WO2008098494A1 - Method and apparatus for performing heat dissipation of electric component on circuit board - Google Patents

Abstract

The invention discloses one method for heat dissipation in circuit board electron part, which comprises the following steps: dividing the circuit board electron part into multiple sets; through circuit board to form wind guide channel to let gas flow into each electron part far from the wind intake guide; through forming wind exit guide channel to guide the gas flow each electron part gas flow into out of circuit board to make one set of electron gas flow not through other set electron parts. The invention avoids heat overlap each other in the direction of the airflow to improve dissipation effect. The invention also discloses a circuit board, an airflow distributing equipment and communicating equipment.

Description

 Method and device for dissipating heat from electronic components on circuit board

 The present invention relates to the field of communications, and in particular, to a method and apparatus for dissipating heat from electronic components on a circuit board. Background technique

 At present, the plug-in box is the basic form of the communication device. Referring to FIG. 1, a plurality of printed circuit board (PCB board 2) plug-ins are inserted side by side in the plug box 1. The PCB board 2 is inserted into the subrack 1 and electrically connected to the motherboard to obtain power, and at the same time, communicate with other PCB boards 2 in the subrack 1. The PCB board 2 is provided with various electronic heat generating devices, so that it is generally required that the airflow from the bottom to the top flows through the PCB board 2 to dissipate heat to the respective PCB boards 2.

 The following is an example of a 10 Gb small pluggable optical transceiver module (XFP optical module) on the PCB 2. Referring to Figure 2, the XFP optical module is an important high-speed input and output component on the PCB 2 of the communication device. It can not only achieve an OGbps transmission rate, but also has a compact shape, can be hot swapped, and is easy to install. XFP optical modules are temperature-sensitive devices, and temperature has a large impact on the stability of their transmission performance. Most XFP optical modules require a case temperature of 70 degrees Celsius or less, so a heat sink is required and sufficient airflow is required to flow through the optical module.

 As shown in Fig. 2, with the rapid development of communication device technology, it is required to arrange a plurality of XFP optical modules 3 side by side at the panel 4 of one PCB board 2. This arrangement results in the following two aspects: The heat dissipation capability of the XFP optical module 3 is greatly deteriorated:

 1. Since the XFP optical module 3 has a heat sink, the wind resistance of the optical module array is much larger than that of the side area, and a large amount of airflow will be bypassed from the side low wind resistance zone, resulting in a serious air volume passing through the optical module group. insufficient.

2. In the direction of airflow, the heat radiated by the optical module upstream of the airflow will be brought downstream, so that the temperature of the optical module at the downstream position of the airflow rises, and the temperature is closer to the temperature of the wind side light module. The higher the degree, the easier it is to exceed the maximum allowable temperature (about 70 degrees Celsius), which affects the transmission performance of the XFP optical module 3, and does not even work properly.

 A solution to the above problem is also proposed in the prior art. Referring to FIG. 3, a baffle 5 is disposed on the PCB 2, and the bypassed airflow is directed to the optical module to increase the airflow flowing through the optical module. Therefore, it is possible to improve the heat dissipation performance. In the case of a large number of optical modules, the solution still cannot overcome the heat accumulation of the XFP optical module 3 in the airflow direction, thereby causing a problem of gradually increasing temperature. Summary of the invention

 Embodiments of the present invention provide a method and apparatus for dissipating heat from electronic components on a circuit board to avoid forming a heat stack in the airflow direction, thereby improving heat dissipation.

 A method for dissipating heat from electronic components on a circuit board, dividing the electronic components on the circuit board into a plurality of groups; guiding airflow to the air inlets through air inlet guide channels formed on the circuit board Each set of electronic components; and an airflow guide channel formed on the circuit board guides airflow through each set of electronic components remote from the air outlet to the outside of the circuit board, so that airflow that has passed through a set of electronic components is not Go through other sets of electronic components.

 A circuit board comprising:

 Printed circuit board PCB;

 a panel, fixed to one side of the PCB;

 An electronic component mounted on a side of the PCB adjacent to the panel, the electronic components being at least two groups and arranged along a length direction of the panel;

 The air inlet guiding channel is disposed on the PCB board along a length direction of the electronic component arrangement, and the air inlet guide channel respectively guides the airflow to each group of electronic components far from the air inlet;

An air guiding channel is disposed on the PCB board along a length direction of the electronic component arrangement, and the air guiding channel guides the airflow of each set of electronic components away from the air outlet to the PCB An air distribution device for use on a circuit board, comprising:

 a distribution unit having two air flow passages that are staggered and isolated;

 A spacer is fixed to opposite sides of the dispensing member and extends away from the dispensing member to extend the two airflow passages.

