WO2007118511A1 - Method and device for placing electronic components, especially semiconductor chips, on a substrate - Google Patents

Abstract

Disclosed are a method and a device for placing electronic components (1) on a substrate (2) in a positioning station (3). The component that lies in a supply station by means of a contact face (4) is picked up by a primary tool (6), is conveyed away using a rotational movement, and is transferred to at least one swiveling tool (41, 42). The trajectory of the component between the level (47) of the supply station and a more elevated stand-by level (7) is divided into at least two separate curved movements. The component is received by at least one secondary tool at the stand-by level, is conveyed over the substrate, and is placed thereupon. The component can be placed on the substrate by means of the same contact surface or the structured surface thereof depending on whether the primary tool transfers the component to an intermediate swiveling tool (41) first or directly to a final swiveling tool (42).

Description

Method and device for storing electronic components, in particular semiconductor chips on a substrate

The invention relates to a method for depositing electronic components, in particular semiconductor chips according to the preamble of claim 1. With such a method, for example, in the production of semiconductor devices in Chipmontageautomaten (Diebondern) the unhoused chip from the already divided silicon wafer (wafer) and then picked deposited or bonded to corresponding substrates. After the bonding process, further process steps such as e.g. Curing, wire bonding, melting of solder joints, encapsulation, singulation, etc.

There are a variety of different processes for placing the chip on the substrate, such as gluing, soldering or laminating. The nature of the connection process also determines whether the chip must be turned before placement (flip-chip applications) or not (non-flip applications). Turning of the chip is expressly understood below not a relative movement with respect to a spatial axis or spatial plane, but a turning with respect to the original bearing side. In the case of non-flip applications, the chip is not turned over and, after being picked up by the wafer film, transported directly in one step to the substrate, whereby the pickup tool is simultaneously used as a bonding tool. The support side with which the chip was glued onto the wafer film is then also the side with which the chip is glued onto the substrate. A known device of this kind is mentioned, for example, in EP 1 049 140 or become known from the company journal "Newsline 1/2002" by the applicant (machine type "Easyline"). In the case of flip-chip applications, the chip is deposited with its structure side after turning on the substrate, that is, the structure of the chip. Layer side, with which the chip was adhered to the wafer, after placing then the side facing away from the substrate. On modern Diebondersysteme ever greater demands are made in terms of manufacturing costs, throughput, accuracy and process flexibility. Nevertheless, the machines should not exceed existing equipment in terms of height, machine layout, weight, etc. This leads to an ever greater complexity of the machines in terms of mechanics, motion sequences and control. By the US 2005/0132567 a device has become known in which semiconductor chips are received by a rotatable picking tool with three tool heads and transported from there to a higher level and taken over by a further tool which moves the chips in a linear movement over the substrate leads and settles there. Picking plane and substrate plane run parallel, but at different levels. This makes it possible for the rolling table to be moved under the substrate table, which is obviously advantageous, especially with large wafers, because this makes it possible to keep the overall base area of the machine small. However, in this case, the chip is evidently always turned over by the transfer operation, so that it is not deposited with its support side but with its structure side on the substrate (flip-chip application). In addition, the rotatable picking tool needs to overcome the height difference between the picking plane and the discharge plane has a relatively large outer diameter, which is not advantageous in terms of both the kinematics and for reasons of space.

It is therefore an object of the invention to provide a method of the type mentioned, in which the height difference between the level of the supply station and a higher level deployment can be overcome with less space and kinematically more advantageous and in the construction also parts can be placed on the substrate with the same edition page again (non-flip application), with the highest possible throughput can be achieved with an improved Absetzgenauigkeit. It should also be possible to pick at room temperature, but may also be able to place hot. In addition, it should be possible with the same method or with the same device to drive both flip-chip and non-flip applications in order to broaden the range of use at low additional cost considerably. The position of the chip should be optimally detectable with the corresponding optical image recognition devices at different points. Finally, the device should also be as compact as possible and have the smallest possible machine floor plan. This object is achieved in procedural terms with a method that has the features in claim 1. In terms of the device, the object is achieved with a device having the features in claim 11.

