[go: up one dir, main page]

WO2006104078A1 - Film d’étanchéité d’élément électroluminescent organique et structure d’étanchéité d’élément électroluminescent organique - Google Patents

Film d’étanchéité d’élément électroluminescent organique et structure d’étanchéité d’élément électroluminescent organique Download PDF

Info

Publication number
WO2006104078A1
WO2006104078A1 PCT/JP2006/306099 JP2006306099W WO2006104078A1 WO 2006104078 A1 WO2006104078 A1 WO 2006104078A1 JP 2006306099 W JP2006306099 W JP 2006306099W WO 2006104078 A1 WO2006104078 A1 WO 2006104078A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
film
organic
molecular weight
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/306099
Other languages
English (en)
Japanese (ja)
Inventor
Kenichi Horie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ThreeBond Co Ltd
Original Assignee
ThreeBond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ThreeBond Co Ltd filed Critical ThreeBond Co Ltd
Priority to JP2007510477A priority Critical patent/JP4941295B2/ja
Publication of WO2006104078A1 publication Critical patent/WO2006104078A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present invention relates to a film for sealing an organic EL element that emits light with high brightness by application of an electric field, and more specifically, an organic EL element formed on a substrate in order to protect the organic EL element from moisture and the like
  • the present invention relates to a film-like sealing material formed on the entire surface of the film, and an organic EL element sealing structure using the sealing material.
  • An organic EL element is a polycrystalline semiconductor device that can be used for a backlight of a liquid crystal because it can emit light with high luminance at a low voltage, and is expected to be a thin flat display device.
  • the organic EL element has a very weak moisture interface, the interface between the metal electrode and the organic EL element layer is peeled off due to the influence of moisture, the metal becomes highly resistive due to oxidation, and the organic substance itself of the organic EL element is moisture. As a result, the light emission stops or the brightness decreases.
  • organic EL elements are integrated with a sealing substrate such as glass by using a thermosetting epoxy resin to isolate them from external factors such as water.
  • No. 2002-216950 was developed. This method has the drawbacks that it is difficult to deal with thin films because it requires the pasting of glass substrates, and that it is difficult to deal with the increase in size and film.
  • sealing with a single inorganic film layer has been proposed, but there are problems such as adhesion of the single inorganic film layer and generation of pinholes. Furthermore, a laminated structure of inorganic / organic layers is deposited In addition, a sealing method for forming on an organic EL element has been proposed, and the process is complicated because of the use of a vapor deposition process.
  • gas barrier films having an organic / inorganic multilayer structure have also been proposed, all of which are proposals as substrate films, and the organic layer is made of acrylic (Japanese Patent Laid-Open No. 2004-244606, Kaihei 10-119170) or polyparaxylylene (Japanese Patent Laid-Open No. 2003-109748), which is not sufficient in terms of adhesive strength to organic EL elements and reliability.
  • many sealing methods using an adhesive or an inorganic film have been proposed. However, the sealing performance, cost, etc. when considering thinning, upsizing, and filming of an organic EL element are reduced. Therefore, it cannot be a sufficient sealing means.
  • Patent Document 1 JP 2002-216950 A
  • Patent Document 2 Japanese Patent Laid-Open No. 2001-283645
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2004-139977
  • Patent Document 4 Japanese Patent Application Laid-Open No. 2004-244606
  • Patent Document 5 JP-A-10-119170
  • Patent Document 6 Japanese Unexamined Patent Publication No. 2003-109748
  • the present invention solves the above-mentioned problems of the prior art, can be sealed without adversely affecting the organic EL element by a simple process, and the organic EL display is made thin, large, and film.
  • the purpose is to provide a film-like encapsulant for encapsulating organic EL elements.
  • the epoxy resin layer 1, the inorganic film layer, and the epoxy are formed on the base film.
  • an organic EL device sealing film in which resin layers 2 are sequentially laminated.
  • the film for sealing an organic EL element of the present invention is a film formed in a separate process from an organic EL element, unlike a conventional sealing film that has already been cross-linked and does not have re-fusing properties, but is heated.
