WO2008123259A1 - Matériau à revêtement argent pour élément de contact mobile et procédé de production d'un matériau à revêtement argent de ce type - Google Patents
Matériau à revêtement argent pour élément de contact mobile et procédé de production d'un matériau à revêtement argent de ce type Download PDFInfo
- Publication number
- WO2008123259A1 WO2008123259A1 PCT/JP2008/055603 JP2008055603W WO2008123259A1 WO 2008123259 A1 WO2008123259 A1 WO 2008123259A1 JP 2008055603 W JP2008055603 W JP 2008055603W WO 2008123259 A1 WO2008123259 A1 WO 2008123259A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silver
- coated material
- movable contact
- contact component
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
- H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Switches (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008800166508A CN101681728B (zh) | 2007-03-27 | 2008-03-25 | 用于可动接点部件的银包覆材料及其制造方法 |
| EP08738848A EP2139012A4 (fr) | 2007-03-27 | 2008-03-25 | Matériau à revêtement argent pour élément de contact mobile et procédé de production d'un matériau à revêtement argent de ce type |
| US12/593,034 US20100186993A1 (en) | 2007-03-27 | 2008-03-25 | Silver-coated material for movable contact component and method for manufacturing such silver-coated material |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-082604 | 2007-03-27 | ||
| JP2007082604 | 2007-03-27 | ||
| JP2008076884A JP4834022B2 (ja) | 2007-03-27 | 2008-03-24 | 可動接点部品用銀被覆材およびその製造方法 |
| JP2008-076884 | 2008-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008123259A1 true WO2008123259A1 (fr) | 2008-10-16 |
Family
ID=39830752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/055603 Ceased WO2008123259A1 (fr) | 2007-03-27 | 2008-03-25 | Matériau à revêtement argent pour élément de contact mobile et procédé de production d'un matériau à revêtement argent de ce type |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100186993A1 (fr) |
| EP (1) | EP2139012A4 (fr) |
| JP (1) | JP4834022B2 (fr) |
| KR (1) | KR20090127405A (fr) |
| CN (1) | CN101681728B (fr) |
| TW (1) | TW200842212A (fr) |
| WO (1) | WO2008123259A1 (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012107524A1 (fr) * | 2011-02-09 | 2012-08-16 | Impact Coatings Ab | Matériau destiné à produire une couche de contact électriquement conductrice, élément de contact possédant un telle couche, procédé destiné à produire cet élément de contact, et utilisations de ce matériau |
| JP2012162775A (ja) * | 2011-02-08 | 2012-08-30 | Dowa Metaltech Kk | 銀めっき材およびその製造方法 |
| WO2013168764A1 (fr) * | 2012-05-11 | 2013-11-14 | 株式会社オートネットワーク技術研究所 | Borne plaquée destinée à un connecteur, et paire de bornes |
| JP5547357B1 (ja) * | 2013-02-22 | 2014-07-09 | 古河電気工業株式会社 | 端子、電線接続構造体および端子の製造方法 |
| JP2023156264A (ja) * | 2022-04-12 | 2023-10-24 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシー | 高温用途のための銀コーティング |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE45924E1 (en) * | 2005-09-22 | 2016-03-15 | Enplas Corporation | Electric contact and socket for electrical part |