If the path of the component between the level of the supply station and the supply level is covered in at least two separate, ascending curve movements, space can obviously be saved with respect to the ground plan. The primary tool lays back a first curve movement with the component, transfers the component in a transfer position to at least one pivoting tool, which covers a second curve movement up to the delivery level. The curve radii are much smaller than when the stroke of the component must be covered by a single turning tool. In addition, much smaller masses must be accelerated or decelerated, which reduces the energy consumption and enables faster movement sequences. With correspondingly large height differences of course, several pivoting tools could be connected in series, so that the hub in more than two separate pivoting movements would be covered. Evidently, the at least one pivoting tool must be arranged in the effective range of the primary tool.

For a flip-chip application, it is particularly advantageous if the primary tool passes the component to an intermediate pivoting tool, which detects the component on the support side and, after a pivoting movement, transfers it to an end pivoting tool, which in turn captures the component on the structural side and pivots it into the deployment plane, where it is is transferred to the secondary tool, where it is finally deposited with the structure side on the substrate. Evidently, the intermediate pivoting tool assumes the function of transferring the component to the end pivoting tool in such a way that it can be detected on the structure side. Only under this condition, the component is last deposited by the secondary tool again with the structure side, if a repeated turning should be avoided.

In contrast, it is useful in non-flip applications when the primary tool passes the component directly to a Endschwenkwerkzeug which detects the component on the support side and pivots in the deployment plane, where it is passed to the secondary tool, where it last again with the same support side to the substrate is discontinued. Evidently, so already causes the transfer of the component from the primary tool to the Endschwenkwerkzeug that it can be detected by the secondary tool on the structure side and thus also discontinued again with the support side.

Particularly versatile applications arise, however, when the components in a first operating mode on the Zwischenschwenkwerkzeug and in a second operating mode directly The pivoting movement of the primary tool in the first or in the second operating mode, starting from the receptacle on the supply station preferably extends to separate movement sections, for example sectors. This allows either flip-chip applications and non-flip applications to be run. The execution of the pivoting movement of the primary tool on separate movement sections depending on the selected operating mode allows an optimal arrangement of the intermediate pivoting tool or the Endschwenkwerkzeugs or a geometrically optimal curve. Instead of partial arc movements, however, depending on the choice of gear used, other curve movements could be driven, such as a cycloid or a spiral. The opposite direction of curvature allows short distances and the most direct possible overcoming of the hub between the level of the storage station and the deployment level. The movement of the secondary tool from the acquisition of the component to over the substrate is advantageously linear. Again, however, a curved movement would be conceivable.

A particularly advantageous machine arrangement and movement guidance results when the transport of the component from the supply station to the substrate is essentially on an approximately vertical transport plane. All drive elements and auxiliary devices can be arranged as evident along this plane. As a result, the visual observation of the workflow and the maintenance of the machine is much easier. Further advantages can be achieved if the actual position (position and angle) of the component on the supply station is determined before recording with a first image recognition device, and or if the actual position of the component in the delivery plane is determined before transport to the substrate with a second image recognition device , and / or if the actual position of the substrate with a third Bildkennungsein- direction is determined, wherein deviations between the determined actual values and a predetermined desired position of the component are preferably corrected during transport. The image recognition devices may, for example, be CCD cameras. With a total of only three such cameras, a very high degree of precision or an optimal correction possibility can be achieved. Depending on the application, it would also be conceivable, for example, to measure only the actual position of the component in the deployment plane.

With regard to the possibility of the different operating modes mentioned above, it is expedient if the determination of the actual position of the component in the deployment plane by the second image recognition device in the first operating mode from bottom to top against the component held on the secondary tool and in the second operating mode from top to bottom against the component held on the end pivoting tool takes place. This ensures that regardless of the operating mode in the deployment level, the component can always be measured on the structure side.

The determination of the actual position is advantageously carried out with one of the image recognition devices whenever the primary tool or the secondary tool or the end pivot tool releases the image field of the actual position to be determined. Transport movement and image recognition thus take place in such a way that they do not hinder each other.