  • the film of the present invention has a structure of an organic layer, an inorganic layer, and an organic layer.
  • the sealing film of the present invention can be sealed by a simple process in which a separately manufactured organic EL element is thermocompression bonded and adhered to the surface irregularities of the organic EL element by melting and crosslinking. That is, according to the present invention, the above-mentioned problems are solved, and the organic EL display can be made thinner, larger and made into a film.
  • sealing film of the present invention it is possible to form a sealing layer on the entire surface of the organic EL element without strict humidity control, and to easily manufacture a device including the organic EL element.
  • the present invention is a film for sealing an organic EL element having an epoxy resin layer 1, an inorganic film layer, and an epoxy resin layer 2 sequentially laminated on a base film, the epoxy resin
  • the epoxy resin composition forming the layer 1 and / or the epoxy resin layer 2 includes a low molecular weight epoxy resin having a molecular weight of 200 to 2,000 and a high molecular weight epoxy resin having a molecular weight of 20,000 to 100,000.
  • the organic EL device sealing film wherein the low molecular weight epoxy resin and the high molecular weight epoxy resin can be cured.
  • the present invention is a low molecular weight epoxy resin having a molecular weight of 200 to 2,000 having at least two glycidyl groups in one molecule, and the high molecular weight epoxy resin is in one molecule.
  • the organic EL device sealing film is a high molecular weight epoxy resin having a molecular weight of 20,000-100,000 and having at least two glycidinole groups.
  • the present invention provides the latent imidazole compound, wherein the epoxy resin composition forming the epoxy resin layer 1 and Z or the epoxy resin layer 2 further has a melting point or decomposition temperature of 80 ° C or higher. And a film for sealing the organic EL device, comprising a silane coupling agent.
  • the entire surface of the organic EL element formed on the glass or film substrate is An organic EL element sealing structure sealed with the organic EL element sealing film is provided.
  • the organic EL device sealing structure is formed on a glass or plastic film substrate after forming an organic EL device layer comprising a transparent electrode, a hole transport layer, an organic EL device layer and a back electrode.
  • the sealing film of the present invention is bonded together, and the epoxy resin layers 1 and 2 are further thermally cured. Even if the base film of the organic EL device sealing film of the present invention is used as a release film and peeled before or after thermosetting, the sealing performance is not particularly affected. Further, after the release film is peeled off before thermosetting, it can be sealed with another glass substrate or metal substrate while being heated.
  • the gas barrier property can be easily applied to the organic EL element. High sealing can be performed, and the progress of deterioration of the organic EL element can be greatly suppressed.
  • the film for sealing an organic EL device of the present invention can be applied to a flexible organic EL by forming an epoxy resin on both upper and lower sides of the inorganic film.
  • the base film by using a peelable film as the base film, it is possible to peel off the release film and bond it to another film (thin plate) substrate before curing the epoxy resin layer. It becomes. Furthermore, by making the base film transparent, it is possible to correspond to a top emission structure.
  • thermosetting composition mainly composed of high molecular weight epoxy resin, low molecular weight epoxy resin, imidazole epoxy curing agent and silane coupling agent.
  • the sealing structure of the organic EL element in the present invention is manufactured as follows. First, a transparent electrode is formed on a glass or film substrate with a thickness of about 0.1 lxm. Formation of the transparent electrode
  • the film can be formed by a method such as vacuum deposition and sputtering. However, the film formation by vacuum deposition may cause crystal grains to grow and reduce the smoothness of the film surface. When applied to a thin film EL, the dielectric breakdown film causes non-uniform light emission. Need attention. On the other hand, the film formation by the sputtering has good surface smoothness, and favorable results are obtained when a thin film device is laminated thereon.
  • a hole transport layer and an organic EL element layer are formed on the transparent electrode at a thickness of 0.01 ⁇ m to 0.10 ⁇ m, preferably 0.03 ⁇ m to 0.07 ⁇ m.
