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WO2008044763A1 - Matériau patte-langue et procédé de production correspondant - Google Patents

Matériau patte-langue et procédé de production correspondant Download PDF

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Publication number
WO2008044763A1
WO2008044763A1 PCT/JP2007/069939 JP2007069939W WO2008044763A1 WO 2008044763 A1 WO2008044763 A1 WO 2008044763A1 JP 2007069939 W JP2007069939 W JP 2007069939W WO 2008044763 A1 WO2008044763 A1 WO 2008044763A1
Authority
WO
WIPO (PCT)
Prior art keywords
tab lead
lead material
film
plating
nickel plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/069939
Other languages
English (en)
Japanese (ja)
Inventor
Satoshi Yamazaki
Ikuo Tabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoritsu Chemical and Co Ltd
Nets Co Ltd
Original Assignee
Kyoritsu Chemical and Co Ltd
Nets Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoritsu Chemical and Co Ltd, Nets Co Ltd filed Critical Kyoritsu Chemical and Co Ltd
Publication of WO2008044763A1 publication Critical patent/WO2008044763A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/531—Electrode connections inside a battery casing
    • H01M50/534—Electrode connections inside a battery casing characterised by the material of the leads or tabs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/531—Electrode connections inside a battery casing
    • H01M50/536—Electrode connections inside a battery casing characterised by the method of fixing the leads to the electrodes, e.g. by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Definitions

