WO2008020523A1 - Electronic component handling apparatus, method for operating the electronic component handling apparatus, test tray and pusher - Google Patents

Abstract

A handler (1) transfers a test tray (500) storing a plurality of IC devices (2) to the positions of a plurality of sockets (40) on test section units (Hi-Fix) (50) arranged on a test head (5). A plurality of the test section units have at least different size or arrangement (including pitch and flat surface direction) or the number of the sockets (40). The handler (1) is applicable to any test section unit (50) as the outer shapes of the test section units (50) are made substantially the same. The handler (1) is applicable to a plurality of the test section units (50), which have different socket size or arrangement or number, by using the same handler.

Description

 Specification

 Electronic component handling device and its operation method, test tray and pusher

 Technical field

 [0001] The present invention relates to an electronic component handling apparatus capable of operating a test tray containing a plurality of electronic components in order to test an electronic component such as an IC device, an operating method thereof, and the electronic component handling apparatus. It relates to the test tray and pusher used.

 Background art

 [0002] In the manufacturing process of electronic components such as IC devices, a test apparatus for testing the finally manufactured electronic components is required. In such a test apparatus, a large number of IC devices are stored in a test tray by an electronic component handling apparatus called a handler, and the external terminals of each IC device are connected to connection terminals of sockets provided on the test head. Make electrical contact and have the main test equipment (tester) perform the test. In this way, IC devices are tested and at least categorized as good or defective.

 [0003] A test unit (sometimes referred to as Hi-Fix) is generally provided on the test head. The test unit includes a performance board and a socket board electrically connected to the performance board and provided with a plurality of sockets. The test unit is provided to be replaceable with respect to the test head body.

 [0004] Here, the socket in which the IC device is mounted during the test needs to be appropriately changed depending on the type of the IC device. For example, if the size of the IC device changes, the socket size must be changed accordingly, and if the socket size changes, the socket arrangement may need to be changed.

 [0005] Therefore, a plurality of test unit units having different socket sizes and arrangements are prepared as test unit units, and a desired test unit unit is selected and attached to a common test head body.

Disclosure of the invention Problems to be solved by the invention

 [0006] However, test unit units having different socket sizes and arrangements as described above cannot be handled by the same handler because the test unit units themselves have different external sizes. In other words, when the test unit units have different external shapes, it is necessary to change the device that transports the test tray, the device that drives the pusher, etc., and it is extremely difficult to deal with the same handler in practice. Therefore, conventionally, it has been necessary to prepare a plurality of corresponding handlers for each test unit unit having a different socket size and arrangement.

[0007] When changing the number of IC devices to be simultaneously measured, the number of sockets on the test unit must naturally be changed, and accordingly, the socket is arranged in the test unit unit itself. The size of the outline will also vary. Therefore, the same handler cannot be used for test unit units with different numbers of sockets, and it was necessary to prepare multiple handlers for each test unit with different numbers of sockets.

 [0008] The present invention has been made in view of such a situation, and a plurality of test unit units having different socket sizes, arrangements, or numbers can be handled by the same electronic component handling apparatus. It is an object of the present invention to provide an electronic component handling device, an operation method of the electronic component handling device, and a test tray and a pusher that can be used in the electronic component handling device.

 Means for solving the problem

[0009] In order to achieve the above object, firstly, the present invention relates to a plurality of sockets that a test section unit (Hi-Fix) provided in a test head has a test tray housing a plurality of electronic components. An electronic component handling device capable of transporting to a position, wherein the outer dimensions of a plurality of test unit units differing in at least one kind of socket size, arrangement (including pitch and orientation in the plane direction) and number. By using substantially the same size, an electronic component handling apparatus that can be used in conformity with any of the plurality of test unit units is provided (Invention 1).

[0010] In the above invention (Invention 1), it is necessary to change the device for transporting the test tray, the device for driving the pusher, etc., by making the outer shapes of the plurality of types of test unit units substantially the same size. Therefore, the same electronic component hand can be used for multiple types of test unit units. It is possible to cope with a ring device.

 [0011] In the above invention (Invention 1), according to the type of the test unit used, the electronic component storage member included in the test tray so that the electronic component can be mounted in the socket included in the test unit. Are preferably exchangeable (Invention 2).

In the above invention (Invention 2), it is preferable to automatically replace the electronic component storage member of the test tray according to the type of the test unit used (Invention 3).

[0013] In the above invention (Invention 3), it is preferable that the information of the test unit to be used is read, and the electronic component storage member of the test tray is automatically replaced based on the read information. (Invention 4).

[0014] In the above invention (Invention 2), the test tray includes a movable member capable of holding and releasing the electronic component storage member, and the electronic component handling device drives the movable member. It is preferable to have a device to make U ヽ (Invention 5).

[0015] In the above invention (Invention 5), the movable member is a hook-shaped member, and the electronic component storage member is formed with an engaging portion for engaging the hook-shaped movable member! (Invention 6).

 [0016] In the above invention (Invention 2), the electronic component housing member is formed with a plurality of ridges standing in the Z-axis direction, and the ridges are cut out. It is preferable that the electronic component is housed in (Invention 7).

 [0017] In the above invention (Invention 7), the protrusion may include a plurality of protrusions extending in the X-axis direction and a plurality of protrusions extending in the Y-axis direction. Preferred (Invention 8).