  • ⁇ Preferably deposited sequentially with a thickness of 0.05 zm.
  • a back electrode is formed on the organic EL element layer with a thickness of 0.:! To 0.3 zm.
  • the organic EL device sealing film of the present invention is bonded to the upper part of the glass or film substrate on which these devices have been formed, using a roll laminator or the like.
  • the thickness of the base film is preferably about 25 to 200 zm.
  • the inorganic film layer is set to 1 111 to 15/1 111, preferably 5 / im to 15 ⁇ , particularly preferably 5 ⁇ ⁇ to 10 ⁇ m. If an organic film of about 5 ⁇ m is formed directly on the organic EL element substrate or sealing film, cracks may occur due to stress. However, by forming an epoxy resin layer on both the upper and lower sides. It becomes a buffer material and can suppress the occurrence of cracks.
  • the thickness of each of the epoxy resin layers 1 and 2 is 5 to 30 / im, particularly 5 to 20 ⁇ , considering transfer workability and the like.
  • the organic EL element sealing film preferably has a total thickness of 36 ⁇ m to 250 ⁇ m.
  • the organic EL element sealing film of the present invention is pressure-bonded onto an organic EL element produced in a separate process using a pressure bonding apparatus such as a vacuum laminator or a roll laminator. At that time, by heating to an appropriate temperature, for example, 50 to 100 ° C., the epoxy resin layer softens and develops fluidity, easily deforms due to pressure stress, and matches the surface shape of the organic EL element. The ability to adhere is S.
  • the heat treatment is performed continuously or by raising the heating temperature, whereby the low molecular weight epoxy resin group and the glycidyl group of the high molecular weight epoxy resin cause a three-dimensional cross-linking reaction in the epoxy resin layer. Hardens. Once three-dimensionally cross-linked epoxy resin is no longer meltable and exhibits strong adhesive strength.
  • the melting temperature (flowing temperature) and the curing temperature (crosslinking reaction temperature) of the epoxy resin composition can be adjusted by the composition of the epoxy resin composition. That is, the melting temperature can be adjusted according to the molecular weight and addition amount of the high molecular weight epoxy resin used, the molecular weight and structure of the low molecular weight epoxy, the addition amount, and the type and amount of filler such as silica powder. it can. For example, it can be adjusted so that it does not have fluidity at 25 ° C at room temperature and exhibits fluidity at 50 ° C to 100 ° C.
  • the expression of the fluidity means that the epoxy resin composition forming the epoxy resin layers 1 and 2 does not have a viscosity that flows out drastically, and the resin composition enters the uneven space of the organic EL element due to stress. It means that some degree of flexibility occurs.
  • the curing temperature can be adjusted mainly by the type and amount of the curing agent in the composition.
  • the “latent curing agent” used in the present specification is stable for a long period of time when it is kept at room temperature when it is blended in the epoxy resin composition, but it rapidly cures under predetermined conditions such as heating. Means a curing agent that begins. By using the latent curing agent, a one-component heat-curable epoxy resin composition can be obtained.
  • Such latent curing agents include dicyandiamide, diaminodiphenylsulfone, polyhydric phenol, imidazole, and the like, and imidazole compounds that initiate a curing reaction at a relatively low temperature are particularly preferable.
  • the epoxy resin layers 1 and 2 are particularly limited as long as they are latent imidazole compounds that can be cured by heating, are solid at room temperature, and have a melting point or decomposition temperature of 80 ° C or higher. It can be used as a latent curing agent.
  • Examples of the imidazole compound include 2_methylimidazole, 2_heptadecylimidazole, 2_phenylimidazole, 2_phenylimidazole, 4-methylimidazole, and 1-cyanoethyl-2-phenylimidazole.
  • Examples of the commercially available imidazole compounds include Amicure PN_23, PN-R (Ajinomoto Co., Inc.), Ade force Hardener EH-4346S (Asahi Denka Kogyo Co., Ltd.), Nova Cure HX_ 3721, Novaki Yua HX-3921HP (manufactured by Asahi Kasei Corporation) and the like.
  • a release film such as a polyethylene terephthalate film can be used as the base film, and the release film is peeled off and removed before or after the epoxy resin layers 1 and 2 are thermally cured.
  • the sealing performance is not affected.
  • the release film is removed before thermosetting, and a glass substrate is further bonded onto the sealing film of the present invention, or a metal substrate is bonded for the purpose of heat dissipation, and then the epoxy resin layer is formed by heat treatment. It can also be cured.
