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WO2008013048A1 - Composition de revêtement - Google Patents

Composition de revêtement Download PDF

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Publication number
WO2008013048A1
WO2008013048A1 PCT/JP2007/063662 JP2007063662W WO2008013048A1 WO 2008013048 A1 WO2008013048 A1 WO 2008013048A1 JP 2007063662 W JP2007063662 W JP 2007063662W WO 2008013048 A1 WO2008013048 A1 WO 2008013048A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
coating composition
coupling agent
polymer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/063662
Other languages
English (en)
Japanese (ja)
Inventor
Meiten Koh
Nobuyuki Komatsu
Kouji Yokotani
Miharu Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to KR1020097004084A priority Critical patent/KR101095766B1/ko
Priority to US12/307,829 priority patent/US8779047B2/en
Publication of WO2008013048A1 publication Critical patent/WO2008013048A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D131/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Coating compositions based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/006—Other inhomogeneous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)

Definitions

  • the present invention relates to a coating composition for forming a high dielectric film of, for example, a film capacitor, and a high dielectric film formed from the coating composition.
  • plastic insulators are characterized by high insulation resistance, excellent frequency characteristics, and excellent flexibility. Therefore, plastic insulators are used for communication, electronic equipment, power, and medium-low pressure phase advancement. It is expected to be used as a film material for film capacitors such as piezoelectric capacitors, pyroelectric elements, and transfer material carrying dielectrics.
  • Film capacitors are usually composed of a film having a structure in which aluminum or zinc is vapor-deposited on the surface of a dielectric polymer film, or a film cover in which aluminum foil and a dielectric polymer film are laminated in multiple layers. Many are also used in which electrodes are formed on dielectric polymer films by metal deposition.
  • Hydrocarbon polymers such as polypropylene, polyester, and polyphenylene sulfide are being investigated as dielectric polymers for film capacitors. These films alone have a dielectric constant of about 2.3 to 3 There is only.
  • a high-dielectric polyvinylidene fluoride polymer is considered to be a cyanoethylated pullulan.
  • the film of the displacement also has a dielectric constant of 20
  • the thin film is a difficult material because of the following.
  • Inorganic particles with a particularly high dielectric constant as one of the means for increasing the dielectric constant of capacitor films It has been proposed to combine the polymer with a polymer to form a film.
  • the melt kneading method (1) is a method in which a polymer and inorganic ferroelectric particles are kneaded at a temperature higher than the melting temperature of the polymer, and then formed into a film by a melt extrusion method or an inflation method, and if necessary, a stretching treatment is performed.
  • a hydrocarbon polymer such as polyphenylene sulfide, polypropylene, or polyester
  • a vinylidene fluoride polymer are used. Cases to be used (for example, JP-A-59-43039, JP-A-60-185303, JP-A-58-69252) are known.
  • the film is difficult to manufacture.
  • thermosetting polymer or precursor such as aromatic polyamide, aromatic polyimide, epoxy resin, etc., which is excellent in heat resistance and mechanical strength
  • a hydrocarbon-based thermosetting polymer or precursor such as aromatic polyamide, aromatic polyimide, epoxy resin, etc.
  • a case using a vinylidene fluoride polymer JP Sho 54-129397
  • a hydrocarbon-based thermosetting polymer When a hydrocarbon-based thermosetting polymer is used, a thin film with high mechanical strength can be manufactured. However, the film has a large dielectric loss, and it becomes a hard film and has excellent stickiness (flexibility). Therefore, it is not suitable as a film for a film capacitor that requires a high temperature. In particular, a system in which inorganic ferroelectric particles are added and mixed is used for embedded capacitor applications by virtue of its very hard property.
  • the present invention provides a high dielectric film having high dielectric properties, low dielectric loss, and capable of being thinned, and having excellent tackiness (flexibility), and a high dielectric film of a film capacitor. It is an object of the present invention to provide a coating composition suitable for forming a film.
  • the present invention provides:
  • Such a coating composition is suitable for forming a high dielectric film of a film capacitor.
  • the present invention also relates to a film obtained by applying a coating composition to a substrate, drying it to form a film, and then peeling the film from the substrate, in particular, a high dielectric property of a film capacitor. Also related to film.
  • the coating composition of the present invention comprises:
  • thermoplastic non-fluorinated polymer (A) a thermoplastic non-fluorinated polymer
