WO2008126414A1 - 粘性液体材料の吐出方法および装置 - Google Patents
粘性液体材料の吐出方法および装置 Download PDFInfo
- Publication number
- WO2008126414A1 WO2008126414A1 PCT/JP2008/000936 JP2008000936W WO2008126414A1 WO 2008126414 A1 WO2008126414 A1 WO 2008126414A1 JP 2008000936 W JP2008000936 W JP 2008000936W WO 2008126414 A1 WO2008126414 A1 WO 2008126414A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid material
- screw
- insertion hole
- screw insertion
- material supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1026—Valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H10P72/0428—
Landscapes
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08738546.4A EP2138241B1 (en) | 2007-04-10 | 2008-04-10 | Method and device for discharging viscous liquid material |
| JP2009508919A JP5467865B2 (ja) | 2007-04-10 | 2008-04-10 | 粘性液体材料の吐出方法および装置 |
| HK10104098.1A HK1137162B (en) | 2007-04-10 | 2008-04-10 | Method and device for discharging viscous liquid material |
| US12/595,150 US8439227B2 (en) | 2007-04-10 | 2008-04-10 | Viscous liquid material discharging method and apparatus |
| CN200880011632.0A CN101663103B (zh) | 2007-04-10 | 2008-04-10 | 粘性液体材料的排出方法及装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-102729 | 2007-04-10 | ||
| JP2007102729 | 2007-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008126414A1 true WO2008126414A1 (ja) | 2008-10-23 |
Family
ID=39863573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/000936 Ceased WO2008126414A1 (ja) | 2007-04-10 | 2008-04-10 | 粘性液体材料の吐出方法および装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8439227B2 (ja) |
| EP (1) | EP2138241B1 (ja) |
| JP (1) | JP5467865B2 (ja) |
| CN (1) | CN101663103B (ja) |
| TW (1) | TWI428190B (ja) |
| WO (1) | WO2008126414A1 (ja) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2008059909A1 (ja) * | 2006-11-15 | 2010-03-04 | 武蔵エンジニアリング株式会社 | 液体材料の吐出方法および装置 |
| JP2015077568A (ja) * | 2013-10-17 | 2015-04-23 | 富士電機株式会社 | 高粘度はんだ塗布装置 |
| CN105234045A (zh) * | 2015-10-29 | 2016-01-13 | 鹿敏 | 一种注胶头及具有其的注胶机 |
| CN106111451A (zh) * | 2016-08-30 | 2016-11-16 | 三河市汇莹电气设备制造有限公司 | 一种新型螺杆点胶机喷射阀 |
| CN106391399A (zh) * | 2016-08-30 | 2017-02-15 | 三河市汇莹电气设备制造有限公司 | 一种新型led点胶机 |
| JP2019130480A (ja) * | 2018-01-31 | 2019-08-08 | パナソニックIpマネジメント株式会社 | ペースト塗布装置及びペースト塗布方法 |
| JP2019130479A (ja) * | 2018-01-31 | 2019-08-08 | パナソニックIpマネジメント株式会社 | ペースト塗布装置及びペースト塗布方法 |
| JP2019181374A (ja) * | 2018-04-11 | 2019-10-24 | 株式会社ミマキエンジニアリング | 印刷装置および印刷方法 |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8757511B2 (en) | 2010-01-11 | 2014-06-24 | AdvanJet | Viscous non-contact jetting method and apparatus |
| CN102688826B (zh) * | 2011-03-23 | 2015-10-14 | 大连华工创新科技股份有限公司 | 微量多组分涂胶头体 |
| US9346075B2 (en) | 2011-08-26 | 2016-05-24 | Nordson Corporation | Modular jetting devices |
| US9254642B2 (en) | 2012-01-19 | 2016-02-09 | AdvanJet | Control method and apparatus for dispensing high-quality drops of high-viscosity material |
| JP2014014790A (ja) * | 2012-07-10 | 2014-01-30 | Hitachi Ltd | ペースト塗布装置 |
| ITTO20130689A1 (it) * | 2013-08-12 | 2013-11-11 | Stan Engineering Corp S R L | Dispositivo erogatore, in particolare per prodotti pastosi o cremosi. |
| ITTO20130690A1 (it) * | 2013-08-12 | 2013-11-11 | Stan Engineering Corp S R L | Pompa dosatrice volumetrica ad azionamento remoto e sistema dosatore/erogatore comprendente almeno una tale pompa. |
