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WO2008109804A1 - Dissipateur thermique à augmentation de vapeur - Google Patents

Dissipateur thermique à augmentation de vapeur Download PDF

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Publication number
WO2008109804A1
WO2008109804A1 PCT/US2008/056166 US2008056166W WO2008109804A1 WO 2008109804 A1 WO2008109804 A1 WO 2008109804A1 US 2008056166 W US2008056166 W US 2008056166W WO 2008109804 A1 WO2008109804 A1 WO 2008109804A1
Authority
WO
WIPO (PCT)
Prior art keywords
vapor
condensate
grooves
transfer device
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2008/056166
Other languages
English (en)
Inventor
Steven Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Convergence Technologies Ltd
Original Assignee
Convergence Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Convergence Technologies Ltd filed Critical Convergence Technologies Ltd
Publication of WO2008109804A1 publication Critical patent/WO2008109804A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H10W40/73—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • This application relates to cooling devices and, more particularly, to a vapor- augmented heat spreader including condensate and vapor grooves, wherein the capillary force generated by the vapor grooves is lower than the capillary force generated by the condensate grooves.
  • a metallic lid has been placed on top of the semiconductor to function as a heat spreader.
  • vapor chambers have been used to enhance the heat spreading effect. While these solutions are somewhat effective, problems still remain.
  • the metallic lid utilizes a conductive mechanism for heat transport; consequently, it needs to be sufficiently thick to ensure appropriate heat spreading. Increased lid thickness, however, results in a semi-finite heat-transfer behavior. Thus, a thicker heat spreader may cause localized, transient overheating.
  • Vapor chambers although an improvement over the metallic lid, do not maintain dimensional tolerance under the high vapor pressure generated when the vapor chamber is integrated with the electronics and subjected to the high-temperature reflow processes (e.g., in the context of the vapor chamber operating in the format of a vapor-chamber lid).
  • vapor chamber wick selection is problematic — the appropriate wick needs to be chosen to both enable a high condensate flow rate and maintain sufficient capillary pressure to overcome the effect of gravity. This becomes more of a problem as the thickness of the vapor chamber is reduced in an effort to replace the function of the metallic lid.
  • the present invention is directed toward a vapor-augmented heat spreader device including vapor and condensate channels selectively formed into a pair of fluid transfer elements to enable the selective increase of the device's in-plane thermal spreading ability.
  • Each set of channels may be spaced to form crests configured to provide sufficient joint area to minimize resistances to through-plane heat flow, as well as to ensure an appropriate pressure rating.
  • the heat spreader device includes a lower panel and an upper panel.
  • Each panel is generally planar, including a top surface and a bottom surface.
  • the lower panel has condensate channels formed into its top surface, while the upper panel has vapor channels formed into its bottom surface (i.e., the channels are formed on generally opposing interior surfaces).
  • the channels formed into the upper and lower panels are spaced apart such that a plurality of crests is created.
  • the crests function as pillars, supporting the sheet against high pressures existing within the device.
  • the crests may be selectively joined (e.g., via welding) to create crest joints.
  • the device may be evacuated and charged with a vaporizable liquid, which is then sealed inside to create a heat-pipe environment.
  • the dimensions or shape of the condensate channels may differ from the dimensions or shape of the vapor channels such that the condensate channels can generate a higher capillary force than the vapor channels.
  • the condensate channels may possess dimensions smaller than those of the vapor channels.
  • the condensate channels may possess a shape differing from that of the vapor channels (e.g., the condensate channels may include sharper corners than the vapor channels).
  • the lower panel furthermore, may include a multi-wick structure, in which wicking power increases with decreasing distance to an evaporation region.
  • the multi-wick structure may also define a boiling-enhanced, multi-wick structure to promote evaporation and minimize boiling superheat.
  • FIG. 1 illustrates a perspective view of a vapor-augmented heat spreader in accordance with an embodiment of the invention.
  • FIG. 2A illustrates an exploded view of the vapor-augmented heat spreader taken along line A - A of FIG. 1.
  • FIG. 2B illustrates a cross sectional view of the vapor-augmented heat spreader taken along line A - A of FIG. 1, showing an embodiment including edge joint connections.
  • FIG. 3 illustrates a cross sectional view of the vapor-augmented heat spreader taken along line A - A of FIG. 1, showing an embodiment including a folded joint connection.
