WO2008035324A3 - Apparatus for fluid treatment - Google Patents
Apparatus for fluid treatment Download PDFInfo
- Publication number
- WO2008035324A3 WO2008035324A3 PCT/IL2006/001094 IL2006001094W WO2008035324A3 WO 2008035324 A3 WO2008035324 A3 WO 2008035324A3 IL 2006001094 W IL2006001094 W IL 2006001094W WO 2008035324 A3 WO2008035324 A3 WO 2008035324A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluid
- pressure
- contact
- cushion
- support surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A non-contact support apparatus for fluid treatment of a stationary or traveling object while supporting the object without contact by fluid- cushion induced forces. The apparatus comprises substantially opposite non-contact platforms having support surfaces, each support surface comprising a plurality of basic cells each cell having a plurality of pressure outlets and a plurality of fluid-evacuation channels. Each of the pressure outlets is fluidically connected through a flow restrictor to a high-pressure fluid supply, the pressure outlets providing pressurized fluid for generating pressure induced forces, maintaining a fluid-cushion between the object and the support surface of the platform The flow restrictor characteristically exhibits fluidic return spring behavior. Each of the plurality of fluid- evacuation channels has an inlet and outlet, for locally balancing mass flow for a plurality of basic cells.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IL2006/001094 WO2008035324A2 (en) | 2006-09-19 | 2006-09-19 | Apparatus for fluid treatment |
| TW095143276A TW200816294A (en) | 2006-09-19 | 2006-11-22 | Apparatus for fluid treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IL2006/001094 WO2008035324A2 (en) | 2006-09-19 | 2006-09-19 | Apparatus for fluid treatment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008035324A2 WO2008035324A2 (en) | 2008-03-27 |
| WO2008035324A3 true WO2008035324A3 (en) | 2009-04-09 |
Family
ID=39200948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IL2006/001094 Ceased WO2008035324A2 (en) | 2006-09-19 | 2006-09-19 | Apparatus for fluid treatment |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW200816294A (en) |
| WO (1) | WO2008035324A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010024263A1 (en) * | 2010-06-18 | 2011-12-22 | Festo Ag & Co. Kg | Air storage facility |
| US10513011B2 (en) * | 2017-11-08 | 2019-12-24 | Core Flow Ltd. | Layered noncontact support platform |
| CN111270468B (en) * | 2020-03-18 | 2020-10-27 | 威马汽车科技集团有限公司 | Automobile cushion finishing machine |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3251139A (en) * | 1965-03-10 | 1966-05-17 | Us Dynamics Mfg Corp | Dynamic insulating systems |
| US3599851A (en) * | 1970-05-08 | 1971-08-17 | Buckbee Mears Co | Hydrodynamic turnover mechanisms |
| US5317778A (en) * | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
| US20010038783A1 (en) * | 2000-04-17 | 2001-11-08 | Hitachi Kokusai Electric Inc. | Dual loading port semiconductor processing equipment |
| US20030102015A1 (en) * | 1998-01-09 | 2003-06-05 | Halbmaier David L. | Wafer container washing apparatus |
| US20050126605A1 (en) * | 2003-12-15 | 2005-06-16 | Coreflow Scientific Solutions Ltd. | Apparatus and method for cleaning surfaces |
| US20050195381A1 (en) * | 2004-03-04 | 2005-09-08 | Asml Netherlands B.V. | Moveable object carrier, lithographic apparatus comprising the moveable object carrier and device manufacturing method |
| US20060050262A1 (en) * | 2004-09-09 | 2006-03-09 | Nikon Corporation | Non-contact pneumatic transfer for stages with small motion |
| US20060054774A1 (en) * | 2001-12-27 | 2006-03-16 | Yuval Yassour | High-performance non-contact support platforms |
-
2006
- 2006-09-19 WO PCT/IL2006/001094 patent/WO2008035324A2/en not_active Ceased
- 2006-11-22 TW TW095143276A patent/TW200816294A/en unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3251139A (en) * | 1965-03-10 | 1966-05-17 | Us Dynamics Mfg Corp | Dynamic insulating systems |
| US3599851A (en) * | 1970-05-08 | 1971-08-17 | Buckbee Mears Co | Hydrodynamic turnover mechanisms |
| US5317778A (en) * | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
| US20030102015A1 (en) * | 1998-01-09 | 2003-06-05 | Halbmaier David L. | Wafer container washing apparatus |
| US20010038783A1 (en) * | 2000-04-17 | 2001-11-08 | Hitachi Kokusai Electric Inc. | Dual loading port semiconductor processing equipment |
| US20060054774A1 (en) * | 2001-12-27 | 2006-03-16 | Yuval Yassour | High-performance non-contact support platforms |
| US20050126605A1 (en) * | 2003-12-15 | 2005-06-16 | Coreflow Scientific Solutions Ltd. | Apparatus and method for cleaning surfaces |
| US20050195381A1 (en) * | 2004-03-04 | 2005-09-08 | Asml Netherlands B.V. | Moveable object carrier, lithographic apparatus comprising the moveable object carrier and device manufacturing method |
| US20060050262A1 (en) * | 2004-09-09 | 2006-03-09 | Nikon Corporation | Non-contact pneumatic transfer for stages with small motion |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008035324A2 (en) | 2008-03-27 |
| TW200816294A (en) | 2008-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 06796101 Country of ref document: EP Kind code of ref document: A2 |
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| NENP | Non-entry into the national phase |
Ref country code: DE |
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| 122 | Ep: pct application non-entry in european phase |
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