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WO2005089999A1 - Bille de brasage sans plomb - Google Patents

Bille de brasage sans plomb Download PDF

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Publication number
WO2005089999A1
WO2005089999A1 PCT/JP2005/004427 JP2005004427W WO2005089999A1 WO 2005089999 A1 WO2005089999 A1 WO 2005089999A1 JP 2005004427 W JP2005004427 W JP 2005004427W WO 2005089999 A1 WO2005089999 A1 WO 2005089999A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
solder
mass
free solder
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/004427
Other languages
English (en)
Japanese (ja)
Inventor
Daisuke Souma
Takahiro Roppongi
Hiromi Kawamata
Hiroshi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP2006511176A priority Critical patent/JP4392020B2/ja
Publication of WO2005089999A1 publication Critical patent/WO2005089999A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H05K3/346—

Definitions

  • the present invention relates to a solder ball used for soldering a surface mount component, particularly to a lead-free solder ball containing no Pb.
  • a surface mount component is a device in which electronic components are directly soldered and mounted on lands formed on the surface of a printed circuit board, and generally includes QFP, PLCC, SOP, SOJ, and the like.
  • QFP Quality of Service
  • PLCC Landing Component
  • SOP Synchronization Protocol
  • SOJ SOJ
  • a surface mount component is a device in which electronic components are directly soldered and mounted on lands formed on the surface of a printed circuit board, and generally includes QFP, PLCC, SOP, SOJ, and the like.
  • a solder paste is applied to the land of the printed circuit board, the surface-mounted components are mounted on the applied portion, and then the solder paste is melted in a reflow furnace.
  • the surface mount components were soldered to the printed circuit board.
  • solder bumps are formed on the electrodes of the BGA in advance, and the solder bumps are soldered to the printed circuit board.
  • a method of forming a solder bump on a BGA electrode will be briefly described.
  • an adhesive flux and solder paste are applied to the BGA electrodes, and solder balls are mounted on the applied portions by a mounting device.
  • the BGA on which the solder balls are mounted is heated in a reflow furnace to melt the solder balls, thereby forming solder bumps on the electrodes of the BGA. Since the reflow temperature at this time is at least 30 ° C higher than the melting temperature of the solder ball, the surface of the molten solder ball becomes easily oxidized.
  • the solder ball used for BGA has been Sn-Pb solder.
  • the eutectic composition (63Sn-Pb) of the Sn-Pb solder has been widely used because it has excellent solderability and has few defects.
  • electronic devices that used solder balls containing lead while being used became old and became inconvenient or broke down, they were discarded without purging up or repairing.
  • plastics and metals that make up the electronic equipment could be reused.
  • the printed circuit board could not be completely separated because the land and solder adhered metallically. Even if collected, they could not be reused, so they had to be disposed of in landfills.
  • Lead-free solder includes Sn-Ag based, Sn-Cu based, Sn-Ag-Cu based, Sn-Sb based, Sn-Bi based, Sn-Zn based based on Sn and the like. It is obtained by further adding other elementary kashimi elements. As described above, various types of lead-free solder have certain strengths and weaknesses, and they are used differently depending on the application.
  • Sn-Bi-based lead-free solder has a low melting point of 139 ° C for Sn-58Bi. Although it has the feature of little heat influence, its use is limited because it is very brittle. In the Sn-Zn system, Sn-9Zn has a melting point of 199 ° C and has a melting point close to that of conventional 63Sn-Pb eutectic solder. The force Zn, which has a large tendency to ionize, has a problem of insufficient corrosion resistance.
  • Sn-3.0-4.0Ag Sn-0.5-1.0Cu, Sn-1.0-4.0Ag-0.5Cu, more preferably Sn-3.0-4.0Ag-0.5Cu (melting point: 221-227 ° C)
  • Sn- Sn-based lead-free solders such as 3.0-5.0Sb have a slightly higher melting point than eutectic solders, but because of their high mechanical strength, they are suitable for soldering electronic devices, especially for forming BGA bumps in the form of solder balls. Many are used.
  • Patent Literature 1-16 describes a lead-free solder to which Cr is added.
  • Patent Document 1 JP-A-2-179386
  • Patent Document 2 JP-A-2000-15476
  • Patent Document 3 JP 2001-205476 A
  • Patent Document 4 Japanese Patent Application Laid-Open No. 2002-18589
  • Patent Document 5 JP-A-2002-248596
  • Patent Document 6 JP-A-2003-94195
  • solder bumps on the BGA is a force that mounts the solder balls on the electrodes of the BGA and also melts the solder balls in a reflow furnace.