  • FIG. 4 illustrates a cross sectional view of the vapor-augmented heat spreader taken along line B - B of FIG. 1, further showing joints around a charging tube.
  • FIG. 5 illustrates a plan view of the interior surface of the lower sheet of FIG. 1, showing a groove structure formed into the lower sheet in accordance with an embodiment of the invention.
  • FIG. 6 illustrates a plan view of the interior surface of the upper sheet of FIG. 1, showing groove structure formed into the upper sheet in accordance with an embodiment of the invention.
  • FIG. 1 illustrates a perspective view of a vapor-augmented heat spreader in accordance with an embodiment of the invention.
  • the vapor-augmented heat spreader 100 may include a first (upper) fluid transfer element or sheet or panel 110, a second (lower) fluid transfer element or sheet or panel 120, and an optional charging tube 130 disposed between the sheets.
  • Each sheet 110, 120 may be generally planar, including a top surface and a bottom surface.
  • the upper sheet 110 includes an exterior surface 200A and an interior surface 205A; similarly, the lower sheet 120 also includes an exterior surface 200B and interior surface 205B (which faces the interior surface of the first sheet).
  • the upper sheet 110 may further include one or more air- grooves.
  • the exterior surface 200A of the upper sheet 110 may include an air groove 140A formed therein; similarly, the exterior surface 200B of the lower sheet 120 may include an air-groove 140B formed therein.
  • the air grooves 140A, 140B may be formed through stamping, selective etching, material removal, cutting, skiving, swaging, scribing, or other processes known in the art.
  • the thickness of the sheets 110, 120 may include, but is not limited to, about 12 ⁇ m to about 2 cm.
  • the charging tube 130 which is in fluid communication with the interior chamber of the heat spreader 100, may connect to a vacuum pump and/or liquid supply. In operation, the tube 130 is sealed after gases within the device are evacuated and/or after the device is charged with a vaporizable liquid.
  • FIGS. 2A and 2B illustrate cross sectional views of the device taken along lines A-A of FIG. 1, showing the internal structure of the vapor-augmented heat spreader 100 in accordance with an embodiment of the invention.
  • the upper sheet 110 includes one or more vapor channels or grooves 210A, 210B, 210C formed into its interior surface 205A (i.e., the surface facing the interior surface 205B of the lower sheet 120).
  • the dimensions and/or shape of the vapor grooves 210A - 210C may be any suitable for its described purpose.
  • the vapor grooves 210A - 210C are configured to allow for the condensation and passage of vapor once the condensate (i.e., the vaporizable liquid) is vaporized.
  • the shape of the vapor grooves 210A - 210C may include, but is not limited to, a circular shape 210A, a rectangular shape 210B, and polygonal shape 210C.
  • the rectangular 210B and the polygonal 210C vapor grooves moreover, may have rounded corners 220 (which may result from the groove formation process).
  • the vapor grooves 210A - 210C may be formed via stamping, selective etching, material removal, cutting, skiving, swaging, scribing or similar methods known in the art.
  • the overall vapor groove structure is formed using a combination of groove shapes (e.g., rounded and polygonal).
  • the vapor grooves 210A - 210C may be spaced apart such that crests 225 are selectively disposed along the interior surface 205A of the upper sheet 110 (discussed in greater detail below).
  • the groove structure moreover, may form predetermined patterns on the surface, including, but not limited to grid patterns and/or a leaf- vein patterns (FIG. 6).
  • the lower sheet 120 includes one or more condensate channels or grooves 230A, 230B, 230C, 230D, 230E (also called vaporizable liquid grooves) formed into its interior surface 205B (i.e., the surface facing the interior surface 205A of the upper sheet 110).
  • the condensate grooves 230A - 230E are wicking structures configured to transport vaporizable liquid, e.g., toward the evaporation region of the lower sheet.
  • the condensate grooves 230A - 230E may be formed via stamping, selective etching, machining, material removal, cutting, skiving, swaging, scribing, or similar processes known in the art.
  • the shape of the condensate grooves 230A - 230E includes, but is not limited to, a triangular shape 230A, a rectangular shape 230B, and a circular shape 230C, as well as the shape resulting from forming the grooves using techniques such as skiving 230D (crescent-like shapes) and scribing 230E (e.g., having generally flat, parallel side walls and generally V-shaped base).