  • the present invention relates to a tab lead material and a manufacturing method thereof, and more particularly to a tab lead material suitable for use in a nonaqueous electrolyte battery or a capacitor and a manufacturing method thereof.
  • a film-like positive electrode and a negative electrode are opposed to each other via a separator, and a non-aqueous electrolyte is interposed therebetween to transmit lithium ions to enable charging / discharging.
  • These power generation elements are covered with a highly airtight exterior material, and electricity can be taken out from the negative electrode and the positive electrode by a tab lead material (see Patent Document 1). .
  • lithium-based nonaqueous electrolyte batteries contain a fluorine atom such as LiPF.
  • Lithium salt dissolved in the organic solvent is used as an electrolyte.
  • this fluorine-containing electrolyte such as LiPF chemically decomposes and generates HF when it comes into contact with water.
  • This HF is a highly corrosive substance, which erodes the metal such as aluminum that constitutes the tab lead material and reduces the adhesive strength with the insulating film adhered to the surface, causing peeling. It was.
  • the above-mentioned problem is a problem in a film exterior type non-aqueous electrolyte battery. It is used in an extremely severe situation because it is used in an automobile, and moreover in a vibration or temperature environment. Therefore, there is a strong demand for the solution of the above problems.
  • Patent Document 1 JP-A-11 224652
  • the present invention was made to eliminate the drawbacks of the prior art in the tab lead material.
  • the tab lead material made of a thin metal plate material is used in a laminate package type battery or capacitor, this tab lead material is used.
  • the purpose is to improve the reliability of the battery or capacitor by improving the adhesion between the film and the film material adhered to it.
  • a first aspect of the present invention is a tab lead material comprising a thin metal plate and a nickel sulfamate coating formed on the surface thereof.
  • a thin metal plate a nickel sulfamate sulfamate coating formed on the surface thereof, and a polymer film including chitosan or a derivative thereof formed on the surface thereof. I prefer to do it.
  • the metal thin plate is preferably subjected to heat treatment.
  • the thickness of the plating film is preferably 1. O ⁇ m or more and 3.0 m or less, and a nickel plating film is preferably formed on the entire surface of the metal thin plate.
  • the metal it is possible to use the same or an anorium.
  • the second aspect of the present invention includes a step of applying nickel sulfamate plating to the surface of a metal thin plate, and a step of forming a primer film containing chitosan or a derivative thereof on the surface of the plating film. This is a method for producing a tab lead material.
  • the metal thin plate is annealed.
  • the annealing treatment may be performed after the nickel plating treatment.
  • the chemical resistance of the tab lead material using the metal thin plate is improved by applying nickel sulfamate to the surface of the metal thin plate.
  • the surface By forming the limer layer, the adhesiveness with the plastic film heat-sealed to the surface is improved and the reliability is improved.
  • FIG. 1 is a cross-sectional view of a tab lead material of the present invention.
  • FIG. 1 A cross-sectional view of the tab lead material of the present embodiment is shown in FIG.
  • this tab lead material 10 has a nickel sulfamate plating layer 12 formed on the surface of a thin metal plate 11, and a primer layer 13 containing chitosan or a derivative thereof is formed on the surface. It is.
  • the tab lead material will be described below.
  • the metal thin plate forming the tab lead material of the present embodiment copper or aluminum is suitable because of its electrical conductivity.
  • copper material rolled oxygen-free copper is preferable.
  • the metal thin plate may be a metal foil made of these alone, or a laminated thin plate with these materials or other metal materials! /.
  • the metal sheet material is preferably subjected to annealing treatment. This will be described later.
  • the thickness is preferably in the range of 0.;! To 0.5 mm.
  • the width is preferably 10 to 100 mm and the length is 40 to 100 mm.
  • matte nickel plating is applied to the surface of the thin metal plate. This can improve the chemical resistance of the tab lead material, particularly the resistance to hydrogen fluoride, which is expected to occur in the electrolyte solution in a non-aqueous electrolyte battery.
  • a method for forming a dull nickel plating film a plating method using a known dull nickel plating bath such as a nickel sulfamate plating bath or a Watt bath can be adopted, but the stress of the nickel plating film is 1 to A method of forming a film of about 7 kg ⁇ mm 2 is preferable. Matte nickel plating means that the fineness of the crystal of the coating film is normal in nickel plating. Without adding brighteners such as aromatic sulfonates, aromatic sulfonamides, aromatic sulfonimides, aldehydes, aryl compounds, acetylene compound nitriles, etc. It is a method of applying a texture.
  • the nickel plating film to be formed has low stress and excellent flexibility, and the nickel plating film can be prevented from being damaged when the electrode is formed by press molding at the time of assembling a battery or the like. In addition, handling during use of the battery becomes easy.
  • a general nickel plating (glossy plating) cannot be used because it cracks when a metal sheet with a hard coating is bent at an angle of 180 degrees.
  • 0.2 mmt x 8 mm wide x 60 mm long lead material with electroless Ni plating will crack once and will not withstand actual use.
  • the nickel plating film formed by the nickel sulfamate plating method did not generate cracks even if it was bent four times by the same method (partial cracks occurred at the fifth time).
  • the tab lead material of the present invention it is indispensable to bend the terminal lead when assembling a battery or the like, and a material that is predicted to generate cracks cannot withstand actual use and cannot be used.
  • the thickness of the nickel plating film of the present embodiment is preferably in the range of 1.0 ⁇ m to 3.0 ⁇ m. If the thickness of the nickel plating film falls below this range, the surface of the thin metal sheet will be exposed due to scratching of the plating film when handling the tab coating material with the coating film, and the chemical resistance of the tab lead material will be greatly increased. The reliability of the battery or capacitor decreases. On the other hand, in order to make the thickness of the nickel plating film beyond this range, only a long time is required for the plating, and no improvement in characteristics corresponding to this is seen, which is economically disadvantageous. A more preferable range of the thickness of the plating film is 2.0 ⁇ 2.5 to 01.
  • the nickel plating film may be a single film! /, But it can also be formed into a multilayer plating film by a plurality of plating processes. This makes it possible to obtain a reliable film free from defects such as pinholes in the plating film.
  • the surface of the nickel sulfamate coating should be coated with other metal materials such as gold, silver, and cobalt to form a multilayer film. You can also.
  • the thickness of each plating layer is not particularly limited, as long as the entire multilayer plating film can sufficiently cover the entire surface of the thin metal sheet.
  • the total film thickness is preferably the same as that of a single film.
  • the nickel plating film is preferably formed on the entire surface of the thin metal plate. That is, it is preferable to form a textured film not only on the main surface but also on the side surfaces of the thin plate.
  • a primer (primer) film is formed on the surface of the tab lead material of the present invention in order to improve the adhesion with the insulating film adhered to the surface.
  • This primer is made of a material composed of chitosan or a derivative thereof described in detail below.
  • the thickness of the primer is preferably about 2001 111 to 5 111.
  • the thickness force is less than 200 nm, the force S for improving the adhesiveness between the tab lead material and the insulating film on the surface cannot be achieved, and it is easily peeled off.
  • the film thickness exceeds ⁇ , if a force for peeling the tab lead material and the insulating film is applied, the primer itself causes cohesive failure and breaks, so that the adhesive strength decreases.