Further advantages can be achieved if the first image recognition device is arranged in such a way that the acquisition of the image field assigned to it occurs in both operating modes from within the swivel range of the primary tool. Likewise, the second image recognition device for the second drive mode can be arranged such that the detection of the image field associated with it takes place from within the pivoting range of the Endschwenkwerkzeugs. The first and the second image recognition device or their optical axes at the output opening can be arranged on mutually offset vertical axes. However, another arrangement would be possible, for example, if the axes of rotation of the primary tool and the Endschwenkwerkzeugs lie on a common vertical.

The third image recognition device for detecting the actual position of the substrate can be arranged on a preferably linearly displaceable carriage. This allows the camera to be moved to an observation position, regardless of the position of the secondary tool. This simplifies the construction of the substrate feed. Namely, in substrates having a matrix-like arrangement of settling positions, the substrates need only be displaced in one direction (x), while the other direction (y) can be achieved by the image recognition device movable in this spatial direction and the secondary tool also movable in this spatial direction. In addition, this evidently increases the flexibility of the processes and thus improves the throughput, since the measurement can be decoupled from the position of the secondary tool and thus processes can be parallelized. For high-precision applications, it may also be expedient to arrange the third image recognition device directly on the carriage of the secondary tool.

Further advantages can be achieved if the storage station is designed as a transport station for the preferably linear passage of a plurality of substrates. As a means of transport can be used per se known clamping devices, conveyor belts or the like. In addition to the supply station, a wafer cassette can be arranged, which is movable for loading wafer frames on the supply station in different loading positions, in which the storage station and the wafer cassette are at least partially arranged on the same plane, wherein the wafer cassette is movable to a rest position in which the supply station for executing a loaded wafer frame is at least partially displaceable over the wafer cassette in the horizontal working plane. As can be seen, the wafer cassette can thus be arranged in a very space-saving manner without impairing its function when loading the workstation.

Further advantages can finally be achieved even if one or more intermediate storage stations are arranged in the pivoting area of the primary tool and / or the final pivoting tool, on which a component can be temporarily stored before being transferred to the secondary tool. As can be seen, individual components can be temporarily removed from the working process and stored temporarily in order to be further processed at a later time. In view of today's quality requirements in the production, it is partly necessary, for example, to differentiate the quality of chips. In order to obtain the highest possible yield, it may be necessary to sell only high-quality chips to high-quality substrate positions, whereby lower quality chips can be used on lower-quality substrate positions. The Zwischenablagestation allows a particularly simple way a qualitative control of the filing process.

Evidently, various embodiments of the invention are conceivable without departing from the subject matter of the scope. For example, two separate Endschwenkwerkzeuge components from a common primary tool and passed to two separate secondary tools.

Further individual features and advantages of the invention will become apparent from the following description of an embodiment and from the drawings. Show it:

Figure 1 is a simplified representation of a subdivided

Wafers with an enlarged semiconductor chip,

Figure 2 is an overall perspective view of a

Contraption,

FIG. 3 shows a greatly simplified page representation of FIG

Device according to FIG. 2 with a wafer cassette in the rest position,

FIG. 4 shows the device according to FIG. 3 with the wafer cassette in the lowermost feed position,

FIG. 5 shows the device according to FIG. 3 with the wafer cassette in the uppermost feed position,

FIG. 6 shows a perspective view of a primary tool, an intermediate pivoting tool and an end pivoting tool as well as a secondary tool,

7 is a schematic representation of the curve of the tools on the device according to FIG. 6, FIG. FIG. 8 is a side view of the first image recognition device on the primary tool;

Figure 9 is a side view of the second

Image recognition device on Endschwenkwerkzeug,

Figure 10 is a frontal view of the two

Image recognition devices according to FIG. 8 FIG. 11B. All sequences of a work process without

Turning the component, and

Figure 12a-12e different sequences of a work with

Turning the component.