 A communication device includes a case, a motherboard mounted in the case, and a plurality of circuit boards inserted into the motherboard; the circuit board includes:

 Printed circuit board PCB;

 a panel, fixed to one side of the PCB;

 An electronic component mounted on a side of the PCB adjacent to the panel, the electronic components being at least two groups and arranged along a length direction of the panel;

 The air inlet guiding channel is disposed on the PCB board along a length direction of the electronic component arrangement, and the air inlet guide channel respectively guides the airflow to each group of electronic components far from the air inlet;

 An air guiding channel is disposed on the PCB along a length direction of the electronic component arrangement, and the air guiding channel guides airflow through each set of electronic components away from the air outlet to the PCB. The temperature-sensitive electronic components on the circuit board are divided into a plurality of groups, and the airflow is respectively guided to the airflow guides of the electrical components of the groups of electric groups far from the air inlet through the air inlet guide channel formed on the circuit board. Leading to the outside of the board; thus, the airflow that has passed through a set of electronic components no longer passes through any other set of electronic components, thereby avoiding the formation of heat stacks in the direction of the airflow, thereby improving heat dissipation and extending temperature sensitivity. The life cycle of electronic components. DRAWINGS

 1 is a schematic diagram of a plug-in box and a PCB board in a communication device in the prior art;

 2 is a schematic structural view of a first PCB board in the prior art;

3 is a schematic structural view of a second PCB board in the prior art; 4 is a schematic diagram of grouping of XFP optical modules on a PCB according to an embodiment of the present invention; FIG. 5 is a schematic structural diagram of a first PCB board according to an embodiment of the present invention;

 6A and FIG. 6B are schematic diagrams showing the structure of a second type of PCB board according to an embodiment of the present invention;

 7 is a schematic view of a PCB board with a cover plate according to an embodiment of the present invention;

 8 is a schematic structural view of a third type of PCB in the embodiment of the present invention;

 9 is a schematic structural view of a fourth PCB board according to an embodiment of the present invention;

 10 is a schematic structural view of a first air distribution device according to an embodiment of the present invention;

 1 is a schematic structural view of a second air distribution device according to an embodiment of the present invention;

 12 is a schematic structural view of a fifth PCB board according to an embodiment of the present invention;

 FIG. 13 is a schematic structural view of a sixth PCB board according to an embodiment of the present invention. detailed description

 In this embodiment, the electronic components on the circuit board are divided into multiple groups, and after the airflow is introduced from the air inlet of the circuit board, the airflow is guided by the air inlet guide channel to the electronic components of each group far away from the air inlet. And the airflow of each set of electronic components respectively passing away from the air outlet is guided to the outside of the circuit board by the air guiding passage, so that the airflow that has passed through one set of electronic components does not pass through other sets of electronic components.

The electronic component can be a variety of temperature sensitive electronic components, such as a pluggable optical transceiver module (XFP optical module). The electronic components disposed on the printed circuit board (PCB) are divided into two or more groups, and the air guiding channel and the air guiding guide are disposed on the PCB board along the length direction of the electronic component arrangement. a channel, and the air guiding channel and the air guiding channel are separated from each other at an intersection; in order to reduce wind resistance, adjacent two sets of electronic components on the PCB board may be separated by a distance, the air guiding guide The lead channel and the air guiding channel cross and extend to the corresponding electronic components in this distance; in a specific case, the adjacent two sets of electronic components on the PCB board may also be arranged with a corresponding distance between the two sets of electronic components. The guiding channel and the air guiding channel do not affect the implementation effect of the embodiment. The PCB board 2 provided with a small pluggable optical transceiver module (XFP optical module) will be described in detail below as an example.

 As shown in FIG. 4, the XFP optical modules 3 on the PCB board 2 are divided into two groups, and the first group of XFP optical modules 6 and the second group of XFP optical modules 7 are separated by a certain distance, and each XFP optical module 3 is separated. A heat sink is disposed on each of the XFP optical modules 3, and the height of the heat sink downstream of the airflow is slightly lower than the height of the heat sink of the optical module upstream of the airflow, so that unnecessary wind resistance can be minimized, so that all The XFP optical module 3 has an approximate heat dissipation capability.