  • Chitosan the main component of this primer, is chicken, which is a naturally occurring polymer obtained from shells or mushrooms such as shrimp, shrimp and insects, ie, / 3-polypolyacetyl-D-darcosamine It is a substance obtained by deacetylation and is a polysaccharide containing an amino group with 2-amino-2-deoxy-D-glucose as a structural unit. It is a material that forms a salt with various acids and becomes cationic when dissolved in water. is there. Since it is a compound having such a high reactivity, it is possible to adhere to both surfaces of the hydrophilic material surface and the hydrophobic material surface!
  • Chitosan or a derivative thereof used in the present invention may be a polymer substance composed of only 2-amino-2-deoxy D-glucose, or a co-polymer in which this is polymerized with other glucose. They can be combined. Further, it may be a derivative in which another substituent is introduced into a part of the functional group of glucosamine constituting this polymer. Specifically, those represented by the following chemical formula can be used. [0024] [Chemical 1]
  • R -CH 2 — CH— CH 2 — OH or ⁇
  • Such chitosan is produced industrially, is supplied in various grades, and is commercially available.
  • chitosan and derivatives thereof having a degree of deacetylation of 80% or more are suitable.
  • the degree of deacetylation is lower than the above range, it is difficult to dissolve in water because it dissolves in water to form an aqueous solution, which is inappropriate for the present invention.
  • the weight average molecular weight is more preferably in the range of 10,000 to 1,000,000, preferably 1,000 to 2,000,000. If the molecular weight is below this range, it is inappropriate for use in the present invention in terms of forming a film of the adhesive layer. On the other hand, if the molecular weight exceeds this range, the viscosity of the solution becomes too high. In view of handling such as workability, it is inappropriate for use in the present invention.
  • Preferred chitosan derivatives include chitosan, chitosan pyrrolidone carboxylate, hydroxypropyl chitosan, glycerylated chitosan, cationized chitosan, chitosan lactate, chitosan adipate, etc. It is preferable that the chitosan derivative further contains an organic compound having at least one carboxyl group in the molecule.
  • the tab lead material of the present embodiment is provided with a nickel plating process on the surface of the metal thin plate, and can be performed by adding a subsequent primer film forming process.
  • Nickel plating is applied to the surface of the thin metal plate constituting the tab lead material.
  • This metal thin plate is preferably annealed. This annealing process will be described later.
  • the nickel plating treatment of the present embodiment is preferably performed by the electrolytic plating using a nickel sulfamate plating bath, in addition to the ability of the resulting coating film to have low stress and flexibility.
  • An example of the composition of the nickel sulfamate plating bath used in the present embodiment is shown.
  • NiCl6 ⁇ O 10-50g / 1
  • the conditions for performing nickel sulfamate plating can be appropriately determined according to the composition of the plating solution used, but in the case of the nickel sulfamate plating bath described above, the liquid temperature is 30 to 60 °. C, Cathode current density 0.;! ⁇ 50A / dm 2 , preferably liquid temperature 50 ⁇ 60 ° C, Cathode current density 0.4 ⁇ ; lOA / dm 2
  • a primer film is formed on the surface of the thin metal plate subjected to the nickel plating.
  • This primer film improves the adhesion between the metal thin plate and the film disposed on the surface thereof.
  • a primer containing chitosan or a derivative thereof is used as the primer layer material. Use.
  • This primer is preferably used as an aqueous solution of the aforementioned chitosan or a derivative thereof, or an organic solvent solution.
  • the concentration is preferably in the range of 0.;! To 20% by mass.
  • concentration of chitosans is less than 0.1% by mass, the effect of improving adhesiveness is improved. It is not practical.
  • concentration of chitosan exceeds the above range, the viscosity of the chitosan solution increases and handling becomes difficult.
  • this primer includes an organic compound having at least one carboxyl group in the molecule, a trivalent chelate-forming metal compound, a rheo-mouth property improving agent, and a xotropy improving agent. It is possible to use additives such as oxidants and antioxidants in combination. In particular, when a chelate-forming compound is used in combination, a chelate compound is formed together with the amino group of chitosan, and the film formability is improved.
  • Formation of this primer film is preferably carried out by immersing a metal thin plate in a primer solution and drying it.
  • the primer film is preferably formed on the surface and side surfaces of the metal thin plate.
  • the metal thin plate used in the present invention may have high rigidity due to the effects of residual stress and the like due to various machining during the manufacturing process.
  • cracks may occur or break at the stage of handling.
  • the annealing treatment is a technique commonly known as annealing treatment, and is preferably performed in the range of 100 ° C to 500 ° C in an inert or reducing atmosphere.
  • the treatment time is related to the treatment temperature, it can usually be carried out in about 1 minute to 1 hour.
  • the tab lead material has improved chemical resistance to chemicals such as hydrofluoric acid, and the adhesiveness to a film or the like that is bonded to the surface by a method such as heat fusion is remarkably improved. Therefore, this tab lead material may come into contact with chemicals such as hydrofluoric acid, and is preferably applied to the field where it is used as an assembly with a film.
  • Such fields include, but are not limited to, non-aqueous electrolyte secondary batteries and non-aqueous electrolyte capacitors.
  • the tab lead material of the present invention is extremely excellent in adhesiveness, and can be used in HEVs (Hybrid Electric Vehicles) that can be used in harsh conditions. Suitable for use!
  • HEVs Hybrid Electric Vehicles
  • a plating treatment is performed at a bath temperature of 50 ° C. under a current density of 1 OA / dm 2 and a thickness of 1.
  • Three types of test samples were prepared with a coating film of O ⁇ m, 2. ,, m, and 3.0 ⁇ m.
  • a primer in which glyceryl chitosan was dissolved in water was applied to the surface of these test samples to a thickness of 1 ⁇ m or less, and dried to prepare a tab lead material sample.
  • a test sample was prepared by heat-sealing maleic anhydride-modified polypropylene phenolic (thickness 0.1 mm, width 10 mm, length 12 mm) on the surface of the obtained tab lead material sample.
  • a test sample as Comparative Example 1 was prepared in the same manner as in the above example, except that the nickel sulfamate plating treatment was not performed.
  • a test sample as Comparative Example 2 was prepared in the same manner as in the above example, except that the primer layer forming treatment containing chitosan or its derivative was not performed.
  • test sample to be used in Comparative Example 3 was prepared in the same manner except that the nickel sulfamate treatment and the primer layer formation treatment containing chitosan or its derivative were not affected. Created.
  • test samples prepared in the above Examples and Comparative Examples 1, 2, and 3 were immersed in 1% HF aqueous solution for 90 minutes, corrosiveness by HF, and reliability of film and tab material welding (hydrofluoric acid resistance test) Evaluated.
  • test piece of this example that had been subjected to the plating treatment and the primer treatment was The welded film with no discoloration due to oxidation did not peel off.
  • the copper material of Comparative Example 1 that was not subjected to the plating treatment was discolored to brown, and the film welding interface also peeled 4 to 6 mm from the welding part where the film edge was 10 mm.
  • Comparative Example 2 and Comparative Example 3 which are film-welded tabs that were not subjected to primer treatment, the PP film on which both were deposited all peeled off in 30 minutes.
  • the tab lead material used for HEV applications is important for improving Ni resistance and chemical resistance and adhesion by performing Ni plating and primer treatment. .

