓物2之 間的重力接觸力幾乎相#，此對於電化學及/或電解處理 期間之電流傳輸尤其重要。在此實施例中，處理室3具有 與待處理之物品1之形狀及尺寸大體上疊合之内截面。不 同於此璺合，物品可較佳略大於處理室3之内截面。在此 情況下，在物品之邊沿區域1〇中發生略微較少，或對於較 ^突出物不發生表面處理。此外，物品卜亦可略小於處理 至例如對於太陽能電池，内截面可為圓形、方形或長 方形，具彳或無縮短轉角或曲線，或其可具有$同形狀。 突出物應選擇成相對於垂直中心線9至少接近對稱，以便 Ρ牛低或避免作用於物品i之水平合力。最後，亦可選擇處 理室3之截面與物品1不疊合，以便僅選擇性電鏟與處理流 體24接觸之物品區域。 、為減少相對於處理室之固定外部形狀改變物品形狀之情 況下之成本及勞力，可使用相應減小處理室3之内徑及/或 130646.doc -19- 200848554 形狀之摘入物及复遂 物次其類似物來調適處理室之内部形狀。 在圖1中，處理流體例示性地在中u、、A 由流動方向箭頭4象,““ “處理室3中。此 、象徵性表示。為實施物品1之化學改質， 請處理流體經由管之化予改貝 ^ rB 7AA 開口 6以朝向待處理物品 氏面7的方向循環傳遞至處理室3中。或者，可使用任 何構件將處理流體傳遞 哭之被動错4 ★ 处里至中，包括諸如升高流體容 構件。處理流體在底面7處經向向外向物品 Π::在填充處理流體之處理室内，但至少在物品附 引導垂直中心線9向處理室3之所有側面徑向對稱地 ^ =係藉由諸如隔板、散布孔之旋轉，稱（對稱化）構 2 ’错由將處理流體呈環狀或在中心饋入處理室3之底 二’及/或藉由使用多個對稱性構件將處理流體饋入處理 至3之。底部部分來達成。此流體引起將漂浮於流體表面上 之物口口:卜拉之黏著力。然而，由於該流係徑向對稱流動， 因此此等力彼此抵消’至少直至因公差產生之可忽略之較 小剩餘部分。在溢流邊緣13與置放於支物上之物…之 成火平間隙，且其允許處理流體流出處理室3周圍且 流入:集器14中’其中將降落高度調節至較小以避免不當 地夾π空氣。為此’選擇較大處理流體總體積使得儲集器 14内之其水平面幾乎達到溢流邊緣13。泵5將處理流體自 儲集器U傳遞回處理室3中。為達成調節每時間單位流體 循環量之目的’可在管内使用用於泵之具有可變旋轉速度 ◎㈣’或可調節扼流器、閥及其類似物。對於具有 1.5 dm處理表面之物品，在實驗中選擇各處理室每分鐘3 130646.doc -20- 200848554 與20公升之間的流動流體體積。各別量主要與方法有關 根據本發明，在無橫向末端擋塊之情況下物品丨固定於處 理至3上允許在以上廣泛範圍内調節流動體積，而不會發 生物品移位。在圖丨中，頂視圖展示具有縮短邊緣之典^ 太陽能電池。處理室3之内截面具有相同形狀。在此圖中 溢流邊緣13被物品1遮住且因此由虛線指出。在此裝置未 使用橫向末端擋塊。 若為特定方法設計所需，可在處理室3内整合較佳相對 於垂直中心線9軸對稱之其他旋轉對稱構件u，諸如隔 板、隔膜、膜片、可溶性或不溶性陽極及其他電極或裝 備。其經設計用以維持沿物品之均一對稱性流動。 對於可溶性陽極，可使用具有或無孔洞之自行支撐板以 及塊狀材料。塊狀材料（例如，金屬球）設置於亦用於與浴 電流源電連接之導電及化學惰性金屬栅攔上。塊狀材料之 上由例如聚丙烯之離子可透性織物過濾器覆蓋。處理流體 流向物品之底面7同時穿過此配置，此配置統稱為陽極， 或在本說明書中一般稱為旋轉對稱構件丨！。 如圖3所示支撐物2決定間隙高度15。因此，其必須靠近 處理室精確地機械定位。至少一個支撐物可由非導電材 料，或在電化學及/或電解處理物品1之情況下由金屬製 成。在此情況下，該至少一個支撐物較佳亦充當用於向物 口口 1供給之電源之電接點2。支撐物2可如圖1中所示固定於 槽壁17上，或如圖2中所示固定於獨立支撐物底座16上。 圖2說明物品1之電化學及/或電解處理。可溶性或不溶 130646.doc -21 - 200848554 性陽極21配置於處理室3内。對於金屬化，藉由浴電流源 22使物品1與陽極21相對發生陰極轉換。因此，物品1之潤 濕底面7及金屬毯覆式接點2之潤濕區域被電解質電鍍直至 電解質/空氣邊界25。視電解質而$，尤丨視其金屬含量 而定，晶體亦可能沈積於此邊界處。接點金屬化3〇以及晶 體形成不利於電鍍設備之連續操作。在各次或數次金屬化 程序之後，必須電解去金屬化及清洗接點2。為此，使其 與經陰極轉換之對立電極相對發生陽極極化。然而，在接 點2之此區域中，電解去金屬化不完全。若不採取其他措 施僅成—人金屬化及去金屬化程序即將引起電錢金屬在電 解質/空氣邊界25之區域中以幾乎環狀或條狀之形式在接 點上生長。此干擾性沈積接下來稱為金屬環31且通常必須 人工移除，因此t斷自動生產過程。 成倍延長去金屬化時間也許可能較大程度地電解溶解金 屬環31。然而，此與系統之生產能力損失相關聯且因此應 予以避免。電解溶解或蝕刻金屬環31之另一種可能性可為 增加去金屬化期間之循環電解質流動體積。然而，此可能 必需更複雜的配置且產生因受推動及因此更擾亂的流動而 增加空氣夾帶至電解質中之缺點。 空氣影響電解質之添加劑，從而產生增加其消耗之缺 點。然而，由於對於本發明與電鍍時間相比去金屬時間較 佳極短，因此臨時流動增加僅對電解質系統產生較小鱟 響。 〜 圖3描述支撐物2之有利實施例。為避免潤濕物品之邊緣 130646.doc -22- 200848554 23，應避免此臨界區域内支撐物2與物品i之間的接觸。此 係藉由支撐物2之所述形狀及定向以及藉由物品相對於槽 緣之突出物來達成。為避免處理流體潤濕支撐物底座16， 可如所示將支撐物設計成虹吸管狀。 圖4a以側視圖展示溢流邊緣丨3之實施例。較佳使用直邊 緣線。如此圖中所示，$同形狀之切口 18可位於部分溢流 邊緣13中或整個溢流邊緣13上。在此，類似於梯形切口， 亦可選擇正弦曲線形狀。此等切口用於個別影響（降低）處 理室邊沿區域中處理流體之流速。藉由溢流邊緣13處之切 口 18，處理流體之排出流速因此可相對於既定流動體積最 佳化以確保物品如所預期般經均一處理。切口丨8之深度及 間距在0.5 mm至5 mm之範圍内。視方法而^，間隙高度 15可在0.3 mm與6 mm之間變化，且較佳在丨mm與3 mm之 間之範圍内。間隙高度15係自切口 18之最上部量測。 圖4b以截面圖展示溢流邊緣13區域中槽壁17之不同實施 例。截面形狀視方法巾冑。圓形溢流邊緣減少此區域中之 旋渦形成。對於通常尺寸之晶圓或太陽能電池而言，溢流 邊緣之邊緣寬度19可在銳角轉角（大於〇〇贿）至5麵之範 圍内且較佳在0·5 mm與2· 5 mm之間。 圖5展示複數個處理室3,其係在大型生產設備中並㈣ 相接配置。儲集器U接收來自一個、數個或所有處理室3 之溢流處理流體m 5將處理流體#遞至㈣管2〇 中’分配管20經由中心入口管6與處理室3相連。為避免平 行饋送之處理室3内之不等流動體積’分配管汕可併有具 130646.doc -23- 200848554 有㈣長度且配備開口之内t，處理流體首先由果傳遞至 内管中。自彼處，流體接著到達分配管2〇。 在此κ刼例中，各處理室3包含較佳配備允許電化學或 電解處理物品1所需之電解質穿過之開口的可溶性或不溶 !·生陽極21為達成金屬化之目的，藉由浴電流源μ使物品 1發生陰極轉換。單極或雙極脈衝電流源亦適用。浴電流 源22可向數個處理室3供給浴電流用於電鍍。處理室3較佳 藉由在此未圖示之傳送構件平行（亦㈣時）裝載及卸載物 品。因此，整個生產設備需要較少傳送構件。 /圖6展示一或數次金屬化過程之後去金屬化接點】之情 形。未裝載物品1。在此’位於電解質溢流區域中之接點2 藉助於浴電流源22及在此未示之轉換構件發生陽極轉換。 在此情況下，陽極21充當陰極，自接點2移除之金屬（例 如，銅、錫或銀）沈積於其上。以此方式，此金屬可有效 地在隨後電鍍步驟中重新使用。 在圖5及6中，因簡化圖示夹屁 丁未展不使軋流對準接點2流動 之裝備。用於完全移除在各金屬化過程期間發生之全部接 點金屬化30及用於避免金屬環31堆積之此等設備展示於以 下圖7至9中。 圖7a說明物品1金屬化期間 4间之It形。例如具有圓形或長 方形形狀之接點2接觸且支一斗 叉撐物品。在圓形形 下，物品停留在處理室3上之至 Λ ^ ^二個接點2上。對於方形 或長方形物品，通常在處理宮由 接㈣U用三個以上接點用於 接觸及承載。或者’處理言可 至了僅包含—個大體上環形且位 130646.doc -24- 200848554 於靠近内槽壁（未圖示）處之支撐物。由泵（未圖示）傳遞之 電解質24沿物品1之底面7流動，且自彼處經溢流邊緣13流 入僅部分可見之儲集14中。由於流出處理室3之電解質Contact to avoid the aforementioned capillary action of the lateral restraints or end stops. Due to the generally extremely low thickness of articles having an edge height of from about 0.1 mm to about 0.3 mm, partial wetting of the article cannot be avoided. Since a small amount of fluid may cause an improper chemical reaction at the above, this method has to be discarded. However, the experiment unexpectedly shows that the transverse shear force generated by the fluid flowing along the surface of the article is actually controllable. If the process fluid flow is directed radially symmetrically from the vertical line to all sides of the process chamber at least in the vicinity of the article, and if the article is placed in position with the process chamber, avoiding the absence of lateral restraints or end stops The horizontal displacement of the support. By enhancing the accuracy, especially for the above symmetry of the experimental structure, the horizontal drift of the item from its central position can be substantially reduced. If the gap height is substantially identical over the entire circumference of the processing chamber due to at least the precise positioning of the support relative to the overflow edge 'and if the overflow edge and gap are fully horizontally positioned along the entire circumference without any lateral ends Broadcast the block and place it on the support. This is achieved when the alignment domain is equal to the surface of the article. For this reason, it has proven to be beneficial if 130646.doc •13- 200848554 can adjust the height level of the support to a sufficient extent. Since more than one support is used in this experiment, it has also proven to be beneficial if the supports are arranged at least nearly symmetrically with respect to the vertical centerline of the processing chamber. Although a plurality of symmetrically configured supports are used