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WO2008087851A1 - Substrat flexible et dispositif semi-conducteur - Google Patents

Substrat flexible et dispositif semi-conducteur Download PDF

Info

Publication number
WO2008087851A1
WO2008087851A1 PCT/JP2007/075243 JP2007075243W WO2008087851A1 WO 2008087851 A1 WO2008087851 A1 WO 2008087851A1 JP 2007075243 W JP2007075243 W JP 2007075243W WO 2008087851 A1 WO2008087851 A1 WO 2008087851A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
wiring patterns
semiconductor device
metal foil
forming region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/075243
Other languages
English (en)
Japanese (ja)
Inventor
Katsuyuki Naitoh
Hiroaki Kitazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2008087851A1 publication Critical patent/WO2008087851A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W70/688—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un substrat flexible (1) qui comprend une base (3) ayant une surface supérieure comprenant une région de montage de puce semi-conductrice (8) et une région de formation de motif en feuille métallique (4). Une pluralité de motifs de câblage (2) composés d'une feuille de cuivre sont formés dans la région de formation de motifs en feuille métallique (4). Dans une partie de la région de formation de motifs en feuille métallique (4), une pluralité de motifs de câblage (2) sont formés de telle sorte que le rapport de la largeur des motifs de câblage (2) sur l'intervalle entre les motifs de câblage (2) est de plus de 1 mais pas moins de 8,7.
PCT/JP2007/075243 2007-01-19 2007-12-28 Substrat flexible et dispositif semi-conducteur Ceased WO2008087851A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-010157 2007-01-19
JP2007010157A JP4185954B2 (ja) 2007-01-19 2007-01-19 フレキシブル基板及び半導体装置

Publications (1)

Publication Number Publication Date
WO2008087851A1 true WO2008087851A1 (fr) 2008-07-24

Family

ID=39635856

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075243 Ceased WO2008087851A1 (fr) 2007-01-19 2007-12-28 Substrat flexible et dispositif semi-conducteur

Country Status (3)

Country Link
JP (1) JP4185954B2 (fr)
TW (1) TW200843071A (fr)
WO (1) WO2008087851A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022093692A (ja) * 2019-08-27 2022-06-23 ルネサスエレクトロニクス株式会社 半導体装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4983386B2 (ja) * 2007-05-15 2012-07-25 住友金属鉱山株式会社 Ｃｏｆ用配線基板
JP5325684B2 (ja) * 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
US8917227B2 (en) * 2011-10-05 2014-12-23 Panasonic Corporation Display
JP2014082481A (ja) * 2012-09-28 2014-05-08 Nichia Chem Ind Ltd 発光装置
JP6076048B2 (ja) * 2012-11-12 2017-02-08 オリンパス株式会社 撮像装置及び内視鏡
EP3417760A1 (fr) * 2012-10-23 2018-12-26 Olympus Corporation Appareil à semiconducteur et procédé de fabrication d'un tel appareil
JP5657767B2 (ja) * 2013-10-30 2015-01-21 ルネサスエレクトロニクス株式会社 半導体装置
JP5878611B2 (ja) * 2014-11-26 2016-03-08 ルネサスエレクトロニクス株式会社 半導体装置
JP6870043B2 (ja) * 2019-08-27 2021-05-12 ルネサスエレクトロニクス株式会社 半導体装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032229A (ja) * 1996-03-26 1998-02-03 Canon Inc Ｔｃｐ構造体、回路接続構造及び表示装置
JPH1145913A (ja) * 1997-05-26 1999-02-16 Seiko Epson Corp フィルムキャリアおよび半導体装置
JP2000031612A (ja) * 1998-07-09 2000-01-28 Seiko Epson Corp 配線基板
JP2000323525A (ja) * 1999-05-10 2000-11-24 Nec Corp 半導体装置の実装構造、及びその製造方法
JP3093150U (ja) * 2002-10-01 2003-04-18 船井電機株式会社 リモートコントローラのプリント基板へのｉｃ位置決め構造及びプリント基板へのｉｃ位置決め構造。
JP2003289087A (ja) * 2002-03-28 2003-10-10 Seiko Epson Corp 配線基板、半導体装置及びその製造方法、パネルモジュール並びに電子機器
JP2004096072A (ja) * 2003-05-12 2004-03-25 Victor Co Of Japan Ltd 配線基板
JP2005109254A (ja) * 2003-09-30 2005-04-21 Optrex Corp 集積回路搭載基板およびこれを備えた表示装置
JP2005294639A (ja) * 2004-04-01 2005-10-20 Ibiden Co Ltd フレックスリジッド配線板
JP2006032872A (ja) * 2004-07-22 2006-02-02 Sony Corp 回路基板及び半導体装置
JP2006196878A (ja) * 2004-12-16 2006-07-27 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110202A (ja) * 2001-09-28 2003-04-11 Toshiba Corp カード型電子機器
JP2006351976A (ja) * 2005-06-20 2006-12-28 Murata Mfg Co Ltd 回路モジュールおよび回路装置
JP2008010496A (ja) * 2006-06-27 2008-01-17 Victor Co Of Japan Ltd 実装基板の作製方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032229A (ja) * 1996-03-26 1998-02-03 Canon Inc Ｔｃｐ構造体、回路接続構造及び表示装置
JPH1145913A (ja) * 1997-05-26 1999-02-16 Seiko Epson Corp フィルムキャリアおよび半導体装置
JP2000031612A (ja) * 1998-07-09 2000-01-28 Seiko Epson Corp 配線基板
JP2000323525A (ja) * 1999-05-10 2000-11-24 Nec Corp 半導体装置の実装構造、及びその製造方法
JP2003289087A (ja) * 2002-03-28 2003-10-10 Seiko Epson Corp 配線基板、半導体装置及びその製造方法、パネルモジュール並びに電子機器
JP3093150U (ja) * 2002-10-01 2003-04-18 船井電機株式会社 リモートコントローラのプリント基板へのｉｃ位置決め構造及びプリント基板へのｉｃ位置決め構造。
JP2004096072A (ja) * 2003-05-12 2004-03-25 Victor Co Of Japan Ltd 配線基板
JP2005109254A (ja) * 2003-09-30 2005-04-21 Optrex Corp 集積回路搭載基板およびこれを備えた表示装置
JP2005294639A (ja) * 2004-04-01 2005-10-20 Ibiden Co Ltd フレックスリジッド配線板
JP2006032872A (ja) * 2004-07-22 2006-02-02 Sony Corp 回路基板及び半導体装置
JP2006196878A (ja) * 2004-12-16 2006-07-27 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022093692A (ja) * 2019-08-27 2022-06-23 ルネサスエレクトロニクス株式会社 半導体装置
JP7318055B2 (ja) 2019-08-27 2023-07-31 ルネサスエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
JP4185954B2 (ja) 2008-11-26
TW200843071A (en) 2008-11-01
JP2008177402A (ja) 2008-07-31

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