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WO2008143099A1 - 積層配線基板及びその製造方法 - Google Patents

積層配線基板及びその製造方法 Download PDF

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Publication number
WO2008143099A1
WO2008143099A1 PCT/JP2008/058867 JP2008058867W WO2008143099A1 WO 2008143099 A1 WO2008143099 A1 WO 2008143099A1 JP 2008058867 W JP2008058867 W JP 2008058867W WO 2008143099 A1 WO2008143099 A1 WO 2008143099A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
manufacturing
conductive
same
laminated wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058867
Other languages
English (en)
French (fr)
Inventor
Takaharu Hondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to CN2008800164589A priority Critical patent/CN101683007B/zh
Priority to EP08752738.8A priority patent/EP2157842B1/en
Priority to US12/600,444 priority patent/US8502086B2/en
Priority to JP2009515174A priority patent/JP4955763B2/ja
Priority to KR1020097026234A priority patent/KR101116712B1/ko
Priority to TW097120005A priority patent/TW200941656A/zh
Publication of WO2008143099A1 publication Critical patent/WO2008143099A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H10W72/073—
    • H10W72/354—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　積層配線基板の製造方法は一方の面に導電層１ｂ～４ｂが設けられた絶縁基板１ａ～４ａ、前記絶縁基板に設けられ他方の面側から前記導電層に到達する貫通孔２ｅ～４ｅ及び前記貫通孔内に導電性ペーストを充填して前記導電層に接続させた導電ビア２ｄ～４ｄを有する配線基板基材２～４を、少なくとも一つ以上積層した積層配線基板の製造方法であって、前記導電性ペーストが貫通孔に充填される前に、前記導電層の貫通孔内における表面部分に平滑化処理を施して平滑面部２ｇを形成することを特徴とする。
PCT/JP2008/058867 2007-05-17 2008-05-14 積層配線基板及びその製造方法 Ceased WO2008143099A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN2008800164589A CN101683007B (zh) 2007-05-17 2008-05-14 层压配线基板及其制造方法
EP08752738.8A EP2157842B1 (en) 2007-05-17 2008-05-14 Laminated wiring board and method for manufacturing the same
US12/600,444 US8502086B2 (en) 2007-05-17 2008-05-14 Laminated wiring board and method for manufacturing the same
JP2009515174A JP4955763B2 (ja) 2007-05-17 2008-05-14 積層配線基板及びその製造方法
KR1020097026234A KR101116712B1 (ko) 2007-05-17 2008-05-14 적층 배선 기판 및 그 제조 방법
TW097120005A TW200941656A (en) 2007-05-17 2008-05-30 Multilayer UV-curable adhesive film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-131324 2007-05-17
JP2007131324 2007-05-17

Publications (1)

Publication Number Publication Date
WO2008143099A1 true WO2008143099A1 (ja) 2008-11-27

Family

ID=40031808

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058867 Ceased WO2008143099A1 (ja) 2007-05-17 2008-05-14 積層配線基板及びその製造方法

Country Status (7)

Country Link
US (1) US8502086B2 (ja)
EP (1) EP2157842B1 (ja)
JP (1) JP4955763B2 (ja)
KR (1) KR101116712B1 (ja)
CN (1) CN101683007B (ja)
TW (2) TW200904291A (ja)
WO (1) WO2008143099A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138862A (ja) * 2009-12-28 2011-07-14 Fujikura Ltd 多層配線板及びその製造方法
JP2014239258A (ja) * 2012-12-27 2014-12-18 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内蔵印刷回路基板の製造方法
JP2017220612A (ja) * 2016-06-09 2017-12-14 株式会社デンソー 多層基板の製造方法
WO2025254165A1 (ja) * 2024-06-04 2025-12-11 株式会社フジクラ プリント配線板

