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WO2008131587A1 - Tuyau de chauffage et son procédé de fabrication - Google Patents

Tuyau de chauffage et son procédé de fabrication Download PDF

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Publication number
WO2008131587A1
WO2008131587A1 PCT/CN2007/001425 CN2007001425W WO2008131587A1 WO 2008131587 A1 WO2008131587 A1 WO 2008131587A1 CN 2007001425 W CN2007001425 W CN 2007001425W WO 2008131587 A1 WO2008131587 A1 WO 2008131587A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
heat pipe
metal
layer
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2007/001425
Other languages
English (en)
Chinese (zh)
Inventor
Jenshyan Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/CN2007/001425 priority Critical patent/WO2008131587A1/fr
Priority to US12/596,490 priority patent/US20100108297A1/en
Publication of WO2008131587A1 publication Critical patent/WO2008131587A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the present invention relates to a heat pipe and a method of manufacturing the same, and more particularly to a heat pipe for dissipating heat from a light emitting diode and a method of manufacturing the same.
  • a vapor chamber is used directly, the problem of narrowing the installation area can be solved, but additional means are needed to discharge heat from the electronic component, such as a heat sink. Moreover, the space required for the heat sink and the heat sink is still too large for an electronic device having a small idle space.
  • the heat pipe provided by the present invention comprises a tube body, a cavity and a porous capillary flow guiding layer.
  • the tube body has a first opening, and the tube body has a diameter of less than 10 mm.
  • the cavity has a second opening, and the second opening is engaged with the first opening, thereby forming a sealed space between the tube and the cavity.
  • the porous capillary flow guiding layer is formed inside the tubular body and the cavity. Wherein the sealed space accommodates a working fluid, and a cross-sectional area of the cavity is larger than a cross-sectional area of the tubular body.
  • the tubular body is integrally formed with the cavity.
  • the cavity is formed by a recess and an upper cover.
  • the upper cover engages the recess and has the second opening.
  • the groove may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process.
  • the cavity has a flat end for placement by a general electronic component.
  • the porous capillary flow guiding layer may be sintered by a copper metal powder, a nickel metal powder, a silver metal powder, a metal powder coated with copper, nickel or silver or other similar metal powder. to make.
  • the porous capillary flow guiding layer comprises a layer of metal particles and a metal mesh.
  • the metal particle layer is sintered and formed on an inner wall of the tube body and an inner wall of the cavity, and the metal mesh body is disposed on the metal particle layer.
  • the porous capillary flow guiding layer comprises a corrugated folded metal cloth and a flat metal mesh layer, and the corrugated folded metal cloth is laid on the inner wall of the tubular body and the cavity.
  • the inner wall, and the flat metal mesh layer are disposed on the corrugated metal cloth.
  • the corrugated shape of the corrugated metal cloth may be triangular, rectangular, trapezoidal or wavy.
  • the porous capillary flow guiding layer comprises a plurality of fine scores formed on an inner wall of the tubular body and an inner wall of the cavity.
  • the porous capillary flow guiding layer comprises a plurality of fine nicks and a gold It is a sintered layer, the fine notch is formed on the inner wall of the cavity, and the metal sintered layer is formed on the inner wall of the pipe body and is welded to the fine notch.
  • the heat pipe manufacturing method comprises the following steps: (a) providing a pipe body having a first opening and a third opening; (b) providing a cavity having a second opening; (c) a first opening of the tubular body sealingly engages a second opening of the cavity to form a half finished heat pipe; (d) pumping the semi-finished heat pipe; and (e) sealing the third opening .
  • the inner wall of the semi-finished heat pipe comprises a porous capillary flow guiding layer, the semi-finished heat pipe accommodating a working fluid, and a cross-sectional area of the cavity is larger than a cross-sectional area of the pipe body.
  • the working fluid is injected into the semi-finished heat pipe before or after step (d).
  • the sealing joint in the step (c) is a welding process, a welding process, a mechanical fastening process or a gluing process.
  • the step (b) of the heat pipe manufacturing method provided by the present invention may include: providing a groove; providing an upper cover, the upper cover having the second opening; and engaging the upper cover with the groove to The cavity is formed.
