WO2008036959A3 - dispositif matriciel à micromiroirS comprenant une couche de métal réfléchissante encapsulée et son procédé de fabrication - Google Patents
dispositif matriciel à micromiroirS comprenant une couche de métal réfléchissante encapsulée et son procédé de fabrication Download PDFInfo
- Publication number
- WO2008036959A3 WO2008036959A3 PCT/US2007/079256 US2007079256W WO2008036959A3 WO 2008036959 A3 WO2008036959 A3 WO 2008036959A3 US 2007079256 W US2007079256 W US 2007079256W WO 2008036959 A3 WO2008036959 A3 WO 2008036959A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal layer
- array device
- making
- same
- reflective metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0012—Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Elements Other Than Lenses (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
La présente invention porte sur un dispositif à micromiroirs optiques et son dispositif matriciel et son procédé de fabrication. Grâce à l'introduction d'une couche de sous-revêtement et une couche de revêtement externe avec une couche de métal fortement réfléchissante, la couche réfléchissante des micromiroirs est protégée de l'environnement, d'une oxydation, d'une dégradation, des acides, des bases, et d'une corrosion galvanique des structures micromécaniques. De même la nouvelle structure d'enduction améliore les performances du dispositif matriciel à micromiroirs en réduisant la dégradation de la réflectivité de la couche de métal, en produisant un effet anti-reflet dans la zone non efficace optiquement, et en protégeant les structures micromécaniques.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/534,620 US7589885B2 (en) | 2006-09-22 | 2006-09-22 | Micromirror array device comprising encapsulated reflective metal layer and method of making the same |
| US11/534,613 | 2006-09-22 | ||
| US11/534,613 US7589884B2 (en) | 2006-09-22 | 2006-09-22 | Micromirror array lens with encapsulation of reflective metal layer and method of making the same |
| US11/534,620 | 2006-09-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008036959A2 WO2008036959A2 (fr) | 2008-03-27 |
| WO2008036959A3 true WO2008036959A3 (fr) | 2009-02-26 |
Family
ID=39201351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2007/079256 Ceased WO2008036959A2 (fr) | 2006-09-22 | 2007-09-22 | dispositif matriciel à micromiroirS comprenant une couche de métal réfléchissante encapsulée et son procédé de fabrication |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2008036959A2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103137884B (zh) * | 2011-11-25 | 2016-01-27 | 海洋王照明科技股份有限公司 | 一种有机电致发光器件的复合封装结构及其封装方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6891655B2 (en) * | 2003-01-02 | 2005-05-10 | Micronic Laser Systems Ab | High energy, low energy density, radiation-resistant optics used with micro-electromechanical devices |
| US6903860B2 (en) * | 2003-11-01 | 2005-06-07 | Fusao Ishii | Vacuum packaged micromirror arrays and methods of manufacturing the same |
| EP1544161A1 (fr) * | 2002-08-01 | 2005-06-22 | Nikon Corporation | Element structurel tridimensionnel et procede de fabrication de l'element, commutateur optique et microdispositif |
| US7068416B2 (en) * | 2004-04-12 | 2006-06-27 | Angstrom Inc. | Three-dimensional imaging device |
-
2007
- 2007-09-22 WO PCT/US2007/079256 patent/WO2008036959A2/fr not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1544161A1 (fr) * | 2002-08-01 | 2005-06-22 | Nikon Corporation | Element structurel tridimensionnel et procede de fabrication de l'element, commutateur optique et microdispositif |
| US6891655B2 (en) * | 2003-01-02 | 2005-05-10 | Micronic Laser Systems Ab | High energy, low energy density, radiation-resistant optics used with micro-electromechanical devices |
| US6903860B2 (en) * | 2003-11-01 | 2005-06-07 | Fusao Ishii | Vacuum packaged micromirror arrays and methods of manufacturing the same |
| US7068416B2 (en) * | 2004-04-12 | 2006-06-27 | Angstrom Inc. | Three-dimensional imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008036959A2 (fr) | 2008-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| NENP | Non-entry into the national phase |
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| 122 | Ep: pct application non-entry in european phase |
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