| JP5681378B2 (ja) * | 2010-04-27 | 2015-03-04 | Dowaメタルテック株式会社 | めっき部材およびその製造方法 |
| DE102011006899B4 (de) | 2011-04-06 | 2025-01-30 | Te Connectivity Germany Gmbh | Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement und eine Vorrichtung zur Herstellung |
| US20130023166A1 (en) * | 2011-07-20 | 2013-01-24 | Tyco Electronics Corporation | Silver plated electrical contact |
| JP6046406B2 (ja) | 2011-07-26 | 2016-12-14 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 高温耐性銀コート基体 |
| DE102011080468B4 (de) * | 2011-08-04 | 2019-05-29 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines Kontaktträgers eines Schaltkontaktes für ein elektromechanisches Schaltgerät sowie ein solcher Kontaktträger |
| DE102011088211A1 (de) * | 2011-12-12 | 2013-06-13 | Robert Bosch Gmbh | Kontaktelement und Verfahren zu seiner Herstellung |
| JP5387742B2 (ja) * | 2012-04-06 | 2014-01-15 | 株式会社オートネットワーク技術研究所 | めっき部材、コネクタ用めっき端子、めっき部材の製造方法、及びコネクタ用めっき端子の製造方法 |
| JP6502667B2 (ja) * | 2012-06-06 | 2019-04-17 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
| US8944838B2 (en) | 2013-04-10 | 2015-02-03 | Tyco Electronics Corporation | Connector with locking ring |
| JP2013239437A (ja) | 2013-05-02 | 2013-11-28 | Tanaka Kikinzoku Kogyo Kk | リベット型接点及びその製造方法 |
| CN105392928A (zh) * | 2013-06-07 | 2016-03-09 | 株式会社杰希优 | 贵金属被覆构件及其制造方法 |
| US20160172069A1 (en) * | 2013-06-11 | 2016-06-16 | Kanzacc Co., Ltd. | Contact terminal structure |
| JP6079508B2 (ja) * | 2013-08-29 | 2017-02-15 | 株式会社オートネットワーク技術研究所 | めっき部材、コネクタ用めっき端子、めっき部材の製造方法、およびコネクタ用めっき端子の製造方法 |
| US20150079421A1 (en) * | 2013-09-19 | 2015-03-19 | Tyco Electronics Amp Gmbh | Electrical component and method for fabricating same |
| JP6284533B2 (ja) * | 2013-09-21 | 2018-02-28 | 古河電気工業株式会社 | 可動接点部と固定接点部とからなる電気接点構造 |
| JP6004121B2 (ja) * | 2013-12-04 | 2016-10-05 | 株式会社オートネットワーク技術研究所 | 電気接点およびコネクタ端子対 |
| JP6330689B2 (ja) * | 2015-02-19 | 2018-05-30 | 株式会社オートネットワーク技術研究所 | 電気接点対およびコネクタ用端子対 |
| JP6497293B2 (ja) * | 2015-10-20 | 2019-04-10 | 株式会社オートネットワーク技術研究所 | 端子用金属板、端子及び端子対 |
| JP6383379B2 (ja) * | 2016-04-27 | 2018-08-29 | 矢崎総業株式会社 | メッキ材および、このメッキ材を用いた端子 |
| US20180053714A1 (en) * | 2016-08-18 | 2018-02-22 | Rohm And Haas Electronic Materials Llc | Multi-layer electrical contact element |
| JP7084217B2 (ja) * | 2017-06-15 | 2022-06-14 | 矢崎総業株式会社 | 電気接点部材、めっき付き端子、端子付き電線、及びワイヤーハーネス |
| JP7121881B2 (ja) | 2017-08-08 | 2022-08-19 | 三菱マテリアル株式会社 | 銀皮膜付端子材及び銀皮膜付端子 |
| WO2019031549A1 (fr) * | 2017-08-08 | 2019-02-14 | 三菱マテリアル株式会社 | Matériau de borne doté de film de revêtement d'argent et borne doté de film de revêtement d'argent |
| EP3540097A1 (fr) * | 2018-03-13 | 2019-09-18 | COVENTYA S.p.A. | Produits galvanisés et bain électrolytique approprié pour fournir de tels produits |
| DE102018112013A1 (de) | 2018-05-18 | 2019-11-21 | Maschinenfabrik Reinhausen Gmbh | Kontaktsystem für einen laststufenschalter |
| JP7111000B2 (ja) * | 2019-01-18 | 2022-08-02 | 株式会社オートネットワーク技術研究所 | 金属材および接続端子 |