  • a minimum inorganic film having a thickness of, for example, about 100 to 200 nm is formed on the organic EL element substrate, and then the organic EL sealing of the present invention is performed. It can also be sealed with a film.
  • the cured product of the epoxy resin composition forming the epoxy resin layer 1 and / or 2 of the present invention has a moisture permeability S at a thickness of 150 zm of the cured product layer in an atmosphere of 95% humidity at 60 ° C. 500mgZm 2 X 24 hours or less, and the light transmittance of 405 ⁇ m is 90% or more for the 20 ⁇ m thickness of the cured product layer. It is preferable to have the above adhesive strength. Furthermore, the epoxy resin composition is preferably cured at a relatively low temperature of 120 ° C. or lower.
  • the epoxy resin composition for forming the epoxy resin layer 1 and the epoxy resin layer 2 of the present invention is a polymerizable composition containing a compound having a polymerizable glycidinole group in the molecule.
  • the composition as a whole must be solid at room temperature (25 ° C.).
  • Such a composition is preferably prepared by mixing a low molecular weight epoxy resin having a molecular weight of 200 to 2,000 and a high molecular weight epoxy resin having a molecular weight of 20,000 to 100,000.
  • a filler such as silica powder is added to an epoxy resin that is liquid at room temperature, or a high molecular polymer that is compatible with epoxy resin is dissolved so that it becomes an apparent solid at room temperature. May be.
  • the high molecular weight epoxy resin having a molecular weight of 20,000-100,000 used for forming the epoxy resin layer 1 and Z or 2 of the present invention is solid at room temperature, preferably 1 minute. It has at least two or more glycidinole groups in the child.
  • Specific examples include epoxy resins such as solid bisphenol A type epoxy resin, solid bisphenol F type epoxy resin, and phenoxy resin. Among these, a phenoxy resin having a film strength when the epoxy resin layers 1 and 2 are laminated in an unreacted state is preferable.
  • Examples of commercially available high molecular weight epoxy resins include Epicoat 1256 (manufactured by Japan Epoxy Resin), PKHH (INCHEM), and YP-70 (manufactured by Toto Kasei).
  • a low molecular weight epoxy resin is added.
  • a compound having a molecular weight of less than 2,000, particularly a molecular weight of 200 to 2,000 and having one or more glycidyl groups in the molecule is preferred.
  • Specific preferred examples include epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol type epoxy resin, and phenol novolac type resin.
  • those having a low chlorine ion content particularly those having hydrolyzable chlorine of 500 ppm or less are preferred.
  • Epiclone EXA_ 835LV produced by Dainippon Ink Industries, Ltd.
  • Nephepicoat 152 produced by Japan Epoxy Resin Co., Ltd.
  • the mixing ratio of the high molecular weight epoxy resin and the low molecular weight epoxy resin is such that the high molecular weight epoxy resin is 40 to 150 parts by weight with respect to 100 parts by weight of the low molecular weight epoxy resin. In particular, it is preferable to add 50 to 100 parts by weight. If the high molecular weight epoxy resin is less than 40 parts by weight, a film cannot be formed when formed into a sheet, whereas if it exceeds 150 parts by weight, the film of the sheet becomes hard and brittle, workability is deteriorated, and crosslinking is performed. Density is low and reliability is difficult to maintain.
  • the amount of the curing agent component added is 0.5 to 20 parts by weight, particularly 1.5 to 5 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin compound in consideration of storage stability, curability, and transmittance. : It is preferable to add 10 parts by weight. If the curing agent is added in an amount of less than 0.5 parts by weight, the epoxy resin compound cannot be sufficiently cured, while if it exceeds 20 parts by weight, the cured product becomes highly colored, and further, Stability after forming into a film is deteriorated.
  • silane coupling agent examples include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3 glycidoxypropylmethyldimethoxysilane, 2- (3,4 epoxycyclohexane Hexyl) ethyltrimethoxysilane, N-phenyl-1-yaminopropyltrimethoxysilane, N— (2 aminoethyl) 3 aminopropylmethyldimethoxysilane, N— (2 aminoethyl) 3 aminopropylmethyltrimethoxysilane , 3 aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, butyltrimethoxysilane, N- (2 (bibenzylbenzylamino)