  • thermoplastic non-fluorinated polymers It is the base polymer of the film, and has a dielectric constant (measured at a frequency of 10 kHz, 20 ° C. Unless otherwise specified, the same applies in this specification) of 2.0 or more, and 2.5 or more thermoplastic.
  • Non-fluorine polymer strength This is preferable because it contributes to the high dielectric constant of the film.
  • the upper limit of the dielectric constant of thermoplastic non-fluorinated polymers is usually around 6.0.
  • thermoplastic non-fluorinated polymers include, for example, polycarbonate, cellulose, polyphenylene ether, polycyclohexylene, polyphenylene oxide, polysulfone, polyethersulfone, polyvinyl chloride, polystyrene, poly Among these, polycarbonate, cellulose, polyphenylene ether, polycyclohexylene, polysenolephone, and polyethersulfone are preferred because of their excellent film formability and heat resistance.
  • Examples of the polycarbonate include Dupylon (trade name) and Novarex (trade name) manufactured by Mitsubishi Engineering Plastics, which provide excellent heat resistance, dimensional stability, and mechanical strength. .
  • Examples of cellulose include cellulose acetate and nitrocellulose, which are excellent in compatibility with inorganic ferroelectric particles and give excellent mechanical strength.
  • Examples of the polyphenylene ether include Rubyace (trade name) and Remalloy (trade name) manufactured by Mitsubishi Engineering Plastics Co., Ltd., which give low dielectric loss and excellent heat resistance.
  • polycycloolefin examples include ZEONOR (trade name) manufactured by Nippon Zeon Co., Ltd. Giving low dielectric loss and excellent heat resistance.
  • Examples of the polysulfone include Udel (trade name) manufactured by Solvay Advanced Polymer, which provides excellent heat resistance and excellent mechanical strength at high temperatures.
  • barium titanate-based oxide particles or lead zirconate titanate-based oxide particles (PZ T) particles are typical inorganic ferroelectric particles, and their dielectric constant is 500 or more. It is.
  • barium titanate-based oxide particles have a high dielectric constant exceeding 1500, and point power that is easy to atomize is also preferred.
  • the particle diameter of the inorganic ferroelectric particles (B) is 2 ⁇ m or less, more preferably 1.2 m or less, particularly about 0.01 to 0.5 m in terms of the average particle diameter.
  • a point force excellent in surface smoothness and uniform dispersibility is also preferred.
  • the affinity improver (C) enhances the affinity between the polymer (A) and the inorganic ferroelectric particles (B) and uniformly disperses them, while the inorganic ferroelectric particles (B) and the polymer (A ) Is a component that plays a role in binding in the film. Without this component (C), voids are likely to occur in the film and the dielectric constant decreases.
  • Component (C) also functions to uniformly disperse inorganic ferroelectric particles with polymer (A) in the film-forming composition described below.
  • titanium-based coupling agent examples include monoalkoxy type, chelate type, and coordinate type. Particularly, the monoalkoxy type having good affinity with the inorganic ferroelectric particles (B), Chelate type is preferred.
  • Examples of the silane coupling agent include a high molecular type and a low molecular type, and monoalkoxysilane, dialkoxysilane, trialkoxysilane, dipodalalkoxysilane and the like in terms of the number of functional groups.
  • a low molecular type alkoxysilane having a good affinity with the inorganic ferroelectric particles (B) is preferred.
  • the surfactant (C2) there are a high molecular type and a low molecular type, and there are a nonionic surfactant, an anionic surfactant, and a cationic surfactant in terms of the type of functional group.
  • High molecular surfactants are preferred because they can be used and have good thermal stability.
  • Nonionic surfactants include, for example, polyether derivatives, polybutylpyrrolidone derivatives, alcohol derivatives, and the like. Particularly, the polyether derivatives have a high point of affinity with the inorganic ferroelectric particles (B). Is preferred.
  • examples of the anionic surfactant include a polymer containing a sulfonic acid, a carboxylic acid, and a salt thereof, and specifically, from the viewpoint of good affinity with the polymer (A). Acrylic acid derivative polymers, methacrylic acid derivative polymers, and maleic anhydride copolymers are preferred.
  • Examples of the cationic surfactant include compounds having a nitrogen-containing complex ring such as amine compounds and imidazolines and their halogenated salts. From the viewpoint of low aggressiveness to the polymer (A), A compound having a nitrogen-containing complex ring is preferred.
  • Examples of the salt form include ammonia salts containing halogen ions such as alkyltrimethyl ammonium chloride. Amorphous salts with high dielectric constants and halogen ions are preferred.