  • the groove may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process. And forming a first sintered metal layer on the groove, a second sintered metal layer is formed on the upper cover, and the first sintered metal layer is in contact with the second sintered metal layer.
  • the porous capillary flow guiding layer is formed by joining with the tubular body.
  • a sintered metal powder layer is formed on the inner wall of the cavity.
  • the porous capillary flow guiding layer is formed by inserting a center rod from the third opening into the semi-finished heat pipe and substantially abutting the sintered metal powder layer; the center rod and the semi-finished product Filling a first metal powder between the heat pipes; performing a sintering process to fuse the first metal powder with the sintered metal powder layer to form the porous capillary flow guiding layer; and The rod is removed from the semi-finished heat pipe.
  • the cavity has a plurality of fine scores on the inner wall.
  • the porous capillary flow guiding layer is formed by inserting a center rod from the third opening into the semi-finished product heat Inside the conduit and substantially abutting the plurality of fine scores; filling a second metal powder between the center rod and the semi-finished heat pipe; performing a sintering process to make the second metal powder and the A plurality of fine scores are welded to form the porous capillary flow guiding layer; and the center rod is removed from the semi-finished heat pipe.
  • the first metal powder or the second metal powder may be a copper metal powder, a nickel metal powder, a silver metal powder, a metal plated with copper, nickel or silver. Powder or other similar metal powder.
  • the porous capillary flow guiding layer utilizes a machining process to create a plurality of fine scores on the inner wall of the tubular body and the inner wall of the cavity to form the porous capillary guide. Stream layer.
  • the porous capillary flow guiding layer is formed by: sintering a plurality of metal particles on an inner wall of the tubular body and an inner wall of the cavity; and providing a metal mesh body in the On the metal particles to form the porous capillary flow guiding layer.
  • the porous capillary flow guiding layer is formed by: laying a corrugated folded metal cloth on the inner wall of the tubular body and the inner wall of the cavity; and providing a flat metal mesh layer The corrugated folded metal cloth is formed to form the porous capillary flow guiding layer.
  • Another heat pipe manufacturing method comprises the following steps: (A) providing a first pipe body having an opening and a closed end; (B) necking the first pipe body to form a communication a cavity and a second tube, wherein the cavity includes the closed end, the second tube includes the opening; (C) pumping the cavity and the second tube And (D) sealing the opening; wherein the cavity and the inner wall of the second tube body comprise a porous capillary flow guiding layer, the cavity and the second tube body accommodating a working fluid, The cross-sectional area of the cavity is larger than the cross-sectional area of the second pipe body.
  • step (B) is carried out at a temperature in the range of from 400 to 600 °C.
  • the porous capillary flow guiding layer is formed on the inner wall of the first tubular body.
  • the porous capillary flow guiding layer is formed by: placing a first metal powder in the first tube; inserting a center rod from the opening into the first tube body and substantially abutting the first tube a metal powder; filling a second between the center rod and the inner wall of the first tube a metal powder; performing a sintering process to fuse the first metal powder with the second metal powder to form the porous capillary flow guiding layer; and removing the center rod from the first tube.
  • the technical effect of the present invention is to provide a heat pipe having different sectional areas and a manufacturing method thereof, and an electronic component or a clustered electronic component having a large heat generating area can be disposed on a flat end of the heat pipe, and An efficient and rapid cooling mode of the electronic component is provided.