  • the present inventors have conducted intensive studies on the cause of the yellowing of the surface of a solder bump when a solder bump is formed on a BGA electrode and the cause of solder corrosion in a corrosive atmosphere.
  • the solder bumps turn yellow because the surface is oxidized when the solder balls are melted.
  • the solder is always melted at the time of soldering.
  • the oxidized Sn and Pb of the Sn-Pb solder covers the surface. Since the Sn and Pb oxides contain Pb, they become almost white, and this white does not cause an error in the image recognition device.
  • lead-free solder containing Sn as a main component Sn as the main component oxidizes during melting, and the oxidized tin becomes yellow, causing an error in an image recognition device.
  • the portion soldered with a Sn-based lead-free solder ball corrodes in a corrosive atmosphere because a large amount of Sn is contained in the lead-free solder ball. This is because the resistance is lower than that of Pb.
  • the present inventors have found that if the solder surface is in a state in which it is difficult to oxidize when the solder ball is melted, the solder surface does not turn yellow, or after soldering, an inert atmosphere is formed on the solder surface.
  • the aim was to make it difficult to corrode even if a large amount of Sn was contained if there was a barrier to block.
  • the present inventors have searched for an element that has the effect of preventing oxidation and have a barrier effect, and have found that adding a trace amount of Cr to a lead-free solder containing Sn as a main component has the effect of preventing oxidation and having a barrier effect.
  • the present invention has been completed.
  • the present invention relates to a lead-free solder ball containing 80% by mass or more of Sn, wherein 0.0001 to 0.003% by mass of Cr is added to the solder ball. is there.
  • the lead-free solder ball of the present invention does not yellow when a solder bump is formed on a BGA, so that no error occurs when image processing is performed by an image recognition device.
  • the lead-free solder ball of the present invention does not corrode even when exposed to a corrosive atmosphere for a long period of time, it does not crack or peel off, and can exhibit the bonding strength of the solder itself. It is excellent.
  • the lead-free solder ball according to the present invention includes Sn-Ag, Sn-Cu, Sn-Ag-Cu,
  • the “system” here is the alloy itself or the alloy obtained by adding a small amount of another element to the alloy.
  • Sn-Ag-based is a binary alloy of Sn-Ag as it is, and a multi-element alloy in which one or more selected from In, Bi, Sb, Ni, P, Ge, and Ga are added to Sn-Ag alloy. It is.
  • Sn-Cu system, Sn-Ag-Cu system, and Sn-Sb system are also powerful.
  • the yellowing of lead-free solder occurs when a large amount of Sn is added. That is, if the added amount of Sn is 80% by mass or more, the oxidized color of Sn becomes yellow during melting, which causes an error in the image recognition device. Therefore, in the present invention, an object is to prevent yellowing in a lead-free solder containing 80% by mass or more of Sn.
  • the amount of the Sn main component of force Cr is obtained by 0.0001 to 0.003 mass 0/0 added Caro the Cr to lead-free solder is less than 0.0001 wt%, and anti-yellowing The effect of preventing corrosion does not appear, but if added in excess of 0.003% by mass, the oxide film becomes too thick and impairs the solderability.
  • JISZ 3198-3 solder spread rate is used as a guide for the wettability of lead-free solder S. If the solder spread rate is less than 75% for lead-free solder, good solderability with poor wettability cannot be performed.
  • the preferred amount of Cr added is 0.0005 to 0.001% by mass, and within this range, yellowing can be prevented and solderability is good.
  • the lead-free solder ball of the present invention is a ball having a diameter at which the bonding strength is extremely weakened by the effect of corrosion, that is, a lead-free solder ball having a fine diameter, approximately 0.05-0.6 mm. It has excellent effects.
  • solderability Table 1 shows the results of the spread ratio on a conventional copper plate using a solder ball with a diameter of 0.5 mm. JISZ3198-3 (Lead-free solder test method) Method Part 3 Spreading test method).
  • the solder ball of the example had good yellowing and good solder spreading.
  • the amount of Cr added was 0.0005-0.001% by mass.
  • the comparative solder ball satisfies both the yellowing and spreading properties. Things were powerful. Industrial applicability
  • the lead-free solder ball of the present invention is suitable for forming bumps other than force BGA, such as forming bumps on top of head pins or forming bumps on connector electrodes, which are suitable for forming BGA bumps. It goes without saying that it can be applied to things.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