  • Examples of the epoxy group-containing compound (C3) include an epoxy compound and a glycidyl compound, which may be a low molecular weight compound or a high molecular weight compound. Among them, a low molecular weight compound having one epoxy group having particularly good affinity with the polymer (A) is preferable.
  • an epoxy group-containing coupling agent classified as a coupling agent for example, epoxysilane is not included in the epoxy group-containing compound (C3), but is included in the coupling agent (C1).
  • the blending amount of component (C) is 0.01 parts by mass or more, preferably 0.1 parts by mass or more, particularly preferably 1 part by mass or more with respect to 100 parts by mass of the polymer (A). If the amount is too small, it will be difficult to disperse uniformly.
  • the upper limit is 30 parts by mass. If the amount is too large, the dielectric constant of the resulting film will decrease. A preferable upper limit is 25 parts by mass, and further 20 parts by mass.
  • a coupling agent (C1) and an epoxy group-containing compound (C3) are preferred because of their good affinity with the inorganic ferroelectric particles (B).
  • Agent or silane coupling agent power Especially preferred because of its good affinity for both polymer (A) and inorganic ferroelectric particles (B).
  • the coupling agent (C1) and the epoxy group-containing compound (C3) form a chemical bond (having a reactive group) with the inorganic ferroelectric particles (B), the coupling agent (C1) and the epoxy group-containing compound (C3) are further enhanced. It exerts a strong friendship improvement effect.
  • ketone solvents such as methyl ethyl ketone
  • ester solvents such as ethyl acetate
  • ether solvents such as dioxane
  • amide solvents such as dimethylformamide
  • ether-based solvents, amide-based solvents, and ketone-based solvents are preferred.
  • polyphenylene ethers examples include ketone solvents, aromatic hydrocarbon solvents such as toluene and mesitylene, and chlorinated hydrocarbon solvents such as chloroform and cyclomethane. In view of the good point strength, ketone solvents and aromatic hydrocarbon solvents are preferred.
  • polysulfone examples include alcohol solvents such as isopropyl alcohol and butanol, ketone solvents, and chlorinated hydrocarbon solvents. Alcohol solvents and ketone solvents are particularly preferable from the viewpoint of good coatability. Favored ,.
  • a fluorine-based polymer for example, a high dielectric constant polyvinylidene fluoride (PVdF) -based Polymer, fluorinated polymer, fluoroethylene Z butyl ether copolymer and so on. These fluoropolymers may be combined within a range that does not impair the object of the present invention.
  • PVdF polyvinylidene fluoride
  • Examples of the reinforcing filler include particles or fibers of silicon carbide, silicon nitride, magnesium oxide, potassium titanate, glass, alumina, and boron compounds.
  • Examples thereof include group-modified polyolefin, styrene-modified polyolefin, functional group-modified polystyrene, polyacrylimide, and tamilphenol, and may be blended within a range that does not impair the object of the present invention.
  • High dielectric organic compounds such as copper phthalocyanine tetramer may also be blended in a range without impairing the object of the present invention.
  • the coating composition of the present invention can be adjusted to a viscosity of 0.01 to 3? & '3 with a solvent (0).
  • the point power to obtain a film is also preferable.
  • the point power for suppressing the surface roughness is preferably 1.5 Pa's or less.
  • the VISCONE CV series cone plate viscometer manufactured by Tokai Yagami Co., Ltd. is used. The measurement conditions are room temperature, rotation speed 94rpm and No. 2 cone (10p).
  • the coating composition has a component that does not exist in the film! Defoaming agents, dispersing agents, wetting agents, leveling agents, spreading agents, and the like may be added as components that do not substantially affect the results (high dielectric constant, flexibility, thinning).
  • the coating composition is prepared by preparing a solution of the solvent (D) of the polymer (A), adding the remaining components appropriately thereto, and dispersing by stirring, preferably heating and stirring. Is done. More specifically, there are the following methods.
  • the affinity improver (C) is a chemically reactive affinity improver.
  • a ring agent (CI) or an epoxy group-containing compound (C3) the components (C) and (B) are reacted and then stirred and dispersed, and the components (B) and ( Add component C) to solvent (D), react and stir and disperse simultaneously, or use both together (this treatment is sometimes referred to as (B) component surface treatment) .
  • the affinity improver is a surfactant (C2), no reaction occurs, so add the components (B) and (C) to the solvent (D) and perform the reaction and stirring and dispersion simultaneously. Is convenient.
  • the order of addition is not particularly limited, and stirring / dispersing treatment may be performed each time one component is added.
  • the component (B) is previously removed from the surface adsorbed water by heat treatment or the like because the uniform dispersibility is further improved.
