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WO2008081828A1 - 固体撮像素子用カバーガラス及びその製造方法 - Google Patents

固体撮像素子用カバーガラス及びその製造方法 Download PDF

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Publication number
WO2008081828A1
WO2008081828A1 PCT/JP2007/074994 JP2007074994W WO2008081828A1 WO 2008081828 A1 WO2008081828 A1 WO 2008081828A1 JP 2007074994 W JP2007074994 W JP 2007074994W WO 2008081828 A1 WO2008081828 A1 WO 2008081828A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass
cover glass
sheet
covering film
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/074994
Other languages
English (en)
French (fr)
Inventor
Hiroaki Nakahori
Daisuke Okawa
Masahiro Yodogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to KR1020097013468A priority Critical patent/KR101413499B1/ko
Priority to CN2007800455363A priority patent/CN101553926B/zh
Publication of WO2008081828A1 publication Critical patent/WO2008081828A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
    • C03C17/3417—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials all coatings being oxide coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/70—Properties of coatings
    • C03C2217/73—Anti-reflective coatings with specific characteristics
    • C03C2217/734—Anti-reflective coatings with specific characteristics comprising an alternation of high and low refractive indexes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/365—Coating different sides of a glass substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Glass Compositions (AREA)

Abstract

　カバーガラスの透光面に施された被覆膜が容易に剥離し難く、基板との十分な接着面積と接着強度を実現し、高い機械的強度と高い光学性能、さらに安定した化学的な性能を有する清浄度の高い固体撮像素子用カバーガラス及びその製造方法を提供する。本発明の固体撮像素子用カバーガラス１０は、無機酸化物ガラス製の薄板状で、板厚方向に対向する２つの透光面１１、１２の少なくとも一方の面に被覆膜Ｃ１、Ｃ２を有し、カバーガラス１０の外周端面がレーザーにより切断された面１３、１４よりなり、被覆膜Ｃ１、Ｃ２がレーザー切断以前に成膜されてなることを特徴とし、その製造方法は、ガラス原料混合物を溶融する工程と、得られた溶融ガラスを板ガラスＧに成形する工程と、該板ガラスＧの２つの透光面１１、１２の少なくとも一方の面に被覆膜Ｃ１、Ｃ２を形成する成膜工程と、該被覆膜付き板ガラスにレーザーを射出する射出工程と、射出工程後の板ガラスを小片のガラスに分割する工程とを有する。
PCT/JP2007/074994 2007-01-05 2007-12-26 固体撮像素子用カバーガラス及びその製造方法 Ceased WO2008081828A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097013468A KR101413499B1 (ko) 2007-01-05 2007-12-26 고체촬상소자용 커버유리 및 그 제조방법
CN2007800455363A CN101553926B (zh) 2007-01-05 2007-12-26 固体成像元件用覆盖玻璃及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-000793 2007-01-05
JP2007000793 2007-01-05

Publications (1)

Publication Number Publication Date
WO2008081828A1 true WO2008081828A1 (ja) 2008-07-10

Family

ID=39588510

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074994 Ceased WO2008081828A1 (ja) 2007-01-05 2007-12-26 固体撮像素子用カバーガラス及びその製造方法

Country Status (5)

Country Link
JP (1) JP5347267B2 (ja)
KR (1) KR101413499B1 (ja)
CN (1) CN101553926B (ja)
TW (1) TWI393687B (ja)
WO (1) WO2008081828A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011024573A1 (ja) * 2009-08-31 2011-03-03 オリンパスメディカルシステムズ株式会社 撮像装置
JP2011162409A (ja) * 2010-02-12 2011-08-25 Asahi Glass Co Ltd 近赤外線カットフィルタガラスおよび近赤外線カットフィルタガラスの製造方法
WO2018144666A1 (en) * 2017-02-02 2018-08-09 Guardian Glass, LLC Heat treatable coated article having coatings on opposite sides of glass substrate
US11728363B2 (en) 2018-08-22 2023-08-15 Sony Semiconductor Solutions Corporation Solid-state imaging device, imaging device, and electronic apparatus
WO2025047374A1 (ja) * 2023-08-25 2025-03-06 京セラ株式会社 蓋体、光学部品搭載用パッケージ、光学装置及び光学モジュール

