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WO2008123259A1 - 可動接点部品用銀被覆材およびその製造方法 - Google Patents

可動接点部品用銀被覆材およびその製造方法 Download PDF

Info

Publication number
WO2008123259A1
WO2008123259A1 PCT/JP2008/055603 JP2008055603W WO2008123259A1 WO 2008123259 A1 WO2008123259 A1 WO 2008123259A1 JP 2008055603 W JP2008055603 W JP 2008055603W WO 2008123259 A1 WO2008123259 A1 WO 2008123259A1
Authority
WO
WIPO (PCT)
Prior art keywords
silver
coated material
movable contact
contact component
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055603
Other languages
English (en)
French (fr)
Inventor
Suguru Yamaguchi
Yoshiaki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to US12/593,034 priority Critical patent/US20100186993A1/en
Priority to CN2008800166508A priority patent/CN101681728B/zh
Priority to EP08738848A priority patent/EP2139012A4/en
Publication of WO2008123259A1 publication Critical patent/WO2008123259A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Contacts (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture Of Switches (AREA)

Abstract

　銅または銅合金からなる導電性基材１上に厚さ０．０１～０．５μｍのニッケルまたはニッケル合金からなる下地層２が被覆され、該下地層２上にパラジウム、パラジウム合金、または銀スズ合金からなる厚さ０．０１～０．５μｍの中間層３が被覆され、該中間層３上に銀または銀合金からなる最表層４が形成された可動接点部品用銀被覆材。
PCT/JP2008/055603 2007-03-27 2008-03-25 可動接点部品用銀被覆材およびその製造方法 Ceased WO2008123259A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/593,034 US20100186993A1 (en) 2007-03-27 2008-03-25 Silver-coated material for movable contact component and method for manufacturing such silver-coated material
CN2008800166508A CN101681728B (zh) 2007-03-27 2008-03-25 用于可动接点部件的银包覆材料及其制造方法
EP08738848A EP2139012A4 (en) 2007-03-27 2008-03-25 SILVER COATED MATERIAL FOR MOBILE CONTACT ELEMENT AND PROCESS FOR PRODUCING SILVER COATED MATERIAL OF THIS TYPE

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-082604 2007-03-27
JP2007082604 2007-03-27
JP2008076884A JP4834022B2 (ja) 2007-03-27 2008-03-24 可動接点部品用銀被覆材およびその製造方法
JP2008-076884 2008-03-24

Publications (1)

Publication Number Publication Date
WO2008123259A1 true WO2008123259A1 (ja) 2008-10-16

Family

ID=39830752

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055603 Ceased WO2008123259A1 (ja) 2007-03-27 2008-03-25 可動接点部品用銀被覆材およびその製造方法

Country Status (7)

Country Link
US (1) US20100186993A1 (ja)
EP (1) EP2139012A4 (ja)
JP (1) JP4834022B2 (ja)
KR (1) KR20090127405A (ja)
CN (1) CN101681728B (ja)
TW (1) TW200842212A (ja)
WO (1) WO2008123259A1 (ja)

Cited By (5)

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WO2012107524A1 (en) * 2011-02-09 2012-08-16 Impact Coatings Ab Material for providing an electrically conducting contact layer, a contact element with such layer, method for providing the contact element, and uses of the material
JP2012162775A (ja) * 2011-02-08 2012-08-30 Dowa Metaltech Kk 銀めっき材およびその製造方法
WO2013168764A1 (ja) * 2012-05-11 2013-11-14 株式会社オートネットワーク技術研究所 コネクタ用めっき端子および端子対
JP5547357B1 (ja) * 2013-02-22 2014-07-09 古河電気工業株式会社 端子、電線接続構造体および端子の製造方法
JP2023156264A (ja) * 2022-04-12 2023-10-24 ローム アンド ハース エレクトロニック マテリアルズ エルエルシー 高温用途のための銀コーティング