In FIG. 1, an arrangement known per se is shown in a highly simplified manner, in which an already subdivided semiconductor wafer 18 is glued onto a wafer foil 19, which in turn is tensioned in a wafer frame 20. The semiconductor chips 1 are already isolated by the sawing lines, which is indicated by the intersecting lines. Each chip 1 has a support side 4 with which it adheres to the wafer foil 19 before detachment. Semiconductor structure is applied on the side opposite the support side 4, which is why it is referred to below as the structure side 17. If the electronic component is not a semiconductor chip, the structure side simply corresponds to the top side of the component. The separation of the chips by sawing or the detachment process from the wafer film with the aid of needles and other auxiliaries are already sufficiently known to the person skilled in the art.

First, the essential functional units of a device will be described with reference to FIG. On a machine frame a storage station 5 is arranged, which in the pre- lying case as a wafer table for the reception of prepared wafer frames according to Figure 1 is formed. The supply station can be moved on a horizontal plane in two spatial axes, so that each individual chip can be moved to a detachment position. From a wafer cassette 27, which is lowered here in the rest position, if necessary, further wafer frames can be added. The storage station 3, to which the components must be transported from the storage station, is here designed as a feed system 39, on which in the direction of arrow x substrates 2 can be cyclically fed.

The individual chips are lifted by a primary tool 6 of the storage station 5 and pivoted up and then alternatively passed an intermediate pivoting tool 41 or directly to a Endschwenkwerkzeug 42. The latter passes the chip to the secondary tool 8, which is displaceable along a carriage guide 21 to above the storage station 3.

Further details of the device can be seen from FIG. For the transport of the individual chips 1, first of all a height difference between the level 47 of the supply station and the supply level 7 has to be overcome, which practically coincides with the level of the depositing station 3 with the substrates 2. This height difference is carried out in the manner described in more detail below at least two pivotal movements of the primary tool 6 and the Endschwenkwerkzeugs 42 and optionally still covered by an intermediate pivotal movement of the Zwischenschwenkwerkzeugs 41. The secondary tool 8 is attached to a carriage 15 which is linearly displaceable on a guide rail 21. On the secondary tool correction movements in the x and y axes and about an axis of rotation before settling of the component are possible if this is necessary due to the determination of the actual position. The various tools are provided with recording tools for holding a component, for example by means of negative pressure. These receiving tools may preferably perform at least one further movement in its longitudinal axis and / or about its longitudinal axis.

In the pivoting range of the primary tool 6 and the Endschwenkwerkzeugs 42 each a Zwischenablagestation 40a and 40b is arranged. As mentioned above, these intermediate stations serve to temporarily place a chip in a waiting position for further transport at a later time. Similar to the work tools for the transport of the components and the intermediate storage stations are provided with recording tools.

For the monitoring and correction of different actual positions different cameras are arranged on the device. A first camera 10 determines the actual position of a chip 1 at the storage station 5 before lifting. A second lower camera IIa detects the position of a chip in the case of transfer to the secondary tool 8. A second upper camera IIb, however, detects the position of a chip on Endschwenkwerkzeug 42 prior to transfer to the secondary tool 8. It can be seen, alternatively, one of the two second cameras IIa or IIb, depending on whether the secondary tool detects the chip on the support side or on the structure side. Finally, a third camera 12 can detect the actual position of the substrate 2 on the storage station 3. This third camera 12 is arranged on a carriage 16, which is displaceable along a guide rail 22. Further details of these components will become apparent from FIGS. 8 to 10. Since the storage station 3 and the storage station 5 are at different levels, it can be seen, the storage station 5, so the wafer table with regard to its range of movement under the storage station, so push under the supply system, whereby the floor plan of the machine frame 26 can be kept very small. The storage station 5 must be horizontally displaceable in two spatial axes, since each individual chip to be removed is to be driven exactly under the lifting primary tool 6. Such controls are already known to the skilled person.

From FIGS. 3 to 5 further details on the displaceability of the storage station 5 in combination with the wafer cassette 27 can be seen. The wafer cassette 27 has different pockets in a known manner, wherein a prepared wafer frame with a divided wafer (according to FIG. 1) is contained in each compartment. The wafer cassette is vertically movable and a removal mechanism, not shown here, can remove a wafer frame from each floor and transfer it to the storage station 5. According to FIG. 3, the wafer cassette 27 is lowered below the level of the storage station. In this position, the storage station 5, which can be displaced in two spatial axes, can be pushed both under the storage station 3 and over the wafer cassette 27, as can be seen, with which the machine floor plan can be kept very small.

