[go: up one dir, main page]

WO2008117573A1 - Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and method for manufacturing semiconductor device - Google Patents

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and method for manufacturing semiconductor device Download PDF

Info

Publication number
WO2008117573A1
WO2008117573A1 PCT/JP2008/052046 JP2008052046W WO2008117573A1 WO 2008117573 A1 WO2008117573 A1 WO 2008117573A1 JP 2008052046 W JP2008052046 W JP 2008052046W WO 2008117573 A1 WO2008117573 A1 WO 2008117573A1
Authority
WO
WIPO (PCT)
Prior art keywords
aqueous dispersion
mechanical polishing
chemical mechanical
kit
preparing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052046
Other languages
French (fr)
Japanese (ja)
Inventor
Masatoshi Ikeda
Akihiro Takemura
Hirotaka Shida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP2009506235A priority Critical patent/JPWO2008117573A1/en
Publication of WO2008117573A1 publication Critical patent/WO2008117573A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P52/403—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains (A) a water-soluble polymer having at least one group selected from amino groups and cationic functional groups in a side chain, (B) an oxidizing agent, (C) at least one compound other than the component (A) which is selected from amino acids, organic acids and inorganic acids, and (D) abrasive grains.
PCT/JP2008/052046 2007-03-27 2008-02-07 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and method for manufacturing semiconductor device Ceased WO2008117573A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009506235A JPWO2008117573A1 (en) 2007-03-27 2008-02-07 Chemical mechanical polishing aqueous dispersion, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and semiconductor device manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007082510 2007-03-27
JP2007-082510 2007-03-27

Publications (1)

Publication Number Publication Date
WO2008117573A1 true WO2008117573A1 (en) 2008-10-02

Family

ID=39788313

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052046 Ceased WO2008117573A1 (en) 2007-03-27 2008-02-07 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and method for manufacturing semiconductor device

Country Status (3)

Country Link
JP (1) JPWO2008117573A1 (en)
TW (1) TW200845175A (en)
WO (1) WO2008117573A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135792A (en) * 2008-12-03 2010-06-17 Lg Chem Ltd Slurry composition for primary chemical mechanical polishing and chemical mechanical polishing method
JP4772156B1 (en) * 2010-07-05 2011-09-14 花王株式会社 Polishing liquid composition for silicon wafer
JP2013043893A (en) * 2011-08-22 2013-03-04 Jsr Corp Aqueous dispersion for chemical and mechanical polishing and chemical and mechanical polishing method using the same
WO2015141687A1 (en) * 2014-03-17 2015-09-24 日本キャボット・マイクロエレクトロニクス株式会社 Slurry composition and method for polishing substrate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009048436B4 (en) * 2009-10-07 2012-12-20 Siltronic Ag Method for grinding a semiconductor wafer
TWI857986B (en) * 2019-11-13 2024-10-11 奇美實業股份有限公司 Protective film composition, manufacturing method of semiconductor device, and laser cutting method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303792A (en) * 2002-04-10 2003-10-24 Nippon Shokubai Co Ltd Water-based dispersing element for chemical mechanical polishing and polishing method
JP2004311967A (en) * 2003-03-27 2004-11-04 Nippon Shokubai Co Ltd Polymer and composition for cmp abrasive
JP2005347579A (en) * 2004-06-03 2005-12-15 Nippon Shokubai Co Ltd Abrasive additive and abrasive
JP2006269909A (en) * 2005-03-25 2006-10-05 Fuji Photo Film Co Ltd Polishing liquid for metal and polishing method
JP2006524918A (en) * 2003-04-21 2006-11-02 キャボット マイクロエレクトロニクス コーポレイション Coated metal oxide particles for CMP

