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WO2008096594A1 - インプリント用モールドおよびその製造方法 - Google Patents

インプリント用モールドおよびその製造方法 Download PDF

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Publication number
WO2008096594A1
WO2008096594A1 PCT/JP2008/050826 JP2008050826W WO2008096594A1 WO 2008096594 A1 WO2008096594 A1 WO 2008096594A1 JP 2008050826 W JP2008050826 W JP 2008050826W WO 2008096594 A1 WO2008096594 A1 WO 2008096594A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
group
imprint mold
imprint
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050826
Other languages
English (en)
French (fr)
Inventor
Katsuya Ueno
Yasuhide Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to CN2008800038834A priority Critical patent/CN101610888B/zh
Priority to JP2008557054A priority patent/JP4930517B2/ja
Priority to EP08703670A priority patent/EP2116350A4/en
Publication of WO2008096594A1 publication Critical patent/WO2008096594A1/ja
Priority to US12/511,215 priority patent/US7767309B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

　表面に設けられた被覆層が剥離しにくいインプリント用モールドおよびその製造方法を提供する。 　モールド本体と、該モールド本体の表面に設けられた、離型剤からなる被覆層とを有し、前記離型剤が、下式（１）で表される化合物を含むことを特徴とするインプリント用モールド、およびその製造方法。 　ただし、Ｒ＝Ｒｆ－Ｘ－、左右のＲは同一の基、Ｒｆ＝パーフルオロアルキル基、Ｘ＝－（ＯＣ３Ｆ６）－、－（ＯＣ２Ｆ４）－、－（ＯＣＦ２）－のうちの１種以上かつ該単位の合計が１以上の基、Ｙ＝有機基、ｎの平均＝２～１０、Ｚ＝－Ｓｉ（Ｒ１）ｍ（Ｒ２）３－ｍ、Ｒ１＝水酸基または加水分解可能な基、Ｒ２＝水素原子または炭化水素基、ｍ＝１～３。
PCT/JP2008/050826 2007-02-07 2008-01-22 インプリント用モールドおよびその製造方法 Ceased WO2008096594A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800038834A CN101610888B (zh) 2007-02-07 2008-01-22 压印用模及其制造方法
JP2008557054A JP4930517B2 (ja) 2007-02-07 2008-01-22 インプリント用モールドおよびその製造方法
EP08703670A EP2116350A4 (en) 2007-02-07 2008-01-22 PRINTING FORM AND MANUFACTURING METHOD THEREFOR
US12/511,215 US7767309B2 (en) 2007-02-07 2009-07-29 Imprinting mold and process for its production

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-028268 2007-02-07
JP2007028268 2007-02-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/511,215 Continuation US7767309B2 (en) 2007-02-07 2009-07-29 Imprinting mold and process for its production

Publications (1)

Publication Number Publication Date
WO2008096594A1 true WO2008096594A1 (ja) 2008-08-14

Family

ID=39681505

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050826 Ceased WO2008096594A1 (ja) 2007-02-07 2008-01-22 インプリント用モールドおよびその製造方法

Country Status (7)