 Referring to FIG. 5, a first partition 8 is disposed on a side of the first set of XFP optical modules 6 and a second set of XFP optical modules 7 away from the panel 4, and a distance is set at a distance from the first partition 8. The second partition plate 9, the first partition plate 8, the second partition plate 9, and the area away from the XFP optical module 3 form an air inlet guide passage (shown by a broken line in Fig. 5) and an air outlet as shown in Fig. 5. The guiding channel (shown by the solid line in FIG. 5) is isolated from the air guiding channel.

 The extending portions of the air guiding channel and the air guiding channel are groove-shaped (ie, the groove 10) and form an upper and lower layer structure; the first group of XFP optical modules 6 and the second group of XFP optical modules 7 Intersected by a distance. The first spacer 8 disposed beside the first set of XFP optical modules 6 extends to the side of the panel 4 of the second set of XFP optical modules 7 in this distance, and is disposed first to the side of the second set of XFP optical modules 7. The partition 8 extends to the second partition 9 at this distance, thus forming the underflow air guiding passage shown in FIG. 5; and at the same time, the first partition disposed beside the first set of XFP optical modules 6. The plate 8 extends to the second partition 9 in this distance, and the first partition 8 disposed beside the second set of XFP optical modules 7 extends to the panel 4 of the first set of XFP optical modules 6 in this distance. On the side, the wind guiding passage in the upper layer shown in Fig. 5 is formed.

When the airflow for cooling the XFP optical module 3 is introduced by the air inlet, the air guiding channel guides the airflow to the second group of XFP optical modules 7 far from the air inlet, so that the first group of XFP optical modules 6 And the second group of XFP optical modules 7 can obtain the cooling airflow of the same temperature; after the cooling airflow passes through the two sets of XFP optical modules respectively, the air guiding channel passes through the airflow of the first group of XFP optical modules 6 far away from the air outlet. Lead to the outside of the PCB 2, so that the XFP optical module has been The cooled airflow will not pass through any set of XFP optical modules again, thus avoiding the heat accumulation of the airflow and ensuring the transmission performance of the XFP optical module.

 In this embodiment, an airflow adjusting plate 1 1 may be disposed near the air inlet of the second partition plate 9, and the air flow adjusting plate 11 may be rotated in a direction close to or away from the panel 4, thereby controlling the size of the input cooling airflow. .

 On the other hand, as shown in FIG. 6A, the extension portions of the air inlet guiding channel and the air outlet guiding channel may also be provided as a conducting member 12 through which the air guiding channel and the air guiding channel are guided. The through holes 13 distributed on the through-holes 12 extend to the first set of XFP optical modules 6 or the second set of XFP optical modules 7. As shown in FIG. 6B, when the cooling airflow is introduced from the air inlet, the air inlet guiding channel introduces the cooling airflow into the through hole 13 on the right side of the conducting member 12, and the cooling airflow is guided by the through hole 13 to The second set of XFP optical modules 7; and the cooling airflow passing through the first set of XFP optical modules 6 is guided by the through holes 13 on the left side of the conducting member 12 to the air guiding channel, and the air guiding channel is The cooling airflow is led to the outside of the PCB board 2.

 In a specific example, the spacing between the PCB boards 2 in the subrack 1 is 22 mm, and correspondingly, the heights of the first partition 8, the second partition 9 and the panel 4 are also 22 mm, and are guided by the wind. At the intersection of the channel and the air guiding channel, the height of each channel is 1 1匪, so that when the PCB board 2 is inserted into the box 1, the former PCB board 2 can function as a cover plate and will enter the wind. The guiding channel and the air guiding channel are sealed. If the distance between the PCB boards 2 is large, the PCB board 2 may be provided with a corresponding cover plate to seal the air inlet guide channel and the air outlet guide channel. Referring to FIG. 7, the cover plate 14 may be fixed at One or more of the panel 4, the first partition 8 and the second partition 9. For example, it is detachably fixed to the panel 4 and the first partition 8, or is attached to one or more of the panel 4, the first partition 8, and the second partition 9.

By analogy, when the XFP optical modules on the PCB 2 are divided into three or more groups according to actual needs, the above method is also applicable. As shown in FIG. 8 , the first partition plate 8 is disposed on the side of the first group of the XFP optical module 15 , the second group of the XFP optical modules 16 , and the third group of the XFP optical modules 17 away from the panel 4 . And at a distance from the first partition 8 The second partition plate 9 is disposed, and the first partition plate 8, the second partition plate 9 and the area away from the XFP optical module form an air inlet guiding channel and an air guiding channel as shown in FIG. The lead passage and the outlet guide passage are isolated from each other.