  • the condensate grooves 230A - 230E possessing a triangular shape 230A and a rectangular shape 230B may further have rounded corners 220 (which may result from the groove formation processes of the grooves 230A - 230E).
  • the overall condensate groove structure is formed using a combination shapes (e.g., rounded and polygonal).
  • the condensate grooves 230A - 230E may be spaced apart such that crests 235 are formed along the interior surface 205B of the lower sheet 120.
  • the condensate grooves 230A - 230E may form predetermined patterns on the surface, including, but not limited to grid patterns and/or a leaf-vein patterns (FIG. 5).
  • the condensate groove structure may further define a multi-wick structure — a structure having wicking power that increases with decreasing distance to the evaporation region (i.e., the region proximate the heat source).
  • the condensate groove structure may further incorporate a boiling-enhanced, multi-wick structure 240 to promote evaporation and minimize boiling superheat.
  • the overall condensate groove structure may be formed by selectively combining the boiling-enhanced, multi-wick structure, as well as condensate grooves 230A - 230E having various shapes. Additional information on multi-wick structures (with or without boiling enhancement) is disclosed in U.S. Patent Application No.
  • the condensate grooves should possess characteristics capable of giving rise to a higher capillary force than the vapor grooves .
  • the capillary force generated by each vapor groove 210A - 210C may be lower than the capillary force generated by each condensate groove 230A - 230E.
  • the condensate groove 230A - 230E may (1) possess a smaller size than the vapor grooves 210A - 210C and/or (2) possess a geometry/shape with sharper corners than the geometry/shape of the vapor grooves 210A - 210C.
  • the upper sheet 110 may be coupled (i.e., functionally joined/sealed) to the lower sheet 120 via processes such as ultrasonic welding, thermosonic welding, TIG welding, plasma welding, laser welding, soldering, brazing or any other methods known in the art.
  • the crests 225, 235 which selectively define contact areas between the interior surface 205 A of the upper sheet 110 and the interior surface 205B of the lower sheet, may be selectively sealed to form crest joints 250.
  • the crest joints 250 effectively form a series of pillars within the chamber, providing strength to the vapor-augmented heat spreader 110 and enabling the device to resist the high level of vapor pressure the heat spreader device 100 has to sustain during reflow process (e.g., pressures created in environments of about 200°C).
  • crest joints 250 may be formed wherever the crests 225, 235 on the two sheets 110, 120 are in mechanical contact with each other. This configuration differs from ordinary vapor chambers having solid internal inserts in that the present crest joints 250 have only one joining interface (although each sheet may itself consist of a plurality of plated and/or coating materials for joint promotion purposes).
  • the number of contact areas that are sealed to form crest joints 250 is not particularly limited. Preferably, at least about 10% of the planar sheet area should be utilized in forming crest joints 250 to provide the heat spreader device 100 with sufficient mechanical strength to withstand the forces generated during the operation of the device.
  • the vapor-augmented heat spreader device 100 may include an edge joint or seal 260 disposed along the seam of the heat spreader device 100 (i.e., where the edges of the two sheets 110, 120 come into contact with each other).
  • the edge joints 260 seal the two sheets 110, 120 together, maintaining a fluid tight seal within the device 100.
  • the vapor- augmented heat spreader device 100 may also be formed from a single sheet folded over onto itself, creating a structure where the upper sheet or panel 110 and lower sheet or panel 120 are connected along one side via a folded-joint 300.
  • One or more edge joints 260 similar to those discussed above may be utilized to seal the remaining sides of the device 100 together.
  • the edge joints 260 and crest joints 250 may be formed together or separately using the same or different processes.
  • the crest joints 260 and edge joints 250 may be formed simultaneously using thermosonic welding.
  • the upper 110 and lower 120 sheets may be coupled together, the tube 130 inserted, and then sealed as described above (e.g., via edge joints 260).
  • the heat spreader device 100 may then be evacuated and charged with a vaporizable liquid (via the tube 130). Once charged, the tube 130 may be sealed to maintain the internal conditions of the device 100.
  • FIG. 4 illustrates a cross- sectional view of the vapor-augmented heat spreader 100 taken along lines B-B of FIG. 1. As shown, in the area where the charging tube 130 is connected to the upper sheet 110 and the lower sheet 120, tube edge joints 400 may further be utilized to form a fluid tight seal.