 [0018] Further, in the above invention (Invention 7), the protruding portion has a substantially L shape in plan view, and the angular force of the electronic component housing member is increased gradually toward the diagonal. A plurality of the cutout portions may be formed side by side at a predetermined interval, and the cutout portion may be formed at a position opposite to the one corner (Invention 9).

 [0019] In the above invention (Invention 8), the notch is formed at a substantially central portion of the electronic component housing member, and extends in the X-axis direction and in the Y-axis direction. The existing protrusions may be positioned around the notch (invention 10).

[0020] In the above invention (Invention 7), the electric power of the pusher included in the electronic component handling apparatus. A plurality of protrusions that can be inserted between the plurality of protrusions in the electronic component storage member are provided in the child component pressing portion, and the electronic component storage member is provided between the plurality of protrusions. It is preferable that the protruding portion is a recess that can be inserted! / (Invention 11).

 [0021] In the above invention (Invention 11), the protrusion of the pusher is formed of the protruding portion of the electronic component storage member having the smallest notch among the plurality of types of electronic component storage members. It is preferred to be formed without interference! (Invention 12).

 [0022] In the above invention (Invention 11), the convex portion of the pusher has a substantially rectangular convex portion in plan view provided at one corner of the electronic component pressing portion and a diagonal from the corner of the electronic component pressing portion. A plurality of convex portions having a substantially L shape in plan view formed side by side at predetermined intervals so as to gradually increase toward the surface (Invention 13), and the convex portion of the pusher may be It may extend in the X-axis direction and the Y-axis direction around the substantially central part of the portion (Invention 14).

 [0023] In the above invention (Invention 1), the electronic component handling apparatus is capable of transferring electronic components to a supply tray tester tray, depending on the type of test unit mute used. It is preferable that the arrangement of the electronic components can be changed in the process of transferring the electronic components to the supply tray tester tray (Invention 15).

 [0024] In the above invention (Invention 15), the electronic component handling device includes a transfer device that holds an electronic component stored in a supply tray and can transfer the electronic component to a test tray. The apparatus may have a function of changing the arrangement of electronic components held (Invention 16).

 [0025] In the above invention (Invention 16), it is preferable that the transfer device has a function of changing the orientation of the electronic component held in a plane direction (Invention 17).

 [0026] In the above invention (Invention 15), the electronic component handling device includes a mounting portion on which the electronic component can be temporarily mounted while the electronic component is transferred to the supply tray tester tray. The placement section may have a function of changing the placement of the placed electronic component (Invention 18).

[0027] In the above invention (Invention 18), it is preferable that the placing section has a function of placing and changing the pitch and Z or the orientation of the planar direction of the electronic component. 19). [0028] In the above invention (Invention 18), it is preferable that the arrangement of the electronic components is automatically changed according to the type of the test unit used (Invention 20).

 [0029] In the above invention (Invention 20), it is preferable to read the information of the test unit to be used and automatically change the arrangement of the electronic components based on the read information (Invention 21). .

 [0030] Secondly, the present invention is a test tray that houses a plurality of electronic components and is routed so as to be transported to a test unit in an electronic component handling apparatus, wherein the test tray is an electronic component. A component storage member; and a support member that removably supports the electronic component storage member. The support member includes a movable member that can hold and release the electronic component storage member. A test tray is provided (Invention 22).

 [0031] According to the above invention (Invention 22), an electronic component storage member is prepared by appropriately preparing an electronic component storage member corresponding to the type (size, arrangement or number of sockets) of the test unit used. It is possible to support a plurality of types of test unit units by having the support member supported by the movable member.

 [0032] In the above invention (Invention 22), the movable member is a hook-shaped member, and the electronic component housing member is formed with an engaging portion for engaging the hook-shaped movable member !, (Invention 23).

 [0033] In the above invention (Invention 22), the electronic component housing member is formed with a plurality of ridges standing in the Z-axis direction, and the ridges are notched. It is preferable that the electronic component is housed in (Invention 23).

 [0034] In the above invention (Invention 24), the protrusion may include a plurality of protrusions extending in the X-axis direction and a plurality of protrusions extending in the Y-axis direction. Preferred (Invention 25).

 [0035] In the above invention (Invention 24), the protrusions have a substantially L shape in plan view, and the angular force of the electronic component storage member is increased at predetermined intervals so as to increase sequentially toward the diagonal. And the notch may be formed at a position diagonally opposite to the one corner (Invention 26).

[0036] In the above invention (Invention 25), the notch is formed in a substantially central portion of the electronic component housing member, and has a protrusion extending in the X-axis direction and the Y-axis direction. Extending The protruding ridge portion may be positioned around the notch portion! (Invention 27).

[0037] Thirdly, the present invention provides an electronic component in which a plurality of protrusions standing in the Z-axis direction are formed, and the electronic component is housed in the notch where the protrusion is notched. A pusher used in an electronic component handling apparatus corresponding to a test tray provided with a storage portion, wherein an electronic component pressing portion of the pusher has a plurality of protrusions on the electronic component storage member. A plurality of convex portions that can be inserted between each other are provided, and the plurality of convex portions are concave portions into which the protruding portions of the electronic component housing member can be inserted. (Invention 28).