| CN103962278A (zh) * | 2014-05-14 | 2014-08-06 | 苏州意玛斯砂光设备有限公司 | 一种自动注胶装置 |
| JP6452147B2 (ja) * | 2015-01-19 | 2019-01-16 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
| CN104624436A (zh) * | 2015-01-19 | 2015-05-20 | 东莞市高顿塑胶制品有限公司 | 一种全自动油边机 |
| CN104624439A (zh) * | 2015-01-19 | 2015-05-20 | 东莞市高顿塑胶制品有限公司 | 一种旋转点油装置 |
| US10953413B2 (en) * | 2015-06-04 | 2021-03-23 | Nordson Corporation | Jet cartridges for jetting fluid material, and related methods |
| CN105127051A (zh) * | 2015-08-07 | 2015-12-09 | 东莞市高顿塑胶制品有限公司 | 一种点油机 |
| KR102465976B1 (ko) * | 2016-05-31 | 2022-11-10 | 주식회사 탑 엔지니어링 | 점성 액체 토출 장치 |
| JP6778426B2 (ja) * | 2016-09-20 | 2020-11-04 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
| CN107458024A (zh) * | 2017-09-09 | 2017-12-12 | 芜湖润林包装材料有限公司 | 一种蜂窝板包装箱胶水涂抹机 |
| US10933435B2 (en) | 2017-12-21 | 2021-03-02 | The Boeing Company | Apparatuses for depositing an extrudable substance onto a surface |
| US10781029B2 (en) * | 2017-12-21 | 2020-09-22 | The Boeing Company | Apparatuses for depositing an extrudable substance onto a surface |
| JP7193739B2 (ja) * | 2018-02-02 | 2022-12-21 | 株式会社スリーボンド | 吐出装置、および給液方法 |
| CN109395975A (zh) * | 2018-12-25 | 2019-03-01 | 肖根福罗格注胶技术(苏州工业园区)有限公司 | 用于高粘度高填料的胶水注胶头 |
| CN111974637A (zh) * | 2019-05-24 | 2020-11-24 | 上海锺炜科技工程有限公司 | 一种计量泵模块及涂胶系统 |
| CN112974161A (zh) * | 2019-12-16 | 2021-06-18 | 上海锺炜科技工程有限公司 | 一种计量泵模块及涂胶系统 |
| CN113464424A (zh) * | 2020-03-30 | 2021-10-01 | 上海锺炜科技工程有限公司 | 一种计量泵模块及涂胶系统 |
| CN113857006A (zh) * | 2021-10-26 | 2021-12-31 | 广东欧美亚智能装备有限公司 | 一种出胶效率高的出胶装置 |
| CN116921148A (zh) * | 2022-04-08 | 2023-10-24 | 东莞市格立工具有限公司 | 一种有防漏装置的喷嘴 |
| KR102654092B1 (ko) * | 2022-09-20 | 2024-04-03 | 주식회사 프로텍 | 편심 스크류 펌프 |
| DE102023108595A1 (de) * | 2023-04-04 | 2024-10-10 | Baumer Hhs Gmbh | Klebstoffauftragssystem |
| CN117139064B (zh) * | 2023-10-26 | 2024-02-06 | 拏云智能科技(江苏)有限公司 | 一种多针头点胶装置及其出胶速度调整方法 |
| CN119793818A (zh) * | 2025-03-14 | 2025-04-11 | 常州科瑞尔科技有限公司 | 外壳涂胶用螺旋泵胶装置及其工作方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201671A (ja) * | 1985-05-28 | 1987-09-05 | Pilot Pen Co Ltd:The | 粘性液体押出装置 |
| JPH0511513A (ja) | 1991-06-28 | 1993-01-22 | Mita Ind Co Ltd | 静電印刷用版及びそれを用いる多数枚印写法 |
| US6386396B1 (en) | 2001-01-31 | 2002-05-14 | Hewlett-Packard Company | Mixing rotary positive displacement pump for micro dispensing |
| JP2002326715A (ja) | 2001-05-01 | 2002-11-12 | Musashi Eng Co Ltd | 液体材料の吐出方法およびその装置 |
| JP2006053196A (ja) * | 2004-08-09 | 2006-02-23 | Juichi Kubo | 光ファイバ配線方法及びその装置 |
| WO2007097277A1 (ja) * | 2006-02-21 | 2007-08-30 | Musashi Engineering, Inc. | 脱泡機構を備える液材吐出装置 |
| WO2008069000A1 (ja) * | 2006-12-04 | 2008-06-12 | Musashi Engineering, Inc. | 液体材料吐出装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3408051A (en) * | 1966-02-23 | 1968-10-29 | Mixing Equipment Co Inc | Column mixing apparatus |
| JPH02100672U (ja) * | 1989-01-23 | 1990-08-10 | ||
| US5028373A (en) * | 1990-01-18 | 1991-07-02 | Toyo Machinery & Metal Co., Ltd. | Method for controlling injection unit of injection molding machine |
| US5564606A (en) * | 1994-08-22 | 1996-10-15 | Engel; Harold J. | Precision dispensing pump for viscous materials |
| US5984147A (en) * | 1997-10-20 | 1999-11-16 | Raytheon Company | Rotary dispensing pump |
