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WO2008143042A1 - Procédé de traitement au laser et produit traité au laser - Google Patents

Procédé de traitement au laser et produit traité au laser Download PDF

Info

Publication number
WO2008143042A1
WO2008143042A1 PCT/JP2008/058692 JP2008058692W WO2008143042A1 WO 2008143042 A1 WO2008143042 A1 WO 2008143042A1 JP 2008058692 W JP2008058692 W JP 2008058692W WO 2008143042 A1 WO2008143042 A1 WO 2008143042A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
processing method
processed product
laser processing
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058692
Other languages
English (en)
Japanese (ja)
Inventor
Naoyuki Matsuo
Kanji Nishida
Atsushi Hino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of WO2008143042A1 publication Critical patent/WO2008143042A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Prevention Of Fouling (AREA)

Abstract

La présente invention concerne un procédé de traitement au laser permettant de faciliter le traitement au laser avec un rendement élevé en réduisant de manière efficace la contamination d'une surface d'un matériau à traiter en par la matière décomposée dans le cas du traitement du matériau par un faisceau laser. Le procédé de traitement au laser permettant de traiter le matériau en appliquant le faisceau laser sur le matériau est caractérisé en ce que le matériau est traité au laser tout en retirant la matière décomposée, générée par irradiation par faisceau laser, par aspiration au voisinage de la partie irradiante.
PCT/JP2008/058692 2007-05-16 2008-05-12 Procédé de traitement au laser et produit traité au laser Ceased WO2008143042A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007130532A JP5096040B2 (ja) 2007-05-16 2007-05-16 レーザー加工方法及びレーザー加工品
JP2007-130532 2007-05-16

Publications (1)

Publication Number Publication Date
WO2008143042A1 true WO2008143042A1 (fr) 2008-11-27

Family

ID=40031751

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058692 Ceased WO2008143042A1 (fr) 2007-05-16 2008-05-12 Procédé de traitement au laser et produit traité au laser

Country Status (3)

Country Link
JP (1) JP5096040B2 (fr)
TW (1) TW200848191A (fr)
WO (1) WO2008143042A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014167875A1 (fr) * 2013-04-08 2014-10-16 住友化学株式会社 Dispositif d'usinage laser et système de production de dispositif d'affichage optique
WO2016006547A1 (fr) * 2014-07-09 2016-01-14 住友化学株式会社 Dispositif ainsi que procédé de collage, et système ainsi que procédé de production de dispositif d'affichage optique
CN109311122A (zh) * 2016-03-24 2019-02-05 艾斯曼汽车德国有限责任公司 用于借助脉冲激光束通过在覆盖材料上进行材料去除来引入限定的弱化线的方法
US11167541B2 (en) 2018-12-14 2021-11-09 Tdk Corporation Apparatus for manufacturing element array and apparatus for removing specific element

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5328424B2 (ja) * 2009-03-02 2013-10-30 本田技研工業株式会社 穴あけ装置
WO2011016572A1 (fr) * 2009-08-06 2011-02-10 住友化学株式会社 Procédé de fabrication de plaques polarisantes
JP5460176B2 (ja) * 2009-08-18 2014-04-02 キヤノン株式会社 レーザ加工装置
KR101203106B1 (ko) * 2010-04-05 2012-11-20 김원옥 씨오피층이 포함된 다층필름의 레이저 절단방법
TWI413566B (zh) * 2010-05-28 2013-11-01 Lg Chemical Ltd 偏光片之製造方法
JP5481300B2 (ja) 2010-07-29 2014-04-23 住友化学株式会社 偏光板切断方法および当該方法によって切断された偏光板
TW201207913A (en) * 2010-08-13 2012-02-16 Msscorps Co Ltd Two-stage encapsulation removing method for semiconductor device and laser grooving device
JP2012045581A (ja) * 2010-08-27 2012-03-08 Mitsubishi Materials Corp レーザ加工方法
JP5663507B2 (ja) * 2012-02-16 2015-02-04 信越化学工業株式会社 ペリクルの製造方法
JP2014026186A (ja) * 2012-07-30 2014-02-06 Miyakoshi Printing Machinery Co Ltd ラベル用紙のハーフカット型抜き加工方法
JP6057778B2 (ja) 2013-02-27 2017-01-11 本田技研工業株式会社 レーザ加工装置
JP2014121736A (ja) * 2014-03-18 2014-07-03 Sumitomo Chemical Co Ltd レーザー光照射装置およびレーザー光照射方法
JP6814459B2 (ja) * 2016-07-28 2021-01-20 三星ダイヤモンド工業株式会社 レーザ加工方法
JP7021887B2 (ja) * 2016-09-30 2022-02-17 住友化学株式会社 光学フィルムの製造方法
JP7242166B2 (ja) * 2016-09-30 2023-03-20 住友化学株式会社 光学フィルム及び光学フィルムの製造方法
JP2018065331A (ja) * 2016-10-21 2018-04-26 昭和電工パッケージング株式会社 ラミネート材の加工方法
US20240058892A1 (en) * 2021-03-03 2024-02-22 Meng Keong LIM An integrated x-ray imaging and laser ablating system for precision micromachining

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001084579A (ja) * 1999-09-10 2001-03-30 Fuji Photo Film Co Ltd 磁気テープ加工装置
JP2002341322A (ja) * 2001-05-17 2002-11-27 Matsushita Electric Ind Co Ltd 液晶表示素子の製造方法および製造装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004268080A (ja) * 2003-03-07 2004-09-30 Sumitomo Heavy Ind Ltd レーザ加工装置および加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001084579A (ja) * 1999-09-10 2001-03-30 Fuji Photo Film Co Ltd 磁気テープ加工装置
JP2002341322A (ja) * 2001-05-17 2002-11-27 Matsushita Electric Ind Co Ltd 液晶表示素子の製造方法および製造装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014167875A1 (fr) * 2013-04-08 2014-10-16 住友化学株式会社 Dispositif d'usinage laser et système de production de dispositif d'affichage optique
JP2014217879A (ja) * 2013-04-08 2014-11-20 住友化学株式会社 レーザー加工装置及び光学表示デバイスの生産システム
WO2016006547A1 (fr) * 2014-07-09 2016-01-14 住友化学株式会社 Dispositif ainsi que procédé de collage, et système ainsi que procédé de production de dispositif d'affichage optique
JP2016018105A (ja) * 2014-07-09 2016-02-01 住友化学株式会社 貼合装置、貼合方法、光学表示デバイスの生産システム及び光学表示デバイスの生産方法
CN106663393A (zh) * 2014-07-09 2017-05-10 住友化学株式会社 贴合装置、贴合方法、光学显示器件的生产系统以及光学显示器件的生产方法
CN109311122A (zh) * 2016-03-24 2019-02-05 艾斯曼汽车德国有限责任公司 用于借助脉冲激光束通过在覆盖材料上进行材料去除来引入限定的弱化线的方法
CN109311122B (zh) * 2016-03-24 2020-11-17 艾斯曼汽车德国有限责任公司 用于借助脉冲激光束通过在覆盖材料上进行材料去除来引入限定的弱化线的方法
US11167541B2 (en) 2018-12-14 2021-11-09 Tdk Corporation Apparatus for manufacturing element array and apparatus for removing specific element

Also Published As

Publication number Publication date
JP5096040B2 (ja) 2012-12-12
TW200848191A (en) 2008-12-16
JP2008284572A (ja) 2008-11-27

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