[0038] In the above invention (Invention 28), the protrusion of the pusher is formed of the protruding portion of the electronic component storage member having the smallest notch among the plurality of types of electronic component storage members. It is preferred to be formed without interference! (Invention 29).

[0039] In the above invention (Invention 28), the protrusion of the pusher has a substantially rectangular protrusion in plan view provided at one corner of the electronic component pressing portion and a diagonal from the corner of the electronic component pressing portion. There may be a plurality of L-shaped convex portions in a plan view formed in a plurality at a predetermined interval so as to increase sequentially toward the surface (Invention 30), and the convex portion of the pusher It may extend in the X-axis direction and the Y-axis direction around the substantially central part of the portion (Invention 31).

 [0040] Fourthly, the present invention provides an electronic component handling apparatus capable of transporting a test tray containing a plurality of electronic components to a plurality of socket positions of a test unit provided in a test head. In accordance with the predetermined test unit used from a plurality of test unit units that have at least one type of socket size, arrangement, and number, and the outer shape is substantially the same size. Provided is an operation method of an electronic component handling apparatus characterized by exchanging an electronic component storage member of a test tray so that the electronic component can be mounted in a socket of the test unit (Invention 32).

 [0041] In the above invention (Invention 32), it is preferable to automatically replace the electronic component storage member of the test tray in accordance with a predetermined test unit used (Invention 33).

[0042] Fifth, according to the present invention, a test tray unit provided in a test head has a test tray in which a plurality of electronic components are accommodated by transferring electronic components to a test tray. A method of operating an electronic component handling device that can transport to the position of multiple sockets, wherein the test unit units are different in size, arrangement and number of sockets, and have the same outer dimensions. An electronic component handling apparatus operating method characterized in that the arrangement of electronic components is changed in the process of transferring electronic components to the test tray according to a predetermined test unit used from Provide (Invention

34).

 [0043] In the above invention (Invention 34), it is preferable that the arrangement of the electronic components is automatically changed according to a predetermined test unit used (Invention 35).

 The invention's effect

 [0044] According to the electronic component handling device, test tray or pusher of the present invention, the same electronic component handling device can handle a plurality of test unit units having different socket sizes, arrangements or numbers. is there.

 Brief Description of Drawings

 FIG. 1 is an overall side view of an IC device test apparatus including a handler according to an embodiment of the present invention.

 FIG. 2 is a perspective view of a handler according to the same embodiment.

 FIG. 3 is a cross-sectional view of the main part in the test chamber of the handler according to the same embodiment.

 FIG. 4 is a plan view of a plurality of test unit units having different socket sizes, arrangements, and numbers.

FIG. 5 is a bottom view showing an example of a movable head of the XY transport device in the handler according to the embodiment.

 FIG. 6 is a plan view showing an example of a precursor in the handler according to the embodiment.

 FIG. 7 is a perspective view of a test tray used in the handler according to the embodiment.

 FIG. 8 is a cross-sectional view of the carrier of the test tray used in the handler according to the same embodiment (A-A cross-sectional view in FIG. 7).

 FIG. 9 is a perspective view of a carrier core of a test tray used in the handler according to the same embodiment.

FIG. 10 is a perspective view of a pusher block in the handler according to the embodiment. FIG. 11 is a sectional view of the pusher block and the carrier core of the test tray in the handler according to the same embodiment.

 FIG. 12 is a plan view of the carrier core and pusher block of the test tray in the handler according to the same embodiment.

 FIG. 13 is a perspective view showing another example of a carrier core.

 FIG. 14 is a plan view of a carrier core and a pusher block according to another example.

 Explanation of symbols

[0046] 1 ... Handler (Electronic component handling device)

 10 ·· 'IC device (electronic parts) test equipment

 30 ... Pusher

 30a- · Pusher block

 310 ... Recess

 311 ... Projection

 303 ... movable head

 304 ··· Χ— Y transfer device (transfer device)

 305 ... Preciseer (mounting part)

 5 ... Test head

 50, 50a, 50b, 50c, 50d ... Test collar unit

 51 ··· Socket board

 40, 40a, 40b, 40c, 40d ... socket

 500 ·· 'Test tray

 518, 518A ... Carrier core (electronic component storage member)

 520

 521, 521X, 521Υ ...

 BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an overall side view of an IC device test apparatus including an electronic component handling apparatus (hereinafter referred to as “node,”) according to an embodiment of the present invention, and FIG. 2 is an oblique view of a handler according to the embodiment. FIG. 3 is a cross-sectional view of the main part in the test chamber of the handler according to the embodiment.

[0048] First, an overall configuration of an IC device test apparatus including a handler according to an embodiment of the present invention will be described.

 As shown in FIG. 1, the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main apparatus 6. The handler 1 performs an operation of sequentially transporting IC devices (an example of electronic components) to be tested to a socket provided in the test head 5, classifying the IC devices that have been tested according to the test results, and storing them in a predetermined tray. Execute.

 [0050] The socket provided in the test head 5 is electrically connected to the test main device 6 through the cable 7. The IC device detachably attached to the socket is connected to the test main device 6 through the cable 7. Connect and test the IC device with the electrical test signal from the main test device 6.

 [0051] Although a control device that mainly controls the handler 1 is built in the lower part of the handler 1, a space portion 8 is provided in part. The test head 5 is replaceably disposed in the space portion 8 so that the IC device can be mounted in the socket on the test head 5 through the through hole formed in the handler 1.