| US6349858B1 (en) * | 1999-10-08 | 2002-02-26 | Saint-Gobain Performance Plastics | Dispense head assembly |
| US6234358B1 (en) * | 1999-11-08 | 2001-05-22 | Nordson Corporation | Floating head liquid dispenser with quick release auger cartridge |
| JP2002320895A (ja) * | 2001-04-27 | 2002-11-05 | Matsushita Electric Ind Co Ltd | 流体塗布装置 |
| US7043815B2 (en) * | 2002-01-25 | 2006-05-16 | L & L Products, Inc. | Method for applying flowable materials |
| US6983867B1 (en) * | 2002-04-29 | 2006-01-10 | Dl Technology Llc | Fluid dispense pump with drip prevention mechanism and method for controlling same |
| DE102005012487A1 (de) | 2005-03-16 | 2006-09-21 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Halogenglühlampe |
-
2008
- 2008-04-10 WO PCT/JP2008/000936 patent/WO2008126414A1/ja not_active Ceased
- 2008-04-10 US US12/595,150 patent/US8439227B2/en active Active
- 2008-04-10 JP JP2009508919A patent/JP5467865B2/ja active Active
- 2008-04-10 TW TW097112955A patent/TWI428190B/zh active
- 2008-04-10 CN CN200880011632.0A patent/CN101663103B/zh active Active
- 2008-04-10 EP EP08738546.4A patent/EP2138241B1/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201671A (ja) * | 1985-05-28 | 1987-09-05 | Pilot Pen Co Ltd:The | 粘性液体押出装置 |
| JPH0511513A (ja) | 1991-06-28 | 1993-01-22 | Mita Ind Co Ltd | 静電印刷用版及びそれを用いる多数枚印写法 |
| US6386396B1 (en) | 2001-01-31 | 2002-05-14 | Hewlett-Packard Company | Mixing rotary positive displacement pump for micro dispensing |
| JP2002326715A (ja) | 2001-05-01 | 2002-11-12 | Musashi Eng Co Ltd | 液体材料の吐出方法およびその装置 |
| JP2006053196A (ja) * | 2004-08-09 | 2006-02-23 | Juichi Kubo | 光ファイバ配線方法及びその装置 |
| WO2007097277A1 (ja) * | 2006-02-21 | 2007-08-30 | Musashi Engineering, Inc. | 脱泡機構を備える液材吐出装置 |
| WO2008069000A1 (ja) * | 2006-12-04 | 2008-06-12 | Musashi Engineering, Inc. | 液体材料吐出装置 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP2138241A4 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2008059909A1 (ja) * | 2006-11-15 | 2010-03-04 | 武蔵エンジニアリング株式会社 | 液体材料の吐出方法および装置 |
| JP2015077568A (ja) * | 2013-10-17 | 2015-04-23 | 富士電機株式会社 | 高粘度はんだ塗布装置 |
| CN105234045A (zh) * | 2015-10-29 | 2016-01-13 | 鹿敏 | 一种注胶头及具有其的注胶机 |
| CN106111451A (zh) * | 2016-08-30 | 2016-11-16 | 三河市汇莹电气设备制造有限公司 | 一种新型螺杆点胶机喷射阀 |
| CN106391399A (zh) * | 2016-08-30 | 2017-02-15 | 三河市汇莹电气设备制造有限公司 | 一种新型led点胶机 |
| JP2019130480A (ja) * | 2018-01-31 | 2019-08-08 | パナソニックIpマネジメント株式会社 | ペースト塗布装置及びペースト塗布方法 |
| JP2019130479A (ja) * | 2018-01-31 | 2019-08-08 | パナソニックIpマネジメント株式会社 | ペースト塗布装置及びペースト塗布方法 |
| JP7012213B2 (ja) | 2018-01-31 | 2022-01-28 | パナソニックIpマネジメント株式会社 | ペースト塗布装置及びペースト塗布方法 |
| JP2019181374A (ja) * | 2018-04-11 | 2019-10-24 | 株式会社ミマキエンジニアリング | 印刷装置および印刷方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1137162A1 (en) | 2010-07-23 |
| EP2138241B1 (en) | 2014-05-28 |
| CN101663103A (zh) | 2010-03-03 |
| US20100181337A1 (en) | 2010-07-22 |
| US8439227B2 (en) | 2013-05-14 |
| JPWO2008126414A1 (ja) | 2010-07-22 |
| TWI428190B (zh) | 2014-03-01 |
| EP2138241A1 (en) | 2009-12-30 |
| CN101663103B (zh) | 2014-08-06 |
| KR20090129493A (ko) | 2009-12-16 |
| EP2138241A4 (en) | 2010-05-05 |
| TW200848168A (en) | 2008-12-16 |
| JP5467865B2 (ja) | 2014-04-09 |
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