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JP5334416B2 (ja) * 2005-09-22 2013-11-06 株式会社エンプラス 電気接触子及び電気部品用ソケット
JP5681378B2 (ja) * 2010-04-27 2015-03-04 Ｄｏｗａメタルテック株式会社 めっき部材およびその製造方法
DE102011006899B4 (de) * 2011-04-06 2025-01-30 Te Connectivity Germany Gmbh Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement und eine Vorrichtung zur Herstellung
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
JP6046406B2 (ja) * 2011-07-26 2016-12-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 高温耐性銀コート基体
DE102011080468B4 (de) * 2011-08-04 2019-05-29 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Kontaktträgers eines Schaltkontaktes für ein elektromechanisches Schaltgerät sowie ein solcher Kontaktträger
DE102011088211A1 (de) * 2011-12-12 2013-06-13 Robert Bosch Gmbh Kontaktelement und Verfahren zu seiner Herstellung
JP5387742B2 (ja) 2012-04-06 2014-01-15 株式会社オートネットワーク技術研究所 めっき部材、コネクタ用めっき端子、めっき部材の製造方法、及びコネクタ用めっき端子の製造方法
CN104364660B (zh) * 2012-06-06 2018-09-21 恩普乐股份有限公司 电触头和电气部件用插座
US8944838B2 (en) 2013-04-10 2015-02-03 Tyco Electronics Corporation Connector with locking ring
JP2013239437A (ja) * 2013-05-02 2013-11-28 Tanaka Kikinzoku Kogyo Kk リベット型接点及びその製造方法
JPWO2014196291A1 (ja) * 2013-06-07 2017-02-23 株式会社Ｊｃｕ 貴金属被覆部材およびその製造方法
JP5819547B2 (ja) * 2013-06-11 2015-11-24 株式会社Ｋａｎｚａｃｃ 接触端子構造
JP6079508B2 (ja) * 2013-08-29 2017-02-15 株式会社オートネットワーク技術研究所 めっき部材、コネクタ用めっき端子、めっき部材の製造方法、およびコネクタ用めっき端子の製造方法
US20150079421A1 (en) * 2013-09-19 2015-03-19 Tyco Electronics Amp Gmbh Electrical component and method for fabricating same
JP6284533B2 (ja) * 2013-09-21 2018-02-28 古河電気工業株式会社 可動接点部と固定接点部とからなる電気接点構造
CN105814746B (zh) * 2013-12-04 2018-05-15 株式会社自动网络技术研究所 电接点和连接器端子对
JP6330689B2 (ja) * 2015-02-19 2018-05-30 株式会社オートネットワーク技術研究所 電気接点対およびコネクタ用端子対
JP6497293B2 (ja) * 2015-10-20 2019-04-10 株式会社オートネットワーク技術研究所 端子用金属板、端子及び端子対
JP6383379B2 (ja) * 2016-04-27 2018-08-29 矢崎総業株式会社 メッキ材および、このメッキ材を用いた端子
US20180053714A1 (en) * 2016-08-18 2018-02-22 Rohm And Haas Electronic Materials Llc Multi-layer electrical contact element
JP7084217B2 (ja) * 2017-06-15 2022-06-14 矢崎総業株式会社 電気接点部材、めっき付き端子、端子付き電線、及びワイヤーハーネス
JP7121881B2 (ja) * 2017-08-08 2022-08-19 三菱マテリアル株式会社 銀皮膜付端子材及び銀皮膜付端子
WO2019031549A1 (ja) * 2017-08-08 2019-02-14 三菱マテリアル株式会社 銀皮膜付端子材及び銀皮膜付端子
EP3540097A1 (en) * 2018-03-13 2019-09-18 COVENTYA S.p.A. Electroplated products and electroplating bath for providing such products
DE102018112013A1 (de) 2018-05-18 2019-11-21 Maschinenfabrik Reinhausen Gmbh Kontaktsystem für einen laststufenschalter
JP7111000B2 (ja) * 2019-01-18 2022-08-02 株式会社オートネットワーク技術研究所 金属材および接続端子
