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WO2008152833A1 - 硬化性組成物および光学デバイス - Google Patents

硬化性組成物および光学デバイス Download PDF

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Publication number
WO2008152833A1
WO2008152833A1 PCT/JP2008/053439 JP2008053439W WO2008152833A1 WO 2008152833 A1 WO2008152833 A1 WO 2008152833A1 JP 2008053439 W JP2008053439 W JP 2008053439W WO 2008152833 A1 WO2008152833 A1 WO 2008152833A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
optical device
compound
temperature
anoptical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053439
Other languages
English (en)
French (fr)
Inventor
Seiji Nakajima
Tomohiro Fukuhara
Mitsuo Ito
Naoki Masutani
Hiroyuki Terai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Toagosei Co Ltd
Original Assignee
Omron Corp
Toagosei Co Ltd
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Toagosei Co Ltd, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of WO2008152833A1 publication Critical patent/WO2008152833A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L13/00—Compositions of rubbers containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

　本発明は、カルボキシ末端ブタジエンニトリルゴム変性ビスフェノールＡ型エポキシ化合物（Ａ－１）および／またはエポキシ化ポリブタジエン化合物（Ａ－２）と、上記（Ａ－１）および（Ａ－２）以外のカチオン重合性化合物（Ｂ）とを含有する硬化性組成物であって、当該硬化性組成物の硬化物の２５°C、５８９ｎｍでの屈折率が１．４０以上１．６０以下であることを特徴とする硬化性組成物に関する。これにより、高温環境下または高温高湿度環境下でも剥離等の不具合を起こすことなく、長期にわたり、光学デバイスの接着を実現出来る硬化性組成物、およびそれを用いた光学デバイスを提供する。
PCT/JP2008/053439 2007-06-14 2008-02-27 硬化性組成物および光学デバイス Ceased WO2008152833A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007157987A JP5401767B2 (ja) 2007-06-14 2007-06-14 硬化性組成物および光学デバイス
JP2007-157987 2007-06-14

Publications (1)

Publication Number Publication Date
WO2008152833A1 true WO2008152833A1 (ja) 2008-12-18

Family

ID=40129446

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053439 Ceased WO2008152833A1 (ja) 2007-06-14 2008-02-27 硬化性組成物および光学デバイス

Country Status (2)

Country Link
JP (1) JP5401767B2 (ja)
WO (1) WO2008152833A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150422A (ja) * 2008-12-25 2010-07-08 Toagosei Co Ltd 接着剤組成物
JP2010265360A (ja) * 2009-05-13 2010-11-25 Nitto Denko Corp 光学部品用樹脂組成物およびそれを用いた光学部品
JP2012001689A (ja) * 2010-06-21 2012-01-05 Adeka Corp 光硬化性樹脂組成物
JP2012121980A (ja) * 2010-12-08 2012-06-28 Ube Industries Ltd 変性単独重合体ジエン系ゴム及びその製造方法並びにそれを用いたゴム組成物

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5446902B2 (ja) * 2009-03-05 2014-03-19 Ｄｉｃ株式会社 カチオン重合性接着剤及びそれを用いて得られた偏光板
JP5351850B2 (ja) * 2010-07-30 2013-11-27 日立電線株式会社 光モジュール
JP5697927B2 (ja) * 2010-09-03 2015-04-08 株式会社日本触媒 光学用接着剤組成物
JP2012082261A (ja) * 2010-10-07 2012-04-26 Kaneka Corp 光硬化性組成物およびその硬化物
CN103764708B (zh) * 2011-08-25 2016-12-14 东洋油墨Sc控股株式会社 光聚合性组合物、光聚合性涂覆剂、层叠体及偏光板
JP5304859B2 (ja) * 2011-08-25 2013-10-02 東洋インキＳｃホールディングス株式会社 光重合性組成物、およびその用途
JP5967654B2 (ja) * 2012-11-28 2016-08-10 日本化薬株式会社 樹脂組成物及びその硬化物（２）
JP6284721B2 (ja) * 2013-08-26 2018-02-28 株式会社Adeka エネルギー線感受性組成物
JP6789218B2 (ja) * 2015-07-27 2020-11-25 株式会社Adeka 樹脂組成物及び硬化物
JP6880809B2 (ja) * 2016-12-09 2021-06-02 東亞合成株式会社 活性エネルギー線硬化型封止剤用組成物
JP7790035B2 (ja) * 2021-06-07 2025-12-23 東亞合成株式会社 硬化膜を有する基材の製造方法
WO2023243227A1 (ja) * 2022-06-16 2023-12-21 パナソニックＩｐマネジメント株式会社 光導波路の接続方法及び光導波路接続装置
CN120936646A (zh) * 2023-03-29 2025-11-11 三井化学株式会社 树脂组合物、液晶密封剂以及使用其的液晶显示面板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136563A (ja) * 1984-12-07 1986-06-24 Toyo Ink Mfg Co Ltd 光硬化型接着性組成物とそれを用いて被着体を接着する方法
JPS61213217A (ja) * 1985-03-19 1986-09-22 Nippon Soda Co Ltd 封着用光硬化性組成物
JPS6296579A (ja) * 1985-10-24 1987-05-06 Nippon Soda Co Ltd 光デイスクメモリ用光硬化性接着剤
JP2001040068A (ja) * 1999-07-27 2001-02-13 Asahi Denka Kogyo Kk 光重合性組成物
WO2003087187A1 (fr) * 2002-04-15 2003-10-23 Toagosei Co., Ltd. Composition de resine durcissable aux rayonnements actiniques et produit de durcissement de cette derniere
JP2005042052A (ja) * 2003-07-24 2005-02-17 Sekisui Chem Co Ltd 光カチオン重合性組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136563A (ja) * 1984-12-07 1986-06-24 Toyo Ink Mfg Co Ltd 光硬化型接着性組成物とそれを用いて被着体を接着する方法
JPS61213217A (ja) * 1985-03-19 1986-09-22 Nippon Soda Co Ltd 封着用光硬化性組成物
JPS6296579A (ja) * 1985-10-24 1987-05-06 Nippon Soda Co Ltd 光デイスクメモリ用光硬化性接着剤
JP2001040068A (ja) * 1999-07-27 2001-02-13 Asahi Denka Kogyo Kk 光重合性組成物
WO2003087187A1 (fr) * 2002-04-15 2003-10-23 Toagosei Co., Ltd. Composition de resine durcissable aux rayonnements actiniques et produit de durcissement de cette derniere
JP2005042052A (ja) * 2003-07-24 2005-02-17 Sekisui Chem Co Ltd 光カチオン重合性組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150422A (ja) * 2008-12-25 2010-07-08 Toagosei Co Ltd 接着剤組成物
JP2010265360A (ja) * 2009-05-13 2010-11-25 Nitto Denko Corp 光学部品用樹脂組成物およびそれを用いた光学部品
JP2012001689A (ja) * 2010-06-21 2012-01-05 Adeka Corp 光硬化性樹脂組成物
JP2012121980A (ja) * 2010-12-08 2012-06-28 Ube Industries Ltd 変性単独重合体ジエン系ゴム及びその製造方法並びにそれを用いたゴム組成物

Also Published As

Publication number Publication date
JP5401767B2 (ja) 2014-01-29
JP2008308588A (ja) 2008-12-25

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