 [0052] The handler 1 is an apparatus for testing an IC device, which is an electronic component to be tested, in a temperature state higher than normal temperature (high temperature) or a lower temperature state (low temperature). As shown in FIG. 2, the handler 1 includes a chamber 100 including a thermostatic bath 101, a test chamber 102, and a heat removal bath 103. The upper part of the test head 5 (test unit 50) is inserted into the test chamber 102 as shown in FIG. 3, where the IC device 2 is tested.

 [0053] As shown in FIG. 2, the handler 1 of the present embodiment stores an IC device that also performs testing, and also stores an IC storage unit 200 that classifies and stores tested IC devices, and an IC storage Part 200 Loader part 300 for sending IC devices to be tested to the chamber part 100 to which force is sent, the chamber part 100 including the test head, and the unloader part for taking out and classifying the tested ICs that have been tested in the chamber part 100 It consists of 400 and

A number of IC devices before being set in the handler 1 are stored in a customer tray (not shown), and are supplied to the IC storage unit 200 of the nodler 1 shown in FIG. IC device Here, the customer tray is also transferred to a test tray 500 (see FIG. 7), which will be described later, which is used for transport in the handler 1. Inside Handler 1, the IC device moves while placed on the test tray 500, and is subjected to a test (inspection) to determine whether it operates properly by being subjected to high or low temperature stress, and depending on the test result. Classified.

[0055] On the test head 5, test unit units 50a to 50d as shown in FIG. 4 are provided. The test unit units 50a to 50d include a performance board 52 and a socket board 51 electrically connected to the performance board 52 and provided with a plurality of sockets 40a to 40d. The test unit units 50a to 50d are provided to be replaceable with respect to the test head body.

 [0056] In the present embodiment, the test unit units 50a to 50d are provided with a plurality (12 pieces in FIG. 4) of socket boards 51, and each socket board 51 has a plurality (4 pieces or 6 pieces in FIG. 4). ) Sockets 40a-40d are provided!

 [0057] The test unit units 50a to 50d are different in the size, arrangement (pitch or orientation in the plane direction) or number of the sockets 40a to 40d, and the sockets 40a to 40d depend on the type of IC device under test. The size, arrangement, and number of 40d are set as appropriate. For example, the arrangement (especially pitch) of the sockets 40a to 40d is in the state where the electrical characteristics of the test unit 50a to 50d are the best in consideration of the characteristics of the electrical signals branched in the test unit 50a to 50d. That is, it is set as appropriate so that the performance of the test main device 6 can be maximized.

 [0058] In the present embodiment, the change in the arrangement of the sockets 40a to 40d as described above is performed for each of the socket boards 51 provided in a plurality in the test unit units 50a to 50d, whereby the test unit units 50a to 50d. It is possible to further improve the characteristics of the electrical signal branched within 50d.

[0059] Referring to FIG. 4, the socket 40b of the test unit 50b is smaller than the socket 40a of the test unit 5Oa and has a smaller pitch. The socket board 51 is provided close to the center. Further, the socket 40c of the test unit 5Oc is provided in a state of being rotated by 90 ° with respect to the socket 40a of the test unit 50a. Further, the socket 40a of the test unit 50a is connected to each socket board 51. In contrast, four sockets 40d of the test unit 50d are provided on each socket board 51, and the number of sockets 40d of the test unit 50d is larger than the socket 40a of the test unit 50a. .

 [0060] As described above, the test unit units 50a to 50d are different in size, arrangement, or number of the sockets 40a to 40d, but have the same outer shape. In this way, by setting the outer dimensions of the test unit units 50a to 50d to the same size, the test unit 500 transporting the test tray 500 can be changed to the test unit units 50a to 50d without changing the device that drives the pusher 30. On the other hand, the same handler 1 can be used.

 [0061] The handler 1 will be described below.

 As shown in Fig. 2, the IC storage unit 200 of Handler 1 stores the pre-test IC stocker 201 that stores the IC device before the test and the tested IC device that stores the IC devices classified according to the test results. IC stocker 202 is provided.

 [0062] A pre-test IC stocker 201 shown in FIG. 2 holds a stack of customer trays containing IC devices to be tested. In addition, in the tested IC stocker 202, customer trays in which IC devices classified after the test are stored are stacked and held.

 As shown in FIG. 2, the customer tray stored in the pre-test IC stocker 201 is stored in the device substrate 105 by means of a tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. It is carried from the lower side to the window part 306 of the loader part 300. In this loader section 300, the IC device under test loaded on the customer tray is transferred to the precursor 305 by the XY transport device 304 (corresponding to the transfer device of the present invention), where the IC device under test is transferred. After correcting the mutual positions of the devices, the IC device under test transferred to the precursor 305 is reloaded onto the test tray 500 stopped at the loader unit 300 by using the XY transport device 304 again.

[0064] As shown in FIG. 2, the X-Y transport device 304 for reloading the IC device under test onto the test tray 500, such as a customer tray car, has two rails 301 installed on the upper portion of the device substrate 105. The movable rail 302 that can reciprocate between the test tray 500 and the customer tray (this direction is defined as the Y-axis direction) by the two rails 301 and the movable arm 302 And a movable head 303 that is movable along the movable arm 302 in the X-axis direction.