According to FIG. 4, the wafer cassette 27 is in the lowest unloading position, in which a wafer frame can be removed from the topmost level. As a result, each time a wafer frame is pecked empty, it is pushed back to the corresponding empty floor and removed from the next floor, a new wafer frame until the last floor is reached. In this case, the wafer cassette 27 is located in the uppermost removal position. on, which is shown in FIG. Of course, the wafer cassette 27 is lowered again into the rest position according to FIG. 3 after each loading or unloading operation.

FIG. 6 shows further details of the entire transport device. The primary tool 6 is arranged at the end and on the outside of an L-shaped rotary arm 23. The rotary arm rotates about a horizontal axis 13 and is rotatably driven by a motor 25. The primary tool describes a turning circle or pitch circle 14, wherein the motor 25 allows actuation in both directions of rotation. A still described camera housing 24 with a lens exit is disposed within the turning circle 14. In a similar or similar manner, the final pivoting train 42 is pivotable about an axis 44 on a turning circle 45 on an L-shaped pivot arm 43. Again, a camera body 24 'projects into the interior of the turning circle 45, but with an upwardly directed lens output.

Finally, an intermediate pivoting tool 41 is still arranged in the effective range of the primary tool 6 or of the end pivoting tool 42. This rotates about an axis 50 and describes a turning circle 51. Since no camera housing housing has to be stored here within the turning circle, the arrangement on an L-shaped turning arm is not required. The provision level 7 practically forms a horizontal tangent to the turning circle 45. The guide rail 21 extends over the provision level 7 for the carriage 15 of the secondary tool 8. In the position shown in FIG. 6, the secondary tool 8 has just taken over a semiconductor chip from the end pivot tool 42 and transports it in the direction of the storage station. All tools are provided in a conventional manner with recording tools, which required for their operation pneumatic lines and control devices are not shown.

FIG. 7 shows the geometrical relationship of the tools shown in FIG. 6 to one another and in particular the curve of a component 1 between the plane 47 of the supply station and the supply plane 7. The axes of rotation 13, 44 and 50 of the working tools form a triangle relative to one another, with the revolving circuits 14 , 45 and 51 on the thighs of the triangle touch or approximately, thereby forming a first transfer position 52, a second transfer position 53 and a third transfer position 54. Starting from the receiving position 55, the primary tool 6 returns a pivoting movement which, depending on the operating mode, leads via a first sector S1 to the first transfer position 52 or via a second sector S2 to the second transfer position 53. The intermediate pivoting tool 41 is either inactive or always puts a pivoting movement between the first transfer position 52 and the third transfer position 54 back. The Endschwenkwerkzeug 42 defines a pivoting path between the second transfer position 53 and the discharge position 56 or between the third transfer position 54 and the discharge position 56 depending on the operating mode. Evidently, it is possible depending on the structural conditions, the radii of different circles form differently. It would also be possible to integrate additional pivoting tools, so that the stroke between the two levels 7 and 47 is covered in several cornering movements. The intermediate deposition stations 40a, 40b arranged along the curved path could also be designed as pivoting tools which are capable of transporting a component away.

The functioning and arrangement of the first camera 10 and the lower second camera will be described below with reference to FIGS. 8 to 10. ra IIa described. The cameras are each arranged in an elongated camera housing 24 or 24 ', which projects into the turning circle of the primary tool 6 or the end pivot tool 42. In the first camera 10, the exit opening 29 is directed downwards against the plane 47 of the supply station. On the other hand, in the lower second camera IIa, the output port 29 'is directed upward against the delivery plane. Depending on the working position of the primary tool 6 arranged on the rotary arm 23 or of the end pivoting tool 42 arranged on the rotary arm 43, the image area 37 is completely released in each case for the corresponding camera.

In particular, it can be seen from FIG. 10 that, corresponding to the axes of rotation 13 and 44, the respective optical axes in the region of the exit openings of the cameras are arranged laterally offset from one another. In certain cases, it would also be conceivable that the axes of rotation 13 and 44 and thus also the optical axis are arranged in the region of the outlet opening on a common vertical axis.