  • Figure 1 is an exploded cross-sectional view of the first preferred embodiment before the heat pipe is completed
  • 2A is a cross-sectional view of the half-finished heat pipe of the first preferred embodiment
  • Figure 2B is a cross-sectional view of the first preferred embodiment of the center rod inserted into the semi-finished heat pipe
  • Figure 2C is the first preferred embodiment between the center bar and the semi-finished heat pipe Filling in a cross-sectional view of a first metal powder
  • Figure 2D is a cross-sectional view of the semi-finished heat pipe of the first preferred embodiment
  • Figure 2E is a cross-sectional view of the heat pipe of the first preferred embodiment
  • FIG. 3A is a partial cross-sectional view of a first opening and a second opening of a heat pipe according to an embodiment
  • FIG. 3B is a first opening of the heat pipe of the embodiment bonded to a second opening
  • FIG. 3C is a partial cross-sectional view showing a first opening and a second opening of the heat pipe of another embodiment
  • FIG. 3D is a first opening of the heat pipe of the embodiment bonded to a second opening
  • Figure 3E is a cross-sectional view of the heat pipe cavity of the above specific embodiment
  • 4A is a cross-sectional view of a half-finished heat pipe of a second preferred embodiment
  • Figure 4B is a cross-sectional view showing the center rod of the second preferred embodiment inserted into the semi-finished heat pipe;
  • Figure 4C is the second preferred embodiment between the center bar and the semi-finished heat pipe Filling in a cross-sectional view of a second metal powder;
  • Figure 4D is a cross-sectional view of the heat pipe of the second preferred embodiment
  • 4E is a cross-sectional view of a specific embodiment before the heat pipe is completed
  • Figure 4F is a cross-sectional view of the heat pipe of the specific embodiment before it is completed;
  • Figure 4G is a cross-sectional view of the heat pipe of the specific embodiment
  • Figure 4H is a cross-sectional view of the cavity of the heat pipe of the above specific embodiment
  • Figure 5 is a cross-sectional view of a heat pipe of a third preferred embodiment
  • Figure 6 is a cross-sectional view of a heat pipe of a fourth preferred embodiment
  • Figure 7 is a cross-sectional view showing a heat pipe of a fifth preferred embodiment
  • Figure 8A is a cross-sectional view showing a first tube body of a heat pipe of a sixth preferred embodiment
  • Figure 8B is a cross-sectional view of the first tube body after necking according to the sixth preferred embodiment
  • Figure 8C is a cross-sectional view of the heat pipe of the sixth preferred embodiment.
  • Figure 8D is a cross-sectional view showing the first tube body of the sixth preferred embodiment in which a first metal powder is placed;
  • Figure 8E is a cross-sectional view of the sixth preferred embodiment in which a center rod is placed on the first tube;
  • Figure 8F is the sixth preferred embodiment of the center rod and the first tube a schematic cross-sectional view of interposing a second metal powder between the bodies;
  • Figure 8G is a cross-sectional view of the first tube body of the sixth preferred embodiment. Summary of the invention
  • FIG. 1 is an exploded cross-sectional view of the heat pipe 1 according to a first preferred embodiment of the present invention before it is completed.
  • the heat pipe 1 comprises a tube body 12 and a cavity 14.
  • the tube body 12 has a first opening 122 and a third opening 124.
  • the cavity 14 has a second opening 142 and a flat end 144.
  • a cross-sectional area of the cavity 14 is greater than a cross-sectional area of the tubular body 12.
  • the cross-sectional area of the cavity 14 refers to the cross-sectional area of the cavity 14 near the flat end 144.
  • the tubular body 12 has a diameter of less than 10 mm. As shown in FIG.
  • the second opening 142 of the cavity 14 is sealingly engaged with the first opening 122 of the tubular body 12 to form a half finished heat pipe 16.
  • the sealing joint may be a welding process, a welding process, a mechanical fastening process or a gluing process.
  • a sintered metal powder layer 182 is formed on the inner wall of the cavity 14, as shown in Fig. 2A.
  • a center rod C1 is inserted from the third opening 124 into the semi-finished heat pipe 16 and substantially abuts the sintered metal powder layer 182, as shown in Fig. 2B.
  • a first metal powder 184 is then filled between the center rod C1 and the semi-finished heat pipe 16, as shown in Figure 2C.
  • the first metal powder 184 may be a copper metal powder, a nickel metal powder, a silver metal powder, a metal powder plated with copper, nickel or silver or the like.
  • a sintering process is then performed to splicing the first metal powder 184 with the sintered metal powder layer 182 to form a porous capillary flow guiding layer 18.
  • the center rod C1 is taken out of the semi-finished heat pipe 16.
  • the semi-finished heat pipe 16 is evacuated and a working fluid L1 is injected before the third opening 124 is sealed.
  • the order in which the working fluid L1 is injected and the pumping is exchanged.