 [0065] A plurality (four in Fig. 5) of suction heads 313 are mounted downward on the movable head 303 of the XY transport device 304, and the customer tray card is also attached by the suction head 313. The IC device 2 to be tested is adsorbed, and the IC device 2 to be tested is stored in the test tray 500.

 [0066] In the handler 1 according to the present embodiment, the socket 40 corresponds to the test unit 50 (for example, the test hook unit 50a, 50b, 50d and the test hook unit 50c) having different orientations in the planar direction. As shown in (a) to (b), the movable head 303 of the XY transport device 304 is rotatable. That is, each suction head 313 sucks the IC device 2 under test as shown in FIG. 5 (a), and in that state, rotates 90 ° and rotates the IC device under test as shown in FIG. 5 (b). Place device 2 in test tray 500. In this way, since the XY transport device 304 can change the orientation of the IC device 2 in the planar direction by 90 °, the handler 1 is connected to the test unit 50a, 50b, 50d and the test unit 50c. Either can be supported.

 The rotation of the movable head 303 is preferably performed automatically based on the information read by the nodler 1 on the information of the test unit 50 to be used.

 In the above embodiment, the force configured to rotate the movable head 303 of the XY transport device 304 is configured so that each suction head 313 provided on the movable head 303 rotates instead. Hey.

 [0069] In the handler 1 according to the present embodiment, instead of rotating the movable head 303 of the XY transport device 304, as shown in FIG. 6, a precursor 305 (corresponding to the placement portion of the present invention) Can be rotated and the pitch can be changed. The precursor 305 of this example includes a substrate 305 and a plurality of movable portions 315 provided on the substrate 305 (four in FIG. 6). The movable portion 315 has a concave device storage portion 325 formed therein. ing. The device storage portion 325 has a shape corresponding to the shape of the IC device 2 under test.

[0070] In the precisionr 305 of this example, each of the movable parts 315 force in which the IC device 2 is housed in the device housing part 325 is rotated by 90 ° or in the X-axis direction and the ZY-axis direction as shown in FIGS. By moving, the orientation of IC device 2 in the plane direction is changed by 90 °, or the pitch is changed. Can be changed.

 [0071] The test tray 500 on which the IC device 2 to be tested is loaded in the loader unit 300 is sent to the constant temperature bath 101 of the chamber 100 and then to the test chamber 102, and each IC device 2 to be tested is tested in the test chamber 102. Is done.

 As shown in FIG. 3, a test unit 50 of the test head 5 is disposed at the lower part of the test chamber 102. The test tray 500 in which the IC device 2 is stored is carried on the test unit 50. The IC device 2 housed in the test tray 500 is pressed against the socket 40 provided in the test unit 50 by pressing the pusher 30. As a result, the external terminal of the IC device 2 is in electrical contact with the connection terminal of the socket 40, and a test signal is applied to the IC device 2 in that state to perform the test. When the test is completed, heat is removed from the test tray 500 in the heat removal tank 103, the temperature of the IC device 2 is returned to room temperature, and then discharged to the unloader section 400 shown in FIG.

 [0073] As shown in Fig. 2, the unloader unit 400 is also provided with XY transport devices 404, 404 having the same structure as the XY transport device 304 provided in the loader unit 300. The tested IC devices 2 are transferred from the test tray 500 carried out to the unloader unit 400 to the customer tray by the transfer devices 404 and 404.

 As shown in FIG. 7, the test tray 500 in the present embodiment includes a plurality of carriers 516 and a frame 510 that detachably supports the carriers 516.

 [0075] As shown in FIGS. 7 and 8, the carrier 516 includes a plurality of (four in FIG. 7) carrier cores 5 18 (corresponding to the electronic component housing member of the present invention) and a carrier core 518 that is detachable. And a carrier body 517 (which corresponds to the support body of the present invention with the frame 510). The plurality of carrier cores 518 are arranged on the carrier body 517 so as to correspond to the position of the socket 40 of the test unit 50. For example, in the example shown in FIG. 7, the carrier cores 518 are arranged in 2 rows × 2 columns.

 [0076] The carrier body 517 has a frame-like shape with an opening corresponding to the carrier core 518, and includes a pivotable hook 517a extending downward.

As shown in FIG. 8, the carrier core 518 is formed with an engaging portion 518a (not shown in FIG. 7). The hook 517a of the carrier body 517 is engaged with the engaging portion 518a of the carrier core 518. Thus, the carrier core 518 is supported by the carrier body 517. Then, the hook 517a rotates and the engagement between the hook 517a and the engaging portion 518a is released, so that the carrier core 518 is detached from the carrier body 517 and can be replaced with another carrier core 518.

Each carrier core 518 is formed with a device storage portion 519 corresponding to the shape of the IC device 2 to be tested, and the IC device 2 to be tested is stored so as to fit into the device storage portion 519. Is done. The structure related to the pusher 30 of the carrier core 518 will be described later.

 [0079] As shown in FIG. 7, a plurality of types of carrier cores 518 are prepared according to the type of test unit 50 (size, arrangement and number of sockets 40). The carrier body 517 is appropriately selected and attached to the carrier body 517. The device storage portion 519 of each carrier core 518 is formed at a position corresponding to the position of the socket 40 in the carrier core 518. For example, in the example shown in FIG. 7, each device storage portion 519 in each carrier core 518 is formed closer to the center portion of the carrier core 518.