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Sealing Battery Cases Or Jackets (AREA)

Abstract

La présente invention concerne un matériau patte-fil qui comprend une feuille métallique mince et qui, lorsqu'il est utilisé dans une cellule ou un condensateur de type boîtier stratifié ou dans un condensateur, fait preuve d'une adhésion améliorée à un matériau pelliculaire à joindre à ce matériau patte-fil. Il a donc pour but d'augmenter la fiabilité de la cellule ou du condensateur. Ce matériau patte-fil (10) comprend une feuille métallique mince (11) ainsi qu'un film déposé de sulfamate de nickel (12) formé en plaquant sa surface par cette substance. Il peut en outre comprendre, formé à la surface du film déposé, une pellicule primaire réactive (13) qui se compose de chitosan ou d'un de ses dérivés. La feuille métallique fine de ce matériau patte-fil a de préférence fait l'objet d'un traitement thermique, et le film déposé a de préférence une épaisseur de 1 à 3 µm. Le métal peut être du cuivre ou de l'aluminium.
PCT/JP2007/069939 2006-10-13 2007-10-12 Matériau patte-langue et procédé de production correspondant Ceased WO2008044763A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006280580A JP2010003711A (ja) 2006-10-13 2006-10-13 タブリード材及びその製造方法
JP2006-280580 2006-10-13