| WO2020153396A1 (fr) * | 2019-01-24 | 2020-07-30 | 三菱マテリアル株式会社 | Matériau de borne de connecteur et terminal de connecteur |
| US11270870B2 (en) * | 2019-04-02 | 2022-03-08 | Applied Materials, Inc. | Processing equipment component plating |
| JP7302248B2 (ja) * | 2019-04-09 | 2023-07-04 | 三菱マテリアル株式会社 | コネクタ用端子材及びコネクタ用端子 |
| JP2020187971A (ja) * | 2019-05-16 | 2020-11-19 | 株式会社オートネットワーク技術研究所 | コネクタ端子、端子付き電線、及び端子対 |
| JP7040544B2 (ja) | 2020-02-20 | 2022-03-23 | 三菱マテリアル株式会社 | コネクタ用端子材 |
| EP4186999A4 (fr) * | 2020-07-22 | 2024-07-31 | Mitsubishi Materials Corporation | Matériau de borne pour connecteurs |
| EP4001472A1 (fr) | 2020-11-16 | 2022-05-25 | COVENTYA S.p.A. | Procédé de préparation d'un produit électroplaqué par dépôt d'une sous-couche, d'une couche barrière de diffusion et d'une couche supérieure sur la surface d'un substrat et produit électroplaqué ainsi préparé |
| CN117089838A (zh) * | 2022-05-19 | 2023-11-21 | 泰连解决方案有限责任公司 | 用于在腐蚀性环境中有改善的接触电阻的分层镀覆叠层 |
| EP4325227B1 (fr) * | 2022-08-16 | 2025-10-01 | Heraeus Precious Metals GmbH & Co. KG | Matière composite en forme de ruban pour aiguilles de contrôle |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59180908A (ja) * | 1983-03-30 | 1984-10-15 | 古河電気工業株式会社 | 銀被覆導体とその製造方法 |
| JPS6037605A (ja) * | 1983-08-11 | 1985-02-27 | 古河電気工業株式会社 | Ag被覆Cu系電子部品材料 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030587B1 (fr) * | 1969-07-02 | 1975-10-02 | ||
| EP0335608B1 (fr) * | 1988-03-28 | 1995-06-14 | Texas Instruments Incorporated | Cadre conducteur à corrosion réduite |
| JPH0359972A (ja) * | 1989-07-27 | 1991-03-14 | Yazaki Corp | 電気接点 |
| US5139890A (en) * | 1991-09-30 | 1992-08-18 | Olin Corporation | Silver-coated electrical components |
| US5384155A (en) * | 1992-06-04 | 1995-01-24 | Texas Instruments Incorporated | Silver spot/palladium plate lead frame finish |
| DE4224012C1 (de) * | 1992-07-21 | 1993-12-02 | Heraeus Gmbh W C | Lötfähiges elektrisches Kontaktelement |
| US5459103A (en) * | 1994-04-18 | 1995-10-17 | Texas Instruments Incorporated | Method of forming lead frame with strengthened encapsulation adhesion |
| US6521358B1 (en) * | 1997-03-04 | 2003-02-18 | Matsushita Electric Industrial Co., Ltd. | Lead frame for semiconductor device and method of producing same |
| TW401634B (en) * | 1997-04-09 | 2000-08-11 | Sitron Prec Co Ltd | Lead frame and its manufacture method |
| KR100371567B1 (ko) * | 2000-12-08 | 2003-02-07 | 삼성테크윈 주식회사 | Ag 선도금을 이용한 반도체 패키지용 리드프레임 |
| CN2461127Y (zh) * | 2000-12-26 | 2001-11-21 | 柳州市半导体材料厂 | 电接触片 |
| US20030006489A1 (en) * | 2001-07-06 | 2003-01-09 | Kenzo Fujii | Flexible wiring substrate interposed between semiconductor element and circuit substrate |
| CN100499099C (zh) * | 2003-01-16 | 2009-06-10 | 松下电器产业株式会社 | 半导体器件的引线框 |
| US6974776B2 (en) * | 2003-07-01 | 2005-12-13 | Freescale Semiconductor, Inc. | Activation plate for electroless and immersion plating of integrated circuits |