 [0080] The hook 517a of the carrier body 517 is automatically rotatable by a drive device (not shown) provided in the handler 1. The handler 1 accommodates a plurality of types of carrier cores 518, and automatically selects the carrier core 518 corresponding to the type of the IC device 2 to be tested so that it can be conveyed to the bottom of the carrier body 517. As a result, a desired carrier core 518 can be automatically attached to the carrier body 517 and thus to the test tray 500, and a single handler 1 can handle a plurality of types of test unit units 50.

 [0081] It is preferable that the carrier core 518 is replaced automatically by the nodler 1 reading the information of the test unit 50 to be used and based on the read information.

 Note that the above example is a case where the number of the sockets 40 in the socket board 51 is four, but when the number of the sockets 40 in the socket board 51 is ½, six carrier cores 518 are supported. The carrier 516 is prepared, and the carrier 516 is supported by the frame 510 of the test tray 500. Replacement of the carrier 516 in the test tray 500 can also be performed automatically by the No. 1 and No. 1 drivers.

[0083] According to the test tray 500, the carrier core 518 corresponding to the type of the test unit 50 to be used (size, arrangement or number of the sockets 40) is prepared, and the carrier core selected as appropriate is prepared. By supporting the carrier 518 on the carrier body 517 (test tray 500) in a detachable manner, it is possible to support a plurality of types of test unit units 50.

 On the other hand, the pusher 30 is provided above the test unit 50 and is held by the match plate 60 as shown in FIG. 3 and FIG. The match plate 60 is supported by the Z-axis drive device 70 so as to be positioned above the test unit 50 and so that the test tray 500 can be inserted between the pusher 30 and the socket 40. The pusher 30 held by the match plate 60 can be moved in the Z-axis direction by driving the Z-axis driving device 70, thereby pressing the IC device 2 mounted on the test tray 500 against the socket 40. It is possible.

 As shown in FIG. 9, the carrier core 518 described above is formed with a plurality of protrusions 521 standing in the Z-axis direction, and the plurality of protrusions 521 are recessed between each other. It is a groove 520.

 [0086] Each protrusion 521 in the present embodiment has a substantially L shape in a plan view including a protrusion extending in the X-axis direction and a protrusion extending in the Y-axis direction. A plurality of L-shaped protrusions 521 are formed side by side at a predetermined interval so that one corner force of the carrier core 518 gradually increases in the opposite direction (this is referred to as “diagonal portion”). The ridge 521 is notched at the diagonal portion. This notch is the aforementioned device storage 519, in which the IC device 2 to be tested is stored. The IC device 2 dropped into the device storage portion 519 is positioned by contacting the end of the cut-out protrusion 521. As shown in FIG. 11, the upper part of the end of the cut ridge 521 is cut obliquely so that the IC device 2 can be easily dropped into the device storage portion 519.

 [0087] In the carrier core 518, as shown in Figs. 12 (a) to 12 (c), sockets 40 having different sizes, pitches, or plane directions can be obtained by changing the notch amount of the protrusion 521. It can correspond to. That is, the carrier core 518 is first prepared without a notch of the protrusion 521, and the protrusion 521 is notched by a predetermined amount according to the size, pitch, or plane direction of the socket 40. Therefore, it is possible to easily manufacture various sockets 40.

The pusher 30 in the present embodiment includes pusher blocks 30 a as shown in FIG. 10 corresponding to the number of sockets 40. In this pusher block 30a, the bottom surface is This is a device pressing portion that presses the device under test IC 2 housed in the device housing portion 519 of the carrier core 518.

 [0089] The device pressing portion of the pusher block 30a is provided with a plurality of convex portions 311 that can be inserted into the plurality of concave grooves 520 of the carrier core 518, and the carrier core 518 is provided between the plurality of convex portions 311. The plurality of protrusions 521 are recessed portions 310 into which the protrusions 521 can be inserted. The convex portion 311 and the concave portion 310 of the pusher block 30a in the present embodiment are substantially L-shaped in plan view corresponding to the shapes of the concave groove 520 and the protruding portion 521 of the carrier core 518.

 [0090] The protrusion 311 of the pusher block 30a interferes with the protrusion 52 1 of the carrier core 518 having the smallest notch (device storage portion 519) of the protrusion 521 among the plurality of types of carrier cores 518. Shina is formed like this. Since the protrusion 311 of the pusher block 30a formed in this way does not interfere with the protrusion 521 of the carrier core 518 having a large cutout portion of the protrusion 521, a plurality of types of carrier cores 518 are formed with one type of pusher block 30a. It is possible to deal with

 When the pusher block 30a is brought close to the IC device 2 housed in the device housing portion 519 of the carrier core 518, as shown in FIGS. 11 and 12, the convex portion 311 of the pusher block 30a becomes the carrier core 518. The protrusion 521 of the carrier core 518 is inserted into the recess 310 of the pusher block 30a. At the same time, the convex portion 311 of the pusher block 3 Oa is inserted into the cutout portion (device storage portion 519) of the carrier core 518, and the IC device 2 is pressed by the insertion portion of the convex portion 311 of the pusher block 30a, so Pressed against ket 40.