in this experiment, the present invention can also be carried out by using a device having only one support. The support can be a lateral or central support, or a continuous or intermittent circumference. Ring support. In the following, the technical f-feature of the at least one support is exemplified in a device having three independent and symmetrically distributed supports. § The horizontal component of the adhesion between the article and the treatment fluid almost cancels each other when the article is placed over the surface of the treatment fluid on the treatment chamber and thus over the building. This is especially the case if the supports are symmetrically arranged and if the fluid flow is contacted radially symmetrically with the bottom surface of the article. An item placed on a support without any lateral end stops is held in place without any frame, holder, holder or support having lateral restraints necessary to achieve this result. Therefore, since there is no lateral L) end stop, there is no wetting of the article. Another advantage is that no protection of any type is required above, for example by covering it with a protective layer or by means of a mechanical covering or a holder such as a conventional vacuum chuck. In addition, no harmful mechanical forces or stresses act on the article. The amount of process fluid flowing into the process chamber is adjusted by means of a pump and/or valve such that the top of the article placed on the surface of the process fluid exiting the process chamber and precisely positioned by means of at least one support is not wetted. The surface tension of the fluid is sufficient to prevent even the thin edges of the article from being wetted. The treatment fluid is permanently fed into the processing chamber and after overflowing the bottom surface of the article 130646.doc -14- 200848554 overflows into the reservoir through the overflow edge of the processing chamber. Thereby, the vertical component of the adhesion between the article and the treatment fluid at the edge of the article causes the article to adhere lightly to the V supports. For the electrochemical and/or electrolytic treatment of the underside of the article, at least one of the support is electrically conductive and may also advantageously serve as an electrical contact for applying the current necessary for the electrolytic treatment of the article. Alternatively, the electrical contact of the item can be achieved using a separate contact that can be attached to the underside of the item and/or to the top. However, one or more embodiments of integrated mechanical and electrical contacts are preferred. Extremely reliable electrical contact can be achieved by the adhesion of the vertical action. Due to the vertical component force, a small frictional force acts between the support region of the support and the bottom surface of the article placed thereon. This further stabilizes the level and center position of the article on the support such that even if there are no lateral end broadcasts or restrictions' items, they remain accidentally held at the center of their previous placement. At least one electrical contact for the power source supplied to the bottom surface of the article is electrolytically demetallized in the same electrolyte after - or several metallization procedures. To avoid annular build-up of metal at the electrolyte/air boundary of each junction, the apparatus of the present invention additionally includes means for moving the metal/electrode boundary at the junction and/or electrolyte surface relative to the natural electrolyte/air boundary for metal The components of the metallization and demetallization. Thus, the flow rate of the electrolyte can be close to or identical in both cases. For moving electrolyte/air boundaries, there are two preferred embodiments 'hereinafter referred to as actual " and Example 2 and which comprise at least one member in the form of a gas distributor. The flow causes the electrolyte in the vicinity of each junction and thus the electrolysis to move to the processing chamber at the air boundary. In the case of vertically arranged contacts, this can be guided by the airflow during the metallization of the treated article during the metallization of the treated article (preferably air 130646.doc 200848554 'according to the surface level of the electrolyte in the alignment process chamber) In the case of a κ flat configuration or a slanted joint, the flow direction of the t body is substantially directed toward the center of the processing chamber. In both cases, the electrolyte/air boundary is moved toward the processing chamber. The demetallization of the anode-switched contacts is carried out by shutting off or stopping the gas flow without the articles. In this way, the natural electrolysis shell/air boundary at each joint is from the original boundary position existing during the metallization. The outer direction moves, therefore, the joints are also completely wetted by the electrolyte in the critical boundary region and completely demetallize in the electrolytic cell where there is no airflow in the presence of air flow. "In Example 2, during demetallization The displacement or movement of the electrolyte/air boundary at each junction occurs in the opposite direction. During the previous metallization, the electrolysis exits through the overflow edge and along the junctions Unaffected or undisplaced, it may be sufficient to reduce airflow. Therefore, a natural electrolyte/air boundary is formed at the joint, and then the contact is