| US7268415B2 (en) * | 2004-11-09 | 2007-09-11 | Texas Instruments Incorporated | Semiconductor device having post-mold nickel/palladium/gold plated leads |
| JP4747604B2 (ja) * | 2005-02-18 | 2011-08-17 | Tdk株式会社 | セラミック電子部品 |
-
2008
- 2008-03-24 JP JP2008076884A patent/JP4834022B2/ja active Active
- 2008-03-25 CN CN2008800166508A patent/CN101681728B/zh not_active Expired - Fee Related
- 2008-03-25 WO PCT/JP2008/055603 patent/WO2008123259A1/fr not_active Ceased
- 2008-03-25 US US12/593,034 patent/US20100186993A1/en not_active Abandoned
- 2008-03-25 EP EP08738848A patent/EP2139012A4/fr not_active Withdrawn
- 2008-03-25 KR KR1020097019426A patent/KR20090127405A/ko not_active Withdrawn
- 2008-03-26 TW TW097110712A patent/TW200842212A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59180908A (ja) * | 1983-03-30 | 1984-10-15 | 古河電気工業株式会社 | 銀被覆導体とその製造方法 |
| JPS6037605A (ja) * | 1983-08-11 | 1985-02-27 | 古河電気工業株式会社 | Ag被覆Cu系電子部品材料 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP2139012A4 * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012162775A (ja) * | 2011-02-08 | 2012-08-30 | Dowa Metaltech Kk | 銀めっき材およびその製造方法 |
| WO2012107524A1 (fr) * | 2011-02-09 | 2012-08-16 | Impact Coatings Ab | Matériau destiné à produire une couche de contact électriquement conductrice, élément de contact possédant un telle couche, procédé destiné à produire cet élément de contact, et utilisations de ce matériau |
| JP5696811B2 (ja) * | 2012-05-11 | 2015-04-08 | 株式会社オートネットワーク技術研究所 | コネクタ用めっき端子および端子対 |
| WO2013168764A1 (fr) * | 2012-05-11 | 2013-11-14 | 株式会社オートネットワーク技術研究所 | Borne plaquée destinée à un connecteur, et paire de bornes |
| US9673547B2 (en) | 2012-05-11 | 2017-06-06 | Autonetworks Technologies, Ltd. | Plated terminal for connector and terminal pair |
| JP5547357B1 (ja) * | 2013-02-22 | 2014-07-09 | 古河電気工業株式会社 | 端子、電線接続構造体および端子の製造方法 |
| CN104137345A (zh) * | 2013-02-22 | 2014-11-05 | 古河电气工业株式会社 | 端子、电线连接结构体以及端子的制造方法 |
| JP2014187031A (ja) * | 2013-02-22 | 2014-10-02 | Furukawa Electric Co Ltd:The | 端子、電線接続構造体および端子の製造方法 |
| US9484642B2 (en) | 2013-02-22 | 2016-11-01 | Furukawa Electric Co., Ltd. | Terminal, a wire connecting structure and a method of manufacturing the terminal |
| WO2014129222A1 (fr) * | 2013-02-22 | 2014-08-28 | 古河電気工業株式会社 | Borne, structure de connexion de câblage et procédé de fabrication de borne |
| CN104137345B (zh) * | 2013-02-22 | 2017-07-18 | 古河电气工业株式会社 | 端子、电线连接结构体以及端子的制造方法 |
| JP2023156264A (ja) * | 2022-04-12 | 2023-10-24 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシー | 高温用途のための銀コーティング |
| JP7720348B2 (ja) | 2022-04-12 | 2025-08-07 | デュポン エレクトロニック マテリアルズ インターナショナル,エルエルシー | 高温用途のための銀コーティング |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090127405A (ko) | 2009-12-11 |
| EP2139012A4 (fr) | 2011-09-28 |
| EP2139012A1 (fr) | 2009-12-30 |
| CN101681728A (zh) | 2010-03-24 |
| JP4834022B2 (ja) | 2011-12-07 |
| US20100186993A1 (en) | 2010-07-29 |
| CN101681728B (zh) | 2012-08-22 |
| JP2008270192A (ja) | 2008-11-06 |
| TW200842212A (en) | 2008-11-01 |
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