 [0092] As shown in FIGS. 11 (a), (b) and FIGS. 12 (a) to (c), the type of carrier core 518, that is, the size of the socket 40, the pitch, or the orientation in the plane direction changes. However, it is possible to press the IC device 2 as described above without changing the pusher block 3 Oa (pusher 30).

 [0093] When the number of sockets 40 in the socket board 51 changes (for example, four force is six), the number of match plates 60 corresponds to the number of sockets 40 (for example, six) pusher blocks 30a. It may be exchanged for one that holds the pusher 30 with the.

As described above, according to the handler 1 and the test tray 500 according to the present embodiment, the socket 4 The same handler 1 can handle a plurality of types of test unit units 50 having a different size, arrangement, or number of zeros.

The embodiments described above are described for facilitating understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

 FIGS. 13 and 14 show other examples of the carrier core 518 and the pusher block 30a.

 As shown in FIG. 13, the carrier core 518A is formed with a ridge 521X standing in the Z-axis direction and extending in the X-axis direction and a ridge 521Y extending in the Y-axis direction. . The ridge 521X and the ridge 521Y are notched at the substantially central portion of the carrier core 518A, and the notch is a device storage portion 519. That is, the protrusion 521X and the protrusion 521Y are located around the notch (device storage 519).

 [0097] In the carrier core 518A, as shown in FIGS. 13 (a) and (b) and FIGS. 14 (a) and (b), the carrier core 518A has a large size by changing the notch amount of the protrusions 521X and 521Y. In addition, sockets 40 with different pitch or planar orientations can be accommodated.

 On the other hand, as shown in FIG. 14, the bottom surface portion (device pressing portion) of the pusher block 30A has a convex extending in the X-axis direction and the Y-axis direction around the substantially central portion of the device pressing portion. Part 311A is formed. The convex portion 311A is designed to prevent interference with the ridges 521X and 521Y of the carrier core 518A having the smallest notch (device storage portion 519) of the ridges 521X and 521Y among the multiple types of carrier cores 518A. Is formed. The protrusion 311A of the pusher block 30A formed in this way does not interfere with the protrusions 521X and 521Y of the carrier core 518A where the notches of the protrusions 521X and 521Y are large. It is possible to correspond to the carrier core 518A.

 Industrial applicability

The present invention is useful for efficient use of an electronic component handling apparatus for a plurality of types of test unit units.

