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WO2008155297A3 - Mems bauelement und verfahren zur herstellung - Google Patents

Mems bauelement und verfahren zur herstellung Download PDF

Info

Publication number
WO2008155297A3
WO2008155297A3 PCT/EP2008/057502 EP2008057502W WO2008155297A3 WO 2008155297 A3 WO2008155297 A3 WO 2008155297A3 EP 2008057502 W EP2008057502 W EP 2008057502W WO 2008155297 A3 WO2008155297 A3 WO 2008155297A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
production
metal
chip
mems component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/057502
Other languages
English (en)
French (fr)
Other versions
WO2008155297A2 (de
Inventor
Christian Bauer
Hans Krueger
Werner Ruile
Alois Stelzl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to JP2010512656A priority Critical patent/JP5203454B2/ja
Publication of WO2008155297A2 publication Critical patent/WO2008155297A2/de
Publication of WO2008155297A3 publication Critical patent/WO2008155297A3/de
Priority to US12/642,357 priority patent/US8110962B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

Zur Vermeidung störender Reflexionen und akustischer Volumenwellen wird bei einem MEMS-Bauelement, welches einen die Bauelementstruktur tragenden Chip umfasst, auf der den Bauelementstrukturen entgegengesetzten Rückseite des Chips eine Metallstruktur zur Streuung von akustischen Volumenwellen vorgesehen. Die Metallstrukturen umfassen ein akustisch an das Material des Chips angepasstes Metall.
PCT/EP2008/057502 2007-06-20 2008-06-13 Mems bauelement und verfahren zur herstellung Ceased WO2008155297A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010512656A JP5203454B2 (ja) 2007-06-20 2008-06-13 Ｍｅｍｓ部品及び製造方法
US12/642,357 US8110962B2 (en) 2007-06-20 2009-12-18 MEMS component and method for production

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007028288A DE102007028288B4 (de) 2007-06-20 2007-06-20 Mit akustischen Wellen arbeitendes MEMS Bauelement und Verfahren zur Herstellung
DE102007028288.7 2007-06-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/642,357 Continuation US8110962B2 (en) 2007-06-20 2009-12-18 MEMS component and method for production

Publications (2)

Publication Number Publication Date
WO2008155297A2 WO2008155297A2 (de) 2008-12-24
WO2008155297A3 true WO2008155297A3 (de) 2009-03-19

Family

ID=40030679

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/057502 Ceased WO2008155297A2 (de) 2007-06-20 2008-06-13 Mems bauelement und verfahren zur herstellung

Country Status (4)

Country Link
US (1) US8110962B2 (de)
JP (1) JP5203454B2 (de)
DE (1) DE102007028288B4 (de)
WO (1) WO2008155297A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2923650B1 (fr) * 2007-11-08 2010-09-03 Commissariat Energie Atomique Composant electronique a connexions par billes decouplees mecaniquement.
US8243075B2 (en) * 2008-10-14 2012-08-14 Autodesk, Inc. Graphics processing unit accelerated dynamic radial tessellation
DE102010032506A1 (de) 2010-07-28 2012-02-02 Epcos Ag Modul und Herstellungsverfahren
DE102011016554B4 (de) * 2011-04-08 2018-11-22 Snaptrack, Inc. Waferlevel-Package und Verfahren zur Herstellung
DE102012204560A1 (de) * 2012-03-22 2013-09-26 BSH Bosch und Siemens Hausgeräte GmbH Wäschetrommel mit einem Strukturmuster sowie Wäschebehandlungsmaschine mit solcher Wäschetrommel
DE102012204559A1 (de) * 2012-03-22 2013-09-26 BSH Bosch und Siemens Hausgeräte GmbH Haushaltsgerät mit einem Prägemuster
JP6193480B2 (ja) * 2013-05-24 2017-09-06 スナップトラック・インコーポレーテッド 微小電気機械システムデバイスパッケージおよび微小電気機械システムデバイスパッケージを製造するための方法
US11740399B2 (en) * 2018-02-06 2023-08-29 Raytheon Company Low cost dispersive optical elements
US11244876B2 (en) * 2019-10-09 2022-02-08 Microchip Technology Inc. Packaged semiconductor die with micro-cavity

Citations (5)