approached or tilted and the anode is switched without the article. Metallization. Therefore, the electrolyte/air boundary at each junction is displaced or moved outwardly from the processing chamber by means of a gas stream such that the electrolyte at each junction reaches an area that is not wetted during metallization. Proximity to the vertically aligned joints, away from the joints aligning the processing chambers, directs the flow of the electrolyte in a manner that raises the level of the water at each joint and wets the area represented by the original natural electrolyte/air boundary at each joint. Since the metallization of the contact area is completely localized in the electrolyte, complete electro-demetallization occurs again. It can be carried out at a current density significantly higher than that used to treat the metallization of the article. 130646.doc -16- 200848554 Electrolytic demetallization. Therefore, demetallization can be performed in a shorter period of time, such as 2 sec., compared to a typical metallization time of 10 to 3 minutes or longer. In accordance with a preferred embodiment, the electrolyte/air boundary during demetallization of at least one of the contacts is sufficiently moved by any of the following steps, either alone or in combination, such that it is formed during prior metallization The boundary is completely positioned within the electrolyte at least in the vicinity of at least one of the contacts: a) in line with the direction of electrolyte flow at each junction or in alignment with the electrolyte surface to direct airflow; b) by providing temporary mechanical tilting capability to each joint, for example Reducing at least one joint for demetallization into the treatment fluid; applying a treatment fluid to the at least one joint; d) raising the overflow edge, for example by using a mechanical barrier or the like, This raises the level of the treatment fluid; and/or increases the level of the treatment fluid by increasing its flow. According to the present invention, the complete demetallization and beta wash of the joints during each demetallization permit the plating apparatus not to Automatically process items intermittently. To enhance the electrical and mechanical properties of at least one of the contacts typically made of oxidized metal, the surface may be covered with a layer of conductive diamond and/or partially covered with an electrically insulating layer. The bottom surface of the article to be electrolyzed must contain at least one contact area for electrical contact with at least one of the contacts, wherein the contact area is electrically connected to the surface to be treated. If the article is in contact with the bottom surface, the contact area must conform to the design of at least one of the contacts so that current can be properly applied to the article. Alternatively, in some cases, the article may be contacted via dry top as long as the bottom surface is electrically connected to the top surface 4. This can be achieved, for example, by providing at least one electrical contact located outside of the electrolyte, wherein the electricity from the bath current source 130646.doc -17- 200848554 flows through the surrounding edge of the article and/or via the article itself article. For solar cells preferably composed of p-doped and eta-doped germanium, this electrical connection can be provided by illuminating the n-doped bottom surface. For its original purpose, the solar cell then acts as a direct current source, which is connected in series with a (bath) current source that is equally polarized during electroplating. A properly illuminated solar cell can carry 1 Α and more of the necessary plating current. An advantage of this embodiment is that there is no metallization of the dry contact member. The desired illuminating body (including the reflector) can be located in the electrolyte in the working tank and can also be located outside the working tank. The external configuration requires at least partially transparent walls of the chamber. All known light sources, especially s-lights and light-emitting diodes, are suitable for use as illuminators. According to a preferred embodiment of the invention, the device thus comprises at least one light-sensitive component for activating the treatment fluid and/or a light source for carrying out chemical, electrochemical or electrolytic treatment. It is preferably located in the processing chamber, but may also be located outside. The at least one light source can be of any type including a halogen lamp, a light emitting diode, a fluorescent lamp, an ultraviolet or infrared source, a laser or a combination thereof. By using a combination of process fluid and light source having a photoactivatable component, the process occurs only when the light source is turned on or assisted at that time. If desired, activation can be selectively guided by the use of a suitable mask that protects certain areas of the surface of the article from illumination. According to another preferred embodiment, the apparatus further comprises at least one transfer member for transferring the article to and from the processing chamber, the member for positioning and placing the article on the at least one support on the processing chamber and Used to reposition and pick up items after processing. These components, which are suitable for loading and unloading, are preferably designed to specifically contact the underside of the article. In other words, 130646.doc -18- 200848554 should avoid touching the edges and/or