Claims

The scope of the claims  [1] An electronic component handling apparatus capable of transporting a test tray containing a plurality of electronic components to positions of a plurality of sockets of a test unit unit provided in a test head,  An electronic component handling device that can be used in conformity with any of the plurality of test unit units by making the outer shapes of the plurality of test unit units having different sizes, arrangements, and numbers of sockets substantially the same size. .  [2] The electronic component storage member of the test tray can be exchanged so that the electronic component can be mounted in the socket of the test unit according to the type of the test unit used. An electronic component handling device according to claim 1. 3. The electronic component handling apparatus according to claim 2, wherein the electronic component storage member of the test tray is automatically replaced according to the type of the test unit used. [4] The electronic component handling apparatus according to [3], wherein information on the test unit used is read and the electronic component storage member of the test tray is automatically replaced based on the read information.  [5] The test tray includes a movable member capable of holding and releasing the electronic component storage member.  3. The electronic component handling apparatus according to claim 2, wherein the electronic component handling apparatus includes a device that drives the movable member. [6] The movable member is a hook-shaped member,  The electronic component housing member is formed with an engaging portion with which the hook-shaped movable member is engaged.  6. The electronic component handling apparatus according to claim 5, wherein [7] The electronic component storage member includes a plurality of protrusions standing in the Z-axis direction, and the electronic component is stored in the cutout portion where the protrusions are notched. The electronic component handling device according to claim 2. [8] The protrusion may include a plurality of protrusions extending in the X-axis direction and a plurality of protrusions extending in the Y-axis direction. Electronic component handling equipment [9] The protrusions have a substantially L shape in plan view, and are formed in a plurality at a predetermined interval so as to increase sequentially from one corner of the electronic component housing member to the diagonal. The notch is formed at a position diagonal to the one corner.  8. The electronic component handling apparatus according to claim 7, wherein [10] The notch is formed in a substantially central portion of the electronic component housing member,  The ridge extending in the X-axis direction and the ridge extending in the Y-axis direction are located around the notch.  9. The electronic component handling apparatus according to claim 8, wherein [11] The electronic component pressing portion of the pusher included in the electronic component handling device is provided with a plurality of convex portions that can be inserted between the plurality of protrusions in the electronic component storage member, 8. The electronic component handling apparatus according to claim 7, wherein a convex portion between the convex portions is a concave portion into which the protruding portion of the electronic component storage member can be inserted.  [12] The protrusion of the pusher is formed so that the cutout portion is the smallest among the plurality of types of electronic component storage members and does not interfere with the protrusions in the electronic component storage member. The electronic component handling apparatus according to claim 11, wherein  [13] The convex portion of the pusher has a substantially rectangular convex portion in plan view provided at one corner of the electronic component pressing portion and a corner force of the electronic component pressing portion so as to gradually increase toward the diagonal. 12. The electronic component handling device according to claim 11, wherein a plurality of convex portions having a substantially L shape in a plan view formed side by side at a predetermined interval.  14. The electronic component handling according to claim 11, wherein the convex portion of the pusher extends in the X-axis direction and the Y-axis direction about a substantially central portion of the electronic component pressing portion. apparatus.  [15] The electronic component handling apparatus is capable of transferring an electronic component to a test tray as well as a supply tray. The electronic component according to claim 1, wherein the arrangement of the electronic component can be changed in the process of transferring the electronic component to the supply tray tester tray according to the type of the test unit used. Child parts handling device.  [16] The electronic component handling device includes a transfer device that holds the electronic components stored in the supply tray and can transfer them to the test tray.  16. The electronic component handling apparatus according to claim 15, wherein the transfer device has a function of changing an arrangement of electronic components held. 17. The electronic component handling apparatus according to claim 16, wherein the transfer device has a function of changing the orientation of the electronic component being held in the planar direction. [18] The electronic component handling apparatus includes a mounting portion on which the electronic component can be temporarily mounted while the electronic component is being transferred to the test tray. 16. The electronic component handling apparatus according to claim 15, wherein the unit has a function of changing an arrangement of the placed electronic component. [19] The electronic component handling device according to [18], wherein the placement unit has a function of changing a pitch and Z or a plane direction of the placed electronic component.  20. The electronic component handling apparatus according to claim 15, wherein the arrangement of the electronic component is automatically changed according to the type of test unit used. 21. The electronic component handling apparatus according to claim 20, wherein information on a test unit to be used is read and the arrangement of the electronic components is automatically changed based on the read information.  [22] A test tray that houses a plurality of electronic components and is routed so as to be transported to a test unit in an electronic component handling device,  The test tray includes an electronic component storage member and a support that removably supports the electronic component storage member,  The support is provided with a movable member capable of holding and releasing the electronic component storage member.  A test tray characterized by that. [23] The movable member is a hook-shaped member, The electronic component housing member is formed with an engaging portion for engaging the hook-shaped movable member. Is  23. The test tray according to claim 22, wherein [24] The electronic component storage member is provided with a plurality of protrusions standing in the Z-axis direction, and the electronic component is stored in the cutout portion where the protrusions are notched. The test tray according to claim 22, wherein the test tray is characterized in that: 25. The ridge portion according to claim 24, wherein the ridge portion includes a plurality of ridge portions extending in the X-axis direction and a plurality of ridge portions extending in the Y-axis direction. Test tray. [26] The protrusions have a substantially L shape in plan view, and are formed in a plurality at a predetermined interval so as to increase sequentially from one corner of the electronic component housing member toward the diagonal. The notch is formed at a position diagonal to the one corner.  25. The test tray according to claim 24. [27] The notch is formed in a substantially central portion of the electronic component housing member,  The ridge extending in the X-axis direction and the ridge extending in the Y-axis direction are located around the notch.  26. The test tray according to claim 25, wherein: [28] A plurality of protruding ridges standing in the Z-axis direction are formed, and the test is provided with an electronic component storage portion in which an electronic component is stored in the cutout portion where the protruding portion is cut out. A pusher used in an electronic component handling device corresponding to a tray,  The electronic component pressing portion of the pusher is provided with a plurality of convex portions that can be inserted between the plurality of protruding portions of the electronic component storage member, and the plurality of convex portions are spaced from each other. A pusher characterized in that the protrusion of the electronic component housing member becomes a recess into which the electronic component storage member can be inserted.  [29] The convex portion of the pusher is formed so that the cutout portion is the smallest among a plurality of types of electronic component storage members and does not interfere with the ridges in the electronic component storage member. 29. The pusher according to claim 28, wherein: [30] The convex portion of the pusher has a substantially rectangular convex portion in plan view provided at one corner of the electronic component pressing portion, and a corner force of the electronic component pressing portion so as to gradually increase toward the diagonal. A plurality of convex portions having a substantially L shape in a plan view formed side by side at predetermined intervals. 29. A pusher according to claim 28, characterized in that: 31. The pusher according to claim 28, wherein the convex portion of the pusher extends in the X-axis direction and the Y-axis direction about a substantially central portion of the electronic component pressing portion. [32] This is a method of operating an electronic component handling apparatus capable of transporting a test tray containing a plurality of electronic components to a plurality of socket positions of a test unit unit provided in a test head. And  Depending on the predetermined test unit used from a plurality of test unit units that differ in size, arrangement and number of sockets and have substantially the same size, the sockets of the test unit A method of operating an electronic component handling apparatus, wherein the electronic component storage member of the test tray is replaced so that the electronic component can be mounted on the test tray.  33. The method of operating an electronic component handling apparatus according to claim 32, wherein the electronic component storage member of the test tray is automatically replaced according to a predetermined test unit used.  [34] The electronic component can be transferred to the supply tray tester tray, and the test tray containing multiple electronic components can be transported to the multiple socket positions of the test unit on the test head. A method of operating an electronic component handling apparatus, in which at least one type of socket is different in size, arrangement, and number, and a predetermined test unit used from among a plurality of test unit units having substantially the same size. Accordingly, the electronic component handling apparatus operating method is characterized in that the arrangement of the electronic components is changed in the process of transferring the electronic components to the supply tray tester tray.  [35] The operation method of the electronic component handling apparatus according to [34], wherein the arrangement of the electronic component is automatically changed according to a predetermined test unit used.