  • FIG. 5 illustrates a plan view of the lower sheet 120 in isolation, showing the interior surface 205B of the lower sheet 120 (i.e., FIG. 5 illustrates a top view the device of FIG. 1, with the upper sheet 110 removed for clarity) and a condensate groove structure formed thereon in accordance with an embodiment of the invention.
  • the condensate groove structure may be formed utilizing one or more predetermined groove patterns.
  • the condensate groove structure includes a combination of patterns such as a grid pattern 500, a leaf vein pattern 510, and/or a multi-wick structure pattern 520 (described above).
  • the condensate groove structure may include the boiling-enhanced, multi- wick structure 520 within the evaporation region.
  • the mechanical contact points 225, 235 of the crests may be utilized to create crest joints 250, e.g., by selectively welding the desired crests together.
  • FIG. 6 illustrates a plan view of the upper sheet 110 in isolation (i.e., FIG. 6 illustrates a bottom view of the device of FIGS. 1 and/or 3, with the lower sheet 120 removed for clarity), showing a vapor groove structure formed on interior surface 205A of the upper sheet 110 in accordance with an embodiment of the invention.
  • the vapor groove structure may be formed utilizing one or more predetermined patterns including, but not limited to, a grid pattern 600 and a leaf-vein pattern 610.
  • FIG. 5 the condensate groove structure
  • FIG. 6 vapor groove structure
  • the vapor-augmented heat spreader 100 is capable of sustaining the high vapor pressure generated at solder reflow temperatures.
  • the groove structures are instrumental in (1) reducing the internal volume of a vapor chamber (thereby decreasing the surface area through which the vapor pressure can act) and (2) increasing the portion/number of directly bonded surfaces, thereby increasing the structure's mechanical strength.
  • the internal volume of the present vapor-augmented heat spreader 100 is provided only by the groove structures formed into the sheets 110, 120 (e.g., like the veins of a leaf).
  • the groove structures formed into the sheets 110, 120 (e.g., like the veins of a leaf).
  • the above groove structure enables the selective increase of the device's in-plane thermal spreading ability, while providing joints sufficient to ensure minimum resistances to through- plane heat flow, as well as ensuring the appropriate pressure rating
  • the heat spreader device 100 may possess any shape or have any suitable dimensions.
  • the device 100 may include a pair of generally rectangular plates brought into contact with each other.
  • the bottom plate may further include an evaporation region defined therein.
  • the upper 110 and lower 120 sheets may be formed from materials including, but not limited to, metal, metallic composites, polymer (with or without metallic lining which may be formed by plating, deposition, or any other methods known in the arts), and combinations thereof.
  • the upper 110 and lower 120 sheets may be form separate components of the device 100, or may possess a unitary structure, wherein the sheets are portions of a larger sheet, which are then folded during joining to eliminate the need for one of the edge-joints.
  • the vapor grooves 210A - 210C and the condensate grooves 230A - 230E on the sheets 110, 120 could form structured grid-like patterns or irregular patterns like veins on a leaf.
  • the shape of the grooves may be rounded (like semi-circular or semi-elliptic), rectangular, polygonal, triangular, or combinations thereof.
  • the manner of providing the higher capillary force to the condensate grooves may be provided by size differentiation, shape differentiation, or both.
  • the condensate and vapor grooves may possess the same size, but have different geometries (shapes).
  • the condensate and vapor grooves may possess similar geometries, but possess different sizes.
  • a smaller rectangular groove could generate a higher surface tension force than a larger rectangular groove.
  • rectangular grooves of different aspect ratios are well-known to generate different surface tension forces.
  • the surface of a sheet 110, 120 i.e., the groove structure
  • the charging port or tube 130 may be formed out of separate sections of the two sheets 110, 120.
  • the tube 130 may be a solid tube attached to the device 100 to maintain compatibility with standard vacuum pump interfaces.
  • the solid tube 130 may be attached through welding, soldering, or any other similar methods known in the arts.
  • the vaporizable liquid can be water, alcohol, ammonia, organic liquid or any other similar materials known in the arts.
  • the air groove 140A, 140B may possess any suitable shape or possess any suitable dimensions suitable for its described purpose.
  • the number of air grooves is not limited — the air groove be formed on the exterior surface 200B of the lower sheet 120 and/or the exterior surface 200A of the upper sheet 110 in order to allow air to properly escape in the presence of solder flux or thermal interface material.
