CN1780546A - Electronic device with socket heat dissipation structure - Google Patents

Abstract

The invention is an electronic device with socket heat radiation structure, it includes: a housing; a plurality of electronic components disposed within the housing; an air inlet arranged on the first side of the shell; the socket is arranged on a second side of the shell, wherein the second side is opposite to the first side, and the electronic elements are positioned between the first side and the second side; and a guide plate arranged between the shell and the electronic element and forming an airflow channel with the shell for guiding a part of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the invention, the socket of the electronic element can effectively dissipate heat, so that the socket meets the safe temperature specification of the socket.

Description

Electronic device with socket heat dissipation structure

technical field

The invention relates to an electronic device with a socket heat dissipation structure, in particular to a power supply with a socket heat dissipation structure.

Background technique

Power supply is an indispensable basic device for the operation of various electrical equipment or information products. Please refer to FIG. 1 , which is a schematic diagram of a conventional power supply. As shown in FIG. 1 , a conventional power supply includes a housing 11 (shown in dashed lines), a plurality of electronic components 12 , a power input component 13 , and a power output component 14 . Wherein, the power input element 13 is usually a socket for plugging in a power cord to input commercial power, and the power output element 14 is used to enable the power supply to form an electrical connection with other electronic devices, and then supply power to the electronic device. In addition, because the electronic components in the power supply will generate heat when the power supply is in operation, and the heat will make the temperature in the casing higher and higher, so one or more cooling fans are usually installed on the power supply casing. 15. The external cold air can be blown into the casing to dissipate heat, or the hot air in the casing can be drawn out of the casing, thereby reducing the temperature inside the casing, so as to avoid damage or shorten the life of the electronic components of the power supply due to overheating.

As shown in FIG. 1 , since the air is sent into the housing by the fan 15 , it will pass through the electronic component 12 and then reach the socket 13 , so the heat generated by the electronic component 12 will inevitably affect the temperature of the socket 13 . According to the current international standard safe temperature value specification, the temperature of the socket on the power supply must be lower than 70°C under the operating state. However, with the development of electronic product technology and in order to meet the needs of users, the number of electronic components loaded in the power supply has gradually increased, and the integration of electronic components has also increased. greatly increased. As the required wattage consumption increases, the heat generated by the operation of the power supply inevitably increases the temperature of the entire power supply, which in turn increases the temperature of the socket indirectly. Generally speaking, the electronic components inside the power supply can withstand heat up to 110-150°C. However, in order to meet the safety temperature specification of the socket, the design of the electronic components will be limited, which will affect the development of the power supply.

Therefore, how to develop a power supply structure that can effectively dissipate heat from the socket is an urgent problem to be solved at present.

Contents of the invention

The main purpose of the present invention is to provide an electronic device with a socket heat dissipation structure, which can effectively dissipate heat from the socket so that it meets the safety temperature specification of the socket.

In order to achieve the above object, a broader embodiment of the present invention provides an electronic device with a socket heat dissipation structure, which includes: a housing; a plurality of electronic components disposed in the housing; an air inlet disposed in the housing a first side of the casing; a socket disposed on a second side of the casing, wherein the second side is opposite to the first side, and the plurality of electronic components are located between the first side and the second side and a deflector, arranged between the casing and the electronic component, and forming an airflow channel with the casing, for guiding a part of the air at the airflow inlet to the socket through the airflow channel , and then dissipate heat from the socket.

According to the above idea of the present invention, the electronic device is a power supply.

According to the above idea of the present invention, the electronic device further includes a fan for dissipating heat from the electronic component. The fan can be disposed on the first side or the second side of the housing.

According to the above idea of the present invention, the deflector is made of an insulating material, and can be formed by bending downwards an insulating sheet disposed on the top of the casing.

According to the above idea of the present invention, the deflector further includes a second part disposed between the electronic component and the socket for isolating heat generated by the electronic component.

According to the above concept of the present invention, the bottom of the deflector plate further includes a horizontal portion for forming the airflow channel isolated from the electronic component.