 The extending portions of the air guiding channel and the air guiding channel are formed by the recess 10 forming the upper and lower layer structure, or by the rectangular parallelepiped member 12 having the through hole 13; the adjacent two sets of electronic components Intersected by a distance; the air guiding channel extends through the groove 1 Q or the through hole 13 to the second group of XFP optical modules 16 and the third group of XFP optical modules 17 at the distance, the air guiding guide The lead channel extends through the recess 10 or the through hole 13 to the first set of XFP optical modules 15 and the second set of XFP optical modules 16 in this distance.

 When the airflow for cooling the XFP optical module is introduced by the air inlet, the air guiding channel guides the airflow to the second group of XFP optical modules 16 and the third group of XFP optical modules 17 far from the air inlet, so that The first set of XFP optical modules 15 , the second set of XFP optical modules 16 and the third set of XFP optical modules 17 can obtain the cooling airflow of the same temperature; when the cooling airflow passes through the three sets of XFP optical modules respectively, the air guiding channel The airflow passing through the first group of XFP optical modules 15 and the second group of XFP optical modules 16 far away from the air outlet is directed to the outside of the PCB board 2, so that the airflow that has cooled the XFP optical module does not pass through any group again. The XFP optical module also avoids the heat accumulation of the airflow and ensures the transmission performance of the XFP optical module.

 In this embodiment, at the intersection of the air inlet channel and the air outlet channel, the air inlet channel is in the lower layer and the air outlet channel is in the upper layer. If the upper and lower layers of the two channels are reversed, the same processing effect can be achieved. In a specific case, referring to FIG. 9, if the PCB board 2 is shallow, when the PCB board 2 is inserted into the motherboard 21, the position where the motherboard 21 is in contact with the PCB board 2 can function as the second partition in FIG. The action of 9, at this time, the second partition 9 may not be provided.

Also provided in the present embodiment is an air distribution device for the PCB board 2, as shown in FIG. 10, the air distribution device includes a distribution member 18, a spacer 19 and a spacer 20, the dispensing member 1 8 having two air flow passages which are staggered and isolated, and the two air flow passages may be constituted by a groove 10 forming an upper and lower layer structure, or may be constituted by a through hole 13; the spacers 19, 20 are fixed in points The opposite sides of the fitting member 18 extend in a direction away from the dispensing member 18 for extending the two air flow passages. Further, the airflow adjusting plate 1 1 may be disposed on the spacer 20; thus, when the airflow distributing device is pasted or detachably fixed on the PCB board 2 as shown in FIG. 4, the device and the PCB board 2 When combined, it is possible to achieve the same air distribution effect as the PCB board 2 shown in Fig. 5 when the XFP optical module 3 is cooled.

 When the PCB 2 matching the air distribution means is shallow, the spacer 20 may not be provided on the air distribution means, wherein the structure is as shown in Fig. 11. This structure is formed as shown in Fig. 9 when it is applied to a circuit board.

 The air distribution device may also be provided with a cover plate for sealing the two air flow passages (including a portion and an extension portion of the distribution member 18), and the upper and lower layers of the two air flow passages may also be exchanged. The same air distribution effect.

 For the case where the XFP optical modules are divided into three or more groups, the required effects can be achieved by simply connecting a plurality of air distribution devices and performing structural adjustments according to actual needs.

 On the other hand, in some cases, other temperature-sensitive electron heat is applied to the PCB 2.

 For example, referring to FIG. 12, on the PCB board 2, the electronic components 22 are arranged on the side of the backplane 23 in the direction of the panel 4, and the backplanes 2 and 3 are respectively disposed on the opposite sides of the PCB 2. When the electronic component 22 needs to be dissipated, the electronic component 22 is grouped, and a partition plate is disposed on the side of the electronic component 22 near the panel 4, and the partition plate and the panel 4 form a corresponding air inlet guide channel. And the air guide channel to achieve the required heat dissipation.

For another example, referring to FIG. 13, on the PCB board 2, the back board 23 is disposed on the side opposite to the panel 4, and the electronic component 24 is disposed between the panel 4 and the back board 23 in the direction of the panel 4. When the electronic component 24 needs to be dissipated, the electronic component 24 is grouped, and a partition is disposed on the side of the electronic component 24 near the panel 4, and the partition is formed into a corresponding entry with the panel 4. a wind guiding channel and an air guiding channel; or, a partition is disposed on the side of the electronic component 24 near the back plate 23, and the partition and the backing plate 23 form a corresponding air guiding channel and an air guiding channel, so that The required heat dissipation can be achieved.