  • the air grooves 140A, 140B may be formed through stamping, selective etching, material removal, cutting, skiving, swaging, scribing, or other processes that are known in the arts.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dissipateur thermique à augmentation de vapeur (100) qui comprend une feuille inférieure (120) en communication avec une feuille supérieure (110). La feuille inférieure (120) comprend des rainures de condensat (230A-230E) formées dans la surface supérieure (250B) et la feuille supérieure (110), une série de rainures de vapeur (210A-210C). Les dimensions des rainures de condensat diffèrent de celles des rainures de vapeur. Par exemple, les rainures de condensat peuvent être de dimensions inférieures aux rainures de vapeur. La feuille inférieure (120) peut également comprendre une structure à mèches multiples en communication avec les rainures de condensat. Cette feuille inférieure (120) peut être couplée à la feuille supérieure (110) au moyen d'un ou plusieurs joints de crête ou de bord.
PCT/US2008/056166 2007-03-08 2008-03-07 Dissipateur thermique à augmentation de vapeur Ceased WO2008109804A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89380107P 2007-03-08 2007-03-08
US60/893,801 2007-03-08

Publications (1)

Publication Number Publication Date
WO2008109804A1 true WO2008109804A1 (fr) 2008-09-12

Family

ID=39494288

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/056166 Ceased WO2008109804A1 (fr) 2007-03-08 2008-03-07 Dissipateur thermique à augmentation de vapeur

Country Status (3)

Country Link
US (1) US20080216994A1 (fr)
TW (1) TW200848683A (fr)
WO (1) WO2008109804A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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* Cited by examiner, † Cited by third party
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CN102466423A (zh) * 2010-11-19 2012-05-23 比亚迪股份有限公司 一种导热板及其制备方法
US20130206369A1 (en) * 2012-02-13 2013-08-15 Wei-I Lin Heat dissipating device
US20160131437A1 (en) * 2014-11-12 2016-05-12 Asia Vital Components Co., Ltd. Thin heat pipe structure
US20160209122A1 (en) * 2015-01-20 2016-07-21 Chaun-Choung Technology Corp. Slim-type vapor chamber and capillary structure thereof
US10175005B2 (en) * 2015-03-30 2019-01-08 Infinera Corporation Low-cost nano-heat pipe
JP7167416B2 (ja) * 2017-02-09 2022-11-09 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用金属シートおよびベーパーチャンバの製造方法
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WO2019065864A1 (fr) * 2017-09-29 2019-04-04 株式会社村田製作所 Chambre de vapeur
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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754594A (en) * 1972-01-24 1973-08-28 Sanders Associates Inc Unilateral heat transfer apparatus
JPS6383587A (ja) * 1986-09-29 1988-04-14 Toshiba Corp 平板形ヒ−トパイプ
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US6863118B1 (en) * 2004-02-12 2005-03-08 Hon Hai Precision Ind. Co., Ltd. Micro grooved heat pipe
US20050051304A1 (en) * 2002-12-12 2005-03-10 Sony Corporation Heat transport device and electronic device
US20050183847A1 (en) * 2004-02-24 2005-08-25 Shwin-Chung Wong Microchannel flat-plate heat pipe with parallel grooves for recycling coolant
US20050280162A1 (en) * 2004-06-18 2005-12-22 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
WO2006099837A1 (fr) * 2005-03-21 2006-09-28 Curamik Electronics Gmbh Systeme de refroidissement pour refroidir des composants d'appareils electroniques, par exemple de calculateurs et appareil electronique, par exemple calculateur muni d'un tel systeme de refroidissement et tube calorifique

Family Cites Families (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3587725A (en) * 1968-10-16 1971-06-28 Hughes Aircraft Co Heat pipe having a substantially unidirectional thermal path
US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3598180A (en) * 1970-07-06 1971-08-10 Robert David Moore Jr Heat transfer surface structure
US3803688A (en) * 1971-07-13 1974-04-16 Electronic Communications Method of making a heat pipe
