[go: up one dir, main page]

WO2005008170A3 - Traitement de normale de contour - Google Patents

Traitement de normale de contour Download PDF

Info

Publication number
WO2005008170A3
WO2005008170A3 PCT/US2004/022401 US2004022401W WO2005008170A3 WO 2005008170 A3 WO2005008170 A3 WO 2005008170A3 US 2004022401 W US2004022401 W US 2004022401W WO 2005008170 A3 WO2005008170 A3 WO 2005008170A3
Authority
WO
WIPO (PCT)
Prior art keywords
edge
wafer
circumference
defects
normal process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2004/022401
Other languages
English (en)
Other versions
WO2005008170A2 (fr
Inventor
Cory Watkins
Mark Harless
Francy Abraham
Hak Chuah Sim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
August Technology Corp
Original Assignee
August Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by August Technology Corp filed Critical August Technology Corp
Priority to JP2006520266A priority Critical patent/JP4949024B2/ja
Priority to KR1020067000874A priority patent/KR101060428B1/ko
Priority claimed from US10/890,762 external-priority patent/US7340087B2/en
Priority claimed from US10/890,692 external-priority patent/US6947588B2/en
Publication of WO2005008170A2 publication Critical patent/WO2005008170A2/fr
Publication of WO2005008170A3 publication Critical patent/WO2005008170A3/fr
Priority to US11/331,619 priority patent/US7366344B2/en
Anticipated expiration legal-status Critical
Priority to US12/036,679 priority patent/US7706599B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/12—Edge-based segmentation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

La présente invention concerne un procédé de vérification de contour permettant de détecter des défauts à la surface d'une plaquette. Ce procédé consiste à acquérir un ensemble d'images numériques qui capture une circonférence de la plaquette, à déterminer un contour de la plaquette autour de la circonférence, à segmenter chaque image numérique en une pluralité de bandes horizontales, à combiner des groupes de contours adjacents autour de la circonférence de la plaquette en cases de pixels de contour, à analyser les cases de pixels de contour par une analyse de groupes de contours, afin d'identifier des défauts, puis à analyser également les cases de pixels de contour par une analyse de tache, afin de déterminer des défauts.
PCT/US2004/022401 2003-07-14 2004-07-14 Traitement de normale de contour Ceased WO2005008170A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006520266A JP4949024B2 (ja) 2003-07-14 2004-07-14 縁部垂直部分処理
KR1020067000874A KR101060428B1 (ko) 2003-07-14 2004-07-14 반도체와 같은 기판을 위한 에지부 검사 방법
US11/331,619 US7366344B2 (en) 2003-07-14 2006-01-13 Edge normal process
US12/036,679 US7706599B2 (en) 2003-07-14 2008-02-25 Edge normal process

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US48695303P 2003-07-14 2003-07-14
US48695203P 2003-07-14 2003-07-14
US60/486,953 2003-07-14
US60/486,952 2003-07-14
US10/890,762 US7340087B2 (en) 2003-07-14 2004-07-14 Edge inspection
US10/890,692 2004-07-14
US10/890,762 2004-07-14
US10/890,692 US6947588B2 (en) 2003-07-14 2004-07-14 Edge normal process

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/331,619 Continuation US7366344B2 (en) 2003-07-14 2006-01-13 Edge normal process

Publications (2)

Publication Number Publication Date
WO2005008170A2 WO2005008170A2 (fr) 2005-01-27
WO2005008170A3 true WO2005008170A3 (fr) 2005-05-06

Family

ID=34084733

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/022401 Ceased WO2005008170A2 (fr) 2003-07-14 2004-07-14 Traitement de normale de contour

Country Status (3)

Country Link
JP (1) JP4949024B2 (fr)
KR (1) KR101060428B1 (fr)
WO (1) WO2005008170A2 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294969A (ja) * 2005-04-13 2006-10-26 Reitetsukusu:Kk ウエハ検査装置及びウエハの検査方法
JP5085953B2 (ja) * 2006-02-24 2012-11-28 株式会社日立ハイテクノロジーズ 表面検査装置
JP4827127B2 (ja) * 2006-03-24 2011-11-30 株式会社トプコン 検査装置
JP5245212B2 (ja) * 2006-05-09 2013-07-24 株式会社ニコン 端部検査装置
EP2023130B1 (fr) 2006-05-09 2018-03-07 Nikon Corporation Dispositif d'inspection de bord
JP2007303853A (ja) * 2006-05-09 2007-11-22 Nikon Corp 端部検査装置
US7616804B2 (en) * 2006-07-11 2009-11-10 Rudolph Technologies, Inc. Wafer edge inspection and metrology
US7486878B2 (en) * 2006-09-29 2009-02-03 Lam Research Corporation Offset correction methods and arrangement for positioning and inspecting substrates
JP4886549B2 (ja) * 2007-02-26 2012-02-29 株式会社東芝 位置検出装置および位置検出方法
DE102007047935A1 (de) * 2007-03-19 2008-09-25 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Inspektion von Defekten am Randbereich eines Wafers und Verwendung der Vorrichtung in einer Inspektionseinrichtung für Wafer
JP5183147B2 (ja) * 2007-10-23 2013-04-17 芝浦メカトロニクス株式会社 円盤状基板の検査装置
JP5183146B2 (ja) * 2007-10-23 2013-04-17 芝浦メカトロニクス株式会社 円盤状基板の検査装置
US8488867B2 (en) 2007-10-23 2013-07-16 Shibaura Mechatronics Corporation Inspection device for disk-shaped substrate
EP2202814B1 (fr) 2008-12-23 2013-06-05 Luvata Espoo Oy Ensemble métallique formant un précurseur pour un supraconducteur et procédé adapté pour la production d'un supraconducteur
DE102010026351B4 (de) * 2010-07-07 2012-04-26 Siltronic Ag Verfahren und Vorrichtung zur Untersuchung einer Halbleiterscheibe
US20130162806A1 (en) * 2011-12-23 2013-06-27 Mitutoyo Corporation Enhanced edge focus tool
DE102012101301B4 (de) * 2012-02-17 2014-11-06 Kocos Automation Gmbh Vorrichtung zur berührungslosen Kantenprofilbestimmung an einem dünnen scheibenförmigen Objekt
IL304714B2 (en) 2021-04-19 2025-03-01 Kla Corp Edge profile inspection for delamination defects