  • the third opening 124 may be shrunk before pumping.
  • the heat pipe 1 is completed after the third opening 124 is sealed.
  • the sealing engagement should avoid excessive damage to the existing porous capillary flow guiding layer.
  • the second opening 142 of the cavity 14 is free of the sintered metal powder layer 182 (please refer to the figure so that the sealing joint can be used without regard to the sintering during the bonding process).
  • the metal powder layer 182 causes damage, for example, using a general welding process or a welding process.
  • the inner wall of the cavity 14 and the inner wall of the pipe body 12 should be as The smooth connection is maintained so that the subsequent first metal powder 184 can be sintered smoothly and fused with the sintered metal powder layer 182 to form the porous capillary flow guiding layer 18.
  • FIG. 3A is a partial cross-sectional view of the first opening 122 and the second opening 142 according to an embodiment.
  • the first opening 122 includes a joint plane 1222 and a weld portion 1224.
  • the second opening 142 includes a joint plane 1422 and a weld portion 1424.
  • the joint planes 1222, 1422 are in close contact with each other.
  • the welded portions 1224, 1424 are all inclined surfaces. When the joining planes are fitted, the welded portions 1224, 1424 form a groove for the filler to be welded. As shown in FIG. 3B, after the sealing joint is completed, only the soldering portions 1224, 1424 are affected, which is filled with a solder P, and the bonding planes 1222, 1224 are unaffected, thereby maintaining the cavity.
  • the inner wall of the body 14 is smoothly connected to the inner wall of the tubular body 12 and does not damage the sintered metal powder layer 182 at the second opening 142 of the cavity 14.
  • FIG. 3C is a partial cross-sectional view of the first opening 122 and the second opening 142 of another embodiment.
  • the first opening 122 includes a joint plane 1222 and a weld portion 1224.
  • the second opening 142 includes a joint plane 1422 and a weld portion 1424.
  • the welded portions 1224, 1424 are each composed of a raised portion 1224a, 1424a and a recess 1224b, 1424b. After the bonding planes are bonded, the bonding planes 1222, 1422 are in close contact with each other, and the protruding portions 1224a, 1424a are fused to each other by heating or other melting means, and fill the grooves 1224b, 1424b.
  • the cavity 14 may include a recess 146 and an upper cover 148.
  • the groove 146 includes the flat end 144, and the upper cover 148 includes the second opening 142.
  • Forming a first sintered metal layer on the groove 146 A second sintered metal layer 1824 is formed on the upper cover 148 of 1822 0 .
  • the cavity 146 is engaged with the upper cover 148 to form the cavity 14, and the first sintered metal layer 1822 and the second sintered metal layer 1824 form the sintered metal powder layer 182.
  • the recess 146 itself may be made by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process.
  • FIG 4A is a cross-sectional view of the heat pipe 2 of a second preferred embodiment before it is completed.
  • the heat pipe 2 is constructed in substantially the same manner as the heat pipe 1 of the first preferred embodiment and will not be described again. Only the manner in which the porous capillary guide layer 28 of the heat pipe 2 is formed will be described in detail.
  • the inner wall of the cavity 24 of the heat pipe 2 has a plurality of fine scores 282 thereon.
  • a center rod C2 is inserted from the third opening 224 of the tubular body 22 of the heat pipe 2 into the half of the finished heat pipe 26 and substantially abuts the plurality of fine scores 282.
  • a second metal powder is further filled between the center rod C2 and the semi-finished heat pipe 26.
  • a sintering process is then performed to fuse the second metal powder 284 with the plurality of fine scores 282 to form the porous capillary flow director layer 28.
  • the center rod C2 is removed from the semi-finished heat pipe 26 as shown in Fig. 4D. And after sealing the third opening 224, the heat pipe 2 is formed.
  • FIG. 4A is a cross-sectional view of the heat pipe 2' of an embodiment before being completed.
  • the plurality of fine scores 282' of the cavity 24' of the heat pipe 2' exhibit an inner diameter which is the same as the inner diameter of the tubular body 22' of the heat pipe 2'. Therefore, a center rod having only a single outer diameter cannot simultaneously satisfy the plurality of fine scores 282' and leave a space between the center rod and the heat pipe .2'-semi-finished heat pipe 26'. The requirement to accommodate the later added metal powder.