 In summary, in the embodiment of the present invention, the temperature sensitive electronic components on the PCB board 2 are divided into multiple groups, and the cooling airflow is respectively guided through the air inlet passages formed on the PCB board 2 Leading to each group of electronic components far from the air inlet; and guiding the cooling airflow through each set of electronic components far from the air outlet to the outside of the PCB 2 through an air guiding passage formed on the PCB 2; The airflow through a set of electronic components no longer passes through any other set of electronic components, thereby avoiding the formation of a heat stack in the direction of the airflow, thereby improving the heat dissipation effect and prolonging the life cycle of the electronic components. The spirit and scope of the invention. Therefore, it is intended that the present invention cover the modifications and variations of the invention as claimed.

Claims

Claim A method for dissipating heat from electronic components on a circuit board, characterized in that the electronic components on the circuit board are divided into groups; the airflow is guided by an air inlet guide channel formed on the circuit board Leading to each group of electronic components far from the air inlet; and guiding the airflow through each set of electronic components far away from the air outlet to the outside of the circuit board through an air guiding channel formed on the circuit board, so that a group has passed The airflow of the electronic components no longer passes through other sets of electronic components.  2. The method according to claim 1, wherein a plurality of said plurality of circuit boards are mounted in one case, and one of the circuit boards is formed between the adjacent two circuit boards to seal the other circuit board The inlet guide channel and the outlet guide channel cover plate, or a cover plate between the adjacent two circuit boards to seal the air inlet guide channel and the air outlet guide channel on one circuit board.  The method according to claim 1 or 2, wherein the air inlet is adjusted in the air inlet by the air flow adjusting plate to adjust the airflow entering the air guiding passage.  4. A circuit board, comprising:  Printed circuit board PCB;  a panel, fixed to one side of the PCB;  Electronic components mounted on the PCB, the electronic components being at least two groups and arranged along a length direction of the panel;  The air inlet guiding channel is disposed on the PCB along a length direction of the electronic component arrangement, and the air inlet guide channel respectively guides the airflow to each group of electronic components far from the air inlet;  An air guiding channel disposed on the PCB along a length direction of the electronic component arrangement, the air guiding channel guiding the airflow of each set of electronic components away from the air outlet to the PCB 5. The circuit board according to claim 4, wherein the air inlet guiding passage and the air outlet guiding passage intersect at adjacent areas of adjacent two sets of electronic components. The circuit board according to claim 5, wherein the electronic component is disposed on a side of the PCB adjacent to the panel, and a first spacer is disposed on a side of the electronic component away from the panel, The first partition and the area remote from the electronic component form the air inlet duct and the air outlet duct.  The circuit board according to claim 6, wherein a second partition is disposed at a distance from the first partition, and the first and second partitions constitute the air guiding passage and Outlet guide channel.  8. The circuit board according to claim 7, wherein an air flow regulating plate is disposed on the second partition on a side of the air inlet.  9. The circuit board according to claim 5, wherein the circuit board further comprises: a back board disposed on a side of the PCB opposite to the panel.  The circuit board according to claim 9, wherein the electronic component is disposed on a side of the PCB adjacent to the backplane, and the electronic component is disposed with a partition away from the side of the backboard. The partition partition and the panel form the air inlet guide passage and the air outlet guide passage.  1 . The circuit board according to claim 9, wherein the electronic component is disposed in an adjacent area of the panel and the backboard, and the electronic component is disposed on a side of the panel with a partition. Forming the air inlet guide channel and the air outlet guide channel with the panel; or  The electronic component is disposed in an adjacent area of the panel and the backboard, and the electronic component is disposed on a side of the backboard with a partition, and the partition and the backboard form the air guiding guide a passage and the outlet guide passage.  The circuit board of claim 4, further comprising:  a cover plate is disposed on the PCB board and seals the air inlet guide passage and the air outlet guide passage. The circuit board according to any one of claims 4 to 12, wherein two adjacent electronic components are separated by a distance; and the air guiding channel extends to the one of the distances. The electronic components are configured to direct airflow to the set of electronic components, the airflow guide channel extending to the other set of electronic components at the distance to derive airflow through the other set of electronic components. The circuit board according to claim 13, wherein the extending portions of the air guiding channel and the air guiding channel are groove-shaped and form an upper and lower layer structure at the intersection; or  The extending portion of the air guiding channel and the air guiding channel is a conducting member disposed between the adjacent two sets of electronic components, and the air guiding channel and the air guiding channel pass through the The through holes distributed on the conductive members extend to a corresponding set of electronic components.  