  • silane coupling agents 3 glycidoxypropyltrimethoxysilane (KBM-403: manufactured by Shin-Etsu Chemical Co., Ltd.) is preferable because of its good compatibility with the epoxy resin composition and excellent stability.
  • the addition amount of the silane coupling agent is preferably 0.1 to 10 parts by weight, more preferably 0.3 to 2 parts by weight, based on 100 parts by weight of the total amount of the epoxy resin composition. If the amount of the silane coupling agent is less than 0.1 parts by weight, the effect cannot be exerted. On the other hand, if the amount exceeds 10 parts by weight, there may be an adverse effect in terms of gas.
  • the epoxy resin composition used for forming the epoxy resin layers 1 and 2 of the present invention has other components such as a storage stabilizer, a plasticizer, and the like as long as the object of the present invention can be achieved.
  • a tack adjuster or the like can also be added.
  • An inorganic film layer is formed between the epoxy resin layers 1 and 2 of the present invention.
  • the inorganic film layer is formed of at least one inorganic compound selected from the group consisting of silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, tin oxide, indium tin oxide (ITO) and silicon nitride. Is done.
  • As a method for forming the inorganic film layer sputtering, CVD, vapor deposition, or the like can be used.
  • the inorganic film since the inorganic film is formed on the epoxy resin layer 1 in an uncured state, the inorganic film can be formed at a low temperature in a short time, and the gas barrier performance is ensured. In order to achieve this, it is necessary to obtain a sufficient film thickness of at least m. Therefore, in the present invention, an inorganic film containing silicon oxide formed by low-temperature CVD is preferable.
  • a solution obtained by dissolving and mixing a solid epoxy resin composition in an organic solvent such as methyl ketone and toluene at room temperature for forming the epoxy resin layer 1 or 2 is prepared.
  • the solution includes a curing agent and, if necessary, an additive.
  • it is applied on the base film so as to have a constant thickness by a coating machine such as a roll coater, and then the organic solvent is volatilized to form a solid sheet, film, or tape at room temperature (about 25 ° C). Form into form.
  • an inorganic film layer is formed on the epoxy resin layer 1 formed on the substrate film by an appropriate forming method, for example, low temperature CVD (FIG. 2).
  • the low temperature CVD is preferably performed at a temperature of 80 ° C or lower.
  • an epoxy resin layer 2 is formed on a base film (transparent film, release film) in the same manner as described above (FIG. 2).
  • the epoxy resin layer 2 may be composed of the same composition as the epoxy resin layer 1, or an epoxy resin composition having a different composition may be used as necessary. Since the epoxy resin layers 1 and 2 are formed so that either of them covers the entire surface of the organic EL element layer, it is necessary to consider that the organic EL element layer is not affected.
  • an organic EL element sealing film is formed ( Figure 2).
  • Film for sealing organic EL element of the present invention Can be stored for a long time at low temperatures by forming the epoxy resin layers 1 and 2 in a solid state at room temperature, but it can be stored with a desiccant such as silica gel in order to keep the moisture content below a certain level. preferable.
  • Epoxy resin compositions for forming the epoxy resin layers 1 and 2 were prepared at the blending ratios shown in Table 1. The contents of each component shown in Table 1 are as follows.
  • PKHH Phenoxy resin Molecular weight: approx. 52,000 (Made by INCEM)
  • KBM403 Silane coupling agent (Shin-Etsu Chemical Co., Ltd.)
  • composition 1 (1 6X-082E-7B (manufactured by ThreeBond Co., Ltd .: product name) shown in Table 1 to a thickness of 20 ⁇ m, 40 ° C was dried to produce a sheet-like substrate A on which the epoxy resin layer 1 was formed, and then the composition 1 was coated on the release film by the same method as described above and dried at 40 ° C. Then, a sheet-like film B on which the epoxy resin layer 2 was formed was prepared.
  • an inorganic film was further deposited on the surface of the epoxy resin layer of the sheet-like substrate A.
  • the inorganic film was a 5 ⁇ m thick silicon oxide film using SMARTWEB manufactured by Applied Films.
  • the inorganic film layer of the sheet-like substrate A and the epoxy resin layer of the sheet-like film B were combined and bonded at 60 ° C using a roll laminator.
  • the temperature at 60 ° C. was a temperature at which the epoxy resin layers 1 and 2 exhibited fluidity and did not cure by polymerization.
  • the epoxy resin layer 1, the inorganic film layer, and the epoxy resin layer 2 were uniformly laminated.