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Publication number Priority date Publication date Assignee Title
US3887887A (en) * 1973-12-28 1975-06-03 Texas Instruments Inc Acoustic bulk mode suppressor
DE2845610B1 (de) * 1978-10-19 1979-07-12 Siemens Ag Oberflaechenwellenfilter mit minimalem UEbersprechen
DE3729014A1 (de) * 1987-08-31 1989-03-09 Siemens Ag Oberflaechenwellenbauteil mit unterdrueckung unerwuenschter akustischer wellen
EP1168612A2 (de) * 2000-06-27 2002-01-02 Murata Manufacturing Co., Ltd. Akustische Oberflächenwellenanordnung
US20050034888A1 (en) * 2001-12-28 2005-02-17 Christian Hoffmann Encapsulated component which is small in terms of height and method for producing the same

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JPS5619467Y2 (de) * 1976-02-12 1981-05-08
JPS52153647A (en) * 1976-06-17 1977-12-20 Victor Co Of Japan Ltd Elastic surface wave element
JPS58119219A (ja) * 1982-01-11 1983-07-15 Hitachi Ltd 弾性表面波装置
JP3140759B2 (ja) * 1990-04-02 2001-03-05 キンセキ株式会社 弾性表面波素子の製造方法
DE4400117C2 (de) 1994-01-04 1996-08-22 Siemens Ag Rasterung für digitale Bilderfassung
JP3480626B2 (ja) * 1995-07-21 2003-12-22 富士通株式会社 弾性表面波素子の電極形成方法
US6140144A (en) * 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
JP3614258B2 (ja) * 1996-10-25 2005-01-26 株式会社ルネサステクノロジ 半導体素子、および半導体装置の製造方法
US6839108B1 (en) * 1998-05-16 2005-01-04 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method of manufacturing the same
JP2001053579A (ja) * 1999-06-02 2001-02-23 Matsushita Electric Ind Co Ltd 弾性表面波素子と移動体通信機器
US6787339B1 (en) * 2000-10-02 2004-09-07 Motorola, Inc. Microfluidic devices having embedded metal conductors and methods of fabricating said devices
DE10056716B4 (de) * 2000-11-15 2007-10-18 Robert Bosch Gmbh Mikrostrukturbauelement
JP4063255B2 (ja) * 2000-12-25 2008-03-19 セイコーエプソン株式会社 振動片の製造方法、振動子の製造方法、発振器の製造方法及び電子機器の製造方法
JP2003087004A (ja) * 2001-09-10 2003-03-20 Tdk Corp バンドパスフィルタ
JP2003133875A (ja) * 2001-10-24 2003-05-09 Seiko Epson Corp 振動片の製造方法、振動片、振動子、発振器及び電子機器
DE10238523B4 (de) 2002-08-22 2014-10-02 Epcos Ag Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung
JP4454410B2 (ja) * 2004-06-28 2010-04-21 京セラ株式会社 弾性表面波装置およびその製造方法ならびに通信装置
JP4514571B2 (ja) * 2004-09-15 2010-07-28 京セラ株式会社 弾性表面波装置およびその製造方法ならびに通信装置
DE102005050398A1 (de) * 2005-10-20 2007-04-26 Epcos Ag Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung
US7642135B2 (en) * 2007-12-17 2010-01-05 Skyworks Solutions, Inc. Thermal mechanical flip chip die bonding

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3887887A (en) * 1973-12-28 1975-06-03 Texas Instruments Inc Acoustic bulk mode suppressor
DE2845610B1 (de) * 1978-10-19 1979-07-12 Siemens Ag Oberflaechenwellenfilter mit minimalem UEbersprechen
DE3729014A1 (de) * 1987-08-31 1989-03-09 Siemens Ag Oberflaechenwellenbauteil mit unterdrueckung unerwuenschter akustischer wellen
EP1168612A2 (de) * 2000-06-27 2002-01-02 Murata Manufacturing Co., Ltd. Akustische Oberflächenwellenanordnung
US20050034888A1 (en) * 2001-12-28 2005-02-17 Christian Hoffmann Encapsulated component which is small in terms of height and method for producing the same

Also Published As

Publication number Publication date
US20100148285A1 (en) 2010-06-17
US8110962B2 (en) 2012-02-07
DE102007028288A1 (de) 2008-12-24
DE102007028288B4 (de) 2013-06-06
WO2008155297A2 (de) 2008-12-24
JP5203454B2 (ja) 2013-06-05
JP2010530686A (ja) 2010-09-09

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