WO2020153396A1 (ja) * 2019-01-24 2020-07-30 三菱マテリアル株式会社 コネクタ用端子材及びコネクタ用端子
US11270870B2 (en) * 2019-04-02 2022-03-08 Applied Materials, Inc. Processing equipment component plating
JP7302248B2 (ja) * 2019-04-09 2023-07-04 三菱マテリアル株式会社 コネクタ用端子材及びコネクタ用端子
JP2020187971A (ja) * 2019-05-16 2020-11-19 株式会社オートネットワーク技術研究所 コネクタ端子、端子付き電線、及び端子対
JP7040544B2 (ja) * 2020-02-20 2022-03-23 三菱マテリアル株式会社 コネクタ用端子材
US20230299548A1 (en) * 2020-07-22 2023-09-21 Mitsubishi Materials Corporation Terminal material for connector
EP4001472A1 (en) * 2020-11-16 2022-05-25 COVENTYA S.p.A. Method for preparing an electroplated product by depositing an underlayer, diffusion barrier layer and top layer on the surface of a substrate and such prepared electroplated product
CN117089838A (zh) * 2022-05-19 2023-11-21 泰连解决方案有限责任公司 用于在腐蚀性环境中有改善的接触电阻的分层镀覆叠层
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012162775A (ja) * 2011-02-08 2012-08-30 Dowa Metaltech Kk 銀めっき材およびその製造方法
WO2012107524A1 (en) * 2011-02-09 2012-08-16 Impact Coatings Ab Material for providing an electrically conducting contact layer, a contact element with such layer, method for providing the contact element, and uses of the material
JP5696811B2 (ja) * 2012-05-11 2015-04-08 株式会社オートネットワーク技術研究所 コネクタ用めっき端子および端子対
WO2013168764A1 (ja) * 2012-05-11 2013-11-14 株式会社オートネットワーク技術研究所 コネクタ用めっき端子および端子対
US9673547B2 (en) 2012-05-11 2017-06-06 Autonetworks Technologies, Ltd. Plated terminal for connector and terminal pair
JP5547357B1 (ja) * 2013-02-22 2014-07-09 古河電気工業株式会社 端子、電線接続構造体および端子の製造方法
CN104137345A (zh) * 2013-02-22 2014-11-05 古河电气工业株式会社 端子、电线连接结构体以及端子的制造方法
JP2014187031A (ja) * 2013-02-22 2014-10-02 Furukawa Electric Co Ltd:The 端子、電線接続構造体および端子の製造方法
US9484642B2 (en) 2013-02-22 2016-11-01 Furukawa Electric Co., Ltd. Terminal, a wire connecting structure and a method of manufacturing the terminal
WO2014129222A1 (ja) * 2013-02-22 2014-08-28 古河電気工業株式会社 端子、電線接続構造体および端子の製造方法
CN104137345B (zh) * 2013-02-22 2017-07-18 古河电气工业株式会社 端子、电线连接结构体以及端子的制造方法
JP2023156264A (ja) * 2022-04-12 2023-10-24 ローム アンド ハース エレクトロニック マテリアルズ エルエルシー 高温用途のための銀コーティング
JP7720348B2 (ja) 2022-04-12 2025-08-07 デュポン エレクトロニック マテリアルズ インターナショナル，エルエルシー 高温用途のための銀コーティング

Also Published As

Publication number Publication date
JP4834022B2 (ja) 2011-12-07
CN101681728B (zh) 2012-08-22
EP2139012A4 (en) 2011-09-28
US20100186993A1 (en) 2010-07-29
TW200842212A (en) 2008-11-01
KR20090127405A (ko) 2009-12-11
JP2008270192A (ja) 2008-11-06
EP2139012A1 (en) 2009-12-30
CN101681728A (zh) 2010-03-24

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