top of the article. Suitable members include - or a plurality of rod-shaped members that are curved and/or angled to reach the bottom surface of the article placed on the surface of the fluid without contacting its edges. [Embodiment] Hereinafter, the present invention will be described in detail by referring to the schematic and not to scale drawings. In Fig. 1, a planar article is placed on a joint or support 2 on the processing chamber 3. At least three supports 2 for the circular article 1 or at least four supports 2 for the angular article 1 are positioned at the edges of the processing chamber 3 and are arranged symmetrically with respect to their vertical centerlines 9. Therefore, the gravitational contact force between the article 1 and the rod-shaped branch 2 therein is almost the same, which is particularly important for current transmission during electrochemical and/or electrolytic treatment. In this embodiment, the processing chamber 3 has an inner cross section that substantially overlaps the shape and size of the article 1 to be treated. Different from this, the article may preferably be slightly larger than the inner cross section of the processing chamber 3. In this case, slightly less occurs in the edge region of the article, or no surface treatment occurs for the more protrusions. In addition, the article may also be slightly smaller than, for example, for solar cells, the inner section may be circular, square or rectangular, with or without shortened corners or curves, or it may have the same shape. The projections should be selected to be at least approximately symmetrical with respect to the vertical centerline 9 so that the yak is low or avoids the horizontal resultant force acting on the article i. Finally, it is also possible to select that the section of the processing chamber 3 does not overlap the article 1 so that only the area of the article in which the selective shovel contacts the processing fluid 24 is selected. In order to reduce the cost and labor in the case of changing the shape of the article relative to the fixed external shape of the processing chamber, the correspondingly reducing the inner diameter of the processing chamber 3 and/or the shape of the 130646.doc -19-200848554 and the complex can be used. The analogy is used to adjust the internal shape of the treatment chamber. In Fig. 1, the treatment fluid is illustratively in the middle u, and A is represented by the flow direction arrow 4, "" in the processing chamber 3. This is symbolically represented. To carry out the chemical modification of the article 1, please treat the fluid via The tube is rotated into the chamber 2 rB 7AA opening 6 is cyclically transferred to the processing chamber 3 in the direction of the object 7 to be treated. Alternatively, any member can be used to transfer the treatment fluid to the passive error 4 ★ in the middle, Including, for example, raising the fluid volume member. The treatment fluid is directed outwardly toward the article at the bottom surface 7: in a processing chamber filled with the treatment fluid, but at least radially symmetrical with respect to all sides of the processing chamber 3 at the article-attached vertical centerline 9 Ground ^ = by means of a partition such as a baffle, a scattering hole, said (symmetric) structure 2 'wrong by feeding the treatment fluid in a ring or at the center into the bottom of the processing chamber 3' and / or by using more The symmetry members feed the treatment fluid into the bottom portion. This fluid causes the mouth of the object that will float on the surface of the fluid: the adhesion of the Bra. However, due to the radial symmetry of the flow system, So these forces cancel each other' Less until the small remaining portion negligible due to tolerances. The overflow edge 13 is placed in a flat gap with the object placed on the support, and it allows the treatment fluid to flow out of the processing chamber 3 and into the collector: In 14', the landing height is adjusted to be small to avoid improperly clamping π air. To this end, the larger total processing fluid volume is selected such that its level in the reservoir 14 almost reaches the overflow edge 13. The pump 5 will treat the fluid Transfer from the reservoir U back into the processing chamber 3. To achieve the purpose of adjusting the amount of fluid circulation per unit time, 'there can be used in the tube with a variable rotational speed for the pump ◎ (four)' or adjustable choke, valve and Analogs. For articles having a treated surface of 1.5 dm, the volume of flowing fluid between 3 130646.doc -20-200848554 and 20 liters per minute per treatment chamber was selected in the experiment. The respective amounts are mainly related to the method according to the invention. The attachment of the article to the treatment to 3 without the lateral end stop allows the flow volume to be adjusted over the broad range above without the displacement of the article. In the figure, the top view shows the shortened edge The solar cell. The cross section within the processing chamber 3 has the same shape. In this figure the overflow edge 13 is obscured by the article 1 and is therefore indicated by the dashed line. The lateral end stop is not used in this device. It is desirable to integrate other rotationally symmetric members u, such as separators, membranes, membranes, soluble or insoluble anodes, and other electrodes or equipment that are preferably axially symmetric with respect to the vertical centerline 9, within the processing chamber 3. To maintain a uniform symmetry flow