[PROBLEMES] Lorsque l’on utilisait des billes de brasage sans plomb de type Sn-Ag, de type Sn-Cu, de type Sn-Ag-Cu et de type Sn-Sb d’une teneur Sn supérieure ou égale à 80 % en masse pour la formation de perles de soudure sur des électrodes de BGA, on a observé le jaunissement de la surface et/ou la corrosion de la portion brasée en cas d’exposition à une atmosphère corrosive dans certains cas. Le jaunissement de la surface d’une perle de soudure peut provoquer une erreur lors de la recherche de la présence ou de l’absence d’une perle de soudure d’un dispositif de reconnaissance d’image, ce qui interfère alors avec le bon déroulement de l’examen, et la corrosion d’une portion brasée réduit la force d’accrochage d’une perle de soudure. [MOYENS POUR RESOUDRE LES PROBLEMES] Une bille de brasage sans plomb contenant du Sn d'une teneur supérieure ou égale à 80 % en masse, comprenant en outre de 0,0001 à 0,003 % en masse de Cr.
PCT/JP2005/004427 2004-03-19 2005-03-14 Bille de brasage sans plomb Ceased WO2005089999A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006511176A JP4392020B2 (ja) 2004-03-19 2005-03-14 鉛フリーはんだボール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-079348 2004-03-19
JP2004079348 2004-03-19

Publications (1)

Publication Number Publication Date
WO2005089999A1 true WO2005089999A1 (fr) 2005-09-29

Family

ID=34993512

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/004427 Ceased WO2005089999A1 (fr) 2004-03-19 2005-03-14 Bille de brasage sans plomb

Country Status (3)

Country Link
JP (1) JP4392020B2 (fr)
TW (1) TW200603932A (fr)
WO (1) WO2005089999A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009248156A (ja) * 2008-04-08 2009-10-29 Hitachi Metals Ltd はんだボール、はんだ層及びはんだバンプ並びにそれらの形成方法
JP2011031253A (ja) * 2009-07-30 2011-02-17 Eishin Kogyo Kk 無鉛ハンダ合金
TWI469845B (zh) * 2012-08-08 2015-01-21 千住金屬工業股份有限公司 High temperature lead free solder alloy
EP3112080A4 (fr) * 2014-02-24 2017-11-29 Koki Company Limited Alliage de soudure sans plomb, matériau de soudure et structure assemblée
JP2020075280A (ja) * 2018-11-09 2020-05-21 千住金属工業株式会社 ハンダボール、ハンダ継手および接合方法
CN115464299A (zh) * 2021-10-21 2022-12-13 上海华庆焊材技术股份有限公司 一种降低焊接空洞的预成型无铅焊片及其制备方法和应用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101283580B1 (ko) 2011-12-14 2013-07-05 엠케이전자 주식회사 주석계 솔더 볼 및 이를 포함하는 반도체 패키지

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11216591A (ja) * 1998-01-28 1999-08-10 Murata Mfg Co Ltd 半田付け物品
JP2001058286A (ja) * 1999-08-20 2001-03-06 Senju Metal Ind Co Ltd チップ部品接合用ソルダペースト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11216591A (ja) * 1998-01-28 1999-08-10 Murata Mfg Co Ltd 半田付け物品
JP2001058286A (ja) * 1999-08-20 2001-03-06 Senju Metal Ind Co Ltd チップ部品接合用ソルダペースト

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009248156A (ja) * 2008-04-08 2009-10-29 Hitachi Metals Ltd はんだボール、はんだ層及びはんだバンプ並びにそれらの形成方法
JP2011031253A (ja) * 2009-07-30 2011-02-17 Eishin Kogyo Kk 無鉛ハンダ合金
TWI469845B (zh) * 2012-08-08 2015-01-21 千住金屬工業股份有限公司 High temperature lead free solder alloy
EP3112080A4 (fr) * 2014-02-24 2017-11-29 Koki Company Limited Alliage de soudure sans plomb, matériau de soudure et structure assemblée
JP2020075280A (ja) * 2018-11-09 2020-05-21 千住金属工業株式会社 ハンダボール、ハンダ継手および接合方法
US10780531B2 (en) 2018-11-09 2020-09-22 Senju Metal Industry Co., Ltd. Solder ball, solder joint, and joining method
CN115464299A (zh) * 2021-10-21 2022-12-13 上海华庆焊材技术股份有限公司 一种降低焊接空洞的预成型无铅焊片及其制备方法和应用

Also Published As

Publication number Publication date
JP4392020B2 (ja) 2009-12-24
JPWO2005089999A1 (ja) 2008-01-31
TWI334366B (fr) 2010-12-11
TW200603932A (en) 2006-02-01

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