Publications (1)

Publication Number Publication Date
WO2008044763A1 true WO2008044763A1 (fr) 2008-04-17

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WO (1) WO2008044763A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010170979A (ja) * 2008-12-22 2010-08-05 Showa Denko Kk 正極タブリード及び負極タブリード並びに電池
JP2023050693A (ja) * 2021-09-30 2023-04-11 双葉電子工業株式会社 タブリード及び非水電解質デバイス

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5421454B2 (ja) * 2010-03-31 2014-02-19 Ｊｍエナジー株式会社 蓄電デバイス
EP2616191B1 (fr) 2010-09-13 2017-04-12 Chemetall GmbH Procédé de revêtement de surfaces et utilisation des objets revêtus selon ce procédé
WO2013002607A2 (fr) * 2011-06-30 2013-01-03 주식회사 엘지화학 Terminal d'électrode pour batterie secondaire et batterie secondaire au lithium comprenant un tel ensemble
JP2013020878A (ja) 2011-07-13 2013-01-31 Sumitomo Electric Ind Ltd リード部材とその製造方法
KR101793412B1 (ko) * 2017-08-30 2017-11-02 양기제 이차전지용 양극탭의 제조방법

Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH09263994A (ja) * 1996-03-26 1997-10-07 Nisshin Steel Co Ltd 深絞り加工性に優れた電池缶材料及びその製造方法
JP2001279489A (ja) * 2000-03-30 2001-10-10 Dowa Mining Co Ltd 電気接触材料及びその製造方法
JP2002329493A (ja) * 2001-05-02 2002-11-15 Mitsubishi Cable Ind Ltd シート型電池
JP2003201576A (ja) * 2002-01-11 2003-07-18 Nippon Parkerizing Co Ltd 水性下地処理剤、下地処理方法および下地処理された材料
JP2005011556A (ja) * 2003-06-17 2005-01-13 Ngk Spark Plug Co Ltd 積層型電池およびその製造方法
JP2006128096A (ja) * 2004-09-30 2006-05-18 Sumitomo Electric Ind Ltd 非水電解質電池用リード線及び非水電解質電池

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09263994A (ja) * 1996-03-26 1997-10-07 Nisshin Steel Co Ltd 深絞り加工性に優れた電池缶材料及びその製造方法
JP2001279489A (ja) * 2000-03-30 2001-10-10 Dowa Mining Co Ltd 電気接触材料及びその製造方法
JP2002329493A (ja) * 2001-05-02 2002-11-15 Mitsubishi Cable Ind Ltd シート型電池
JP2003201576A (ja) * 2002-01-11 2003-07-18 Nippon Parkerizing Co Ltd 水性下地処理剤、下地処理方法および下地処理された材料
JP2005011556A (ja) * 2003-06-17 2005-01-13 Ngk Spark Plug Co Ltd 積層型電池およびその製造方法
JP2006128096A (ja) * 2004-09-30 2006-05-18 Sumitomo Electric Ind Ltd 非水電解質電池用リード線及び非水電解質電池

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010170979A (ja) * 2008-12-22 2010-08-05 Showa Denko Kk 正極タブリード及び負極タブリード並びに電池
EP2372815A4 (fr) * 2008-12-22 2014-05-07 Showa Denko Kk Languette d'électrode positive, languette d'électrode négative et batterie
US9070919B2 (en) 2008-12-22 2015-06-30 Showa Denko Packaging Co., Ltd. Positive electrode tab lead, negative electrode tab lead, and battery
JP2023050693A (ja) * 2021-09-30 2023-04-11 双葉電子工業株式会社 タブリード及び非水電解質デバイス

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