Country Link
US (1) US7767309B2 (ja)
EP (1) EP2116350A4 (ja)
JP (1) JP4930517B2 (ja)
KR (1) KR20090117699A (ja)
CN (1) CN101610888B (ja)
TW (1) TW200904616A (ja)
WO (1) WO2008096594A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010131569A (ja) * 2008-12-08 2010-06-17 Asahi Glass Co Ltd 含フッ素重合体薄膜を有する基材及びその製造方法
JP2010234575A (ja) * 2009-03-30 2010-10-21 Fujifilm Corp インプリント用モールド構造体、インプリント用モールド構造体の製造方法、インプリント方法、及び磁気記録媒体の製造方法
JP2011005695A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
JP2011005696A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
WO2011122605A1 (ja) * 2010-03-30 2011-10-06 Hoya株式会社 インプリント用離型層付きモールド及びインプリント用離型層付きモールドの製造方法、コピーモールドの製造方法
JP2011224982A (ja) * 2010-03-30 2011-11-10 Hoya Corp 離型層付きモールドおよびその製造方法ならびにモールドの製造方法
WO2012018043A1 (ja) * 2010-08-06 2012-02-09 綜研化学株式会社 ナノインプリント用樹脂製モールド
JP2012048772A (ja) * 2010-08-24 2012-03-08 Hoya Corp インプリント用離型層、インプリント用離型層付きモールド及びインプリント用離型層付きモールドの製造方法
JP2013239535A (ja) * 2012-05-14 2013-11-28 Toyo Gosei Kogyo Kk 光インプリント方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009145061A1 (ja) * 2008-05-29 2009-12-03 旭硝子株式会社 光硬化性組成物および表面に微細パターンを有する成形体の製造方法
WO2011118591A1 (ja) * 2010-03-25 2011-09-29 三菱レイヨン株式会社 モールドの製造方法および微細凹凸構造を表面に有する物品の製造方法
KR20130071426A (ko) * 2010-03-30 2013-06-28 호야 가부시키가이샤 임프린트용 이형층 부착 몰드 및 임프린트용 이형층 부착 몰드의 제조 방법, 카피 몰드의 제조 방법
CN101807628B (zh) * 2010-04-02 2012-05-23 日强光伏科技有限公司 一种制作太阳能电池正面栅线电极的方法
CN101872081B (zh) * 2010-06-10 2012-02-08 复旦大学 光致形变液晶高分子三维可调谐光子晶体及其制备方法
WO2012077738A1 (ja) * 2010-12-09 2012-06-14 旭化成株式会社 微細構造積層体、微細構造積層体の作製方法及び微細構造体の製造方法
JP5653769B2 (ja) * 2011-01-19 2015-01-14 富士フイルム株式会社 ナノインプリント方法
WO2012115059A1 (ja) * 2011-02-22 2012-08-30 旭硝子株式会社 微細構造成形体および該微細構造成形体を備えた液晶表示装置
KR101990939B1 (ko) * 2011-02-28 2019-06-19 가부시끼가이샤 다나자와 핫꼬오샤 성형용 금형 및 그 제조 방법, 및 광택도를 합치시키는 방법
US20120261849A1 (en) * 2011-04-14 2012-10-18 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method using same
CN103199268B (zh) * 2013-03-11 2016-02-03 中国科学院上海高等研究院 基于纳米压印技术的有序纳米结构膜、有序纳米结构膜电极的制备及应用
JPWO2017018007A1 (ja) * 2015-07-30 2017-07-27 株式会社棚澤八光社 樹脂成形用型
KR20190083215A (ko) 2018-01-03 2019-07-11 정장수 삽입 및 중심 고정형 드릴팁이 결합 된 드릴 공구
CN114488686B (zh) * 2020-10-26 2025-07-01 浙江水晶光电科技股份有限公司 一种压印母版及其制备方法
CN112571687A (zh) * 2020-12-28 2021-03-30 上海建工四建集团有限公司 一种高开孔率复合硅胶模具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05339007A (ja) * 1992-06-08 1993-12-21 Shin Etsu Chem Co Ltd 含フッ素有機けい素化合物およびその製造方法
JPH10113936A (ja) * 1996-10-15 1998-05-06 Sumitomo Chem Co Ltd キャストシートの製造方法
JP2002283354A (ja) 2001-03-27 2002-10-03 Daikin Ind Ltd インプリント加工用金型およびその製造方法
JP2007028268A (ja) 2005-07-19 2007-02-01 Kddi Corp 不正パケットを送信する端末の帯域割当を制限する基地局、システム及び方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288891A (en) * 1990-11-22 1994-02-22 Nippon Oil And Fats Co. Ltd. Fluoralykyl group-containing organosilicon oligomer, method for preparing same and surface treating agent
JPH04296336A (ja) * 1991-03-27 1992-10-20 Nippon Oil & Fats Co Ltd 表面処理剤
WO1997007155A1 (fr) * 1995-08-11 1997-02-27 Daikin Industries, Ltd. Fluoropolymeres organiques au silicium et leur emploi
DE19819761C2 (de) * 1998-05-04 2000-05-31 Jenoptik Jena Gmbh Einrichtung zur Trennung eines geformten Substrates von einem Prägewerkzeug
US6649272B2 (en) * 2001-11-08 2003-11-18 3M Innovative Properties Company Coating composition comprising fluorochemical polyether silane polycondensate and use thereof
US20040168613A1 (en) * 2003-02-27 2004-09-02 Molecular Imprints, Inc. Composition and method to form a release layer
KR101357816B1 (ko) * 2004-11-24 2014-02-04 몰레큘러 임프린츠 인코퍼레이티드 몰드와 중합가능한 조성물 사이에 바람직한 특성을제공하는 방법 및 조성물

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05339007A (ja) * 1992-06-08 1993-12-21 Shin Etsu Chem Co Ltd 含フッ素有機けい素化合物およびその製造方法
JPH10113936A (ja) * 1996-10-15 1998-05-06 Sumitomo Chem Co Ltd キャストシートの製造方法
JP2002283354A (ja) 2001-03-27 2002-10-03 Daikin Ind Ltd インプリント加工用金型およびその製造方法
JP2007028268A (ja) 2005-07-19 2007-02-01 Kddi Corp 不正パケットを送信する端末の帯域割当を制限する基地局、システム及び方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2116350A4

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010131569A (ja) * 2008-12-08 2010-06-17 Asahi Glass Co Ltd 含フッ素重合体薄膜を有する基材及びその製造方法
JP2010234575A (ja) * 2009-03-30 2010-10-21 Fujifilm Corp インプリント用モールド構造体、インプリント用モールド構造体の製造方法、インプリント方法、及び磁気記録媒体の製造方法
JP2011005695A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
JP2011005696A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
WO2011122605A1 (ja) * 2010-03-30 2011-10-06 Hoya株式会社 インプリント用離型層付きモールド及びインプリント用離型層付きモールドの製造方法、コピーモールドの製造方法
JP2011224982A (ja) * 2010-03-30 2011-11-10 Hoya Corp 離型層付きモールドおよびその製造方法ならびにモールドの製造方法
WO2012018043A1 (ja) * 2010-08-06 2012-02-09 綜研化学株式会社 ナノインプリント用樹脂製モールド
JP5292621B2 (ja) * 2010-08-06 2013-09-18 綜研化学株式会社 ナノインプリント用樹脂製モールド
US9393737B2 (en) 2010-08-06 2016-07-19 Soken Chemical & Engineering Co., Ltd. Resin mold for nanoimprinting
JP2012048772A (ja) * 2010-08-24 2012-03-08 Hoya Corp インプリント用離型層、インプリント用離型層付きモールド及びインプリント用離型層付きモールドの製造方法
JP2013239535A (ja) * 2012-05-14 2013-11-28 Toyo Gosei Kogyo Kk 光インプリント方法

Also Published As

Publication number Publication date
CN101610888B (zh) 2012-10-17
CN101610888A (zh) 2009-12-23
JP4930517B2 (ja) 2012-05-16
EP2116350A4 (en) 2011-06-22
JPWO2008096594A1 (ja) 2010-05-20
EP2116350A1 (en) 2009-11-11
US7767309B2 (en) 2010-08-03
KR20090117699A (ko) 2009-11-12
TW200904616A (en) 2009-02-01
US20090285927A1 (en) 2009-11-19

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