  • this component (B) By subjecting this component (B) to a preliminary heat treatment or surface treatment, uniform dispersion can be facilitated even if the component (B) has a large average particle size.
  • each component may be added in a predetermined amount at once, or may be added in divided portions. In the case of adding it in divided portions, for example, a part of the component (A) is added at the time of mixing the component (B) and the component (C), and the remaining component (A) is added after the mixing.
  • the order of addition and the divided addition may be freely combined, for example, component (C) is added and mixed in an additional manner.
  • component (B) When it is difficult to uniformly disperse component (B), it is desirable to forcibly disperse with stirring. If this dispersion treatment is insufficient, solids such as component (B) will settle easily, making the coating itself difficult, or phase separation will occur inside the coating film when it is dried. It may be difficult to form a film with uniform, excellent mechanical properties and uniform dielectric properties.
  • the stirring and dispersing treatment may be performed on the composition once prepared immediately before coating.
  • the standard of stirring and dispersing is that the composition after stirring and dispersing is not affected even if it is allowed to stand at room temperature (25 ° C) for 7 days. Separation does not occur (change in solution turbidity is slight (less than 10%)), and can be set by conducting a preliminary experiment.
  • Preferred examples of the stirring and dispersing device include a ball mill, a sand mill, an atlite, a pisco mill, a roll mill, a Banbury mixer, a stone mill, a vibrator mill, a dispersin mill, a disperser, a jet mill, and a dino mill.
  • jet mills, roll mills, and dyno mills are preferred because impurities are not easily introduced and continuous production is possible.
  • stirring dispersion condition can be exemplified by the following range, for example.
  • the coating composition of the present invention can be applied (coated) to a substrate, dried to form a film, and then peeled off from the substrate to produce a highly dielectric film. wear.
  • Coating methods include knife coating method, cast coating method, roll coating method, gravure coating method, blade coating method, rod coating method, air doctor coating method, curtain coating method, fakunrun coating method, kiss Capable of using coating method, screen coating method, spin coating method, spray coating method, extrusion coating method, electrodeposition coating method, etc. Of these, it is easy to operate, there are few variations in film thickness, and productivity A roll coating method, a gravure coating method, and a cast coating method are preferable from the viewpoint of superiority.
  • Drying can be performed by a method using Yankee cylinder, counter flow, hot air injection, air flow cylinder, air-through, infrared ray, microwave, induction heating and the like.
  • hot air injection method a condition of 130 to 200 ° C. and within 1 minute can be suitably employed.
  • the high dielectric film of the present invention may be left on the substrate as a so-called coating.
  • the base material is a material from which the polymer (A) is easy to peel, such as a metal plate such as stainless steel or copper; a glass plate; a polymer film deposited with ITO or ZnO; a polymer film subjected to a release treatment.
  • the polymer film which gave the mold release process to the surface is preferable from the point that it is easy to peel and productivity is also high.
  • the release treatment examples include a treatment for applying various release agents, a plasma treatment, and a treatment for laminating a release film.
  • the substrate preferably has a surface free energy (unit: jZm 2 ) of 30 or more and a water contact angle of 110 degrees or less.
  • the obtained film may be used as it is, it may be stretched by a conventional method.
  • the stretching ratio is preferably about 2 to 6 times.
  • the obtained film when used as a high dielectric film of a film capacitor, the obtained film may be further surface-treated with another polymer in order to facilitate the deposition of aluminum for electrodes.
  • the surface of the film may be subjected to plasma treatment or corona discharge treatment.
  • another type of polymer may be coated, or a crosslinking treatment with ultraviolet rays, electron beams, or radiation may be performed to improve the strength.
  • the film of the present invention obtained by force can have a film thickness of 9 ⁇ m or less, preferably 6 ⁇ m or less, and further 5 m or less.
  • the lower limit of the film thickness depends on the type of polymer and the particle size of component (B).
  • the force that maintains mechanical strength is about 2 m.
  • the dielectric constant is 9 or more even when the film thickness is 9 m or less, Can be 12 or more.
  • the film has a dielectric constant of 9 to 20 with a film thickness of 3 / zm, and cellulose has a packing rate of 175% by weight with barium titanate.