  • a sheet-like substrate (PET film) / epoxy resin layer 1 / inorganic film layer (Si Ox) / epoxy resin layer 2 / release film was formed in this way.
  • a transparent electrode, a hole transport layer, an organic EL layer, and a back electrode were formed on a glass substrate to form an organic EL element.
  • Sealing made in Example 1 on the organic EL element The film for the application was bonded.
  • the release film of the sealing film was peeled off, and the epoxy resin layer 2 and the organic EL element were placed so as to face each other, and pressure-bonded at 90 ° C. with a roll laminator. Thereafter, the epoxy resin layers 1 and 2 were crosslinked and cured by heating at 110 ° C. for 1 hour.
  • an organic EL element sealing structure organic EL light emitting body sealed with the sealing film could be obtained.
  • a sealing film was prepared using the epoxy resin compositions 2 to 7 shown in Table 1 by the same procedure, and bonded to the organic EL device in the same manner. However, each was processed at the crimping temperature and heating temperature shown in Table 1.
  • the obtained organic EL phosphor was continuously lit in a high temperature and high humidity environment (60 ° C. ⁇ 90% RH), and the light emission state after 100 hours and after 1000 hours was observed.
  • the light emission state is obtained by measuring the average value of the width of the dark area from the edge of the light emission area. The results are shown in the lower part of Table 1. The unit is ⁇ m.
  • Silicon oxide which is an inorganic film, was directly deposited on the sheet substrate (PET) in the same manner as in Example 1 using SMARTWEB manufactured by Applied Films. Further, in the same manner as in Example 1, a sheet-like film was prepared by coating composition 1 on a release film to form an epoxy resin layer. Subsequently, both were bonded in the same manner to form a sheet-like substrate (PET) / inorganic film layer (SiOx) / epoxy resin layer (composition 1) / release film sealing film. Using the sealing film, an organic EL light emitter was prepared in the same manner as in Example 1. Similarly, a continuous lighting experiment was performed under high temperature and high humidity. The average width was measured.
  • composition 1 shown in the table was uniformly applied to a sheet-like substrate (PET) to a thickness of 20 zm and dried at 40 ° C. to prepare a sheet-like substrate A on which an epoxy resin layer 1 was formed.
  • composition 1 was applied onto the release film in the same manner as described above, and dried at 40 ° C. to prepare sheet-like film B in which epoxy resin layer 2 was formed.
  • Comparative Example 1 shows that when the epoxy resin layer 1 is provided only on one side of the inorganic film layer and the epoxy resin layer 2 is missing, the organic EL element cannot be sufficiently sealed. In addition, Comparative Example 2 showed that the organic EL element was not sufficiently sealed when the inorganic film layer was missing.
  • the organic EL element film of the present invention has a sufficient gas barrier property while being sealed with a thin film, and can be sealed with a simple process.
  • the thin film is preferably 250 ⁇ or less.
  • the organic EL device sealing film of the present invention is not limited to organic EL device sealing, but is used for sealing purposes for the purpose of improving moisture resistance, weather resistance, and impact resistance of organic semiconductors and other electronic components. Yes.
  • FIG. 1 is a cross-sectional view of a film for an organic EL device of Example 1.
  • FIG. 2 is an explanatory view showing a production process of a film for organic EL elements.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un film d’étanchéité d’élément électroluminescent organique pour étanchéifier par un procédé simple et permettre à un affichage électroluminescent organique d’être fin, large et mis sous forme de film sans affecter l’élément électroluminescent organique. La surface entière de l’élément électroluminescent organique formé sur un substrat est étanchéifiée en utilisant le film d’étanchéité d’élément électroluminescent organique comprenant une couche de résine époxy (1), une couche de film inorganique et une couche de résine époxy (2) qui sont stratifiées successivement sur un film de base.
PCT/JP2006/306099 2005-03-29 2006-03-27 Film d’étanchéité d’élément électroluminescent organique et structure d’étanchéité d’élément électroluminescent organique Ceased WO2006104078A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007510477A JP4941295B2 (ja) 2005-03-29 2006-03-27 有機ｅｌ素子封止用フィルム及び有機ｅｌ素子の封止構造体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-094259 2005-03-29
JP2005094259 2005-03-29