along the article. For soluble anodes, self-supporting plates with or without holes and bulk materials can be used. Block materials (eg, metal balls) are also placed for electrical connection to the bath current source. Conductive and chemically inert metal barriers. The bulk material is covered by an ion permeable fabric filter such as polypropylene. The treatment fluid flows through the bottom surface 7 of the article while passing through this configuration, collectively referred to as the anode, or generally referred to herein as a rotationally symmetric component! . The support 2 determines the gap height 15 as shown in FIG. Therefore, it must be accurately mechanically positioned close to the processing chamber. At least one of the supports may be made of a non-conductive material or, in the case of electrochemically and/or electrolytically treating the article 1. In this case, the at least one support preferably also serves as an electrical contact 2 for supplying power to the object port 1. The support 2 can be fixed to the groove wall 17 as shown in Fig. 1, or to the independent support base 16 as shown in Fig. 2. Figure 2 illustrates the electrochemical and/or electrolytic treatment of article 1. Soluble or insoluble 130646.doc -21 - 200848554 The anode 21 is disposed in the processing chamber 3. For metallization, the cathode 1 is caused to reverse the article 1 from the anode 21 by the bath current source 22. Therefore, the wetted bottom surface 7 of the article 1 and the wetted region of the metal blanket contact 2 are electroplated by the electrolyte up to the electrolyte/air boundary 25. Depending on the electrolyte, depending on the metal content, crystals may also deposit at this boundary. Contact metallization and crystal formation are not conducive to continuous operation of the electroplating apparatus. After each or several metallization procedures, the metallization and cleaning contacts 2 must be electrolyzed. To this end, it is anodically polarized relative to the counter electrode that is cathodically converted. However, in this region of the junction 2, the electrolytic demetallization is incomplete. If no other measures are taken, the human metallization and demetallization process will cause the money metal to grow on the joint in the form of an almost annular or strip in the region of the electrolyte/air boundary 25. This interfering deposition is hereinafter referred to as metal ring 31 and typically must be manually removed, thus interrupting the automated production process. Multiple times of extended demetallization time may result in a greater degree of electrolytic dissolution of the metal ring 31. However, this is associated with a loss of production capacity of the system and should therefore be avoided. Another possibility for electrolytically dissolving or etching the metal ring 31 may be to increase the circulating electrolyte flow volume during demetallization. However, this may require a more complicated configuration and create the disadvantage of increasing air entrainment into the electrolyte due to propelled and therefore more disturbing flow. Air affects the additives of the electrolyte, which creates a disadvantage of increasing its consumption. However, since the demetallization time is preferably extremely short compared to the plating time of the present invention, the temporary flow increase produces only a small increase in the electrolyte system. ~ Figure 3 depicts an advantageous embodiment of the support 2. To avoid the edge of the wetted article 130646.doc -22- 200848554 23, contact between the support 2 and the item i in this critical region should be avoided. This is achieved by the shape and orientation of the support 2 and by the protrusion of the article relative to the groove. To avoid the process fluid wetting the support base 16, the support can be designed as a siphon tube as shown. Figure 4a shows an embodiment of the overflow edge 丨3 in a side view. It is preferred to use a straight edge line. As shown in this figure, the same shaped slit 18 can be located in the partial overflow edge 13 or the entire overflow edge 13. Here, similar to a trapezoidal slit, a sinusoidal shape can also be selected. These cuts are used to individually affect (reduce) the flow rate of the treatment fluid in the edge of the chamber. By the slit 18 at the overflow edge 13, the discharge flow rate of the treatment fluid can therefore be optimized relative to the established flow volume to ensure that the article is uniformly treated as expected. The depth and spacing of the slits 8 are in the range of 0.5 mm to 5 mm. Depending on the method, the gap height 15 can vary between 0.3 mm and 6 mm, and is preferably in the range between 丨mm and 3 mm. The gap height 15 is measured from the uppermost portion of the slit 18. Figure 4b shows a different embodiment of the groove wall 17 in the region of the overflow edge 13 in a cross-sectional view. The cross-sectional shape is determined by the method. The circular overflow edge reduces the formation of eddies in this area. For wafers or solar cells of normal size, the edge width 19 of the overflow edge may be in the range of acute angles (greater than bribes) to 5 sides and preferably between 0. 