  • a center rod C2' needs to have a different outer diameter such that a portion of the center rod C2' can abut the plurality of fine scores 282' and between the center rod C2' and the heat pipe 2' Space is left to accommodate the second metal powder 284' added later, and in the subsequent sintering
  • the second metal powder 284' may be fused with the plurality of fine scores 282' to form a porous capillary guide layer 28', as shown in FIG. 4F.
  • the heat pipe 2' is formed as shown in Fig. 4G.
  • the cavity 24, 24' may include a recess 246 and an upper cover 248.
  • the upper cover 248 includes a second opening 242 of the cavity 24.
  • a first plurality of fine scores 2822 are formed on the groove 246.
  • a second plurality of fine scores 2824 are formed on the upper cover 248. Forming the groove 246 with the upper cover 248 to form the cavity 24, 24', and the first plurality of fine scores 2822 and the second plurality of small scores 2824 are formed A few small fine marks 282 are described.
  • the recess 246 housing itself may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process, or a machining process.
  • FIG. 5 is a cross-sectional view of a heat pipe 3 of a third preferred embodiment.
  • the heat pipe 3 is basically made in the same manner as the heat pipe 1 of the first preferred embodiment, and will not be described again. Only the manner in which the porous capillary guide layer 38 of the heat pipe 3 is formed will be described.
  • the porous capillary deflector 38 utilizes a machining process to create a plurality of fine scores 38 on the inner wall of a tubular body 32 of the heat pipe 3 and on the inner wall of a cavity 34 of the heat pipe 3. To form.
  • the plurality of fine scores 38 are scored directly on the inner wall of the semi-finished heat pipe, for example, using a cutter.
  • the cavity of the half of the finished heat pipe has a plurality of small scores originally, so that after the sealing joint, only a few small scores are formed on other parts of the inner wall of the semi-finished heat pipe.
  • a porous capillary flow guiding layer can be formed, but attention should be paid to the connection of the two sets of fine nicks.
  • Such a cavity is more common in a combined cavity, such as a combination of a recess and an upper cover.
  • FIG. 6 is a cross-sectional view of a heat pipe 4 according to a preferred embodiment.
  • the heat pipe 4 is manufactured in substantially the same manner as the heat pipe 1 of the first preferred embodiment, and details are not described herein. Only the manner in which the porous capillary guide layer 48 of the heat pipe 4 is formed will be described.
  • a plurality of metal particles 482 are first sintered on the inner wall of the tube body 42 of the heat pipe 4 and on the inner wall of the cavity 44 of the heat pipe 4.
  • the metal particles 482 are further disposed on a metal mesh 484 to form the porous Capillary baffle 48.
  • the plurality of gold particles 482 may be sintered to the inner wall of the tube body 42 and the inner wall of the cavity 44, respectively.
  • FIG. 7 is a cross-sectional view of a heat pipe 5 of a fifth preferred embodiment.
  • the heat pipe 5 is generally manufactured in the same manner as the heat pipe 1 of the first preferred embodiment, and will not be described herein. Only the manner in which the porous capillary guide layer 58 of the heat pipe 5 is formed will be described.
  • a corrugated metal cloth 582 is first laid on the inner wall of the tube 52 of the heat pipe 5 and on the inner wall of the cavity 54 of the heat pipe 5.
  • the corrugated folded metal cloth 582 is placed on a flat metal mesh layer 584 to form the porous capillary flow guiding layer 58.
  • the corrugated shape of the corrugated folded metal cloth 582 may be triangular, rectangular, trapezoidal or wavy.
  • Fig. 8A is a cross-sectional view showing the first tube body 62 of the heat pipe 6 of a sixth preferred embodiment.
  • the first tubular body 62 has an opening 622 and a closed end 624.
  • the closed end 624 is flat.
  • the first tubular body 62 has a larger inner diameter for subsequent necking.
  • the wall thickness of the end 624 is mostly thicker than the wall thickness before the necking, so that the wall thickness after necking is uniform overall. But should not be limited to this.