According to the above concept of the present invention, the deflector is formed by a non-heating or low-heating element.

According to the above idea of the present invention, the non-heating or low-heating element is a PCB board or a large capacitor.

Another broad implementation of the present invention is to provide an electronic device with a socket heat dissipation structure, which includes: a housing; a plurality of electronic components disposed in the housing; an air inlet disposed in the first housing of the housing one side; a socket disposed on a second side of the housing, wherein the second side is opposite to the first side, and the plurality of electronic components are located between the first side and the second side; and an insulating A sheet is used to insulate the electronic component and the casing, wherein the insulating sheet is separated from the casing by a certain distance to form an air flow channel, and is used to guide a part of the air at the air inlet directly through the air flow channel to the socket, thereby dissipating heat from the socket.

According to the above idea of the present invention, the electronic device is a power supply.

According to the above idea of the present invention, the electronic device further includes a fan for dissipating heat from the electronic component. The fan can be disposed on the first side or the second side of the housing.

According to the above conception of the present invention, the insulating sheet is formed by bending downwards an insulating sheet disposed on the top of the casing.

According to the above idea of the present invention, the insulating sheet further includes a second portion disposed between the electronic component and the socket for isolating heat generated by the electronic component.

According to the above concept of the present invention, the bottom of the insulating sheet further includes a horizontal portion for forming the airflow channel isolated from the electronic component.

Through the invention, the socket of the electronic component can be effectively dissipated to meet the safe temperature specification of the socket.

Below, the present invention will be described in further detail in combination with specific embodiments and accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a conventional power supply.

FIG. 2 is a schematic diagram of a first preferred embodiment of an electronic device with a socket heat dissipation structure according to the present invention.

FIG. 3 is a schematic diagram of a second preferred embodiment of an electronic device with a socket heat dissipation structure according to the present invention.

FIG. 4 is a schematic diagram of a third preferred embodiment of an electronic device with a socket heat dissipation structure according to the present invention.

FIG. 5 is a schematic diagram of a fourth preferred embodiment of an electronic device with a socket heat dissipation structure according to the present invention.

FIG. 6 is a schematic diagram of a fifth preferred embodiment of an electronic device with a socket heat dissipation structure according to the present invention.

FIG. 7 is a schematic diagram of a sixth preferred embodiment of an electronic device with a socket heat dissipation structure according to the present invention.

Wherein, the reference signs are explained as follows:

Shell: 11, 21 The first side of the shell: 211

The second side of the housing: 212 Electronic components: 12, 22

Power input components: 13 Power output components: 14

Fan: 15, 27 Airflow inlet: 23

Socket: 13, 24 Deflector: 25

The second part of the deflector: 251 The third part of the deflector: 252

Deflector horizontal part: 253 Airflow channels: 26

PCB board: 28

Detailed ways

Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different aspects, all of which do not depart from the scope of the present invention, and the description and drawings therein are used as illustrations in nature, not to limit the present invention. invention.

The invention relates to an electronic device with a socket heat dissipation structure. Although the power supply is used in the following embodiments to illustrate the technology of the present invention, the electronic device applicable to the technology of the present invention is not limited to the power supply, and any electronic device applicable to the following technical features can be incorporated herein by reference.

Please refer to FIG. 2 , which is a schematic diagram of an electronic device with a socket heat dissipation structure according to a preferred embodiment of the present invention. As shown in FIG. 2 , the electronic device is a power supply, which includes a housing 21 (shown in dashed lines), a plurality of electronic components 22 , an air inlet 23 , a socket 24 and a deflector 25 . The plurality of electronic components 22 are disposed in the housing 21, the air inlet 23 is disposed on the first side 211 of the housing 21, and the socket 24 is disposed on the second side 212 of the housing 21, wherein the second side 212 is opposite to the first side 211, and the plurality of electronic components 22 are located between the first side 211 and the second side 212, and the deflector 25 is arranged between the casing 21 and the electronic components 22 between.