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010047319A (ja) * 2008-07-23 2010-03-04 Nippon Electric Glass Co Ltd 板ガラス収納積層梱包体、及び板状物収納トレイ
JP5754332B2 (ja) * 2011-09-30 2015-07-29 日本電気硝子株式会社 膜付フィルム状ガラスの製造方法、膜付フィルム状ガラス、ガラス材接合体の製造方法及びガラス材接合体
KR101795327B1 (ko) * 2013-11-14 2017-11-07 미쓰비시덴키 가부시키가이샤 레이저 가공 방법 및 레이저 가공 장치
JP2018157074A (ja) 2017-03-17 2018-10-04 キヤノン株式会社 電子部品、電子部品の製造方法及び電子機器
CN106873841A (zh) * 2017-03-22 2017-06-20 合肥仁德电子科技有限公司 一种触摸屏及其制备方法
WO2019065098A1 (ja) * 2017-09-27 2019-04-04 日本電気硝子株式会社 光学膜付きガラス板及びその製造方法
CN109490239B (zh) * 2018-12-27 2024-02-02 重庆医科大学 一种载玻片制样专用红外透反射光谱测量附件
CN109650720B (zh) * 2019-01-14 2021-09-03 宁波行殊新能源科技有限公司 移动终端玻璃背盖基片及其生产方法
CN110034177A (zh) * 2019-04-24 2019-07-19 深圳扑浪创新科技有限公司 一种光电复合薄膜及其用途

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006140458A (ja) * 2004-10-12 2006-06-01 Nippon Electric Glass Co Ltd 固体撮像素子用カバーガラス及びその製造方法

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JPH0827408B2 (ja) * 1990-04-25 1996-03-21 株式会社コパル 光学多層膜フイルタ素子の製造方法
JPH05102302A (ja) * 1991-10-02 1993-04-23 Kanegafuchi Chem Ind Co Ltd 半導体装置の製造方法
JP3676074B2 (ja) * 1997-03-14 2005-07-27 Ｔｄｋ株式会社 ホットメルト材およびラミネート体とその製造方法
JP2001064029A (ja) * 1999-08-27 2001-03-13 Toyo Commun Equip Co Ltd 多層ガラス基板及び、その切断方法
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
DE10219812A1 (de) * 2002-05-02 2003-11-13 Univ Dresden Tech Bauteile mit kristallinen Beschichtungen des Systems Aluminiumoxid/Siliziumoxid und Verfahren zu deren Herstellung
JP4292383B2 (ja) * 2003-05-19 2009-07-08 セイコーエプソン株式会社 光デバイスの製造方法
JP2005162600A (ja) * 2003-11-11 2005-06-23 Nippon Electric Glass Co Ltd 半導体パッケージ用カバーガラス
JP5146897B2 (ja) * 2004-04-05 2013-02-20 日本電気硝子株式会社 照明用ガラス
JP4845461B2 (ja) * 2004-09-14 2011-12-28 株式会社半導体エネルギー研究所 半導体装置及びその作製方法

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2006140458A (ja) * 2004-10-12 2006-06-01 Nippon Electric Glass Co Ltd 固体撮像素子用カバーガラス及びその製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011024573A1 (ja) * 2009-08-31 2011-03-03 オリンパスメディカルシステムズ株式会社 撮像装置
JP4790874B2 (ja) * 2009-08-31 2011-10-12 オリンパスメディカルシステムズ株式会社 撮像装置
CN102356343A (zh) * 2009-08-31 2012-02-15 奥林巴斯医疗株式会社 摄像装置
US8152316B2 (en) 2009-08-31 2012-04-10 Olympus Medical Systems Corp. Imaging device
CN102356343B (zh) * 2009-08-31 2014-06-11 奥林巴斯医疗株式会社 摄像装置
JP2011162409A (ja) * 2010-02-12 2011-08-25 Asahi Glass Co Ltd 近赤外線カットフィルタガラスおよび近赤外線カットフィルタガラスの製造方法
WO2018144666A1 (en) * 2017-02-02 2018-08-09 Guardian Glass, LLC Heat treatable coated article having coatings on opposite sides of glass substrate
US11112538B2 (en) 2017-02-02 2021-09-07 Guardian Glass, LLC Heat treatable coated article having coatings on opposite sides of glass substrate
US11728363B2 (en) 2018-08-22 2023-08-15 Sony Semiconductor Solutions Corporation Solid-state imaging device, imaging device, and electronic apparatus
WO2025047374A1 (ja) * 2023-08-25 2025-03-06 京セラ株式会社 蓋体、光学部品搭載用パッケージ、光学装置及び光学モジュール

Also Published As

Publication number Publication date
JP2008187170A (ja) 2008-08-14
CN101553926A (zh) 2009-10-07
TW200842116A (en) 2008-11-01
JP5347267B2 (ja) 2013-11-20
KR101413499B1 (ko) 2014-07-01
CN101553926B (zh) 2011-07-13
KR20090101207A (ko) 2009-09-24
TWI393687B (zh) 2013-04-21

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