5 mm and 2.5 mm. . Figure 5 shows a plurality of processing chambers 3 that are in a large production facility and (iv) interfaced. The reservoir U receives the overflow treatment fluid m 5 from one, several or all of the process chambers 3 and delivers the treatment fluid # to the (four) tubes 2〇. The distribution tubes 20 are connected to the treatment chambers 3 via the central inlet tubes 6. In order to avoid unequal flow volume within the processing chamber 3 that is fed in parallel, the dispensing tube can have a length of 130646.doc -23-200848554 and is equipped with an opening t, the treatment fluid is first transferred from the fruit to the inner tube. From there, the fluid then reaches the dispensing tube 2〇. In this embodiment, each of the processing chambers 3 contains a soluble or insoluble solution preferably provided with an opening through which the electrolyte required to electrochemically or electrolytically treat the article 1 is passed through! The green anode 21 is used for the purpose of metallization by means of a bath. The current source μ causes cathodic switching of the article 1. Unipolar or bipolar pulse current sources are also suitable. Bath current source 22 can supply bath current to several processing chambers 3 for electroplating. The processing chamber 3 preferably loads and unloads the articles by parallel (also (4)) the conveying members (not shown). Therefore, the entire production equipment requires fewer transfer members. / Figure 6 shows the shape of the metallization contact after one or several metallization processes. Item 1 is not loaded. The junction 2 in the electrolyte overflow region is anodic switched by means of a bath current source 22 and a conversion member not shown here. In this case, the anode 21 serves as a cathode, and a metal (e.g., copper, tin or silver) removed from the contact 2 is deposited thereon. In this way, the metal can be effectively reused in subsequent plating steps. In Figs. 5 and 6, the simplification of the illustration shows that the flow is not aligned with the flow of the contacts 2. These devices for completely removing all of the joint metallization 30 that occurs during each metallization process and for avoiding metal ring 31 buildup are shown in Figures 7 through 9 below. Figure 7a illustrates the It shape of 4 during metallization of article 1. For example, a contact 2 having a circular or rectangular shape contacts and supports a fork support article. In the circular shape, the article rests on the processing chamber 3 to 接 ^ ^ two contacts 2. For square or rectangular items, usually three or more joints are used for contact and load in the processing chamber. Alternatively, the treatment may include only a support that is substantially annular and has a position of 130646.doc -24-200848554 near the inner groove wall (not shown). The electrolyte 24, which is delivered by a pump (not shown), flows along the bottom surface 7 of the article 1 and flows from there through the overflow edge 13 into the reservoir 14 which is only partially visible. Due to the electrolyte flowing out of the processing chamber 3
24，在物品1之邊沿區域中及因此靠近溢流邊緣丨3或多或 少擴散地形成自然電解質/空氣邊界25。此邊界以及因此 直至電解質/空氣邊界25在各金屬化步驟期間被金屬化之 接點區域在電鍍期間藉助於至少一個較佳為空氣流之氣流 26向處理室3中心之方向位移。對於各設備接點，空氣流 26係由至少一個配置於氣體分配器28(較佳為氣體分配管） 處之個別開口或噴嘴27散發出來。氣體分配器28由至少一 個壓縮機或壓氣機（未圖示）饋送（例如）壓縮空氣。藉由使 用未示之控制設備，可藉助於閥29、擋板或其類似：控制 及因此開啟、停止及關閉空氣流26。至少對於各處理室， 散發氣體或空氣可分別成群地共同控制…的係由位於 壓氣機與喷嘴27之間的擋板或閥29來提供。 月文努二氣&之量及速度以使得無氣流％之情況下金 化後之電解去金屬化導致在最短的可能時間内完全去金屬 化及清洗接狀方式調節。在❹幾乎水平配置或傾斜之 接點的情況下，金屬化期間之電解質/空氣邊界25充分向 :朝處理室3之中心移動’使得在隨後氣流停止或關閉之 ’“下：去金屬化期間，在金屬化期間形成之電解質/空 乳邊界完全定位於電解質内。在空氣流停止或關閉之情況 :的二金屬化期間，電解質/空氣邊界。向 動。此自然邊界接著位於在金屬化期間未金屬化或污染1 130646.doc -25- 200848554 接點2之區域中，因為由於空氣流26該區域保持乾燥。因 此’在各去金屬化過程中達成各接點之完全去金屬化。 在使用垂直配置之接點的情況下，在金屬化期間氣流係 對準電解質之表面引導，使得至少在接點附近處理室3内 • 之電解質水平面降低，從而亦導致電解質/空氣邊界25位 移。 圖7b說明空氣流關閉之情況下接點金屬化3〇之去金屬化 f 開始時的情形。自然形成的電解質/空氣邊界25已向外移 動。接點金屬化30完全定位於電解質内，從而使其能夠完 全電解溶解。最終形成之晶體亦由電解質流溶解。甚至在 許多次金屬化及去金屬化過程之後，亦未能在至少一個接 點處形成金屬環3 1。 圖8a及8b係關於實例1且展示兩種處理情形下相似電鍍 设備之細郎（圖8a中為金屬化，圖此中為去金屬化 在此實例中，接點底座16係配置於電解質24之最高水平 I 面之上。因此，當空氣關閉時電解質不能自身擴散至接點 底座16。 圖9a係關於實例2且展示電解金屬化期間之成角接點2。 電解質經處理室3之溢流邊緣1 3流入儲集器丨4中。此引起 ^ 在成角接點2之所示區域中形成自然電解質/空氣邊界25。 為自接點金屬化30完全去金屬化及清洗接點，在去金屬化 期間此邊界必須完全定位於電解質内。如（例如）圖91)中所 例示，此較佳藉助於至少一個與流動電解質成直線引導的 氣流26來產生。在處理室内無物品存在之情況下，氣流％ 130646.doc • 26 - 200848554 自至少一個噴嘴27散發出來且使電解質或電解質流至少在 接點2附近以使得新形成之電解質/空氣邊界25相對於原自 然電解質/空氣邊界對抗重力（亦即向外）移動之方式位移。 在金屬化期間電解質不能到達此接點區域且其因此未被金 屬化。 對於垂直配置之接點的去金屬化，對準電解質之表面引 導至少一個氣流使得處理室3内之電解質水平面至少在各 接點附近升高，藉此升高電解質/空氣邊界25。在幾乎水 平配置之接點的情況下，如圖9b中所示，亦向接點底座26 之方向幾乎水平地引導氣流。由於金屬化及去金屬化時不 同的電解質/空氣邊界25，在各去金屬化過程中達成接點2 之完全去金屬化及清洗。 去金屬化通常與用作辅助電極之對立電極相對發生。在 07 8及9中，對立電極（未圖示）亦可為位於處理室3内之 可溶性或不溶性陽極。對於此處理， 之接點2相對發生陰極轉換。因此， 該陽極上之金屬可有效地再循環。 中，其自彼處再溶解且用於物品丨之$ 之金屬化。 ’ 5亥％極與待去金屬化 ’自接點2溶解且沈積於 。在接下來的電鑛過程24. A natural electrolyte/air boundary 25 is formed in the rim region of the article 1 and thus more or less diffusely near the overflow edge 丨3. This boundary and thus the region of the contact which is metallized during the respective metallization step until the electrolyte/air boundary 25 is displaced during the electroplating by means of at least one gas stream 26, preferably air stream, is directed towards the center of the process chamber 3. For each device contact, the air stream 26 is emitted by at least one of the individual openings or nozzles 27 disposed at the gas distributor 28, preferably the gas distribution tube. Gas distributor 28 is fed, for example, compressed air by at least one compressor or compressor (not shown). By using a control device not shown, the air flow 26 can be controlled, and thus turned on, stopped and closed, by means of a valve 29, a baffle or the like. At least for each of the processing chambers, the venting gas or air may be separately controlled in groups, each of which is provided by a baffle or valve 29 located between the compressor and the nozzle 27. The amount and speed of the Moonen II gas & the