[go: up one dir, main page]

WO2008146812A1 - Imaging device manufacturing method, imaging device and optical element - Google Patents

Imaging device manufacturing method, imaging device and optical element Download PDF

Info

Publication number
WO2008146812A1
WO2008146812A1 PCT/JP2008/059719 JP2008059719W WO2008146812A1 WO 2008146812 A1 WO2008146812 A1 WO 2008146812A1 JP 2008059719 W JP2008059719 W JP 2008059719W WO 2008146812 A1 WO2008146812 A1 WO 2008146812A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging device
optical element
component
substrate
camera module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059719
Other languages
French (fr)
Japanese (ja)
Inventor
Daisuke Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of WO2008146812A1 publication Critical patent/WO2008146812A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

Provided are an imaging device manufacturing method which is applicable to reflow process and excellent in optical characteristics, an imaging device and an optical element. The imaging device manufacturing method has a step of forming an optical element by curing a curable resin composition. The resin composition contains, as essential components, a component (A), which is an organic compound composed of an organic structure containing at least two carbon-carbon double bonds which react with a SiH group in a molecule; a component (B), which is a silicon compound containing at least two SiH groups in a molecule, and a component (C), which is a hydrosilylation catalyst. The method also has a step of placing a camera module having the optical element on a substrate with an electronic component, and a step of performing reflow process to the camera module, the electronic component and the substrate and mounting the camera module and the electronic component on the substrate.
PCT/JP2008/059719 2007-05-29 2008-05-27 Imaging device manufacturing method, imaging device and optical element Ceased WO2008146812A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007141758 2007-05-29
JP2007-141758 2007-05-29

Publications (1)

Publication Number Publication Date
WO2008146812A1 true WO2008146812A1 (en) 2008-12-04

Family

ID=40075052

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059719 Ceased WO2008146812A1 (en) 2007-05-29 2008-05-27 Imaging device manufacturing method, imaging device and optical element

Country Status (1)

Country Link
WO (1) WO2008146812A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175861A (en) * 2012-02-24 2013-09-05 Fujifilm Corp Substrate module and manufacturing method of the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185826A (en) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd Board mounting camera and mounting method of board mounting camera
JP2004294741A (en) * 2003-03-27 2004-10-21 Kanegafuchi Chem Ind Co Ltd Optical lens and method for manufacturing optical lens
JP2005538503A (en) * 2002-09-06 2005-12-15 ノキア コーポレイション connector
JP2006100516A (en) * 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd Molded substrate, manufacturing method thereof, and camera module using the same
JP2007043628A (en) * 2005-08-05 2007-02-15 Hitachi Maxell Ltd The camera module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185826A (en) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd Board mounting camera and mounting method of board mounting camera
JP2005538503A (en) * 2002-09-06 2005-12-15 ノキア コーポレイション connector
JP2004294741A (en) * 2003-03-27 2004-10-21 Kanegafuchi Chem Ind Co Ltd Optical lens and method for manufacturing optical lens
JP2006100516A (en) * 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd Molded substrate, manufacturing method thereof, and camera module using the same
JP2007043628A (en) * 2005-08-05 2007-02-15 Hitachi Maxell Ltd The camera module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175861A (en) * 2012-02-24 2013-09-05 Fujifilm Corp Substrate module and manufacturing method of the same

Similar Documents

Publication Publication Date Title
WO2009117345A3 (en) Adhesive compositions for use in die attach applications
TW200636877A (en) Temporary wafer bonding method for semiconductor processing
TW200745195A (en) Insulating material, process for producing electronic part/device, and electronic part/device
JP5425759B2 (en) Fixing material and optical element sealing body comprising silane compound polymer
TW200720315A (en) Molding resin composition for optical semiconductor elements and optical semiconductor device obtained by using the same
TW200722910A (en) Photoresist composition and method of manufacturing a thin-film transistor substrate using the same
ATE480130T1 (en) ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE
WO2008027280A3 (en) Optical devices and silicone compositions and processes fabricating the optical devices
TW200618111A (en) Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device
WO2009041472A1 (en) Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
WO2008111470A1 (en) Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
WO2008126717A1 (en) Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them
WO2007130643A3 (en) Die-on-leadframe (dol) with high voltage isolation
WO2009035087A1 (en) Composition for forming silicon-containing fine pattern and method for forming fine pattern using the same
TW200511454A (en) Adhesive sheet for producing a semiconductor device
WO2009038960A3 (en) Flexible epoxy-based compositions
WO2015041342A1 (en) Curable composition, curing product, and method for using curable composition
WO2011081325A3 (en) Light-transmitting resin for an encapsulating material and electronic device comprising same
TW200635976A (en) Epoxy resin composition for photosemiconductor element encapsulation and photosemiconductor device using the same
WO2008123378A1 (en) Method for production of distributed refractive index-type optical element having ultraviolet ray-absorbing ability
JP2013191687A5 (en)
WO2008146812A1 (en) Imaging device manufacturing method, imaging device and optical element
WO2009014113A1 (en) Positive photosensitive resin composition for spray coating, method for forming cured film using the same, cured film and semiconductor device
JP6430388B2 (en) Curable composition, cured product and method of using curable composition
WO2007037858A3 (en) Thermosetting coating compositions with multiple cure mechanisms

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08764747

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08764747

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP