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WO2008128948A3 - Bauteil mit einem metallisierten keramikkörper - Google Patents

Bauteil mit einem metallisierten keramikkörper Download PDF

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Publication number
WO2008128948A3
WO2008128948A3 PCT/EP2008/054630 EP2008054630W WO2008128948A3 WO 2008128948 A3 WO2008128948 A3 WO 2008128948A3 EP 2008054630 W EP2008054630 W EP 2008054630W WO 2008128948 A3 WO2008128948 A3 WO 2008128948A3
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic base
component
metalized
metalized ceramic
crystallographically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/054630
Other languages
English (en)
French (fr)
Other versions
WO2008128948A2 (de
Inventor
Claus Peter Kluge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Priority to EP08736302A priority Critical patent/EP2155628A2/de
Priority to CN200880021667A priority patent/CN101687717A/zh
Priority to JP2010504633A priority patent/JP5538212B2/ja
Priority to US12/596,875 priority patent/US20100147571A1/en
Publication of WO2008128948A2 publication Critical patent/WO2008128948A2/de
Publication of WO2008128948A3 publication Critical patent/WO2008128948A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/005—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C04B41/90—Coating or impregnation for obtaining at least two superposed coatings having different compositions at least one coating being a metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H10W40/10—
    • H10W40/255—
    • H10W40/259—
    • H10W40/47—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C04B2237/064—Oxidic interlayers based on alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/121—Metallic interlayers based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/123—Metallic interlayers based on iron group metals, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H10W40/037—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

Bei Bauteilen mit einem Keramikkörper, der an mindestens einer Stelle seiner Oberfläche mit einer Metallisierung bedeckt ist, können Probleme mit der Haltbarkeit und der Haftfestigkeit der metallischen Beschichtungen auftreten. Erfindungsgemäß wird deshalb vorgeschlagen, dass der Werkstoff an der Oberfläche des Keramikkörpers an den Stellen der Metallisierung vollflächig oder teilflächig durch chemische oder physikalische Vorgänge chemisch und/oder kristallografisch und/oder physikalisch mit oder ohne Zugabe geeigneter Reaktionsstoffe verändert ist und mindestens eine mit dem Keramikkörper verbundene dichte oder poröse Schicht mit einer gleichen oder ungleichen Dicke von mindestens 0,001 Nanometern bildet, die aus mindestens einem homogenen oder heterogenen neuen Werkstoff besteht.
PCT/EP2008/054630 2007-04-24 2008-04-17 Bauteil mit einem metallisierten keramikkörper Ceased WO2008128948A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08736302A EP2155628A2 (de) 2007-04-24 2008-04-17 Bauteil mit einem metallisierten keramikkörper
CN200880021667A CN101687717A (zh) 2007-04-24 2008-04-17 具有一种金属化陶瓷体的构件
JP2010504633A JP5538212B2 (ja) 2007-04-24 2008-04-17 メタライズされたセラミックボディを有するコンポーネント
US12/596,875 US20100147571A1 (en) 2007-04-24 2008-04-17 Component having a metalized ceramic base

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007019632.8 2007-04-24
DE102007019632 2007-04-24

Publications (2)

Publication Number Publication Date
WO2008128948A2 WO2008128948A2 (de) 2008-10-30
WO2008128948A3 true WO2008128948A3 (de) 2009-05-14

Family

ID=39777665

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/054630 Ceased WO2008128948A2 (de) 2007-04-24 2008-04-17 Bauteil mit einem metallisierten keramikkörper

Country Status (7)