electroless demetallization after golding in the absence of airflow results in complete demetallization and cleaning mode adjustment in the shortest possible time. In the case of a nearly horizontally disposed or slanted joint, the electrolyte/air boundary 25 during metallization is sufficiently directed to: "moving toward the center of the process chamber 3" so that the gas flow is stopped or closed "under: demetallization The electrolyte/empty milk boundary formed during metallization is completely localized within the electrolyte. During the event of air flow stop or shutdown: during the two metallization, the electrolyte/air boundary is moving. This natural boundary is then located during metallization. Unmetallized or contaminated 1 130646.doc -25- 200848554 In the area of joint 2, because the area remains dry due to air flow 26, 'complete demetallization of the joints is achieved during each demetallization process. In the case of a vertically configured joint, the gas flow is directed at the surface of the electrolyte during metallization such that at least the electrolyte level within the processing chamber 3 is reduced near the junction, thereby also causing the electrolyte/air boundary 25 to be displaced. 7b illustrates the situation at the beginning of the metallization of the joint metallization in the case of air flow closure. The naturally formed electrolyte/air boundary 25 Moving outwards. The contact metallization 30 is completely positioned in the electrolyte so that it can be completely electrolytically dissolved. The resulting crystals are also dissolved by the electrolyte flow. Even after many metallization and demetallization processes, A metal ring 3 1 is formed at at least one of the contacts. Figures 8a and 8b are related to Example 1 and show a similar plating device in the case of two treatments (metallization in Figure 8a, where demetallization is here) In the example, the contact base 16 is disposed above the highest level I of the electrolyte 24. Thus, the electrolyte cannot diffuse itself to the contact base 16 when the air is closed. Figure 9a is for Example 2 and shows the progress during electrolytic metallization. Corner joint 2. The electrolyte flows into the reservoir crucible 4 through the overflow edge 13 of the processing chamber 3. This causes a natural electrolyte/air boundary 25 to be formed in the region of the angled joint 2 as a self-contact. Metallization 30 completely demetallizes and cleans the contacts, which must be fully positioned within the electrolyte during demetallization. As exemplified in, for example, Figure 91), preferably by means of at least one fluid electrolyte A line-directed gas stream 26 is produced. In the absence of an item in the processing chamber, the gas stream is emitted from at least one of the nozzles 27 and causes the electrolyte or electrolyte to flow at least near the junction 2 to cause a new formation. The electrolyte/air boundary 25 is displaced relative to the original natural electrolyte/air boundary against gravity (i.e., outward) movement. The electrolyte cannot reach this contact region during metallization and is therefore not metallized. Demetallization of the contacts, directing at least one gas flow to the surface of the electrolyte such that the electrolyte level in the processing chamber 3 rises at least near the junctions, thereby raising the electrolyte/air boundary 25. The contacts are arranged in an almost horizontal arrangement In the case, as shown in Figure 9b, the air flow is also directed almost horizontally in the direction of the contact base 26. Due to the different electrolyte/air boundaries 25 during metallization and demetallization, complete demetallization and cleaning of the contacts 2 is achieved during each demetallization process. Demetallization typically occurs in contrast to the counter electrode used as an auxiliary electrode. In 07 8 and 9, the counter electrode (not shown) may also be a soluble or insoluble anode located in the processing chamber 3. For this process, the junction 2 is relatively cathode-converted. Therefore, the metal on the anode can be effectively recycled. Medium, which is redissolved from the other side and used for the metallization of the article. '5 %% pole and metallization to be removed' from junction 2 dissolved and deposited. In the next electric ore process
觸。在此情況下， 月’則可使用乾燥上面3 8來實現電接 省略另外必需之接觸構件去金屬化。 I30646.doc -27- 200848554 受照明太陽能電池在電學上充當直流電源35，其以等效 電路圖繪出。此直流電源35產生太陽能電池電壓Us，其為 取決於照度約0.6 V之量的EMF(電動勢）。載流的此直流電 源3 5連接至電鍍電路，該電路由浴電流源22、上面電接點 36、直流電源35、待處理之底面7、電解池37中之電解質 24及可溶性或不溶性陽極2 1組成。圖丨〇中指明此電錢電路 中所涉及之電壓極性。此等分別為浴電流源22之端電壓 UB、作為電動勢EMF之太陽能電池電壓…及作為負荷或消 費者電壓之電解池之電池電壓Uz。由於兩個驅動電壓之串 耳外連接，冷電流源22之端電壓UB小於電池電壓uz，因為其 降低至接近EMF之量。 物品1之底面7受光源34照明。合適之光源提供接近陽光 之光瑨。必需要，可藉由反射體33增強光線及/或將光線 引導至物品1上。由於照明，太陽能電池在較低内電阻之 情況下產生約0·6 V之EMF。具有1至2 dm2之表面的矽太陽 能電池之此電阻器能夠安全地傳導1安培數量級及更多的 電鍵電流。光源34亦可位於至少部分透明之處理室之外。 電解質可藉助於（例如）分配環32對稱地饋入處理室3 中。此避免減弱自光源發射之光。 除所有常用濕式化學處理之外，本發明尤其適用於所有 典型電解設備及適用於諸如晶圓、太陽能電池、電路板及 混合電路之所有平面物品。此外，可使用適於電解沈積及 溶解之所有金屬，例如銅、鎳、錫及銀。本發明之裝置亦 適於利用浴電流源之反向極化來電解蝕刻。為此，將對立 130646.doc -28- 200848554 ( 電極配置於處理室3内且1 1且其接收經餘刻之金屬。此電極在 延長操作時間後更換。 【圖式簡單說明】 圖1以截面圖及頂視圖展示用於物品專一性單側濕式化 學處理之基本配置。 圖2展不用於物品單側電化學及，或電解處理之基本配置 之接觸區域細節。 圖3展示物品支撐物 節0 之不同實施例及支撐物區域中之細 圖仏以側視圖展示處理室溢流邊緣之實施例。 圖4b以截面圖展示處理室溢流邊緣之實施例。 、—圖5展不生產设施内用於物品電化學及/或電解金屬化 複數個處理室之配置。 圖^展不接點之電解去金屬化期間圖5之配置，在此情況 下该等接點亦在物品處理期$充當支樓物。 圖7a詳細展示根據實例1之處理物品之金屬化期 長接點。 之 間之伸 Θ 7b展示伸長接點去金屬化期間之情形 圖8 a詳細展示根據實 接點。 例1之處理物品金屬化期間之成角 圖讣展示成角接點去金屬化期間之情形 圖9a詳細展示根據實例2之處理 接點 物品金屬化期間之成角 圖9b展示成角接點去金屬化期間之情形 130646.doc -29- 200848554 圖1 〇展示用於具有經照明底面之矽太陽能電池之電解金 屬化之配置。 