Publications (1)

Publication Number Publication Date
WO2006104078A1 true WO2006104078A1 (fr) 2006-10-05

Family

ID=37053336

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/306099 Ceased WO2006104078A1 (fr) 2005-03-29 2006-03-27 Film d’étanchéité d’élément électroluminescent organique et structure d’étanchéité d’élément électroluminescent organique

Country Status (3)

Country Link
JP (1) JP4941295B2 (fr)
TW (1) TWI407611B (fr)
WO (1) WO2006104078A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009070798A (ja) * 2007-08-21 2009-04-02 Fujifilm Corp 表示素子
JP2009070795A (ja) * 2007-08-22 2009-04-02 Fujifilm Corp 表示素子の封止方法およびガスバリアフィルムで封止された表示素子の製造方法
WO2011027815A1 (fr) 2009-09-04 2011-03-10 株式会社スリーボンド Organe d'étanchéité d'élément électroluminescent organique
WO2015072350A1 (fr) * 2013-11-15 2015-05-21 日東電工株式会社 Composition de résine photodurcissable et feuille de composition de résine photodurcissable obtenue en l'utilisant
WO2015098852A1 (fr) * 2013-12-26 2015-07-02 日東電工株式会社 Procédé de production de dispositif à composants électroniques et feuille de scellage de composant électronique
JP2020152050A (ja) * 2019-03-22 2020-09-24 三菱ケミカル株式会社 積層シート
KR20230027195A (ko) 2020-10-13 2023-02-27 미쓰이 가가쿠 가부시키가이샤 표시 소자 봉지재, 유기 el 소자 봉지재 및 표시 소자 봉지 시트

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5467792B2 (ja) * 2008-04-24 2014-04-09 日東電工株式会社 可撓性基板
CN107994131A (zh) * 2017-11-28 2018-05-04 武汉华星光电半导体显示技术有限公司 用于封装oled器件的封装结构、显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6441192A (en) * 1987-08-07 1989-02-13 Alps Electric Co Ltd Thin film electroluminescent display element
JPH09143244A (ja) * 1995-11-20 1997-06-03 Mitsubishi Rayon Co Ltd 複合材料用エポキシ樹脂組成物
JP2000068050A (ja) * 1998-08-24 2000-03-03 Casio Comput Co Ltd 電界発光素子及びその製造方法
JP2003301148A (ja) * 2002-04-10 2003-10-21 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造方法
JP2005060584A (ja) * 2003-08-18 2005-03-10 Hitachi Chem Co Ltd 封止用フィルム
JP2006179318A (ja) * 2004-12-22 2006-07-06 Three Bond Co Ltd 有機ｅｌ素子封止用熱硬化型組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6441192A (en) * 1987-08-07 1989-02-13 Alps Electric Co Ltd Thin film electroluminescent display element
JPH09143244A (ja) * 1995-11-20 1997-06-03 Mitsubishi Rayon Co Ltd 複合材料用エポキシ樹脂組成物
JP2000068050A (ja) * 1998-08-24 2000-03-03 Casio Comput Co Ltd 電界発光素子及びその製造方法
JP2003301148A (ja) * 2002-04-10 2003-10-21 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造方法
JP2005060584A (ja) * 2003-08-18 2005-03-10 Hitachi Chem Co Ltd 封止用フィルム
JP2006179318A (ja) * 2004-12-22 2006-07-06 Three Bond Co Ltd 有機ｅｌ素子封止用熱硬化型組成物