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3825246B2 (en) * 2000-11-24 2006-09-27 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry
JP4336550B2 (en) * 2003-09-09 2009-09-30 花王株式会社 Polishing liquid kit for magnetic disk
JP2005353681A (en) * 2004-06-08 2005-12-22 Hitachi Chem Co Ltd Cmp abrasive for semiconductor insulation film and its manufacturing method, and method of polishing substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303792A (en) * 2002-04-10 2003-10-24 Nippon Shokubai Co Ltd Water-based dispersing element for chemical mechanical polishing and polishing method
JP2004311967A (en) * 2003-03-27 2004-11-04 Nippon Shokubai Co Ltd Polymer and composition for cmp abrasive
JP2006524918A (en) * 2003-04-21 2006-11-02 キャボット マイクロエレクトロニクス コーポレイション Coated metal oxide particles for CMP
JP2005347579A (en) * 2004-06-03 2005-12-15 Nippon Shokubai Co Ltd Abrasive additive and abrasive
JP2006269909A (en) * 2005-03-25 2006-10-05 Fuji Photo Film Co Ltd Polishing liquid for metal and polishing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135792A (en) * 2008-12-03 2010-06-17 Lg Chem Ltd Slurry composition for primary chemical mechanical polishing and chemical mechanical polishing method
JP4772156B1 (en) * 2010-07-05 2011-09-14 花王株式会社 Polishing liquid composition for silicon wafer
JP2013043893A (en) * 2011-08-22 2013-03-04 Jsr Corp Aqueous dispersion for chemical and mechanical polishing and chemical and mechanical polishing method using the same
WO2015141687A1 (en) * 2014-03-17 2015-09-24 日本キャボット・マイクロエレクトロニクス株式会社 Slurry composition and method for polishing substrate

Also Published As

Publication number Publication date
JPWO2008117573A1 (en) 2010-07-15
TW200845175A (en) 2008-11-16

Similar Documents

Publication Publication Date Title
WO2009031389A1 (en) Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device
TW200801046A (en) Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
WO2008079934A3 (en) Low corrosion abrasive articles and methods for forming same
WO2008117573A1 (en) Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and method for manufacturing semiconductor device
TW200734424A (en) Chemical mechanical polishing slurry for organic film, chemical mechanical polishing method, and method of manufacturing semiconductor device
WO2009111001A3 (en) Silicon carbide polishing method utilizing water-soluble oxidizers
MY147729A (en) Polishing composition and method utilizing abrasive particles treated with an aminosilane
EP1757665B8 (en) Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices
TWI368311B (en) Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
WO2006118903A3 (en) Microporous article having metallic nanoparticle coating
WO2007011331A3 (en) Water-soluble polymeric substrate having metallic nanoparticle coating
WO2009007119A3 (en) Process for preparing and crosslinking a cable comprising a polymer composition and a crosslinked cable
WO2009065831A3 (en) Robot, medical work station, and method for projecting an image onto the surface of an object
WO2012013361A3 (en) A polymeric substrate having a glass-like surface and a chip made of said polymeric substrate
WO2008116043A8 (en) Abrasive articles, rotationally reciprocating tools, and methods
TW200738855A (en) CMP abrasive for polishing insulating film, polishing method and semiconductor electronic parts polished by the polishing method
WO2007109326A3 (en) Methods and materials useful for chip stacking, chip and wafer bonding
MY150866A (en) Compositions and methods for polishing silicon nitride materials
WO2006008239A3 (en) Luminescent silicon oxide flakes
WO2011007286A3 (en) Multiple component materials having a color-changing composition
WO2008063337A3 (en) Semiconductor-on-diamond devices and associated methods
WO2009103907A3 (en) Method for local etching of the surface of a substrate
TWI370504B (en) Electrostatic chuck, substrate processing apparatus having the same, and substrate processing method using the same
WO2007082086A3 (en) Assist for raise lower mechanism for a concrete saw
WO2007103887A3 (en) Semiconductor manufacturing process modules

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08710925

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009506235

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08710925

Country of ref document: EP

Kind code of ref document: A1