CS159563B1 (fr) * 1972-12-28 1975-01-31
US3892273A (en) * 1973-07-09 1975-07-01 Perkin Elmer Corp Heat pipe lobar wicking arrangement
US4021816A (en) * 1973-10-18 1977-05-03 E-Systems, Inc. Heat transfer device
US4125387A (en) * 1974-09-19 1978-11-14 Ppg Industries, Inc. Heat pipes for fin coolers
US4009417A (en) * 1975-01-27 1977-02-22 General Electric Company Electrical apparatus with heat pipe cooling
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
US4046190A (en) * 1975-05-22 1977-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flat-plate heat pipe
US4170262A (en) * 1975-05-27 1979-10-09 Trw Inc. Graded pore size heat pipe wick
US4145708A (en) * 1977-06-13 1979-03-20 General Electric Company Power module with isolated substrates cooled by integral heat-energy-removal means
US4279294A (en) * 1978-12-22 1981-07-21 United Technologies Corporation Heat pipe bag system
US4322737A (en) * 1979-11-20 1982-03-30 Intel Corporation Integrated circuit micropackaging
US4351388A (en) * 1980-06-13 1982-09-28 Mcdonnell Douglas Corporation Inverted meniscus heat pipe
US4489777A (en) * 1982-01-21 1984-12-25 Del Bagno Anthony C Heat pipe having multiple integral wick structures
US4523636A (en) * 1982-09-20 1985-06-18 Stirling Thermal Motors, Inc. Heat pipe
US4616699A (en) * 1984-01-05 1986-10-14 Mcdonnell Douglas Corporation Wick-fin heat pipe
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US4785875A (en) * 1987-11-12 1988-11-22 Stirling Thermal Motors, Inc. Heat pipe working liquid distribution system
US4944344A (en) * 1988-10-31 1990-07-31 Sundstrand Corporation Hermetically sealed modular electronic cold plate utilizing reflux cooling
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
JPH0731027B2 (ja) * 1992-09-17 1995-04-10 伊藤 さとみ ヒートパイプおよび放熱装置
US5309986A (en) * 1992-11-30 1994-05-10 Satomi Itoh Heat pipe
US5427174A (en) * 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5780928A (en) * 1994-03-07 1998-07-14 Lsi Logic Corporation Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US6208513B1 (en) * 1995-01-17 2001-03-27 Compaq Computer Corporation Independently mounted cooling fins for a low-stress semiconductor package
JPH08264694A (ja) * 1995-03-20 1996-10-11 Calsonic Corp 電子部品用冷却装置
JP3216770B2 (ja) * 1995-03-20 2001-10-09 カルソニックカンセイ株式会社 電子部品用冷却装置
TW307837B (fr) * 1995-05-30 1997-06-11 Fujikura Kk
JPH098190A (ja) * 1995-06-22 1997-01-10 Calsonic Corp 電子部品用冷却装置
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
JP3164518B2 (ja) * 1995-12-21 2001-05-08 古河電気工業株式会社 平面型ヒートパイプ
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
US5769154A (en) * 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US5642776A (en) * 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
JPH10154781A (ja) * 1996-07-19 1998-06-09 Denso Corp 沸騰冷却装置
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
WO1998033031A1 (fr) * 1997-01-29 1998-07-30 Deutsches Zentrum für Luft- und Raumfahrt e.V. Tube echangeur de chaleur et procede permettant de le produire
DE19805930A1 (de) * 1997-02-13 1998-08-20 Furukawa Electric Co Ltd Kühlvorrichtung
US6424528B1 (en) * 1997-06-20 2002-07-23 Sun Microsystems, Inc. Heatsink with embedded heat pipe for thermal management of CPU
EP0889524A3 (fr) * 1997-06-30 1999-03-03 Sun Microsystems, Inc. Système de refroidissement échelonnable et modulaire de type dissipateur de chaleur-caloduc
US6062302A (en) * 1997-09-30 2000-05-16 Lucent Technologies Inc. Composite heat sink
JPH11121667A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd ヒートパイプ式冷却装置
TW378267B (en) * 1997-12-25 2000-01-01 Furukawa Electric Co Ltd Heat sink
CN1179187C (zh) * 1998-04-13 2004-12-08 古河电气工业株式会社 板式热管及采用热管的冷却装置
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
JP2000124374A (ja) * 1998-10-21 2000-04-28 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた冷却構造
US6121680A (en) * 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US6189601B1 (en) * 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
US6237223B1 (en) * 1999-05-06 2001-05-29 Chip Coolers, Inc. Method of forming a phase change heat sink