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
US5822055A (en) * 1995-06-06 1998-10-13 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen using bright and darkfield detection
US5859698A (en) * 1997-05-07 1999-01-12 Nikon Corporation Method and apparatus for macro defect detection using scattered light
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6432800B2 (en) * 2000-02-03 2002-08-13 Selight Co., Ltd. Inspection of defects on the circumference of semiconductor wafers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4464705A (en) 1981-05-07 1984-08-07 Horowitz Ross M Dual light source and fiber optic bundle illuminator
US4823494A (en) 1987-12-17 1989-04-25 Waterman Phillip S Combination tip-up and hole cover
JPH0694643A (ja) * 1992-09-17 1994-04-08 Kawasaki Steel Corp 表面欠陥検出方法
US5408537A (en) * 1993-11-22 1995-04-18 At&T Corp. Mounted connector pin test using image processing
JP2000114329A (ja) * 1998-09-29 2000-04-21 Yuhi Denshi Kk 基板端部の研削面の検査方法とその装置
JP2001221749A (ja) * 2000-02-10 2001-08-17 Hitachi Ltd 観察装置及び観察方法
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
US5822055A (en) * 1995-06-06 1998-10-13 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen using bright and darkfield detection
US5859698A (en) * 1997-05-07 1999-01-12 Nikon Corporation Method and apparatus for macro defect detection using scattered light
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6432800B2 (en) * 2000-02-03 2002-08-13 Selight Co., Ltd. Inspection of defects on the circumference of semiconductor wafers

Also Published As

Publication number Publication date
KR20060056942A (ko) 2006-05-25
JP4949024B2 (ja) 2012-06-06
WO2005008170A2 (fr) 2005-01-27
KR101060428B1 (ko) 2011-08-29
JP2007536723A (ja) 2007-12-13

Similar Documents

Publication Publication Date Title
WO2005008170A3 (fr) Traitement de normale de contour
CN110296997B (zh) 基于机器视觉的陶瓷瓦的缺陷检测方法及装置
EP1696227A3 (fr) Procédé et appareil de détection de défauts dans des wafers
WO2006105473A3 (fr) Detection automatique de lesions rouges dans des photographies du fond de l'oeil couleurs numeriques
WO1997000452A3 (fr) Appareil et procede de detection de defauts mura
TWI264793B (en) Defect detection apparatus and defect detection method
MY188165A (en) System and method for inspecting a wafer
TW200834059A (en) Defect inspection apparatus and method therefor
US7415362B2 (en) Image defect inspection apparatus
TW200722740A (en) Image defect inspection apparatus, image defect inspection system, and image defect inspection method
Boukouvalas et al. ASSIST: automatic system for surface inspection and sorting of tiles
JP6696323B2 (ja) パターン検査装置およびパターン検査方法
CN101995325A (zh) 一种图像传感器的外观检测方法及系统
JP3572750B2 (ja) コンクリート欠陥の自動評価方法
JP4213142B2 (ja) コロニーの計数方法
CN113177925A (zh) 一种无损检测水果表面缺陷的方法
JP2007147442A (ja) 木材の検査方法及び装置及びプログラム
JP2000180374A (ja) 欠陥検出方法
EP0969498A3 (fr) Méthode et appareil d'inspection visuelle
JP2002257736A (ja) ハニカム構造体の端面検査方法及び装置
Boukouvalas et al. An integrated system for quality inspection of tiles
TW200710387A (en) A method of detecting incomplete edge bead removal from a disk-like object
WO2007026360A3 (fr) Procede et systeme permettant de creer une image de reference au moyen de motifs de qualite inconnue
WO2003010622A3 (fr) Separation automatique de pixels sujets utilisant une segmentation fondee sur des plans multiples de donnees de mesure
JPH09199560A (ja) 半導体基板表面欠陥の検査方法及びその自動検査装置

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2006520266

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 11331619

Country of ref document: US

Ref document number: 1020067000874

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 11331619

Country of ref document: US

122 Ep: pct application non-entry in european phase