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WO2008099655A1 - Photosensitive resin composition and layered product - Google Patents

Photosensitive resin composition and layered product Download PDF

Info

Publication number
WO2008099655A1
WO2008099655A1 PCT/JP2008/051051 JP2008051051W WO2008099655A1 WO 2008099655 A1 WO2008099655 A1 WO 2008099655A1 JP 2008051051 W JP2008051051 W JP 2008051051W WO 2008099655 A1 WO2008099655 A1 WO 2008099655A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
mass
layered product
ethylenically unsaturated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051051
Other languages
French (fr)
Japanese (ja)
Inventor
Yukari Himeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei E Materials Corp
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp, Asahi Kasei EMD Corp filed Critical Asahi Kasei E Materials Corp
Priority to JP2008558028A priority Critical patent/JP4885243B2/en
Publication of WO2008099655A1 publication Critical patent/WO2008099655A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

A photosensitive resin composition which has resistance to alkaline noble-metal cyanide plating baths, is excellent in resolution, adhesion, and resist strippability, and can be developed with an alkaline aqueous solution; and a layered photosensitive-resin product including the photosensitive resin composition. The photosensitive resin composition is characterized by comprising 20-90 mass% carboxylated binder (a), 5-75 mass% addition-polymerizable monomer (b) having at least one ethylenically unsaturated terminal group, and 0.01-30 mass% photopolymerization initiator (c). It is further characterized in that as the addition-polymerizable monomer (b) having at least one ethylenically unsaturated terminal group, a specific compound is contained in an amount of 1-50 mass% based on the whole photosensitive resin composition.
PCT/JP2008/051051 2007-02-02 2008-01-25 Photosensitive resin composition and layered product Ceased WO2008099655A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008558028A JP4885243B2 (en) 2007-02-02 2008-01-25 Photosensitive resin composition and laminate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007024363 2007-02-02
JP2007-024363 2007-02-02

Publications (1)

Publication Number Publication Date
WO2008099655A1 true WO2008099655A1 (en) 2008-08-21

Family

ID=39689901

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051051 Ceased WO2008099655A1 (en) 2007-02-02 2008-01-25 Photosensitive resin composition and layered product

Country Status (5)

Country Link
JP (1) JP4885243B2 (en)
KR (1) KR20090082240A (en)
CN (1) CN101568882A (en)
TW (1) TW200846825A (en)
WO (1) WO2008099655A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012077272A (en) * 2010-10-06 2012-04-19 Yokohama Rubber Co Ltd:The Ultraviolet-curable resin composition
JP2013246387A (en) * 2012-05-29 2013-12-09 Asahi Kasei E-Materials Corp Photosensitive resin composition
WO2014115887A1 (en) * 2013-01-28 2014-07-31 日産化学工業株式会社 Method for producing substrate having pattern and resin composition for hydrofluoric acid etching

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101811091B1 (en) * 2011-03-03 2017-12-20 닛코-매터리얼즈 가부시키가이샤 Photosensitive resin composition, photoresist film using same, resist pattern forming method, and conductor pattern forming method
KR102030179B1 (en) * 2012-07-03 2019-11-08 현대모비스 주식회사 Power management device for micro hybrid system
KR102792073B1 (en) * 2016-12-29 2025-04-08 주식회사 동진쎄미켐 Negative photosensitive resin composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH106404A (en) * 1996-06-19 1998-01-13 Takemoto Oil & Fat Co Ltd Manufacturing method of optical three-dimensional object
JPH10279819A (en) * 1997-02-05 1998-10-20 Teijin Seiki Co Ltd Optical three-dimensional molding resin composition
JP2000250214A (en) * 1999-03-03 2000-09-14 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition
JP2001109139A (en) * 1999-10-07 2001-04-20 Fuji Photo Film Co Ltd Original plate for planographic printing plate
JP2004252093A (en) * 2003-02-19 2004-09-09 Asahi Kasei Chemicals Corp Liquid photosensitive resin letterpress printing plate manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH106404A (en) * 1996-06-19 1998-01-13 Takemoto Oil & Fat Co Ltd Manufacturing method of optical three-dimensional object
JPH10279819A (en) * 1997-02-05 1998-10-20 Teijin Seiki Co Ltd Optical three-dimensional molding resin composition
JP2000250214A (en) * 1999-03-03 2000-09-14 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition
JP2001109139A (en) * 1999-10-07 2001-04-20 Fuji Photo Film Co Ltd Original plate for planographic printing plate
JP2004252093A (en) * 2003-02-19 2004-09-09 Asahi Kasei Chemicals Corp Liquid photosensitive resin letterpress printing plate manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012077272A (en) * 2010-10-06 2012-04-19 Yokohama Rubber Co Ltd:The Ultraviolet-curable resin composition
JP2013246387A (en) * 2012-05-29 2013-12-09 Asahi Kasei E-Materials Corp Photosensitive resin composition
WO2014115887A1 (en) * 2013-01-28 2014-07-31 日産化学工業株式会社 Method for producing substrate having pattern and resin composition for hydrofluoric acid etching
JPWO2014115887A1 (en) * 2013-01-28 2017-01-26 日産化学工業株式会社 Manufacturing method of substrate having pattern and resin composition for hydrofluoric acid etching

Also Published As

Publication number Publication date
JP4885243B2 (en) 2012-02-29
TWI356972B (en) 2012-01-21
CN101568882A (en) 2009-10-28
TW200846825A (en) 2008-12-01
JPWO2008099655A1 (en) 2010-05-27
KR20090082240A (en) 2009-07-29

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