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009070798A (ja) * 2007-08-21 2009-04-02 Fujifilm Corp 表示素子
JP2009070795A (ja) * 2007-08-22 2009-04-02 Fujifilm Corp 表示素子の封止方法およびガスバリアフィルムで封止された表示素子の製造方法
WO2011027815A1 (fr) 2009-09-04 2011-03-10 株式会社スリーボンド Organe d'étanchéité d'élément électroluminescent organique
JPWO2011027815A1 (ja) * 2009-09-04 2013-02-04 株式会社スリーボンド 有機ｅｌ素子封止部材
EP2475223A4 (fr) * 2009-09-04 2015-09-16 Threebond Fine Chemical Co Ltd Organe d'étanchéité d'élément électroluminescent organique
WO2015072350A1 (fr) * 2013-11-15 2015-05-21 日東電工株式会社 Composition de résine photodurcissable et feuille de composition de résine photodurcissable obtenue en l'utilisant
JP2015096571A (ja) * 2013-11-15 2015-05-21 日東電工株式会社 光硬化性樹脂組成物およびそれを用いてなる光硬化性樹脂組成物製シート
WO2015098852A1 (fr) * 2013-12-26 2015-07-02 日東電工株式会社 Procédé de production de dispositif à composants électroniques et feuille de scellage de composant électronique
JP2020152050A (ja) * 2019-03-22 2020-09-24 三菱ケミカル株式会社 積層シート
JP7318252B2 (ja) 2019-03-22 2023-08-01 三菱ケミカル株式会社 積層シート
KR20230027195A (ko) 2020-10-13 2023-02-27 미쓰이 가가쿠 가부시키가이샤 표시 소자 봉지재, 유기 el 소자 봉지재 및 표시 소자 봉지 시트

Also Published As

Publication number Publication date
JP4941295B2 (ja) 2012-05-30
TW200711195A (en) 2007-03-16
JPWO2006104078A1 (ja) 2008-09-04
TWI407611B (zh) 2013-09-01

Similar Documents

Publication Publication Date Title
JP5991789B2 (ja) 接着フィルム
CN104488107B (zh) 粘合膜以及使用该粘合膜的有机电子装置的封装方法
JP6001606B2 (ja) 接着フィルム及びこれを利用した有機電子装置の封止方法
KR101651331B1 (ko) 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법
EP2781570B1 (fr) Procédé de fabrication de dispositif électronique
JP5696038B2 (ja) 封止用組成物および封止用シート
KR101408603B1 (ko) 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
CN101243117A (zh) 有机el组件密封用热硬化型组合物
JP2015504579A (ja) 有機電子装置封止用光硬化型粘接着フィルム、有機電子装置及びその封止方法
JP6105063B2 (ja) 接着フィルム及びこれを利用した有機電子装置の封止製品
JP2015512960A (ja) 接着フィルム
KR101404361B1 (ko) 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
WO2006104078A1 (fr) Film d’étanchéité d’élément électroluminescent organique et structure d’étanchéité d’élément électroluminescent organique
KR101374369B1 (ko) 유기 ｅｌ 디스플레이 장치 및 이에 포함되는 유기 ｅｌ 소자 봉지용 접착제 조성물

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2007510477

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: RU

122 Ep: pct application non-entry in european phase

Ref document number: 06730047

Country of ref document: EP

Kind code of ref document: A1