  • the first tubular body 62 is then necked to form a cavity 626 and a second tubular body 628 that are in communication, as shown in Figure 8B.
  • the cavity 626 includes the closed end 624
  • the second body 628 includes the opening 622.
  • a cross-sectional area of the cavity 626 is greater than a cross-sectional area of the second tubular body 628.
  • the cross-sectional area of the cavity 626 refers to the cross-sectional area of the closed end.
  • the inner walls of the cavity 626 and the second tubular body 628 include a porous capillary flow guiding layer 64.
  • the cavity 626 and the second tube 628 are again evacuated, and a working fluid L2 is injected into the cavity 626 and the second tube 628. Finally, the opening 622 is sealed. The order in which the working fluid L2 is injected and the pumping is exchanged. After sealing the opening 622, the heat pipe 6 is completed as shown in Fig. 8C.
  • the necking is performed at a temperature of 400 to 600 ° C or at a temperature higher than a recrystallization temperature of the first tube 62 by about 200 ° C.
  • the porous capillary flow guiding layer 64 forms the porous capillary flow guiding layer 64 on the inner wall of the first tubular body 62 before the necking, the steps of which are as follows: in the first tubular body 62 A first metal powder 642 is built in, as shown in FIG. 8D; a center rod C3 is inserted into the first tube body 62 from the opening 622 and substantially abuts the first metal powder 642, as shown in FIG. 8E.
  • the tubular body and the cavity are connected in a symmetrical manner.
  • the tubular body and the cavity may also be connected in an asymmetric manner.
  • the tubular body is attached to the cavity near the edge to accommodate different space constraints.
  • the present invention provides a heat pipe having different cross-sectional areas and a method of manufacturing the same, and an electronic component or a cluster of electronic components having a large heat generating area may be disposed on a flat end of the heat pipe, and An efficient and rapid cooling mode of the electronic component is provided.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Powder Metallurgy (AREA)

Abstract

Tuyau de chauffage et son procédé de fabrication. Le tuyau de chauffage (1) comprend un corps de tuyau (12), une cavité (14) et une couche de diversion capillaire poreuse (18). Le corps de tuyau (12) présente une première (122) et une troisième (124) ouvertures, et la cavité (14) une deuxième ouverture (142). La première et la deuxième ouverture (122, 124) sont collées l'une à l'autre, la troisième ouverture est obturée pour former le tuyau de chauffage (1). Le tuyau de chauffage contient un fluide de travail. En coupe, la cavité (14) est plus importante que corps de tuyau (12). La cavité (14) présente une extrémité plate (144)
PCT/CN2007/001425 2007-04-28 2007-04-28 Tuyau de chauffage et son procédé de fabrication Ceased WO2008131587A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2007/001425 WO2008131587A1 (fr) 2007-04-28 2007-04-28 Tuyau de chauffage et son procédé de fabrication
US12/596,490 US20100108297A1 (en) 2007-04-28 2007-04-28 Heat Pipe and Making Method Thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2007/001425 WO2008131587A1 (fr) 2007-04-28 2007-04-28 Tuyau de chauffage et son procédé de fabrication

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WO2008131587A1 true WO2008131587A1 (fr) 2008-11-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114963824A (zh) * 2021-02-25 2022-08-30 全亿大科技（佛山）有限公司 散热结构、散热结构的制作方法以及装置

