WO2008036959A3 - Micromirror array device comprising encapsulated reflective metal layer and method of making the same - Google Patents
Micromirror array device comprising encapsulated reflective metal layer and method of making the same Download PDFInfo
- Publication number
- WO2008036959A3 WO2008036959A3 PCT/US2007/079256 US2007079256W WO2008036959A3 WO 2008036959 A3 WO2008036959 A3 WO 2008036959A3 US 2007079256 W US2007079256 W US 2007079256W WO 2008036959 A3 WO2008036959 A3 WO 2008036959A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal layer
- array device
- making
- same
- reflective metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0012—Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Elements Other Than Lenses (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
The present invention provides an optical micromirror device and its array device and method for making the same. By introducing a sub coating layer and an over coating layer with a high reflective metal layer, the reflective layer of the micromirrors is protected from environmental circumstances, oxidation, degradation, acid, base, and galvanic corrosion of the micro-mechanical structures. Also the new coating structure enhances the performance of the micromirror array device by reducing degradation of the reflectivity of the metal layer, by providing anti-reflection in the optically non-effective area, and by protecting the micro-mechanical structures.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/534,620 US7589885B2 (en) | 2006-09-22 | 2006-09-22 | Micromirror array device comprising encapsulated reflective metal layer and method of making the same |
| US11/534,613 | 2006-09-22 | ||
| US11/534,613 US7589884B2 (en) | 2006-09-22 | 2006-09-22 | Micromirror array lens with encapsulation of reflective metal layer and method of making the same |
| US11/534,620 | 2006-09-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008036959A2 WO2008036959A2 (en) | 2008-03-27 |
| WO2008036959A3 true WO2008036959A3 (en) | 2009-02-26 |
Family
ID=39201351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2007/079256 Ceased WO2008036959A2 (en) | 2006-09-22 | 2007-09-22 | Micromirror array device comprising encapsulated reflective metal layer and method of making the same |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2008036959A2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103137884B (en) * | 2011-11-25 | 2016-01-27 | 海洋王照明科技股份有限公司 | A kind of compound encapsulation structure of organic electroluminescence device and method for packing thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6891655B2 (en) * | 2003-01-02 | 2005-05-10 | Micronic Laser Systems Ab | High energy, low energy density, radiation-resistant optics used with micro-electromechanical devices |
| US6903860B2 (en) * | 2003-11-01 | 2005-06-07 | Fusao Ishii | Vacuum packaged micromirror arrays and methods of manufacturing the same |
| EP1544161A1 (en) * | 2002-08-01 | 2005-06-22 | Nikon Corporation | Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device |
| US7068416B2 (en) * | 2004-04-12 | 2006-06-27 | Angstrom Inc. | Three-dimensional imaging device |
-
2007
- 2007-09-22 WO PCT/US2007/079256 patent/WO2008036959A2/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1544161A1 (en) * | 2002-08-01 | 2005-06-22 | Nikon Corporation | Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device |
| US6891655B2 (en) * | 2003-01-02 | 2005-05-10 | Micronic Laser Systems Ab | High energy, low energy density, radiation-resistant optics used with micro-electromechanical devices |
| US6903860B2 (en) * | 2003-11-01 | 2005-06-07 | Fusao Ishii | Vacuum packaged micromirror arrays and methods of manufacturing the same |
| US7068416B2 (en) * | 2004-04-12 | 2006-06-27 | Angstrom Inc. | Three-dimensional imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008036959A2 (en) | 2008-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| NENP | Non-entry into the national phase |
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| 122 | Ep: pct application non-entry in european phase |
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