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6490160B2 (en) * 1999-07-15 2002-12-03 Incep Technologies, Inc. Vapor chamber with integrated pin array
US6244331B1 (en) * 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
US6410982B1 (en) * 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
US6317322B1 (en) * 2000-08-15 2001-11-13 The Furukawa Electric Co., Ltd. Plate type heat pipe and a cooling system using same
JP4423792B2 (ja) * 2000-09-14 2010-03-03 株式会社デンソー 沸騰冷却装置
US6474074B2 (en) * 2000-11-30 2002-11-05 International Business Machines Corporation Apparatus for dense chip packaging using heat pipes and thermoelectric coolers
US20020144804A1 (en) * 2001-01-19 2002-10-10 Yue Liang Thermal transfer device and working fluid therefor including a kinetic ice inhibitor
US6418019B1 (en) * 2001-03-19 2002-07-09 Harris Corporation Electronic module including a cooling substrate with fluid dissociation electrodes and related methods
CN1126169C (zh) * 2001-03-26 2003-10-29 张吉美 一种冷却器
US20020195231A1 (en) * 2001-04-09 2002-12-26 Siu Wing Ming Laminated heat transfer device and method of producing thereof
JP2004528717A (ja) * 2001-04-30 2004-09-16 サーモ コムポジット、エルエルシー 熱管理材料、デバイスおよび方法
KR100429840B1 (ko) * 2001-07-19 2004-05-04 삼성전자주식회사 마이크로 냉각 장치
US6533029B1 (en) * 2001-09-04 2003-03-18 Thermal Corp. Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
US7080680B2 (en) * 2001-09-05 2006-07-25 Showa Denko K.K. Heat sink, control device having the heat sink and machine tool provided with the device
US20030075306A1 (en) * 2001-10-19 2003-04-24 Jon Zuo Thermal control layer in miniature LHP/CPL wicks
US6609561B2 (en) * 2001-12-21 2003-08-26 Intel Corporation Tunnel-phase change heat exchanger
US6477045B1 (en) * 2001-12-28 2002-11-05 Tien-Lai Wang Heat dissipater for a central processing unit
US6679318B2 (en) * 2002-01-19 2004-01-20 Allan P Bakke Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability
US20030136550A1 (en) * 2002-01-24 2003-07-24 Global Win Technology Heat sink adapted for dissipating heat from a semiconductor device
US6460612B1 (en) * 2002-02-12 2002-10-08 Motorola, Inc. Heat transfer device with a self adjusting wick and method of manufacturing same
US6827134B1 (en) * 2002-04-30 2004-12-07 Sandia Corporation Parallel-plate heat pipe apparatus having a shaped wick structure
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
US6880626B2 (en) * 2002-08-28 2005-04-19 Thermal Corp. Vapor chamber with sintered grooved wick
TW540989U (en) * 2002-10-04 2003-07-01 Via Tech Inc Thin planar heat distributor
US7246655B2 (en) * 2004-12-17 2007-07-24 Fujikura Ltd. Heat transfer device
TWI273210B (en) * 2004-12-30 2007-02-11 Delta Electronics Inc Heat-dissipation device and fabricating method thereof
US20070227703A1 (en) * 2006-03-31 2007-10-04 Bhatti Mohinder S Evaporatively cooled thermosiphon

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754594A (en) * 1972-01-24 1973-08-28 Sanders Associates Inc Unilateral heat transfer apparatus
JPS6383587A (ja) * 1986-09-29 1988-04-14 Toshiba Corp 平板形ヒ−トパイプ
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US20050051304A1 (en) * 2002-12-12 2005-03-10 Sony Corporation Heat transport device and electronic device
US6863118B1 (en) * 2004-02-12 2005-03-08 Hon Hai Precision Ind. Co., Ltd. Micro grooved heat pipe
US20050183847A1 (en) * 2004-02-24 2005-08-25 Shwin-Chung Wong Microchannel flat-plate heat pipe with parallel grooves for recycling coolant
US20050280162A1 (en) * 2004-06-18 2005-12-22 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
WO2006099837A1 (fr) * 2005-03-21 2006-09-28 Curamik Electronics Gmbh Systeme de refroidissement pour refroidir des composants d'appareils electroniques, par exemple de calculateurs et appareil electronique, par exemple calculateur muni d'un tel systeme de refroidissement et tube calorifique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105403084A (zh) * 2015-11-26 2016-03-16 北京卫星制造厂 一种大面积轻薄型高导热微槽道平板热管

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