[go: up one dir, main page]

WO2006000549A8 - Laser machining device for drilling holes into a workpiece comprising an optical deflecting device and a diverting unit - Google Patents

Laser machining device for drilling holes into a workpiece comprising an optical deflecting device and a diverting unit

Info

Publication number
WO2006000549A8
WO2006000549A8 PCT/EP2005/052866 EP2005052866W WO2006000549A8 WO 2006000549 A8 WO2006000549 A8 WO 2006000549A8 EP 2005052866 W EP2005052866 W EP 2005052866W WO 2006000549 A8 WO2006000549 A8 WO 2006000549A8
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
laser
workpiece
diverting unit
rotation axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/052866
Other languages
German (de)
French (fr)
Other versions
WO2006000549A1 (en
Inventor
Hans Juergen Mayer
Uwe Metka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of WO2006000549A1 publication Critical patent/WO2006000549A1/en
Publication of WO2006000549A8 publication Critical patent/WO2006000549A8/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to a laser machining device (100) for drilling holes into a workpiece, particularly into an electronic circuit substrate (150), which comprises: a laser source (110) provided for emitting a laser beam (111); a diverting unit (130) for directing the laser beam (121) to a defined drilling position (154) on the circuit substrate (150), and; a projection lens (140) for focussing the laser beam (141) on the circuit substrate (150). The laser machining device also comprises an optical deflecting device (120), which is situated between the laser source and the diverting unit, serves to carry out the periodic two-dimensional diversion of a laser beam, and which has an optical element and a rotary actuator. The optical element is mounted in a manner that enables it to rotate about a rotation axis and has a planar boundary surface whose normal to the surface is oriented at an angle to the rotation axis and which is such that, when a laser beam impinges thereupon, it deflects this laser beam from its original direction. The rotary actuator is designed for continuously rotating the optical element about the rotation axis.
PCT/EP2005/052866 2004-06-29 2005-06-21 Laser machining device for drilling holes into a workpiece comprising an optical deflecting device and a diverting unit Ceased WO2006000549A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004031405 2004-06-29
DE102004031405.5 2004-06-29

Publications (2)

Publication Number Publication Date
WO2006000549A1 WO2006000549A1 (en) 2006-01-05
WO2006000549A8 true WO2006000549A8 (en) 2006-03-09

Family

ID=35159905

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/052866 Ceased WO2006000549A1 (en) 2004-06-29 2005-06-21 Laser machining device for drilling holes into a workpiece comprising an optical deflecting device and a diverting unit

Country Status (1)

Country Link
WO (1) WO2006000549A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053268B4 (en) * 2006-11-06 2023-07-06 Universität Stuttgart Device for generating a laser radiation field with an intensity profile rotating about an axis
CN101856772A (en) * 2010-05-27 2010-10-13 张立国 Light beam-rotating galvanometer-scanning focused processing system
CN102773605B (en) * 2012-08-11 2016-02-03 张立国 A kind of rotary light beam module group laser motion tracking control system
CN103203552B (en) * 2012-10-12 2015-10-07 张立国 A kind of large format micropore high speed drilling system
CN103706946B (en) * 2013-12-03 2016-09-07 张立国 A kind of laser beam splitter vibration mirror scanning processing unit (plant)
CN103658975B (en) * 2013-12-03 2017-02-15 张立国 Laser beam splitting and processing device
CN110977159A (en) * 2019-09-17 2020-04-10 苏州肯美特设备集成有限公司 A kind of laser light path component forming annular light spot

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725709A (en) * 1984-09-25 1988-02-16 Siemens Aktiengesellschaft Apparatus having a sweep arrangement for non-contacting modification of an article
JP2588281Y2 (en) * 1992-11-25 1999-01-06 株式会社小松製作所 Laser marking device
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US6804269B2 (en) * 2001-06-19 2004-10-12 Hitachi Via Mechanics, Ltd. Laser beam delivery system with trepanning module
DE10317363B3 (en) * 2003-04-15 2004-08-26 Siemens Ag Laser-powered hole boring machine for manufacture of substrates for electrical switching circuits has scanning system with oscillating mirrors and focusing lens

Also Published As

Publication number Publication date
WO2006000549A1 (en) 2006-01-05

Similar Documents

Publication Publication Date Title
CN101393399B (en) Laser direct imaging apparatus
US8040520B2 (en) Device for detecting the edges of a workpiece, and a laser beam processing machine
US8288684B2 (en) Laser micro-machining system with post-scan lens deflection
US9843155B2 (en) Method and apparatus for forming fine scale structures in dielectric substrate
KR19980086495A (en) Laser beam machining device using multiple galvanos scanners
JP2007253203A (en) Optical device for laser processing
JP2019025539A (en) Laser processing equipment
CN101274394A (en) Laser processing device
US6538230B2 (en) Method and apparatus for improving laser hole resolution
EP1666520A4 (en) Processing method of polymer crystal, processing system of polymer crystal, and observation system of polymer crystal
JP2016112579A (en) Laser processing device
WO2006000549A8 (en) Laser machining device for drilling holes into a workpiece comprising an optical deflecting device and a diverting unit
JP2000042779A (en) Laser beam machining device
TW201351544A (en) Method and apparatus for processing a workpiece
JPH0732183A (en) CO2 laser processing equipment
US6862490B1 (en) DLL circuit taking acount of external load
TWI645928B (en) Laser processing apparatus and laser processing method using the laser processing apparatus
JP7612296B2 (en) Method for processing workpiece
KR20220036095A (en) LASER machining apparatus
KR102062164B1 (en) Continuous Processing Device using polygon mirror and multiple incident beam
JP4291844B2 (en) Laser head for laser marking machine
WO2010005394A1 (en) Laser processing system and method
JP4953424B2 (en) Thin film formation method
JP4177730B2 (en) Laser processing method and apparatus
TW201728393A (en) Laser processing method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

CFP Corrected version of a pamphlet front page
CR1 Correction of entry in section i

Free format text: IN PCT GAZETTE 01/2006 UNDER (71) DELETE "SIEMENS AKTIENGESELLSCHAFT [DE/DE]; WITTELSBACHERPLATZ 2, 80333 MUENCHEN (DE)"; UNDER (71) ADD "HITACHI VIA MECHANICS, LTD. [JP/JP]; 2100, KAMI-IMAIZUMI, EBINA-SHI KANAGAWA 243- 0488 (JP) "

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Ref document number: DE

122 Ep: pct application non-entry in european phase