【主要元件符號說明】 1 物品，晶圓，太陽能電池 2 支撐物，接點 3 處理室 4 流動方向箭頭 5 泵 6 入口管 7 物品底面 8 突出物 9 垂直中心線 10 物品邊沿 11 旋轉對稱構件，對稱化構件 12 間隙 13 溢流邊緣 14 儲集器 15 間隙高度 16 支撐物底座，接點底座 17 槽壁 18 切口 19 邊緣寬度 20 分配管 21 陽極 130646.doc -30- 200848554 22 浴電流源 23 物品邊緣 24 電解質，處理流體 25 電解質/空氣邊界 26 氣流，空氣流 27 開口，喷嘴 28 氣體分配器，氣體分配管 29 閥 30 接點金屬化 31 金屬環 32 電解質分配器，分配環 33 反射體 34 光源 35 DC功率源 36 上面電接點 37 電解池 38 物品上面 UB 端電壓 Us 太陽能電池電壓 Uz 電池電壓 130646.doc -31 -touch. In this case, the month's can be dried using the upper surface 38 to omit the otherwise necessary contact member demetallization. I30646.doc -27- 200848554 The illuminated solar cell electrically acts as a DC power source 35, which is depicted in an equivalent circuit diagram. This DC power source 35 generates a solar cell voltage Us which is an EMF (electromotive force) depending on the amount of illumination of about 0.6 V. The current-carrying DC power source 35 is connected to a plating circuit consisting of a bath current source 22, an upper electrical contact 36, a DC power source 35, a bottom surface 7 to be treated, an electrolyte 24 in the electrolytic cell 37, and a soluble or insoluble anode 2 1 composition. The polarity of the voltage involved in this circuit is indicated in Figure 。. These are the terminal voltage UB of the bath current source 22, the solar cell voltage as the electromotive force EMF, and the battery voltage Uz of the electrolytic cell as the load or consumer voltage. Since the two driving voltages are connected in series, the terminal voltage UB of the cold current source 22 is smaller than the battery voltage uz because it is reduced to an amount close to the EMF. The bottom surface 7 of the article 1 is illuminated by a light source 34. A suitable light source provides access to the sun. It is necessary to enhance the light by the reflector 33 and/or to direct the light onto the article 1. Due to the illumination, the solar cell produces an EMF of about 0.6 V with a lower internal resistance. This resistor of a tantalum solar cell with a surface of 1 to 2 dm2 is capable of safely conducting currents on the order of 1 amp and more. Light source 34 can also be located outside of the at least partially transparent processing chamber. The electrolyte can be fed symmetrically into the processing chamber 3 by means of, for example, a distribution ring 32. This avoids attenuating the light emitted from the light source. In addition to all common wet chemical treatments, the present invention is particularly applicable to all typical electrolytic equipment and to all planar articles such as wafers, solar cells, circuit boards, and hybrid circuits. Further, all metals suitable for electrolytic deposition and dissolution, such as copper, nickel, tin and silver, can be used. The apparatus of the present invention is also suitable for electrolytic etching using reverse polarization of a bath current source. To this end, it will be opposite 130646.doc -28- 200848554 (the electrode is placed in the processing chamber 3 and 11 and it receives the metal after the replacement. This electrode is replaced after the extended operation time. [Simplified illustration] Figure 1 The cross-sectional view and top view show the basic configuration for one-side wet chemical treatment of the item specificity. Figure 2 shows the contact area details that are not used for the one-sided electrochemical and/or electrolytically treated basic configuration. Figure 3 shows the article support A different embodiment of the section 0 and a detailed view of the support area, showing an embodiment of the treatment chamber overflow edge in a side view. Figure 4b shows an embodiment of the treatment chamber overflow edge in a cross-sectional view. The configuration of the plurality of processing chambers for the electrochemical and/or electrolytic metallization of the articles in the facility. Figure 2 shows the configuration of Figure 5 during the electrolytic demetallization of the contacts, in which case the contacts are also in the article processing period. Figure 7a shows in detail the metallization period of the treated article according to Example 1. The stretch between the 7b shows the extended joint demetallization. Figure 8a shows in detail the actual joint. Example 1 The angled view during the metallization of the article is shown during the metallization of the corner joint. Figure 9a shows in detail the angle of the metallization during the metallization of the contact article according to Example 2. Figure 9b shows the metallization during the corner joint. Case 130646.doc -29- 200848554 Figure 1 shows the configuration for electrolytic metallization of a solar cell with an illuminated bottom surface. [Key Symbol Description] 1 Article, Wafer, Solar Cell 2 Support, Contact 3 Processing chamber 4 Flow direction arrow 5 Pump 6 Inlet tube 7 Object bottom surface 8 Projection 9 Vertical center line 10 Item edge 11 Rotating symmetrical member, symmetry member 12 Gap 13 Overflow edge 14 Reservoir 15 Gap height 16 Support base , Contact base 17 Slot wall 18 Cut 19 Edge width 20 Dispensing tube 21 Anode 130646.doc -30- 200848554 22 Bath current source 23 Article edge 24 Electrolyte, treatment fluid 25 Electrolyte / air boundary 26 Air flow, air flow 27 Opening, Nozzle 28 gas distributor, gas distribution pipe 29 valve 30 contact metallization 31 metal ring 32 electrolyte Device, above the light source 35 DC power source 34 of the distribution ring 33 of the reflector 36 electrically contacts the article 37 above the cell 38 of the solar cell voltage Us UB terminal voltage of the battery voltage Uz 130646.doc -31 -