The deposition process of a semiconductor chip is described below with reference to FIGS. 11a to 11b, in which the chip with the same support side is placed on the substrate with which it previously adhered to the wafer film (non-flip application). According to FIG. 6A, the rotary arm 23 is in a vertical position, in which the primary tool 6 detects a semiconductor chip from the storage station 5. At the same time the Endschwenkwerkzeug 42 passes an already preloaded chip in the deployment level 7 the secondary tool. 8

According to FIG. 1 b, the primary tool 6 and the end pivoting tool 42 each rotate in a clockwise direction towards each other, rend the secondary tool 8 on the carriage 15 is moved against the storage station 3. Before reaching the storage station, the actual position of the substrate 2 is determined with the third camera 12 on the carriage 16.

According to FIG. 11 c, the secondary tool 8 has reached its delivery position above the substrate 2. The primary tool 6 transfers its chip to the end pivoting tool 42 and at the same time the next chip 1 to be recorded on the supply station 5 is measured with the aid of the first camera 10.

According to FIG. Hd, the secondary tool 8 has deposited its chip on the substrate 2. The primary tool 6 has returned counterclockwise to its receiving position. Likewise, the Endschwenkwerkzeug 42 was pivoted back counterclockwise in its dispensing position.

Finally, Figure He shows the empty secondary tool 8 on its way back to receive a new chip. As shown, both the upper second camera Hb for determining the actual position of the chip on the end pivot tool 42 and the third camera 12 for determining the actual position of the substrate 2 can be actuated in an intermediate position. As soon as the secondary tool 8 has reached its starting position, the cycle begins again according to FIG. For reasons of better clarity, the unneeded lower second camera Ha and the intermediate pivoting tool 41 have been omitted in FIGS.

If it is desired to deposit the chip on the substrate with its structure side (flip-chip application), the device can be operated in another operating mode. In this case, the intermediate pivoting device 41 is actuated, as shown in FIGS. 12a to 12e can be seen. For reasons of better clarity, the upper second camera IIb not required in this operating mode has been omitted in these figures.

According to FIG. 12 a, a chip is received by the primary tool 6 at the storage station 5. At the same time, a chip is deposited on the substrate 2 at the storage station 3 by the secondary tool 8. The end pivoting tool 42 receives a preloaded chip from the intermediate pivoting tool 41. The different cameras are inactive.

According to FIG. 12b, the primary tool 6 with its picked-up chip has been pivoted counterclockwise to the first transfer position. Similarly, the Zwischenschwenkwerkzeug 41 was pivoted back counterclockwise to accommodate a new chip can. The Endschwenkwerkzeug has pivoted the previously loaded chip back into the dispensing position and also the secondary tool 8 has reached its original position in which it can accommodate a new chip. With the help of the third camera 12, the actual position of the newly to be loaded substrate 2 is measured at the discharge station 3.

According to FIG. 12 c, the chip is transferred to the secondary tool 8 at the end pivoting tool 42. The primary tool 6 remains in the first transfer position. As soon as, according to FIG. 12d, the end pivoting tool 42 swings back again, the actual position of the chip now fixed on the secondary tool 8 can be determined with the lower second camera IIa. At the same time, the actual position of the next chip to be picked up at the storage station 5 is determined with the first camera 10. The primary tool can transfer its previously loaded chip to the intermediate pivoting tool 41. Finally, according to FIG. 12e, the primary tool 6 can pivot back into its receiving position. Likewise, the pivoting tool 41 its previously loaded chip in the third transfer position and the secondary tool 8 has reached its dispensing position above the substrate 2. Subsequently, the cycle begins according to Figure 12a again.