Country Link
US (1) US20100147571A1 (de)
EP (1) EP2155628A2 (de)
JP (1) JP5538212B2 (de)
KR (1) KR101476343B1 (de)
CN (1) CN101687717A (de)
DE (1) DE102008001226A1 (de)
WO (1) WO2008128948A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2514181Y2 (ja) 1990-12-26 1996-10-16 トリニティ工業株式会社 押圧機
DE102009025033A1 (de) 2009-06-10 2010-12-16 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
EP2900259B1 (de) 2012-09-28 2020-04-15 Kline, Ellis Glycosidase-dosierungsplan zur behandlung von infektionserkrankungen
JP6307832B2 (ja) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール
JP6111764B2 (ja) * 2013-03-18 2017-04-12 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5672324B2 (ja) 2013-03-18 2015-02-18 三菱マテリアル株式会社 接合体の製造方法及びパワーモジュール用基板の製造方法
JP5751357B1 (ja) * 2014-02-03 2015-07-22 トヨタ自動車株式会社 セラミック部材および金属部材の接合構造
DE102014107217A1 (de) * 2014-05-19 2015-11-19 Ceram Tec Gmbh Leistungshalbleitermodul
DE102017210723A1 (de) * 2016-06-24 2017-12-28 Ceramtec Gmbh Bauteile für Steckverbinder
FR3054721B1 (fr) * 2016-07-29 2018-12-07 Safran Module electronique de puissance d'un aeronef et procede de fabrication associe
DE102017122575B3 (de) * 2017-09-28 2019-02-28 Rogers Germany Gmbh Kühlvorrichtung zum Kühlen eines elektrischen Bauteils und Verfahren zur Herstellung einer Kühlvorrichtung
CN114974990A (zh) * 2021-02-25 2022-08-30 天津首瑞智能电气有限公司 一种电瓷质气密壳体及其制造方法、灭弧室、电的开关
DE102021106952A1 (de) 2021-03-22 2022-09-22 Infineon Technologies Austria Ag Dbc-substrat für leistungshalbleitervorrichtungen, verfahren zum herstellen eines dbc-substrats und leistungshalbleitervorrichtung mit dbc-substrat

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603822A1 (de) * 1996-02-02 1997-08-14 Curamik Electronics Gmbh Keramik-Substrat sowie Verfahren zu seiner Herstellung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072771A (en) * 1975-11-28 1978-02-07 Bala Electronics Corporation Copper thick film conductor
US4182412A (en) * 1978-01-09 1980-01-08 Uop Inc. Finned heat transfer tube with porous boiling surface and method for producing same
US4359086A (en) * 1981-05-18 1982-11-16 The Trane Company Heat exchange surface with porous coating and subsurface cavities
US4659611A (en) * 1984-02-27 1987-04-21 Kabushiki Kaisha Toshiba Circuit substrate having high thermal conductivity
JPS62113783A (ja) * 1985-11-13 1987-05-25 日本セメント株式会社 窒化けい素焼結体のメタライズ方法
US5352482A (en) * 1987-01-22 1994-10-04 Ngk Spark Plug Co., Ltd. Process for making a high heat-conductive, thick film multi-layered circuit board
US5418002A (en) * 1990-12-24 1995-05-23 Harris Corporation Direct bonding of copper to aluminum nitride substrates
US5395679A (en) * 1993-03-29 1995-03-07 Delco Electronics Corp. Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US6861290B1 (en) * 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
US5981085A (en) * 1996-03-21 1999-11-09 The Furukawa Electric Co., Inc. Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
JPH10284808A (ja) * 1997-04-08 1998-10-23 Denki Kagaku Kogyo Kk 回路基板
JP2000281460A (ja) * 1999-03-31 2000-10-10 Tokuyama Corp 金属粉末ろう材および窒化アルミニウム部材と金属部材との接合方法
EP1354353B1 (de) * 2001-01-22 2007-05-30 Parker Hannifin Corporation Rückstandsfrei ablösbares thermisches verbindungsstück mit phasenübergangsmaterial
JP3931855B2 (ja) * 2003-08-08 2007-06-20 株式会社日立製作所 電子回路装置
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
US7332807B2 (en) * 2005-12-30 2008-02-19 Intel Corporation Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
TWI449137B (zh) * 2006-03-23 2014-08-11 製陶技術創新製陶工程股份公司 構件或電路用的攜帶體

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603822A1 (de) * 1996-02-02 1997-08-14 Curamik Electronics Gmbh Keramik-Substrat sowie Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
JP2010524831A (ja) 2010-07-22
EP2155628A2 (de) 2010-02-24
CN101687717A (zh) 2010-03-31
KR101476343B1 (ko) 2014-12-24
WO2008128948A2 (de) 2008-10-30
KR20100017327A (ko) 2010-02-16
JP5538212B2 (ja) 2014-07-02
US20100147571A1 (en) 2010-06-17
DE102008001226A1 (de) 2008-10-30

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