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9618275B1 (en) * 2012-05-03 2017-04-11 Advanced Cooling Technologies, Inc. Hybrid heat pipe
US9057488B2 (en) * 2013-02-15 2015-06-16 Wavien, Inc. Liquid-cooled LED lamp
CN106793671B (zh) * 2015-11-24 2023-03-24 奇鋐科技股份有限公司 散热单元
US10048017B2 (en) * 2015-12-01 2018-08-14 Asia Vital Components Co., Ltd. Heat dissipation unit
CN107278089B (zh) * 2016-04-07 2019-07-19 讯凯国际股份有限公司 热导结构
US10663231B2 (en) * 2016-06-08 2020-05-26 Delta Electronics, Inc. Manufacturing method of heat conducting device
TWM533401U (en) * 2016-06-21 2016-12-01 Tai Sol Electronics Co Ltd Heat dissipation apparatus
US10012445B2 (en) * 2016-09-08 2018-07-03 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure
US11320211B2 (en) * 2017-04-11 2022-05-03 Cooler Master Co., Ltd. Heat transfer device
US10433461B2 (en) * 2017-10-30 2019-10-01 Google Llc High-performance electronics cooling system
US10462932B2 (en) * 2017-11-01 2019-10-29 Hewlett Packard Enterprise Development Lp Memory module cooler with vapor chamber device connected to heat pipes
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US11674758B2 (en) * 2020-01-19 2023-06-13 Raytheon Technologies Corporation Aircraft heat exchangers and plates
CN113573540B (zh) * 2020-04-29 2024-10-29 华为机器有限公司 散热装置及其制造方法和电子设备
JP6980081B1 (ja) * 2020-11-13 2021-12-15 古河電気工業株式会社 ヒートパイプ
CN114760803A (zh) * 2021-01-08 2022-07-15 华为技术有限公司 散热器及通信设备
US20240147667A1 (en) * 2022-10-31 2024-05-02 Guangzhou Neogene Thermal Management Technology Co., Ltd. Liquid-cooling heat-dissipating module with embedded three-dimensional vapor chamber device
TWI868631B (zh) * 2022-11-08 2025-01-01 大陸商廣州力及熱管理科技有限公司 一種具散熱封裝之積體電路元件
TWI828451B (zh) * 2022-11-30 2024-01-01 奇鋐科技股份有限公司 3d均溫板
US20250146762A1 (en) * 2023-11-08 2025-05-08 Asia Vital Components (China) Co., Ltd. Combination heat dissipation structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0262067A (ja) * 1988-08-29 1990-03-01 Matsushita Electric Ind Co Ltd 半導体パッケージ
JPH02130948A (ja) * 1988-11-11 1990-05-18 Mitsubishi Electric Corp 半導体冷却装置
US5632158A (en) * 1995-03-20 1997-05-27 Calsonic Corporation Electronic component cooling unit
CN1840258A (zh) * 2005-03-28 2006-10-04 新灯源科技有限公司 具有平整端面的热导管及其制造方法
CN1844834A (zh) * 2006-03-24 2006-10-11 郑文瑞 除去导热管内部非凝结性气体的方法
CN101029806A (zh) * 2006-03-03 2007-09-05 超众科技股份有限公司 具有扩大部的热管的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3554183A (en) * 1968-10-04 1971-01-12 Acf Ind Inc Heat pipe heating system for a railway tank car or the like
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
US6910794B2 (en) * 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
US7129731B2 (en) * 2003-09-02 2006-10-31 Thermal Corp. Heat pipe with chilled liquid condenser system for burn-in testing
CN2665800Y (zh) * 2003-11-20 2004-12-22 业强科技股份有限公司 散热导管
CN1312766C (zh) * 2004-11-15 2007-04-25 新灯源科技有限公司 承载有源元件的热导管端面整平制造方法及其结构
JP4714638B2 (ja) * 2006-05-25 2011-06-29 富士通株式会社 ヒートシンク

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0262067A (ja) * 1988-08-29 1990-03-01 Matsushita Electric Ind Co Ltd 半導体パッケージ
JPH02130948A (ja) * 1988-11-11 1990-05-18 Mitsubishi Electric Corp 半導体冷却装置
US5632158A (en) * 1995-03-20 1997-05-27 Calsonic Corporation Electronic component cooling unit
CN1840258A (zh) * 2005-03-28 2006-10-04 新灯源科技有限公司 具有平整端面的热导管及其制造方法
CN101029806A (zh) * 2006-03-03 2007-09-05 超众科技股份有限公司 具有扩大部的热管的制造方法
CN1844834A (zh) * 2006-03-24 2006-10-11 郑文瑞 除去导热管内部非凝结性气体的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114963824A (zh) * 2021-02-25 2022-08-30 全亿大科技（佛山）有限公司 散热结构、散热结构的制作方法以及装置

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