The setting of the deflector 25 can insulate the heat generated by the electronic components 22 on the one hand, and on the other hand can form an air flow channel 26 with the housing 23, so that a part of the lower temperature air entering the housing 21 from the air inlet 23 is Without flowing through the heat-generating electronic components 22, it is directly guided to the socket 24 through the airflow channel 26, and then the socket 24 is dissipated to reduce the heat effect caused by the electronic components 22 to the socket 24, and achieve The purpose of making the socket 24 comply with safe temperature specifications.

The power supply of the present invention may further include a fan 27 disposed at the air inlet 23 . In the operating state of the power supply, the cooling efficiency of the electronic components 22 can be improved through the operation of the fan 27, and at the same time, a part of the air entering the casing 21 from the air inlet 23 can quickly flow to the socket 24 through the air flow channel 26. , and the socket 24 is effectively dissipated. In one embodiment, the fan 27 is disposed on a side close to the air flow channel 26 to enhance the cooling effect of the air flow channel 26 on the socket 24 .

In addition, another major feature of the present invention is that the deflector 25 is made of an insulating material. Therefore, the deflector 25 can be used to replace the insulating sheet originally attached to the casing 21 or coated on the casing 21 Insulating material; in other words, the deflector 25 of the present invention has the effect of insulating the electronic component 22 from the casing 21 . Therefore, looking at the present invention from another point of view, the deflector 25 of the present invention can actually be formed by moving the insulating sheet originally attached to the housing 21 by a certain distance, so that the insulating sheet can be further formed between the insulating sheet and the housing. The gas channel 26 is formed between the 21, and a part of the air at the air inlet 23 is directly guided to the socket 24 through the air channel 26, thereby dissipating heat from the socket 24. In one embodiment, the deflector 25 can be formed by directly bending an insulating sheet attached to the top casing 21 of the electronic component 22 downward, as shown in FIG. 3 .

Please refer to FIG. 4 , which is a schematic diagram of another side of the electronic device with the heat dissipation structure of the socket according to a preferred embodiment of the present invention. As shown in Figure 4, the deflector 25 can also include a second part 251 and a third part 252, which are respectively formed on the socket 24 and the electronic components, in addition to the body part that forms the air flow channel 26 together with the housing 21. 22 to prevent the heat generated by the electronic components 22 from being transferred to the socket 24 in order to reduce the temperature of the socket 24 .

In one embodiment, the socket cooling structure of the present invention is applied to an 800-watt server power supply. A fan with a rotating speed of 15000 RPM is set at the place, and the width of the airflow channel (that is, the distance between the deflector and the housing) is about 4mm. When the ambient temperature at the inlet of the airflow is 50°C, measure the temperature of the socket (take two points) in the operating state, and the results are shown in Table 1:

Table I No. N Y 1 82.4°C 69.5°C 2 81.2°C 67.5°C

Wherein, Y/N respectively represent the presence/absence of deflectors. It can be seen from the table that in the power supply with the socket heat dissipation structure of the present invention, the temperature of the socket can be effectively reduced to below 70° C., so it can meet the safety temperature specification of the socket.

The length L and height H of the deflector 25 of the present invention can be adjusted according to design parameters, and are not particularly limited. As shown in Figure 5, the deflector 25 has a relatively small length L and height H, but still can achieve the effect of the air flow channel, can guide the lower temperature air to the socket 24 to dissipate heat from the socket 24, and reduce the temperature of the socket 24. The cost of materials. In one embodiment, when the height H of the deflector 25 is small, the bottom of the deflector 25 may further include a horizontal portion 253 to form the airflow channel 26 isolated from the electronic component 22 .

In addition, in one embodiment, the fan 27 in the power supply of the present invention can also be arranged on the second side 212 of the housing 21 (as shown in FIG. The heated air is drawn out of the housing 21 to reduce the temperature in the housing 21 . In this configuration, the suction force caused by the operation of the fan 27 still has the function of guiding a part of the air entering the housing 21 from the air inlet 23 to the socket 24 through the airflow channel 26, so that the socket 24 can also be dissipated. . In this embodiment, the deflector 25 may also include a second portion 251 formed between the socket 24 and the electronic component 22 to prevent the heat generated by the electronic component 22 from being transmitted to the socket 24 in order to reduce the The temperature of socket 24.