Claims

claims 1. A method for depositing electronic components (1), in particular semiconductor chips, on a substrate (2) at a storage station (3), wherein the with a support side (4) to a supply station (5) resting component with a primary tool (6) on a is detected, picked up and transported by a rotary movement over the plane (47) of the storage station and wherein the component of at least one secondary tool (8) in a lying above the plane (47) of the storage station supply level (7 ), transported across the substrate and deposited there, characterized in that the path of the component between the plane (47) of the supply station and the supply plane (7) is covered in at least two separate ascending curved movements, wherein the primary tool (6) the component in a transfer position at least one pivoting tool (41, 42) passes. 2. The method according to claim 1, characterized in that the primary tool (6) the component (1) an intermediate Schwenkwerk- tool (41) passes, which detects the component on the support side (4) and after a pivoting movement a Endschwenkwerkzeug (42) passes which in turn grips the component on the structure side (17) and pivots it into the delivery plane (7), where it is transferred to the secondary tool (8), finally being deposited on the substrate (2) with the structure side (17). 3. The method according to claim 1, characterized in that the primary tool (6), the component (1) directly to a Endschwenk- Tool (42) passes, which detects the component on the support side (4) and pivots in the deployment plane (7) where it is the secondary tool (8), where it last again with the same support side (4) on the substrate ( 2) is discontinued. 4. The method according to claim 2 and claim 3, characterized in that the components in a first operating mode via the intermediate pivoting tool (41) and in a second operating mode directly to the Endschwenkwerkzeug (42) are transferred, wherein the pivoting movement of the primary tool (6) in the first or in the second operating mode, starting from the receptacle on the supply station, preferably runs on separate movement sections. 5. The method according to any one of claims 1 to 4, characterized in that the curve movements are part arc movements of which preferably two consecutive oppositely curved. 6. The method according to any one of claims 1 to 5, characterized in that the movement of the secondary tool (8) from the acquisition of the component extends linearly over the substrate. 7. The method according to any one of claims 1 to 6, characterized in that the transport of the component (1) from the supply station (5) extends to the substrate (2) substantially on an approximately vertical transport plane. 8. The method according to any one of claims 1 to 7, characterized in that the actual position of the component on the supply station (5) before recording with a first image recognition device (10) is determined and / or that the actual position of the Component in the deployment plane (7) before transport to the substrate with a second image recognition device (IIa, IIb) is determined, and / or that the actual position of the substrate (2) with a third image recognition device (12) is determined, with deviations between the determined Actual values and a predetermined desired position of the component to be corrected. 9. The method of claim 4 and claim 8, characterized in that the determination of the actual position of the component in the deployment plane (7) by the second image recognition device (IIa, IIb) in the first mode of operation from bottom to top against that held on the secondary tool (8) Component and in the second mode of operation from top to bottom against the Endschwenkwerkzeug (42) held component takes place. 10. The method according to claim 8 or claim 9, characterized in that the determination of the actual position with one of the image recognition devices always takes place when the primary tool (6) or the secondary tool (8) or the Endschwenkwerkzeug (42) the image field of to be determined actual position releases. 11. An apparatus for storing electronic components (1), in particular semiconductor chips, on a substrate (2) at a storage station (3) wherein the with a support side (4) to a supply station (5) resting component with a primary tool (6) a structural side facing away from the support side (17) is receivable and with which the component via the plane (47) of the storage station is transportable, wherein the component of at least one secondary tool (8) lying in a plane above the level (47) of the supply station deployment level ( 7) take over, over the substrate (2) transpor- tierbar and there deductible, characterized in that in the effective range of the primary tool (6) at least one pivoting tool (41,42) is arranged, to which a component in a transfer position from the primary tool (6) can be transferred, wherein the path of the component between the Level (47) of the supply station and the supply level (7) in at least two separate ascending curve movements zurücklegbar. 12. The device according to claim (11), characterized in that in the effective range of the primary tool (6) an intermediate pivoting tool (41) and in the effective range of Zwischenschwenkwerkzeugs a Endschwenkwerkzeug (42) is arranged and that of the primary tool (6) on the structural side (17) detected and raised component by the Zwischenschwenkwerkzeug on the support side (4) detectable and übergebar to the Endschwenkwerkzeug, the latter of the latter on the structure side (17) detectable and in the deployment plane (7) is pivotable so that it Secondary tool (8) can be detected and last with the structure side (17) on the substrate (2) is deductible. 