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WO2008096656A1 - ケイ素含有ポリマーおよびその合成方法、膜形成用組成物、ならびにシリカ系膜およびその形成方法 - Google Patents

ケイ素含有ポリマーおよびその合成方法、膜形成用組成物、ならびにシリカ系膜およびその形成方法 Download PDF

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Publication number
WO2008096656A1
WO2008096656A1 PCT/JP2008/051492 JP2008051492W WO2008096656A1 WO 2008096656 A1 WO2008096656 A1 WO 2008096656A1 JP 2008051492 W JP2008051492 W JP 2008051492W WO 2008096656 A1 WO2008096656 A1 WO 2008096656A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
forming
silica film
synthesizing
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051492
Other languages
English (en)
French (fr)
Inventor
Hisashi Nakagawa
Seitarou Hattori
Naohisa Tokushige
Youhei Nobe
Masahiro Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP2008557078A priority Critical patent/JPWO2008096656A1/ja
Publication of WO2008096656A1 publication Critical patent/WO2008096656A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H10P14/60—
    • H10P14/6681—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Polyethers (AREA)
  • Paints Or Removers (AREA)

Abstract

　ケイ素含有ポリマーの合成方法は、（Ａ）加水分解性シランモノマーおよび（Ｂ）加水分解性ポリカルボシランから選ばれた少なくとも１種の加水分解性シラン化合物を含む第１の液を、水および触媒を含む第２の液に添加し、該加水分解性シラン化合物を加水分解縮合させる工程を含む。
PCT/JP2008/051492 2007-02-07 2008-01-31 ケイ素含有ポリマーおよびその合成方法、膜形成用組成物、ならびにシリカ系膜およびその形成方法 Ceased WO2008096656A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008557078A JPWO2008096656A1 (ja) 2007-02-07 2008-01-31 ケイ素含有ポリマーおよびその合成方法、膜形成用組成物、ならびにシリカ系膜およびその形成方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007027978 2007-02-07
JP2007-027978 2007-02-07

Publications (1)

Publication Number Publication Date
WO2008096656A1 true WO2008096656A1 (ja) 2008-08-14

Family

ID=39681567

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051492 Ceased WO2008096656A1 (ja) 2007-02-07 2008-01-31 ケイ素含有ポリマーおよびその合成方法、膜形成用組成物、ならびにシリカ系膜およびその形成方法

Country Status (3)

Country Link
JP (1) JPWO2008096656A1 (ja)
TW (1) TW200848451A (ja)
WO (1) WO2008096656A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010090248A (ja) * 2008-10-07 2010-04-22 Jsr Corp 多層レジストプロセス用シリコン含有膜形成用組成物及びシリコン含有膜並びにパターン形成方法
JP2010106099A (ja) * 2008-10-29 2010-05-13 Jsr Corp 絶縁膜形成用組成物、ならびに絶縁膜およびその形成方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10150033A (ja) * 1996-11-19 1998-06-02 Matsushita Electric Ind Co Ltd 層間絶縁膜形成用材料及び層間絶縁膜
JP2004269692A (ja) * 2003-03-10 2004-09-30 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置
JP2004292643A (ja) * 2003-03-27 2004-10-21 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置
JP2005076031A (ja) * 2003-09-01 2005-03-24 Samsung Electronics Co Ltd 新規のシロキサン樹脂及びこれを用いた半導体層間絶縁膜
WO2005068538A1 (ja) * 2004-01-16 2005-07-28 Jsr Corporation ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、および絶縁膜
WO2005108516A1 (ja) * 2004-05-11 2005-11-17 Jsr Corporation 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法
JP2007254596A (ja) * 2006-03-23 2007-10-04 Jsr Corp 絶縁膜形成用組成物、ポリマーおよびその製造方法、絶縁膜の製造方法、ならびにシリカ系絶縁膜
JP2007254597A (ja) * 2006-03-23 2007-10-04 Jsr Corp 絶縁膜形成用組成物、ポリマーおよびその製造方法、絶縁膜の製造方法、ならびにシリカ系絶縁膜
WO2007139004A1 (ja) * 2006-05-31 2007-12-06 Jsr Corporation 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10150033A (ja) * 1996-11-19 1998-06-02 Matsushita Electric Ind Co Ltd 層間絶縁膜形成用材料及び層間絶縁膜
JP2004269692A (ja) * 2003-03-10 2004-09-30 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置
JP2004292643A (ja) * 2003-03-27 2004-10-21 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置
JP2005076031A (ja) * 2003-09-01 2005-03-24 Samsung Electronics Co Ltd 新規のシロキサン樹脂及びこれを用いた半導体層間絶縁膜
WO2005068538A1 (ja) * 2004-01-16 2005-07-28 Jsr Corporation ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、および絶縁膜
WO2005108516A1 (ja) * 2004-05-11 2005-11-17 Jsr Corporation 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法
JP2007254596A (ja) * 2006-03-23 2007-10-04 Jsr Corp 絶縁膜形成用組成物、ポリマーおよびその製造方法、絶縁膜の製造方法、ならびにシリカ系絶縁膜
JP2007254597A (ja) * 2006-03-23 2007-10-04 Jsr Corp 絶縁膜形成用組成物、ポリマーおよびその製造方法、絶縁膜の製造方法、ならびにシリカ系絶縁膜
WO2007139004A1 (ja) * 2006-05-31 2007-12-06 Jsr Corporation 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法
JP2007324283A (ja) * 2006-05-31 2007-12-13 Jsr Corp 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010090248A (ja) * 2008-10-07 2010-04-22 Jsr Corp 多層レジストプロセス用シリコン含有膜形成用組成物及びシリコン含有膜並びにパターン形成方法
JP2010106099A (ja) * 2008-10-29 2010-05-13 Jsr Corp 絶縁膜形成用組成物、ならびに絶縁膜およびその形成方法

Also Published As

Publication number Publication date
JPWO2008096656A1 (ja) 2010-05-20
TW200848451A (en) 2008-12-16

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