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JPWO2010113448A1 (ja) * 2009-04-02 2012-10-04 パナソニック株式会社 回路基板の製造方法および回路基板
KR101048489B1 (ko) * 2009-06-24 2011-07-11 성균관대학교산학협력단 관통형전극 및 그의 형성방법
JP2011096900A (ja) * 2009-10-30 2011-05-12 Fujitsu Ltd 導電体およびプリント配線板並びにそれらの製造方法
JP5352437B2 (ja) * 2009-11-30 2013-11-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR101019756B1 (ko) * 2009-12-24 2011-03-09 제일모직주식회사 비자외선형 다이접착필름 및 제조방법
KR20110113980A (ko) * 2010-04-12 2011-10-19 삼성전자주식회사 필름을 포함한 다층 인쇄회로기판 및 그 제조 방법
KR101156854B1 (ko) * 2010-05-03 2012-06-20 삼성전기주식회사 반도체 패키지 기판 및 그 제조방법
KR20120009705A (ko) 2010-07-20 2012-02-02 삼성정밀화학 주식회사 방향족 액정 폴리에스테르 수지의 제조방법 및 방향족 액정 폴리에스테르 수지 컴파운드의 제조방법
JP2012169486A (ja) * 2011-02-15 2012-09-06 Fujikura Ltd 基材、配線板、基材の製造方法及び配線板の製造方法
KR20140047967A (ko) * 2012-10-15 2014-04-23 삼성전기주식회사 다층형 코어리스 인쇄회로기판 및 그 제조 방법
US20150366077A1 (en) * 2013-01-30 2015-12-17 Kyocera Corporation Method for producing mounted structure
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JP2016532304A (ja) * 2013-09-06 2016-10-13 チャン ユチュン 液体ガラスの応用
US10425724B2 (en) 2014-03-13 2019-09-24 Starkey Laboratories, Inc. Interposer stack inside a substrate for a hearing assistance device
EP3294799B1 (en) * 2015-05-08 2024-09-04 Henkel AG & Co. KGaA Sinterable films and pastes and methods for the use thereof
CN106356355B (zh) * 2015-07-15 2020-06-26 恒劲科技股份有限公司 基板结构及其制作方法
JP2016105512A (ja) * 2016-03-01 2016-06-09 京セラサーキットソリューションズ株式会社 配線基板の製造方法
JP6700207B2 (ja) * 2017-02-08 2020-05-27 矢崎総業株式会社 印刷回路の電気接続方法
JP7075785B2 (ja) * 2018-03-08 2022-05-26 スタンレー電気株式会社 回路基板、電子回路装置、および、回路基板の製造方法
CN110798977B (zh) * 2018-08-01 2021-03-23 鹏鼎控股(深圳)股份有限公司 薄型天线电路板及其制作方法
CN112449514B (zh) * 2019-08-31 2022-12-20 鹏鼎控股(深圳)股份有限公司 多层线路板及其制作方法
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法
JP2023132391A (ja) * 2022-03-11 2023-09-22 イビデン株式会社 プリント配線板
CN115284696B (zh) * 2022-08-11 2023-07-25 业成科技（成都）有限公司 复合光学膜结构及其制造方法

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JP2003133737A (ja) * 2001-10-29 2003-05-09 Kyocera Corp 多層配線基板及びその製造方法
JP2004179362A (ja) * 2002-11-27 2004-06-24 Kyocera Corp 配線基板およびこれを用いた電子装置
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138862A (ja) * 2009-12-28 2011-07-14 Fujikura Ltd 多層配線板及びその製造方法
JP2014239258A (ja) * 2012-12-27 2014-12-18 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内蔵印刷回路基板の製造方法
JP2017220612A (ja) * 2016-06-09 2017-12-14 株式会社デンソー 多層基板の製造方法
WO2017212934A1 (ja) * 2016-06-09 2017-12-14 株式会社デンソー 多層基板の製造方法
WO2025254165A1 (ja) * 2024-06-04 2025-12-11 株式会社フジクラ プリント配線板

Also Published As

Publication number Publication date
KR20100008005A (ko) 2010-01-22
KR101116712B1 (ko) 2012-03-13
CN101683007A (zh) 2010-03-24
CN101683007B (zh) 2011-12-28
US20100147576A1 (en) 2010-06-17
EP2157842A4 (en) 2011-11-30
TW200904291A (en) 2009-01-16
JPWO2008143099A1 (ja) 2010-08-05
EP2157842B1 (en) 2018-03-14
US8502086B2 (en) 2013-08-06
TW200941656A (en) 2009-10-01
EP2157842A1 (en) 2010-02-24
JP4955763B2 (ja) 2012-06-20

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