13. The device according to claim (11), characterized in that in the effective range of the primary tool (6) a Endschwenkwerkzeug (42) is arranged and that of the primary tool (6) on the structure side (17) detected and raised component (1) by the Endschwenkwerkzeug on the support side (4) can be detected and in the deployment plane (7) is pivotable so that it can be detected by the secondary tool (8) and finally with the same bearing side (4) on the substrate (2) deductible. 14. The apparatus of claim 12 and claim 13, characterized in that both the Zwischenschwenkwerkzeug (41) and the Endschwenkwerkzeug (42) are arranged in the effective range of the primary tool (6), wherein the component (1) alternatively in a first operating mode on the Zwischenschwenkwerkzeug and in a second operating mode directly on the Endschwenkwerkzeug on the deployment plane (7) is transportable. 15. The device according to claim (14), characterized in that the primary tool (6) in the first operating mode in a first movement section from the receiving position at the supply station to the transfer position to the intermediate pivoting tool (41) and in the second operating mode in an adjacent second movement section of the receiving position at the supply station to the transfer position to the Endschwenkwerkzeug (42) is pivotable. 16. The device according to one of claims 11 to 15, characterized in that the primary tool (6) and the at least one pivoting tool (41,42) are pivotable such that a detected component performs a composite of circular arc sections curve movement. 17. Device according to one of claims 11 to 16, characterized in that the secondary tool (8) on a linearly displaceable carriage (15) is arranged. 18. Device according to one of claims 11 to 17, characterized in that the primary tool (6), the at least one pivoting tool (41,41) and the secondary tool (8) are movable substantially on a common, approximately vertical transport plane. 19. Device according to one of claims 11 to 18, characterized in that for the determination of the actual position of the component on the supply station (5) prior to recording, a first image recognition device (10) is provided, and / or that for determining the actual position of A second image recognition device (IIa, IIb) is provided in the delivery plane (7) prior to transport to the substrate, and / or that a third image recognition device (12) is provided for determining the actual position of the substrate (2) determined actual values and a predetermined desired position of the component are correctable. 20. The apparatus of claim 14 and claim 19, characterized in that for determining the actual position of the component in the deployment plane (7), the second image recognition device (IIa, IIb) for the first operating mode below the deployment level directed from bottom to top and for the second operating mode is arranged above the deployment level directed from top to bottom. 21. The device according to claim 20, characterized in that a respective second image recognition device (IIa, IIb) is arranged below and above the supply plane, which can be activated alternatively depending on the operating mode. 22. Device according to one of claims 19 to 21, characterized in that the image recognition means are positioned such that the image field of the actual position to be determined in at least one operating position of the primary tool (6), the at least one pivoting tool (41,42) and / or of the secondary tool (8) is completely detectable. 23. Device according to one of claims 20 or 21 and claim 22, characterized in that the first image recognition device (10) is arranged such that the detection of its associated image field from within the pivot range of the primary tool (6) takes place and that the second image recognition device (IIa) is arranged for the second operating mode such that the detection of the image field associated therewith takes place from within the pivoting range of the end pivoting tool (42). 24. Device according to one of claims 19 to 23, characterized in that the first and the second image recognition device or their optical axes are arranged in the region of the output opening on mutually offset vertical axes. 25. Device according to one of claims 19 to 24, characterized in that the third image recognition device (12) on a linearly displaceable carriage (16) is arranged. 26. Device according to one of claims 11 to 25, characterized in that the storage station (3) is designed as a feed system for the preferably linear passage of a plurality of substrates. 27. Device according to one of claims 11 to 26, characterized in that next to the supply station (5) a wafer cassette (27) is arranged with a plurality of wafers, which is movable for loading wafers on the storage station in different loading positions, in which the supply station can be loaded and unloaded from the wafer cassette with a wafer, and that the wafer cassette can be moved to a rest position, in which the supply station for executing a loaded wafer is at least partially displaceable over the wafer cassette in the horizontal working plane. 28. Device according to one of claims 11 to 27, characterized in that in the effective range of the primary tool (6) and / or the at least one pivoting tool (41,42) one or more intermediate storage stations (40a, 40b) are arranged, on which a component before the transfer to the secondary tool (8) is temporarily stored.