  • dielectric constant film having a thickness of 3 m when blended, dielectric constant film having a thickness of 3 m is 15 to 25, Porifue - when blended barium titanate in filling rate of 175 mass 0/0 ether, dielectric with a film having a thickness of 3 m the rate is 9 to 20, when blended with a filling factor of polycycloalkyl O Les Fi 175 mass barium titanate emissions 0/0, the dielectric constant film having a thickness of 3 m is 9-20, titanium polysulfone When barium oxide is blended at a filling rate of 175% by mass, the film has a thickness of 3 ⁇ m and a dielectric constant of 10 to 25. When blended with barium titanate in filling rate of 175 mass 0/0 down, the dielectric constant film having a thickness of 3 m is 10 to 25.
  • the film of the present invention has a small dielectric loss (measured at 10 kHz, 20 ° C., hereinafter the same unless otherwise specified).
  • Dielectric loss is, for example, 0.05 to 3 for polycarbonate, 0.1 to 4 for cellulose, and 0.1 to 3 for polyphenylene ether.
  • Polycycloolefin it is 0.05 to 3, in the case of polysulfone, 0.05 to 3, and in the case of positive ether sulfone, 0.05 to 3.
  • the inorganic ferroelectric particles (B) and the polymer (A) are bound to each other by the action of the coupling agent or the surfactant, and the void content is small. ! /, (For example, 5% by volume or less, or even 1% by volume or less) A dense structure is achieved and the withstand voltage can be increased.
  • the film of the present invention is excellent in flexibility (stickiness).
  • the film of the present invention is excellent in surface smoothness.
  • the surface center roughness can be ⁇ 1 ⁇ m or less, and further ⁇ 0.6 m or less.
  • the high dielectric film of the present invention is used as a film for a film capacitor.
  • An electrode or the like can be formed on the surface by vapor deposition or the like. Conventionally known materials such as electrodes, formation methods, conditions, and the like can be employed.
  • the film placed on the substrate is measured at room temperature.
  • the obtained composition was applied onto a stainless steel substrate with a bar coater.
  • the film was dried with hot air at 3 ° C. for 3 minutes to form a dielectric film having a thickness of about 5.0 m.
  • the obtained composition was applied onto a stainless steel substrate with a bar coater and dried with hot air at 100 ° C for 3 minutes to form a dielectric film having a thickness of about 5.0 m.
  • the obtained film has flexibility, dielectric constant and dielectric loss tangent at a frequency of 10 kHz. Examined. The results are shown in Table 1.
  • Example 1 instead of cellulose acetate, a coating composition was prepared in the same manner as in Example 1 except that the thermoplastic non-fluorinated polymer described in Table 1 and a solvent were used. Further, a film was produced in the same manner as in Example 1, and the film thickness, flexibility, dielectric constant and dielectric loss tangent were examined. The results are shown in Table 1.
  • thermoplastic non-fluorinated polymers used are as follows.
  • Polyethersulfone Sumika Etacel (trade name) manufactured by Sumitomo Chemical Co., Ltd.
  • Polycycloolefin ZEONOR (trade name) manufactured by Nippon Zeon Co., Ltd.
  • Polyphenylene ether Rubyace (trade name) manufactured by Mitsubishi Engineering Plastics Co., Ltd.
  • the film produced using the coating composition of the present invention has a low dielectric loss with a high dielectric constant, can be thinned, and has excellent tackiness (flexibility). Satisfies the required characteristics of a high-capacitance film as a high-dielectric film. It can be easily produced by a simple method using the adhesive composition.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une composition de revêtement contenant un polymère thermoplastique sans fluor (A), des particules inorganiques ferroélectriques (B), un agent améliorant l'affinité (C), constitué d'au moins un agent de couplage, un agent tensioactif et un composé époxydé, et un solvant (D). L'invention concerne également un film fabriqué à partir d'une telle composition de revêtement, lequel est hautement diélectrique et peut être mis sous forme mince. Ce film est excellent en termes de propriété d'enroulement (de flexibilité) et convient en tant que film hautement diélectrique pour un condensateur à film.
PCT/JP2007/063662 2006-07-27 2007-07-09 Composition de revêtement Ceased WO2008013048A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097004084A KR101095766B1 (ko) 2006-07-27 2007-07-09 코팅 조성물
US12/307,829 US8779047B2 (en) 2006-07-27 2007-07-09 Coating composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006204802A JP5261896B2 (ja) 2006-07-27 2006-07-27 コーティング組成物
JP2006-204802 2006-07-27

Publications (1)

Publication Number Publication Date
WO2008013048A1 true WO2008013048A1 (fr) 2008-01-31

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Application Number Title Priority Date Filing Date
PCT/JP2007/063662 Ceased WO2008013048A1 (fr) 2006-07-27 2007-07-09 Composition de revêtement

Country Status (5)

Country Link
US (1) US8779047B2 (fr)
JP (1) JP5261896B2 (fr)
KR (1) KR101095766B1 (fr)
CN (1) CN101490767A (fr)
WO (1) WO2008013048A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
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