15. The circuit board according to claim 13, wherein the heat sink of the electronic component in each of the electronic components is distributed in a front, low, and rear height along the flow of the airflow.  16. A circuit board, comprising:  Printed circuit board PCB;  a panel fixed to one side of the PCB board;  An electronic component mounted on the PCB in a region adjacent to the back panel, wherein the electronic components are divided into at least two groups and arranged along a length direction of the panel;  a partition plate disposed along a length direction of the panel on a side of the electronic component adjacent to the panel, or disposed on a side of the electronic component away from the panel;  The air inlet guiding channel is disposed on the PCB along a length direction of the electronic component arrangement, and the air inlet guide channel respectively guides the airflow to each group of electronic components far from the air inlet;  An air guiding channel disposed on the PCB along a length direction of the electronic component arrangement, the air guiding channel guiding the airflow of each set of electronic components away from the air outlet to the PCB The circuit board according to claim 16, wherein the partition plate is disposed on a side of the electronic component near the panel, and the air inlet guiding channel and the outer panel are formed by the partition plate and the panel Or the air guiding channel; or the partition plate is disposed on a side of the electronic component near the backboard, and the air inlet guiding channel and the air guiding channel are formed by the partition plate and the backing plate.  18. The circuit board of claim 16, further comprising: A cover plate is disposed on the PCB board and seals the air inlet guide channel and the air outlet guide channel. The circuit board according to any one of claims 16 to 18, wherein a distance between adjacent two sets of electronic components is separated; and the air guiding channel extends to the group at the distance An electronic component to direct airflow to the set of electronic components, the airflow guide channel extending to the other set of electronic components at the distance to derive airflow through the other set of electronic components.  The circuit board according to claim 19, wherein the extending portions of the air guiding channel and the air guiding channel are groove-shaped and form an upper and lower layer structure at the intersection; or  The extending portion of the air guiding channel and the air guiding channel is a conducting member disposed between the adjacent two sets of electronic components, and the air guiding channel and the air guiding channel pass through the The through holes distributed on the conductive members extend to a corresponding set of electronic components.  21. An air distribution device for use on a circuit board, comprising:  a distribution unit having two air flow passages that are staggered and isolated;  A spacer is attached to opposite sides of the dispensing member and extends away from the dispensing member to extend the two airflow passages.  The air distribution device according to claim 21, wherein the two air flow passages are formed by grooves and form an upper and lower layer structure; or  The two air flow passages are formed by through holes.  23. The air distribution device of claim 21, wherein each of the opposite sides is provided with two opposing spacers.  The air distribution device according to any one of claims 21 to 23, further comprising:  A cover plate is fixed to the dispensing member and the spacer to seal the two air flow passages.  25. A communication device comprising a case, a motherboard mounted in the case, and a plurality of circuit boards inserted into the motherboard; wherein the circuit board comprises:  Printed circuit board PCB; a panel, fixed to one side of the PCB; An electronic component mounted on a side of the PCB adjacent to the panel, the electronic components being at least two groups and arranged along a length direction of the panel;  The air inlet guiding channel is disposed on the PCB along a length direction of the electronic component arrangement, and the air inlet guide channel respectively guides the airflow to each group of electronic components far from the air inlet;  An air guiding channel disposed on the PCB along a length direction of the electronic component arrangement, the air guiding channel guiding the airflow of each set of electronic components away from the air outlet to the PCB The communication device according to claim 25, wherein a first spacer is disposed on a side of the electronic component away from the panel, and the first spacer forms a region away from the electronic component Describe the wind guiding channel and the air guiding channel;  A second partition is disposed at a distance from the first partition, and the first and second partitions constitute the air inlet guide passage and the air outlet guide passage.  27. The communication device of claim 25, further comprising:  a cover plate is disposed on the PCB board and seals the air inlet guide passage and the air outlet guide passage. 28. The communication device according to claim 25, 26 or 27, wherein a distance between adjacent two sets of electronic components is separated; a group of electrons extending into the air guiding channel at the distance a component to direct airflow to the set of electronic components, the airflow guide channel extending to the other set of electronic components at the distance to derive airflow through the other set of electronic components.