In the above-mentioned embodiment, the deflector 25 is preferably in the shape of a flat plate, but it is not limited thereto, and it can also be bonded with the electronic component 22 to form an irregular shape.

On the other hand, the deflector of the present invention can also be formed by other methods besides the insulating sheet. For example, the deflector 25 of the present invention can be formed by using non-heating or low-heating components in the power supply, such as PCB boards or large capacitors. As shown in FIG. 7 , the deflector 25 is formed by bending the PCB board 28 upwards, and is separated from the housing 21 by a certain distance, so that a gas flow channel can be further formed between the deflector 25 and the housing 21 26 , and a part of the air at the airflow inlet 23 is directly guided to the socket 24 through the airflow channel 26 , so as to dissipate heat from the socket 24 .

To sum up, the main feature of the electronic device with socket heat dissipation structure of the present invention is that the electronic device includes a deflector, which can form an airflow channel together with the housing of the electronic device, and is used to pass the airflow into the housing from the air inlet. A portion of the air from the body is guided to the socket, thereby dissipating heat from the socket and making it comply with the socket's safe temperature specifications. Furthermore, the deflector of the present invention is made of insulating material, therefore, the deflector of the present invention also has the function of insulating the electronic components and the casing. Therefore, the electronic device with the socket heat dissipation structure of the present invention has great industrial value.

In the present invention, any equivalent structural change can be made by a person familiar with the art by using the specification and drawings of the present invention, but all of them are included in the patent protection scope of the present invention.

Claims (12)

1. An electronic device with a socket heat dissipation structure, characterized in that it comprises: a shell; A plurality of electronic components are arranged in the casing; an air inlet, disposed on the first side of the housing; a socket disposed on a second side of the housing, wherein the second side is opposite the first side, and the plurality of electronic components are located between the first side and the second side; and A deflector is arranged between the casing and the electronic component, and forms an airflow channel with the casing, and is used to guide a part of the air at the airflow inlet to the socket through the airflow channel, and then Cool the socket. 2. The electronic device according to claim 1, wherein the electronic device is a power supply. 3. The electronic device according to claim 1, further comprising a fan for dissipating heat from the electronic component, wherein the fan is disposed on the first side or the second side of the casing. 4. The electronic device as claimed in claim 1, wherein the deflector is made of an insulating material. 5 . The electronic device as claimed in claim 1 , wherein the deflector is formed by bending down an insulating sheet disposed on the top of the housing. 6 . 6 . The electronic device as claimed in claim 1 , wherein the deflector further comprises a second portion disposed between the electronic component and the socket for isolating heat generated by the electronic component. 7. The electronic device as claimed in claim 1, wherein the bottom of the deflector further comprises a horizontal portion for forming the airflow channel isolated from the electronic component. 8. The electronic device according to claim 1, wherein the deflector is formed by a non-heating or low-heating element, and the non-heating or low-heating element is a PCB board or a large capacitor. 9. An electronic device with a socket heat dissipation structure, characterized in that it comprises: a shell; A plurality of electronic components are arranged in the casing; an air inlet, disposed on the first side of the housing; a socket disposed on a second side of the housing, wherein the second side is opposite the first side, and the plurality of electronic components are located between the first side and the second side; and An insulating sheet is used to insulate the electronic component and the casing, wherein the insulating sheet is separated from the casing by a certain distance to form an airflow channel, and is used to directly pass a part of the air at the airflow inlet through the airflow channel lead to the socket, and then dissipate heat from the socket. 10 . The electronic device according to claim 9 , wherein the insulating sheet is formed by bending an insulating sheet at the top of the casing downward. 11 . 11. The electronic device as claimed in claim 9, wherein the insulating sheet further comprises a second portion disposed between the electronic component and the socket for isolating heat generated by the electronic component. 12 . The electronic device as claimed in claim 9 , wherein the bottom of the insulating sheet further comprises a horizontal portion for forming the airflow channel isolated from the electronic component. 13 .

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